TW202137783A - 積層壓電元件及電聲轉換器 - Google Patents

積層壓電元件及電聲轉換器 Download PDF

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Publication number
TW202137783A
TW202137783A TW110108600A TW110108600A TW202137783A TW 202137783 A TW202137783 A TW 202137783A TW 110108600 A TW110108600 A TW 110108600A TW 110108600 A TW110108600 A TW 110108600A TW 202137783 A TW202137783 A TW 202137783A
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TW
Taiwan
Prior art keywords
piezoelectric
layer
piezoelectric film
film
protrusion
Prior art date
Application number
TW110108600A
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English (en)
Chinese (zh)
Inventor
芦川輝男
平口和男
香川裕介
三好哲
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202137783A publication Critical patent/TW202137783A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
TW110108600A 2020-03-19 2021-03-11 積層壓電元件及電聲轉換器 TW202137783A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020049274 2020-03-19
JP2020-049274 2020-03-19
JP2020-212292 2020-12-22
JP2020212292 2020-12-22

Publications (1)

Publication Number Publication Date
TW202137783A true TW202137783A (zh) 2021-10-01

Family

ID=77770852

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110108600A TW202137783A (zh) 2020-03-19 2021-03-11 積層壓電元件及電聲轉換器

Country Status (7)

Country Link
US (1) US12075211B2 (https=)
EP (1) EP4124066A4 (https=)
JP (1) JP7457790B2 (https=)
KR (1) KR20220140576A (https=)
CN (1) CN115244720A (https=)
TW (1) TW202137783A (https=)
WO (1) WO2021187086A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021199800A1 (https=) * 2020-03-30 2021-10-07
WO2023181699A1 (ja) * 2022-03-24 2023-09-28 富士フイルム株式会社 電気音響変換器
TWI828327B (zh) * 2022-09-22 2024-01-01 國立臺灣大學 寬頻高音質的壓電材料複合振膜聲學元件及其製造方法
CN120604526A (zh) * 2023-02-28 2025-09-05 富士胶片株式会社 层叠压电元件及电声换能器
CN117729500B (zh) * 2024-02-08 2024-04-30 成都纤声科技有限公司 一种声学压电结构、声学传感器和电子设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02197183A (ja) * 1988-03-29 1990-08-03 Pennwalt Corp 積層圧電構造及びその形成方法
US5367500A (en) * 1992-09-30 1994-11-22 The United States Of America As Represented By The Secretary Of The Navy Transducer structure
JP2001230462A (ja) * 2000-02-17 2001-08-24 Minolta Co Ltd 圧電変換素子
JP2003078995A (ja) * 2001-09-03 2003-03-14 Taiyo Yuden Co Ltd 圧電音響装置
JP2009094259A (ja) * 2007-10-09 2009-04-30 Denso Corp 積層型圧電素子とその製造方法
JP5224113B2 (ja) * 2008-09-12 2013-07-03 アルプス電気株式会社 積層型アクチュエータ及びその製造方法
JP2010177867A (ja) * 2009-01-28 2010-08-12 Kyocera Corp 圧電スピーカ
JP6005089B2 (ja) * 2013-03-29 2016-10-12 富士フイルム株式会社 電気音響変換フィルム
WO2016039138A1 (ja) * 2014-09-12 2016-03-17 株式会社村田製作所 伸縮フィルム積層体、電子機器
EP3041059B1 (en) * 2014-12-31 2019-09-11 LG Display Co., Ltd. Multilayer actuator and display device comprising the same
JP6431984B2 (ja) * 2015-07-27 2018-11-28 富士フイルム株式会社 電気音響変換フィルムおよびその製造方法、ならびに、電気音響変換器、フレキシブルディスプレイ、声帯マイクロフォンおよび楽器用センサー
JP6683029B2 (ja) 2016-06-20 2020-04-15 コニカミノルタ株式会社 圧電素子、超音波探触子および超音波撮像装置
WO2019078053A1 (ja) * 2017-10-18 2019-04-25 パナソニックＩｐマネジメント株式会社 圧電デバイス及びその製造方法
CN113140669B (zh) * 2020-01-19 2024-05-24 北京小米移动软件有限公司 压电组件及制作方法、屏幕部件和移动终端

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Publication number Publication date
US12075211B2 (en) 2024-08-27
JP7457790B2 (ja) 2024-03-28
EP4124066A1 (en) 2023-01-25
JPWO2021187086A1 (https=) 2021-09-23
WO2021187086A1 (ja) 2021-09-23
KR20220140576A (ko) 2022-10-18
US20230019706A1 (en) 2023-01-19
EP4124066A4 (en) 2023-09-06
CN115244720A (zh) 2022-10-25

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