CN115335482A - 粘接剂组合物和粘接片材、层叠体及印刷线路板 - Google Patents

粘接剂组合物和粘接片材、层叠体及印刷线路板 Download PDF

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Publication number
CN115335482A
CN115335482A CN202180024655.0A CN202180024655A CN115335482A CN 115335482 A CN115335482 A CN 115335482A CN 202180024655 A CN202180024655 A CN 202180024655A CN 115335482 A CN115335482 A CN 115335482A
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China
Prior art keywords
adhesive composition
adhesive
less
liquid crystal
mass
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CN202180024655.0A
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English (en)
Chinese (zh)
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CN115335482B (zh
Inventor
坂本晃一
三浦航
川楠哲生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongyang Textile Mc Co ltd
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Toyobo Co Ltd
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Publication of CN115335482A publication Critical patent/CN115335482A/zh
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Publication of CN115335482B publication Critical patent/CN115335482B/zh
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00Liquid crystal materials
    • C09K19/04Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38Polymers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
CN202180024655.0A 2020-04-06 2021-03-26 粘接剂组合物和粘接片材、层叠体及印刷线路板 Active CN115335482B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020068163 2020-04-06
JP2020-068163 2020-04-06
PCT/JP2021/013044 WO2021205917A1 (ja) 2020-04-06 2021-03-26 接着剤組成物ならびに接着シート、積層体およびプリント配線板

Publications (2)

Publication Number Publication Date
CN115335482A true CN115335482A (zh) 2022-11-11
CN115335482B CN115335482B (zh) 2024-06-25

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Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01161045A (ja) * 1987-12-16 1989-06-23 Shin Etsu Chem Co Ltd 難燃性カバーレイフイルム
JPH09278966A (ja) * 1996-04-10 1997-10-28 Du Pont Mitsui Fluorochem Co Ltd 金属基材被覆用組成物
JPH1171567A (ja) * 1997-06-30 1999-03-16 Toray Ind Inc 溶着用樹脂組成物
JP2002249754A (ja) * 2001-02-27 2002-09-06 Dainippon Ink & Chem Inc 接着剤用樹脂組成物及び積層体
JP2004013054A (ja) * 2002-06-11 2004-01-15 Sumitomo Chem Co Ltd 高耐熱ラベル
JP2006307093A (ja) * 2005-05-02 2006-11-09 Sekisui Chem Co Ltd 光反応型接着剤組成物および液晶表示装置の製造方法
CN102627934A (zh) * 2011-02-01 2012-08-08 阿尔卑斯电气株式会社 密封材料
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
WO2016031342A1 (ja) * 2014-08-27 2016-03-03 東洋紡株式会社 低誘電接着剤組成物
CN108291076A (zh) * 2015-12-24 2018-07-17 株式会社钟化 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片
CN109666434A (zh) * 2018-12-27 2019-04-23 苏州赛伍应用技术股份有限公司 粘合剂及制备方法、包含其的胶膜和制备方法及应用
WO2019172227A1 (ja) * 2018-03-05 2019-09-12 タツタ電線株式会社 接着剤用組成物

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01161045A (ja) * 1987-12-16 1989-06-23 Shin Etsu Chem Co Ltd 難燃性カバーレイフイルム
JPH09278966A (ja) * 1996-04-10 1997-10-28 Du Pont Mitsui Fluorochem Co Ltd 金属基材被覆用組成物
JPH1171567A (ja) * 1997-06-30 1999-03-16 Toray Ind Inc 溶着用樹脂組成物
JP2002249754A (ja) * 2001-02-27 2002-09-06 Dainippon Ink & Chem Inc 接着剤用樹脂組成物及び積層体
JP2004013054A (ja) * 2002-06-11 2004-01-15 Sumitomo Chem Co Ltd 高耐熱ラベル
JP2006307093A (ja) * 2005-05-02 2006-11-09 Sekisui Chem Co Ltd 光反応型接着剤組成物および液晶表示装置の製造方法
CN102627934A (zh) * 2011-02-01 2012-08-08 阿尔卑斯电气株式会社 密封材料
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
WO2016031342A1 (ja) * 2014-08-27 2016-03-03 東洋紡株式会社 低誘電接着剤組成物
CN108291076A (zh) * 2015-12-24 2018-07-17 株式会社钟化 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片
WO2019172227A1 (ja) * 2018-03-05 2019-09-12 タツタ電線株式会社 接着剤用組成物
CN109666434A (zh) * 2018-12-27 2019-04-23 苏州赛伍应用技术股份有限公司 粘合剂及制备方法、包含其的胶膜和制备方法及应用

Also Published As

Publication number Publication date
JP6981583B1 (ja) 2021-12-15
KR20220163937A (ko) 2022-12-12
TW202144528A (zh) 2021-12-01
WO2021205917A1 (ja) 2021-10-14
JPWO2021205917A1 (ja) 2021-10-14

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Effective date of registration: 20230525

Address after: South Building, Meitian Twin Towers, No. 13-1, Meitian 1-chome, Kita ku, Osaka City, Osaka Prefecture, Japan

Applicant after: Dongyang Textile MC Co.,Ltd.

Address before: No. 1, No. 13, meitian-1, Shibei District, Osaka, Osaka, Japan

Applicant before: TOYOBO Co.,Ltd.

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