CN115172241A - Silicon chip self-positioning dry etching device - Google Patents
Silicon chip self-positioning dry etching device Download PDFInfo
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- CN115172241A CN115172241A CN202210677726.3A CN202210677726A CN115172241A CN 115172241 A CN115172241 A CN 115172241A CN 202210677726 A CN202210677726 A CN 202210677726A CN 115172241 A CN115172241 A CN 115172241A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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Abstract
The invention discloses a silicon wafer self-positioning dry etching device.A silicon wafer supporting device and a silicon wafer positioning device are arranged on a lower bin body, the silicon wafer supporting device comprises a supporting rod, the silicon wafer positioning device comprises a positioning rod, the supporting rod is driven by a first power device, the positioning rod is driven by a second power device, a supporting hole and a positioning hole are arranged on a placing platform, a cooling groove is arranged in a silicon wafer placing area on the placing platform, an air inlet interface is arranged on a workbench, an upper mounting plate is arranged on the upper bin body, an upper electrode reaction plate is fixed on the upper mounting plate, an etching hole is arranged on the upper electrode reaction plate, the upper mounting plate is driven by a linear motor, and a compression structure is arranged on the upper mounting plate; the device can place the silicon chip in the silicon chip and place the regional time through the locating lever accuracy and place, and effectively fix the silicon chip when the etching, avoids revealing of cooling gas, makes the silicon chip accurately carry out the sculpture, guarantees production efficiency and production quality.
Description
Technical Field
The invention relates to a silicon wafer self-positioning dry etching device, which is suitable for the field of semiconductor production.
Background
In the semiconductor manufacturing process, the etching of monocrystalline silicon and polycrystalline silicon generally comprises wet etching and dry etching, and the two methods have advantages and disadvantages respectively; dry etching is a technique for etching a thin film using plasma, and when gas exists in the form of plasma, it has two characteristics: on one hand, the chemical activity of the gases in the plasma is much stronger than that of the gases in a normal state, and the gases can react with the materials more quickly by selecting proper gases according to the difference of the etched materials, so that the aim of etching removal is fulfilled; on the other hand, the electric field can be used for guiding and accelerating the plasma, so that the plasma has certain energy, and when the plasma bombards the surface of an etched object, atoms of the material of the etched object can be knocked out, so that the aim of etching is fulfilled by utilizing physical energy transfer, the etched substance is changed into volatile gas, and the volatile gas is pumped out through an air pumping system, and finally the depth required to be realized is etched according to the requirement of a designed pattern; therefore, dry etching is a result of balancing the physical and chemical processes on the wafer surface; at present, a dry etching device comprises a workbench, a vacuum reaction bin for performing dry etching on a silicon wafer is installed on the workbench, the vacuum reaction bin comprises an upper bin body and a lower bin body which are fixedly matched with each other, a feed inlet is formed in the lower bin body, a feed inlet opening and closing mechanism is installed at the feed inlet, a placing platform is arranged in the lower bin body, a silicon wafer placing area is arranged on the placing platform, a support rod capable of sliding in a lifting mode is arranged on the placing platform and used for supporting the silicon wafer fed from the feed inlet, a cooling groove for cooling back is formed in the placing platform, the silicon wafer is placed in the placing area and then covers the cooling groove, cooling gas is introduced into the cooling groove to cool the silicon wafer in an etching process, however, errors can exist in the silicon wafer feeding process through a feeding mechanical arm, errors can also occur when the support rod supports the silicon wafer, the support is placed in the placing area and covers the cooling gas, so that the gas in the cooling groove leaks into the vacuum reaction bin, the leaked gas affects the vacuum degree, the etching of the plasma gas also affects the etching quality, and the heat dissipation of the silicon wafer is caused to be low, and the silicon wafer is caused by the poor in the heat dissipation rate.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the device can accurately place the silicon wafer in a silicon wafer placing area through the positioning rod, so that the silicon wafer can be accurately etched, and the production efficiency and the production quality are ensured.
In order to solve the technical problem, the technical scheme of the invention is as follows: a silicon wafer self-positioning dry etching device comprises a workbench, wherein a vacuum reaction bin for performing dry etching on a silicon wafer is mounted on the workbench, the vacuum reaction bin comprises an upper bin body and a lower bin body which are fixedly matched with each other, a feed inlet is formed in the lower bin body, a feed inlet opening and closing mechanism is mounted at the feed inlet, a placing platform is arranged in the lower bin body, a silicon wafer placing area is arranged on the placing platform, a silicon wafer supporting device and a silicon wafer positioning device are arranged on the lower bin body, the silicon wafer supporting device comprises a plurality of axial telescopic supporting rods which extend out from the silicon wafer placing area and are used for supporting the silicon wafer, the silicon wafer positioning device comprises a plurality of axial telescopic positioning rods which extend out from the silicon wafer placing area and are used for positioning the silicon wafer, and the supporting rods are driven by a first power device to reciprocate between a supporting station and a first standby machine station, the positioning rod is driven by a second power device to reciprocate between the positioning station and a second standby station, a support hole and a positioning hole which are in one-to-one correspondence with the support rod and the positioning rod are formed in the placing platform, a cooling groove which is used for cooling the silicon wafer is formed in a silicon wafer placing area on the placing platform, an air inlet port which is used for communicating cooling gas to enter the cooling groove is formed in the workbench, an upper mounting plate is arranged on the upper bin body in a descending sliding mode, an upper electrode reaction plate is fixed on the upper mounting plate, a plurality of etching holes which are used for introducing etching gas are formed in the upper electrode reaction plate, the upper mounting plate is driven by a linear motor to reciprocate between the etching station and a third standby station, and a compression structure which is used for elastically compressing the edge of the silicon wafer is arranged on the upper mounting plate.
As a preferred scheme, the support rod is fixedly mounted on the support seat, the positioning rod is fixedly mounted on the positioning seat, two or more sliding rods are uniformly and radially arranged on the support seat, axially extending strip-shaped through holes corresponding to the sliding rods one to one are formed in the positioning seat, the positioning seat is sleeved on the support seat, the sliding rods are constrained in the strip-shaped through holes, the support rod at the first standby station is lower than the positioning rod at the second standby station, the support rod at the support station is higher than the positioning rod at the positioning station, a positioning force application structure for keeping the positioning rod at the positioning station is arranged between the positioning seat and the workbench, the first power device and the second power device adopt a set of supporting and positioning linear power devices, and the supporting and positioning linear power devices are connected with the support seat.
As a preferred scheme, the positioning force application structure comprises a force application spring arranged between the positioning seat and the workbench, the positioning seat is forced to move from the second standby station to the positioning station by the elasticity of the force application spring, and when the positioning seat is located at the positioning station, the force application spring is in a free state.
As a preferable scheme, the positioning force application structure comprises a plurality of damping rings, and the damping rings are arranged in the positioning holes or are sleeved and fixed on the positioning rods.
As an optimal scheme, compact structure includes a clamping ring, be equipped with a plurality of guide rods on the clamping ring, the upper end of guide rod is run through go up the mounting panel, the upper end of guide rod be fixed with last mounting panel upper surface contact's stopper, the cover is equipped with buffer spring on the guide rod, buffer spring is located go up between mounting panel and the clamping ring.
As a preferred scheme, positioning plugs which correspond to the positioning holes one by one and block the positioning holes are fixed on the periphery of the pressing ring; the end of the positioning plug is conical.
As a preferred scheme, the top of the positioning rod is provided with an inclination angle which is convenient for guiding the silicon wafer to fall into the silicon wafer placing area when the supporting rod falls.
As a preferred scheme, feed inlet closing mechanism including set up in the door frame on the mouth edge of feed inlet, be provided with the spout on the door frame, install the door shrouding in the spout, the door shrouding is opened or is closed the feed inlet by the drive of door shrouding linear power device.
After the technical scheme is adopted, the invention has the effects that: the silicon wafer self-positioning dry etching device comprises a workbench, wherein a vacuum reaction bin for performing dry etching on a silicon wafer is arranged on the workbench, the vacuum reaction bin comprises an upper bin body and a lower bin body which are fixedly matched with each other, a feed inlet is arranged on the lower bin body, a feed inlet opening and closing mechanism is arranged at the feed inlet, a placing platform is arranged in the lower bin body, a silicon wafer placing area is arranged on the placing platform, a silicon wafer supporting device and a silicon wafer positioning device are arranged on the lower bin body, the silicon wafer supporting device comprises a plurality of supporting rods which axially extend and retract and extend out of the silicon wafer placing area for supporting the silicon wafer, the silicon wafer positioning device comprises a plurality of positioning rods which axially extend and extend out of the silicon wafer placing area for positioning the silicon wafer, and the supporting rods are driven by a first power device to reciprocate between a supporting station and a first standby machine station, the positioning rod is driven by a second power device to reciprocate between a positioning station and a second standby station, a support hole and a positioning hole which are in one-to-one correspondence with the support rod and the positioning rod are arranged on the placing platform, a cooling groove for cooling the silicon wafer is arranged in a silicon wafer placing area on the placing platform, an air inlet port for communicating cooling gas to enter the cooling groove is arranged on the workbench, an upper mounting plate is arranged on the upper bin body in a lifting sliding mode, an upper electrode reaction plate is fixed on the upper mounting plate, a plurality of etching holes for introducing etching gas are formed in the upper electrode reaction plate, the upper mounting plate is driven by a linear motor to reciprocate between the etching station and a third standby station, and a pressing structure for elastically pressing the edge of the silicon wafer is arranged on the upper mounting plate; therefore, firstly, the opening and closing mechanism of the feeding hole is opened, the first power device drives the supporting rod to ascend to the supporting station, the mechanical arm places the silicon wafer on the supporting rod, the feeding hole is closed, the second power device drives the positioning rod to ascend to the positioning station, then the supporting rod gradually descends, the silicon wafer is positioned through the positioning rod until the supporting rod returns to the first standby station, the silicon wafer falls into the silicon wafer placing region, the positioning rod also descends to the second standby station, then the linear motor drives the upper mounting plate to the etching station, so that the pressing structure can elastically press the edge of the silicon wafer, the silicon wafer is attached to the cooling groove and accurately covers the cooling groove, meanwhile, cooling gas is introduced from the gas inlet interface, the vacuum reaction chamber is vacuumized, etching gas is introduced into etching holes in the upper electrode reaction plate, etching reaction is started on the silicon wafer, after etching is completed, the supporting rod jacks up the silicon wafer, the feeding hole is opened, and the silicon wafer is replaced through the mechanical arm; the device can place the silicon chip in the silicon chip and place the regional time through the locating lever accuracy and place, and effectively fix the silicon chip when the etching, avoids revealing of cooling gas, makes the silicon chip accurately carry out the sculpture, guarantees production efficiency and production quality.
The support rod is fixedly arranged on the support seat, the positioning rod is fixedly arranged on the positioning seat, two or more sliding rods are uniformly arranged on the support seat in the radial direction, the positioning seat is provided with axially extending strip-shaped through holes which correspond to the sliding rods one by one, the positioning seat is sleeved on the support seat, the sliding rods are restrained in the strip-shaped through holes, the support rod at a first standby station is lower than the positioning rod at a second standby station, the support rod at a support station is higher than the positioning rod at a positioning station, a positioning force application structure for keeping the positioning rod at the positioning station is arranged between the positioning seat and the workbench, the first power device and the second power device adopt a set of support positioning linear power devices, and the support positioning linear power devices are connected with the support seat; when the supporting and positioning linear power device drives the supporting rod on the supporting seat to move towards the supporting station, the sliding rod slides upwards in the strip-shaped through hole, when the sliding rod is contacted with the upper part of the strip-shaped through hole, the positioning seat is driven to move upwards, then the supporting rod continuously moves upwards to the supporting station, the positioning rod continuously moves upwards to the positioning station, and the supporting rod is higher than the positioning rod to facilitate the feeding of the silicon wafer; when the bracing piece on the supporting seat during to first standby station removes, the slide bar lapse, the positioning seat is owing to fix a position application of force structure also keeps at the location station, the bracing piece is less than the locating lever this moment gradually, the silicon chip consequently can fix a position, when slide bar and the contact of bar through-hole lower part, drive the positioning seat lapse, make the silicon chip accuracy fall into the silicon chip and place the region, also drive the positioning seat lapse simultaneously to the second standby station, the structure of simplifying like this, the cost is reduced, and improve production quality.
Because location application of force structure is including setting up the application of force spring between positioning seat and workstation, application of force spring's elasticity forces the positioning seat to remove to the location station by second standby station, when the positioning seat is in the location station, application of force spring is in free state, and when the bracing piece reachd the support station from first standby station position, the positioning seat was because the embodiment spring also followed rises, and after the positioning seat reachd the location station, application of force spring was in free state, can not rise, has guaranteed that the bracing piece is higher than the locating lever, and when the bracing piece got back to first standby station from the support station, application of force spring had certain elasticity and places the positioning seat and then descends, until slide bar and bar through-hole lower part contact, drives the positioning seat and descends to second standby station, and application of force spring is compressed this moment, makes next time positioning seat can arrive the location station after kick-backing back, guarantees that the silicon chip location is accurate.
And because the positioning force application structure comprises a plurality of damping rings, the damping rings are arranged in the positioning holes or are sleeved and fixed on the positioning rods, in the process that the supporting rods move downwards, the positioning rods are kept at the positioning stations under the damping action of the damping rings, so that the silicon wafers descend along with the supporting rods and are positioned by the positioning rods, then the sliding rods are contacted with the lower parts of the strip-shaped through holes to drive the positioning seats to move downwards, finally the silicon wafers fall into a silicon wafer placing area, and meanwhile, the positioning rods and the supporting rods are respectively positioned at a second standby station and a first standby station, and the positioning rods and the supporting rods can also be driven by one power at the same time.
Because compact structure includes a clamping ring, be equipped with a plurality of guide bars on the clamping ring, the upper end of guide bar is run through go up the mounting panel, the upper end of guide bar is fixed with the stopper with last mounting panel surface contact, the cover is equipped with buffer spring on the guide bar, buffer spring is located go up between mounting panel and the clamping ring, make the clamping ring be connected with last mounting panel through stopper and guide bar can axial displacement when buffer spring compresses, like this when exerting pressure to the silicon chip, the guide bar guides the spring, avoids the compression of spring to take place the skew, makes the silicon chip effectively compress tightly.
Positioning plugs which correspond to the positioning holes one by one and block the positioning holes are fixed on the periphery of the pressing ring; the end part of the positioning plug is conical, and the sealing performance is not good enough in the etching process of the positioning hole, so that the positioning hole is blocked by the positioning plug, the good sealing performance is ensured, the vacuum degree in the vacuum reaction bin can be ensured to meet the etching requirement, and meanwhile, the etching quality reduction caused by the irregular flowing of etching gas in the vacuum reaction bin due to the fact that the gas enters from the positioning hole is avoided.
And because the top of the positioning rod is provided with the inclination angle which is convenient for guiding the silicon wafer to fall into the silicon wafer placing area when the supporting rod falls, the inclination angle can guide the silicon wafer to fall into the silicon wafer placing area in the falling process of the supporting rod, and the accuracy is improved.
The silicon wafer etching device comprises a feeding hole, a feeding hole opening and closing mechanism and a feeding mechanism, wherein the feeding hole opening and closing mechanism is arranged on the feeding hole, the feeding hole opening and closing mechanism comprises a door frame arranged on the edge of the feeding hole, a sliding groove is formed in the door frame, a door sealing plate is installed in the sliding groove, the door sealing plate is driven by a door sealing plate linear power device to open or close the feeding hole, the silicon wafer needs to be subjected to etching reaction in a closed environment, but a manipulator is needed to perform feeding, the silicon wafer can be conveniently fed by opening the door sealing plate, and a closed cavity is formed after the door sealing plate is closed, so that the etching reaction can be performed.
Drawings
The invention is further illustrated by the following examples in conjunction with the drawings.
FIG. 1 is a perspective view of an embodiment of the present invention;
FIG. 2 is a schematic structural view of the upper cartridge body with the outer shell removed in accordance with an embodiment of the present invention;
FIG. 3 is a left side view of the lower cartridge body of the embodiment of the present invention;
FIG. 4 isbase:Sub>A cross-sectional view of FIG. 3 at A-A;
FIG. 5 is a schematic structural view of the upper cartridge body of the embodiment of the present invention;
FIG. 6 is a schematic structural view of a positioning rod and a support rod according to an embodiment of the invention;
FIG. 7 is a schematic structural view of a cooling groove according to an embodiment of the present invention;
in the drawings: 1. a housing; 2. an upper working platform; 3. a middle working platform; 4. a lower working platform; 5. a first cylinder; 6. a supporting base; 61. a slide bar; 7. positioning seats; 71. a strip-shaped through hole; 8. a support bar; 9. positioning a rod; 91. a damping ring; 10. placing a platform; 101. a silicon wafer placement area; 102. a support hole; 103. positioning holes; 11. cooling the groove; 111. a strip-shaped groove; 12. a feed inlet; 13. a door seal plate; 14. a door frame; 141. a chute; 15. a second cylinder; 16. an air inlet interface; 17. a linear motor; 18. an upper mounting plate; 19. an upper electrode reaction plate; 191. etching the hole; 20. pressing a ring; 21. a guide rod; 22. a buffer spring; 23. a positioning plug; 24. a limiting block; 25. an upper bin body; 26. a lower bin body.
Detailed Description
The present invention is described in further detail below by way of specific examples.
As shown in fig. 1 to 7, a silicon wafer self-positioning dry etching device comprises a worktable, a vacuum reaction bin for dry etching a silicon wafer is mounted on the worktable, the vacuum reaction bin comprises an upper bin body 25 and a lower bin body 26 which are fixedly matched with each other, a feed inlet 12 is arranged on the lower bin body 26, a feed inlet 12 opening and closing mechanism is mounted at the position of the feed inlet 12, a placing platform 10 is arranged in the lower bin body 26, a silicon wafer placing region 101 is arranged on the placing platform 10, a silicon wafer supporting device and a silicon wafer positioning device are arranged on the lower bin body 26, the silicon wafer supporting device comprises a plurality of supporting rods 8 which axially extend and extend out from the silicon wafer placing region 101 for supporting the silicon wafer, the silicon wafer positioning device comprises a plurality of positioning rods 9 which axially extend and extend out around the silicon wafer placing region 101 for positioning the silicon wafer, the supporting rods 8 are driven by a first power device to reciprocate between the supporting station and a first standby motor station, the positioning rods 9 are driven by a second power device to reciprocate between the positioning station and the positioning rod 9, a positioning rod 103 and a positioning plate 11 which are driven by a second power device to reciprocate between the positioning station and a positioning plate 18 for cooling gas inlet, a mounting plate 18 is arranged on the positioning plate for cooling the silicon wafer, a mounting plate 18 for cooling and a linear cooling gas inlet 17 for cooling groove 16 for cooling the silicon wafer on the mounting plate is arranged on the silicon wafer placing platform, the mounting plate 18, go up to be provided with on the mounting panel 18 and be used for elasticity to compress tightly the compact structure at silicon chip edge, linear electric motor 17 fixed mounting is at housing 1 top, housing 1 is used for isolated vacuum reaction storehouse and external contact, because linear electric motor 17 simple structure, the motion is steady and has the characteristic of high accuracy, consequently can accurate control go up the distance between electrode reaction plate 19 and the silicon chip, improves the accuracy.
As shown in fig. 3 and 7, the cooling groove 11 is annular, and further includes a strip groove 111 extending from a center of the circle and communicating with the cooling groove 11, the strip groove 111 corresponds to the support rods 8 one to one, and the support rods 8 extend from the strip groove 111, so that the silicon wafer is deformed due to heat generated during the etching process, the etching is inaccurate, the cooling gas is helium, when the silicon wafer is located in the silicon wafer placing region 101, the helium is introduced into the cooling groove 11 through the gas inlet port 16 and is uniformly distributed through the strip groove, the back of the silicon wafer is cooled, the temperature of the back is controlled to be about 20 ℃, the heat generation is effectively reduced, and the production quality is improved.
As shown in fig. 1 and 5, the support rod 8 is fixedly mounted on the support seat 6, the positioning rod 9 is fixedly mounted on the positioning seat 7, two or more sliding rods 61 are uniformly radially arranged on the support seat 6, the positioning seat 7 is provided with axially extending strip-shaped through holes 71 corresponding to the sliding rods 61 one by one, the positioning seat 7 is sleeved on the support seat 6, the sliding rods 61 are constrained in the strip-shaped through holes 71, the support rod 8 at a first standby station is lower than the positioning rod 9 at a second standby station, the support rod 8 at a support station is higher than the positioning rod 9 at a positioning station, a positioning force application structure for keeping the positioning rod 9 at the positioning station is arranged between the positioning seat 7 and the workbench, the first power device and the second power device adopt a set of support positioning linear power device, and the support positioning linear power device is connected with the support seat 6; the supporting and positioning linear power device adopts a first cylinder 5, the working table comprises three layers of working platforms, the three layers of working platforms comprise an upper working platform 2, a middle working platform 3 and a lower working platform 4, the first cylinder 5 is fixedly installed on the lower working platform 4, a guide rod of the first cylinder 5 penetrates through the middle working platform 3 to be connected with a supporting seat 6, a positioning seat 7 is sleeved on the supporting seat 6, the bottoms of the positioning seat 7 and the supporting seat 6 are flush, a sliding rod 61 is positioned at the lower part of a strip-shaped through hole 71, the positioning seat 7 and the supporting seat 6 are installed on the middle working platform 3, a supporting rod 8 fixed on the supporting seat 6 is driven upwards through the first cylinder 5, the sliding rod 61 slides upwards in the strip-shaped through hole 71 until the sliding rod is contacted with the upper part of the strip-shaped through hole 71, then the positioning seat 7 is driven to move upwards, the supporting rod 8 is higher than the positioning rod 9 and synchronously upwards, the silicon wafer is ensured to be not influenced when being placed, the supporting rod 8 forms a supporting area for placing the silicon wafer, after the silicon wafer is placed, the supporting rod 61 slides downwards in the strip-shaped through hole 71 until the silicon wafer is placed, the supporting rod 9, the supporting area is accurately placed, the silicon wafer is placed in the supporting seat 101, and the silicon wafer is placed in the silicon wafer is accurately placed area, and the silicon wafer is placed in the supporting area, and the silicon wafer is placed area, and the silicon wafer is accurately placed area; the first standby station is a state that the supporting rod 8 and the supporting seat 6 are located on the middle working platform 3, the second standby station is a state that the positioning rod 9 and the positioning seat 7 are located on the middle working platform 3, and the supporting station is a state that the supporting rod 8 and the supporting seat 6 are located at the same time with the feeding port 12.
In this embodiment, the positioning force application structure includes a force application spring disposed between the positioning seat 7 and the workbench, the positioning seat 7 is forced to move from the second standby station to the positioning station by the elastic force of the force application spring, and when the positioning seat 7 is at the positioning station, the force application spring is in a free state; the force application spring can produce a power that rises positioning seat 7 jack-up, when supporting seat 6 and positioning seat 7 are in first standby station and second standby station, slide bar 61 is in bar through-hole 71 lower part, positioning seat 7 just is pushed down to supporting seat 6, when supporting seat 6 moves to the support station, supporting seat 6 also can follow the removal owing to force application spring, until after positioning seat 7 reachs the positioning station, force application spring is in free state and just can not continue to rise, supporting seat 6 continues to rise and reachs the support station, when supporting seat 6 moves to first standby station from the support station, supporting seat 6 descends earlier, positioning seat 7 descends because force application spring keeps motionless until slide bar 61 and bar through-hole 71 lower part contact, drive together again.
Further, another scheme can be adopted for the positioning force application structure, as shown in fig. 6, the positioning force application structure includes a plurality of damping rings 91, and the damping rings 91 are disposed in the positioning holes 103 or are fixed on the positioning rod 9 in a sleeved manner; being equipped with damping ring 91 and guaranteeing that when positioning seat 7 does not contact bar through-hole 71 upper portion or lower part at slide bar 61, can not remove, consequently two kinds of schemes are when supporting seat 6 upwards or when the lapse, and the homoenergetic guarantees that positioning seat 7 can not follow supporting seat 6 and take place to remove, can not take place bracing piece 8 and be less than locating lever 9 when supporting the station or can't descend scheduling problem alone when needing the location, ensure the accuracy of location.
As shown in fig. 2 and 5, the compressing structure includes a compression ring 20, a plurality of guide rods 21 are arranged on the compression ring 20, the upper ends of the guide rods 21 penetrate through the upper mounting plate 18, a limiting block 24 in surface contact with the upper surface of the upper mounting plate 18 is fixed at the upper ends of the guide rods 21, a buffer spring 22 is sleeved on each guide rod 21, the buffer spring 22 is located between the upper mounting plate 18 and the compression ring 20, the compression ring 20 can be connected with the upper mounting plate 18 through the limiting block 24 and the guide rods 21, and when the buffer spring 22 is compressed, the guide rods 21 can guide the compression direction, so that the compression accuracy is ensured; when the linear motor 17 drives the pressure ring 20 and the upper mounting plate 18 to descend, the pressure ring 20 firstly touches the silicon wafer, at the moment, the pressure ring 20 is enabled to compress the edge part of the silicon wafer through the buffer spring 22, the upper mounting plate 18 continues to descend until reaching an etching station, the silicon wafer can be compressed without deviation, a space is reserved between the upper electrode reaction plate 19 and the silicon wafer, etching gas is introduced into the etching hole 191 to etch the silicon wafer, and the production accuracy is guaranteed.
As shown in fig. 4 and 5, positioning plugs 23 corresponding to the positioning holes 103 one to one and blocking the positioning holes 103 are fixed around the pressing ring 20; the end part of the positioning plug 23 is conical; because the existence of the positioning hole 103 causes insufficient sealing performance in the etching production, after the pressure ring 20 is contacted with the edge of the silicon wafer, the positioning plug 23 can enter the positioning hole 103, the buffer spring 22 is continuously compressed, the positioning plug 23 can go deep into the positioning hole 103 until the positioning hole 103 is plugged, and the positioning plug 23 blocks the positioning hole 103, so that good sealing performance is ensured. Therefore, the vacuum degree in the vacuum reaction bin can be ensured to meet the etching requirement, and meanwhile, the etching quality reduction caused by the irregular flowing of the etching gas in the vacuum reaction bin due to the fact that the gas enters from the positioning hole is avoided.
As shown in fig. 6, the top of the positioning rod 9 is provided with an inclination angle which is convenient for guiding the silicon wafer to fall into the silicon wafer placing area 101 when the supporting rod 8 falls, and the inclination angle has a certain inclination, so that when the supporting rod 8 falls, the silicon wafer falls into the positioning area, the edge of the silicon wafer falls along the inclination angle to be accurately positioned, and the placing accuracy is effectively ensured.
In this embodiment, the opening and closing mechanism of the feed inlet 12 includes a door frame 14 arranged on the edge of the feed inlet 12, a sliding groove 141 is formed in the door frame 14, a door sealing plate 13 is installed in the sliding groove 141, the door sealing plate 13 is driven by a linear power device of the door sealing plate 13 to open or close the feed inlet 12, the linear power device of the door sealing plate 13 includes a second cylinder 15, the second cylinder 15 is fixedly installed on the lower bin 26, the opening and closing of the door sealing plate 13 is controlled through the extension of a guide rod of the second cylinder 15, the feeding of silicon wafers is facilitated, the feed inlet 12 can be sealed, and the sealing environment during etching is guaranteed.
