CN115280445B - 电子部件的制造方法和装置 - Google Patents
电子部件的制造方法和装置 Download PDFInfo
- Publication number
- CN115280445B CN115280445B CN202080098353.3A CN202080098353A CN115280445B CN 115280445 B CN115280445 B CN 115280445B CN 202080098353 A CN202080098353 A CN 202080098353A CN 115280445 B CN115280445 B CN 115280445B
- Authority
- CN
- China
- Prior art keywords
- electronic component
- paste
- layer
- bodies
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 238000007598 dipping method Methods 0.000 claims abstract description 44
- 238000005470 impregnation Methods 0.000 claims abstract description 22
- 238000005520 cutting process Methods 0.000 claims abstract description 21
- 239000012530 fluid Substances 0.000 claims abstract description 6
- 239000007787 solid Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 22
- 230000007246 mechanism Effects 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 19
- 230000001419 dependent effect Effects 0.000 claims 2
- 239000010408 film Substances 0.000 description 34
- 230000008569 process Effects 0.000 description 15
- 238000010586 diagram Methods 0.000 description 13
- 238000007639 printing Methods 0.000 description 10
- 238000005491 wire drawing Methods 0.000 description 10
- 238000007493 shaping process Methods 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000007646 gravure printing Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000003618 dip coating Methods 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/252—Terminals the terminals being coated on the capacitive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/010448 WO2021181548A1 (ja) | 2020-03-11 | 2020-03-11 | 電子部品の製造方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115280445A CN115280445A (zh) | 2022-11-01 |
| CN115280445B true CN115280445B (zh) | 2024-07-09 |
Family
ID=77671286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080098353.3A Active CN115280445B (zh) | 2020-03-11 | 2020-03-11 | 电子部件的制造方法和装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220415578A1 (ko) |
| EP (1) | EP4120299A4 (ko) |
| JP (1) | JP7161814B2 (ko) |
| KR (1) | KR102648789B1 (ko) |
| CN (1) | CN115280445B (ko) |
| WO (1) | WO2021181548A1 (ko) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005101104A (ja) * | 2003-09-22 | 2005-04-14 | Murata Mfg Co Ltd | 電子部品の製造方法 |
| WO2019198710A1 (ja) * | 2018-04-13 | 2019-10-17 | 株式会社クリエイティブコエム | 電子部品の製造方法及び装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6345813A (ja) | 1986-08-13 | 1988-02-26 | 株式会社村田製作所 | 電子部品の電極形成方法 |
| DE19828574B4 (de) * | 1998-06-26 | 2008-11-27 | Ceramtec Ag | Verfahren zur Metallisierung von Oberflächenbereichen kleinvolumiger keramischer Formkörper |
| JP3855700B2 (ja) * | 2001-08-13 | 2006-12-13 | 株式会社村田製作所 | セラミック電子部品の製造方法 |
| DE10242410A1 (de) * | 2002-09-12 | 2004-03-25 | Robert Bosch Gmbh | Vorrichtung und Verfahren zum Aufbringen eines fluiden Mediums auf ein Substrat |
| JP4462218B2 (ja) * | 2006-03-28 | 2010-05-12 | Ｔｄｋ株式会社 | チップ状電子部品の外部電極形成方法および外部電極形成装置 |
| JP6135150B2 (ja) * | 2013-01-25 | 2017-05-31 | Tdk株式会社 | 電子部品の脱離方法 |
| TW201813724A (zh) * | 2016-10-14 | 2018-04-16 | 創力艾生股份有限公司 | 電子零件的製造方法及裝置以及電子零件 |
| US11052422B2 (en) * | 2018-07-10 | 2021-07-06 | Creative Coatings Co., Ltd. | Electronic component manufacturing method and apparatus |
-
2020
- 2020-03-11 JP JP2022507065A patent/JP7161814B2/ja active Active
- 2020-03-11 EP EP20923928.4A patent/EP4120299A4/en active Pending
- 2020-03-11 WO PCT/JP2020/010448 patent/WO2021181548A1/ja unknown
- 2020-03-11 KR KR1020227034560A patent/KR102648789B1/ko active IP Right Grant
- 2020-03-11 CN CN202080098353.3A patent/CN115280445B/zh active Active
-
2022
- 2022-09-06 US US17/903,936 patent/US20220415578A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005101104A (ja) * | 2003-09-22 | 2005-04-14 | Murata Mfg Co Ltd | 電子部品の製造方法 |
| WO2019198710A1 (ja) * | 2018-04-13 | 2019-10-17 | 株式会社クリエイティブコエム | 電子部品の製造方法及び装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220147680A (ko) | 2022-11-03 |
| EP4120299A4 (en) | 2023-07-19 |
| JPWO2021181548A1 (ko) | 2021-09-16 |
| CN115280445A (zh) | 2022-11-01 |
| US20220415578A1 (en) | 2022-12-29 |
| JP7161814B2 (ja) | 2022-10-27 |
| EP4120299A1 (en) | 2023-01-18 |
| TW202207250A (zh) | 2022-02-16 |
| KR102648789B1 (ko) | 2024-03-19 |
| WO2021181548A1 (ja) | 2021-09-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |