CN115244720A - 层叠压电元件及电声换能器 - Google Patents

层叠压电元件及电声换能器 Download PDF

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Publication number
CN115244720A
CN115244720A CN202180019823.7A CN202180019823A CN115244720A CN 115244720 A CN115244720 A CN 115244720A CN 202180019823 A CN202180019823 A CN 202180019823A CN 115244720 A CN115244720 A CN 115244720A
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CN
China
Prior art keywords
piezoelectric
layer
piezoelectric film
piezoelectric element
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180019823.7A
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English (en)
Chinese (zh)
Inventor
芦川辉男
平口和男
香川裕介
三好哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN115244720A publication Critical patent/CN115244720A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
CN202180019823.7A 2020-03-19 2021-03-02 层叠压电元件及电声换能器 Pending CN115244720A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020049274 2020-03-19
JP2020-049274 2020-03-19
JP2020-212292 2020-12-22
JP2020212292 2020-12-22
PCT/JP2021/007901 WO2021187086A1 (ja) 2020-03-19 2021-03-02 積層圧電素子および電気音響変換器

Publications (1)

Publication Number Publication Date
CN115244720A true CN115244720A (zh) 2022-10-25

Family

ID=77770852

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180019823.7A Pending CN115244720A (zh) 2020-03-19 2021-03-02 层叠压电元件及电声换能器

Country Status (7)

Country Link
US (1) US12075211B2 (https=)
EP (1) EP4124066A4 (https=)
JP (1) JP7457790B2 (https=)
KR (1) KR20220140576A (https=)
CN (1) CN115244720A (https=)
TW (1) TW202137783A (https=)
WO (1) WO2021187086A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117729500A (zh) * 2024-02-08 2024-03-19 成都纤声科技有限公司 一种声学压电结构、声学传感器和电子设备

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021199800A1 (https=) * 2020-03-30 2021-10-07
WO2023181699A1 (ja) * 2022-03-24 2023-09-28 富士フイルム株式会社 電気音響変換器
TWI828327B (zh) * 2022-09-22 2024-01-01 國立臺灣大學 寬頻高音質的壓電材料複合振膜聲學元件及其製造方法
CN120604526A (zh) * 2023-02-28 2025-09-05 富士胶片株式会社 层叠压电元件及电声换能器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078995A (ja) * 2001-09-03 2003-03-14 Taiyo Yuden Co Ltd 圧電音響装置
JP2010068678A (ja) * 2008-09-12 2010-03-25 Alps Electric Co Ltd 積層型アクチュエータ及びその製造方法
US20160014527A1 (en) * 2013-03-29 2016-01-14 Fujifilm Corporation Electroacoustic converter film
WO2016039138A1 (ja) * 2014-09-12 2016-03-17 株式会社村田製作所 伸縮フィルム積層体、電子機器
WO2019078053A1 (ja) * 2017-10-18 2019-04-25 パナソニックＩｐマネジメント株式会社 圧電デバイス及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02197183A (ja) * 1988-03-29 1990-08-03 Pennwalt Corp 積層圧電構造及びその形成方法
US5367500A (en) * 1992-09-30 1994-11-22 The United States Of America As Represented By The Secretary Of The Navy Transducer structure
JP2001230462A (ja) * 2000-02-17 2001-08-24 Minolta Co Ltd 圧電変換素子
JP2009094259A (ja) * 2007-10-09 2009-04-30 Denso Corp 積層型圧電素子とその製造方法
JP2010177867A (ja) * 2009-01-28 2010-08-12 Kyocera Corp 圧電スピーカ
EP3041059B1 (en) * 2014-12-31 2019-09-11 LG Display Co., Ltd. Multilayer actuator and display device comprising the same
JP6431984B2 (ja) * 2015-07-27 2018-11-28 富士フイルム株式会社 電気音響変換フィルムおよびその製造方法、ならびに、電気音響変換器、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
JP6683029B2 (ja) 2016-06-20 2020-04-15 コニカミノルタ株式会社 圧電素子、超音波探触子および超音波撮像装置
CN113140669B (zh) * 2020-01-19 2024-05-24 北京小米移动软件有限公司 压电组件及制作方法、屏幕部件和移动终端

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078995A (ja) * 2001-09-03 2003-03-14 Taiyo Yuden Co Ltd 圧電音響装置
JP2010068678A (ja) * 2008-09-12 2010-03-25 Alps Electric Co Ltd 積層型アクチュエータ及びその製造方法
US20160014527A1 (en) * 2013-03-29 2016-01-14 Fujifilm Corporation Electroacoustic converter film
WO2016039138A1 (ja) * 2014-09-12 2016-03-17 株式会社村田製作所 伸縮フィルム積層体、電子機器
US20170173634A1 (en) * 2014-09-12 2017-06-22 Murata Manufacturing Co., Ltd. Stretchable film laminate and electronic device
WO2019078053A1 (ja) * 2017-10-18 2019-04-25 パナソニックＩｐマネジメント株式会社 圧電デバイス及びその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
陈科 等: "多层PVDF压电薄膜输出电压研究", 电子测量与仪器学报, vol. 32, no. 1, 31 January 2018 (2018-01-31), pages 201 - 208 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117729500A (zh) * 2024-02-08 2024-03-19 成都纤声科技有限公司 一种声学压电结构、声学传感器和电子设备
CN117729500B (zh) * 2024-02-08 2024-04-30 成都纤声科技有限公司 一种声学压电结构、声学传感器和电子设备

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Publication number Publication date
US12075211B2 (en) 2024-08-27
JP7457790B2 (ja) 2024-03-28
EP4124066A1 (en) 2023-01-25
JPWO2021187086A1 (https=) 2021-09-23
WO2021187086A1 (ja) 2021-09-23
KR20220140576A (ko) 2022-10-18
US20230019706A1 (en) 2023-01-19
TW202137783A (zh) 2021-10-01
EP4124066A4 (en) 2023-09-06

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