KR20220140576A - 적층 압전 소자 및 전기 음향 변환기 - Google Patents

적층 압전 소자 및 전기 음향 변환기 Download PDF

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Publication number
KR20220140576A
KR20220140576A KR1020227031142A KR20227031142A KR20220140576A KR 20220140576 A KR20220140576 A KR 20220140576A KR 1020227031142 A KR1020227031142 A KR 1020227031142A KR 20227031142 A KR20227031142 A KR 20227031142A KR 20220140576 A KR20220140576 A KR 20220140576A
Authority
KR
South Korea
Prior art keywords
piezoelectric
layer
piezoelectric film
protrusion
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227031142A
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English (en)
Korean (ko)
Inventor
데루오 아시카와
가즈오 히라구치
유스케 가가와
데츠 미요시
Original Assignee
후지필름 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지필름 가부시키가이샤 filed Critical 후지필름 가부시키가이샤
Publication of KR20220140576A publication Critical patent/KR20220140576A/ko
Pending legal-status Critical Current

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H01L41/047
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H01L41/053
    • H01L41/083
    • H01L41/09
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/02Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04Plane diaphragms
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/88Mounts; Supports; Enclosures; Casings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/88Mounts; Supports; Enclosures; Casings
    • H10N30/883Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/05Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/057Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/852Composite materials, e.g. having 1-3 or 2-2 type connectivity

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
KR1020227031142A 2020-03-19 2021-03-02 적층 압전 소자 및 전기 음향 변환기 Pending KR20220140576A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020049274 2020-03-19
JPJP-P-2020-049274 2020-03-19
JPJP-P-2020-212292 2020-12-22
JP2020212292 2020-12-22
PCT/JP2021/007901 WO2021187086A1 (ja) 2020-03-19 2021-03-02 積層圧電素子および電気音響変換器

Publications (1)

Publication Number Publication Date
KR20220140576A true KR20220140576A (ko) 2022-10-18

Family

ID=77770852

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227031142A Pending KR20220140576A (ko) 2020-03-19 2021-03-02 적층 압전 소자 및 전기 음향 변환기

Country Status (7)

Country Link
US (1) US12075211B2 (https=)
EP (1) EP4124066A4 (https=)
JP (1) JP7457790B2 (https=)
KR (1) KR20220140576A (https=)
CN (1) CN115244720A (https=)
TW (1) TW202137783A (https=)
WO (1) WO2021187086A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250114074A (ko) * 2023-02-28 2025-07-28 후지필름 가부시키가이샤 적층 압전 소자 및 전기 음향 변환기

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021199800A1 (https=) * 2020-03-30 2021-10-07
WO2023181699A1 (ja) * 2022-03-24 2023-09-28 富士フイルム株式会社 電気音響変換器
TWI828327B (zh) * 2022-09-22 2024-01-01 國立臺灣大學 寬頻高音質的壓電材料複合振膜聲學元件及其製造方法
CN117729500B (zh) * 2024-02-08 2024-04-30 成都纤声科技有限公司 一种声学压电结构、声学传感器和电子设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014209724A (ja) 2013-03-29 2014-11-06 富士フイルム株式会社 電気音響変換フィルム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02197183A (ja) * 1988-03-29 1990-08-03 Pennwalt Corp 積層圧電構造及びその形成方法
US5367500A (en) * 1992-09-30 1994-11-22 The United States Of America As Represented By The Secretary Of The Navy Transducer structure
JP2001230462A (ja) * 2000-02-17 2001-08-24 Minolta Co Ltd 圧電変換素子
JP2003078995A (ja) * 2001-09-03 2003-03-14 Taiyo Yuden Co Ltd 圧電音響装置
JP2009094259A (ja) * 2007-10-09 2009-04-30 Denso Corp 積層型圧電素子とその製造方法
JP5224113B2 (ja) * 2008-09-12 2013-07-03 アルプス電気株式会社 積層型アクチュエータ及びその製造方法
JP2010177867A (ja) * 2009-01-28 2010-08-12 Kyocera Corp 圧電スピーカ
WO2016039138A1 (ja) * 2014-09-12 2016-03-17 株式会社村田製作所 伸縮フィルム積層体、電子機器
EP3041059B1 (en) * 2014-12-31 2019-09-11 LG Display Co., Ltd. Multilayer actuator and display device comprising the same
JP6431984B2 (ja) * 2015-07-27 2018-11-28 富士フイルム株式会社 電気音響変換フィルムおよびその製造方法、ならびに、電気音響変換器、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
JP6683029B2 (ja) 2016-06-20 2020-04-15 コニカミノルタ株式会社 圧電素子、超音波探触子および超音波撮像装置
WO2019078053A1 (ja) * 2017-10-18 2019-04-25 パナソニックIpマネジメント株式会社 圧電デバイス及びその製造方法
CN113140669B (zh) * 2020-01-19 2024-05-24 北京小米移动软件有限公司 压电组件及制作方法、屏幕部件和移动终端

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014209724A (ja) 2013-03-29 2014-11-06 富士フイルム株式会社 電気音響変換フィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250114074A (ko) * 2023-02-28 2025-07-28 후지필름 가부시키가이샤 적층 압전 소자 및 전기 음향 변환기

Also Published As

Publication number Publication date
US12075211B2 (en) 2024-08-27
JP7457790B2 (ja) 2024-03-28
EP4124066A1 (en) 2023-01-25
JPWO2021187086A1 (https=) 2021-09-23
WO2021187086A1 (ja) 2021-09-23
US20230019706A1 (en) 2023-01-19
TW202137783A (zh) 2021-10-01
EP4124066A4 (en) 2023-09-06
CN115244720A (zh) 2022-10-25

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