CN115315499A - 粘接剂组合物和粘接片材、层叠体及印刷线路板 - Google Patents

粘接剂组合物和粘接片材、层叠体及印刷线路板 Download PDF

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Publication number
CN115315499A
CN115315499A CN202180022016.0A CN202180022016A CN115315499A CN 115315499 A CN115315499 A CN 115315499A CN 202180022016 A CN202180022016 A CN 202180022016A CN 115315499 A CN115315499 A CN 115315499A
Authority
CN
China
Prior art keywords
adhesive composition
polyester
adhesive
component
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180022016.0A
Other languages
English (en)
Chinese (zh)
Inventor
坂本晃一
三浦航
川楠哲生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongyang Textile Mc Co ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=77929953&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN115315499(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Publication of CN115315499A publication Critical patent/CN115315499A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/181—Acids containing aromatic rings
    • C08G63/185—Acids containing aromatic rings containing two or more aromatic rings
    • C08G63/187—Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings
    • C08G63/189—Acids containing aromatic rings containing two or more aromatic rings containing condensed aromatic rings containing a naphthalene ring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Adhesive Tapes (AREA)
CN202180022016.0A 2020-03-30 2021-03-26 粘接剂组合物和粘接片材、层叠体及印刷线路板 Pending CN115315499A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-060685 2020-03-30
JP2020060685 2020-03-30
PCT/JP2021/013039 WO2021200713A1 (ja) 2020-03-30 2021-03-26 接着剤組成物、ならびに接着シート、積層体およびプリント配線板

Publications (1)

Publication Number Publication Date
CN115315499A true CN115315499A (zh) 2022-11-08

Family

ID=77929953

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180022016.0A Pending CN115315499A (zh) 2020-03-30 2021-03-26 粘接剂组合物和粘接片材、层叠体及印刷线路板

Country Status (5)

Country Link
JP (1) JP6981581B1 (https=)
KR (1) KR20220161283A (https=)
CN (1) CN115315499A (https=)
TW (1) TWI864265B (https=)
WO (1) WO2021200713A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7173252B2 (ja) * 2020-09-24 2022-11-16 三菱ケミカル株式会社 粘着剤組成物、粘着剤及び粘着剤層
JP7156562B1 (ja) 2021-04-16 2022-10-19 三菱ケミカル株式会社 フレキシブルプリント配線板用接着剤組成物
JP7714901B2 (ja) * 2021-04-16 2025-07-30 三菱ケミカル株式会社 接着剤組成物およびフラットケーブル形成用接着剤組成物
EP4417636A4 (en) * 2021-10-14 2025-09-17 Toyo Boseki CROSSLINKED POLYESTER RESIN, ADHESIVE COMPOSITION AND ADHESIVE SHEET
EP4497797A4 (en) 2022-03-23 2025-07-02 Mitsubishi Chem Corp POLYESTER-BASED PRESSURE-SENSITIVE ADHESIVE COMPOSITION, POLYESTER-BASED PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE SHEET, DECORATIVE FILM, FILM FOR ELECTRONIC ELEMENT, AND DECORATIVE MOLDED OBJECT
KR20250129032A (ko) * 2023-02-17 2025-08-28 도요보 가부시키가이샤 적층 폴리에스테르 필름

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06128363A (ja) * 1992-10-16 1994-05-10 Toyobo Co Ltd 熱可塑性ポリエステルエラストマー
CN110268030A (zh) * 2017-03-28 2019-09-20 东洋纺株式会社 含有羧酸基的聚酯系粘合剂组合物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104813A (ja) 1992-09-18 1994-04-15 Canon Inc 無線電話機
JP4674204B2 (ja) * 2006-07-18 2011-04-20 大日精化工業株式会社 ポリウレタン樹脂を含む接着剤組成物およびその応用
JP5187468B1 (ja) * 2011-09-30 2013-04-24 東洋紡株式会社 接着剤組成物、積層体およびポリエステルポリオール
CN107075335B (zh) 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
CN109476124B (zh) * 2016-08-09 2021-06-22 东洋纺株式会社 含有低介电粘合剂层的层叠体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06128363A (ja) * 1992-10-16 1994-05-10 Toyobo Co Ltd 熱可塑性ポリエステルエラストマー
CN110268030A (zh) * 2017-03-28 2019-09-20 东洋纺株式会社 含有羧酸基的聚酯系粘合剂组合物

Also Published As

Publication number Publication date
WO2021200713A1 (ja) 2021-10-07
JPWO2021200713A1 (https=) 2021-10-07
TW202140612A (zh) 2021-11-01
KR20220161283A (ko) 2022-12-06
JP6981581B1 (ja) 2021-12-15
TWI864265B (zh) 2024-12-01

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Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20230620

Address after: South Building, Meitian Twin Towers, No. 13-1, Meitian 1-chome, Kita ku, Osaka City, Osaka Prefecture, Japan

Applicant after: Dongyang Textile MC Co.,Ltd.

Address before: No. 1, No. 13, meitian-1, Shibei District, Osaka, Osaka, Japan

Applicant before: TOYOBO Co.,Ltd.

RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20221108