The working principle of the invention is as follows: firstly, opening the housing 1, driving the supporting seat 6 to ascend by the first air cylinder 5, driving the positioning seat 7 to ascend after the sliding rod 61 on the supporting seat 6 is contacted with the upper part of the strip-shaped through hole 71 until the supporting rod 8 reaches the supporting station and the positioning rod 9 reaches the positioning station, then retracting the guide rod by the second air cylinder 15, driving the door sealing plate 13 to ascend, opening the feed port 12, placing a silicon wafer to be etched on the supporting rod 8 by a manipulator, closing the feed port 12, driving the supporting rod 8 to move towards the first standby machine by the first air cylinder 5, enabling the silicon wafer to enter the positioning area to be contacted with the inclination angle of the positioning rod 9, driving the positioning rod 9 to synchronously descend after the sliding rod 61 slides from the upper part to the lower part of the strip-shaped through hole 71 until the supporting rod 8 reaches the first standby station, the positioning rod 9 returns to the second standby station, the silicon wafer accurately falls into the placing area, then the linear motor 17 drives the upper mounting plate 18 and the upper electrode reaction plate 19 to descend, after the silicon wafer arrives at the etching station, the pressing ring 20 on the upper mounting plate 18 presses the edge position of the silicon wafer through the buffer spring 22, the positioning plug 23 blocks the positioning hole 103, then etching gas is sprayed out from the etching hole 191 in the upper electrode reaction plate 19, etching is started until the etching is finished, the upper electrode reaction plate 19 returns to the third standby station, the supporting rod 8 and the positioning rod 9 repeat the steps to arrive at the supporting station and the positioning station, the feeding hole 12 is opened, the etched silicon wafer is taken out, a new silicon wafer is placed, and then the etching steps are repeated.
The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.
Claims (8)
1. The utility model provides a silicon chip is from dry etching device who locates, includes the workstation, install the vacuum reaction storehouse that is used for carrying out dry etching to the silicon chip on the workstation, the vacuum reaction storehouse is including the upper bin body and the lower storehouse body of mutual fixed fit, be provided with the feed inlet on the lower storehouse body, feed inlet department installs feed inlet closing mechanism, the internal place platform that is provided with of storehouse down, the last silicon chip that is equipped with of place platform places region, its characterized in that: the silicon wafer positioning device comprises a plurality of axially telescopic supporting rods extending out of a silicon wafer placing area and used for supporting a silicon wafer, the silicon wafer positioning device comprises a plurality of axially telescopic positioning rods extending out of the silicon wafer placing area and used for positioning the silicon wafer, the supporting rods are driven by a first power device to reciprocate between a supporting station and a first standby station, the positioning rods are driven by a second power device to reciprocate between the positioning station and a second standby station, supporting holes and positioning holes which correspond to the supporting rods and the positioning rods one to one are formed in a placing platform, a cooling groove used for cooling the silicon wafer is formed in the silicon wafer placing area on the placing platform, an air inlet interface used for communicating cooling air to the cooling groove is formed in the workbench, an upper mounting plate is installed on the upper bin body in a lifting and sliding mode, an upper electrode reaction plate is fixed on the upper mounting plate, a plurality of etching holes used for introducing etching air are formed in the upper electrode reaction plate, the upper mounting plate is driven by a linear motor to move between an etching station and a third standby station, and a compression structure used for elastically compressing the edge of the silicon wafer is arranged on the upper mounting plate.
2. The silicon wafer self-positioning dry etching device according to claim 1, wherein: the support rod is fixedly installed on the support seat, the positioning rod is fixedly installed on the positioning seat, two or more sliding rods are uniformly and radially arranged on the support seat, axially extending strip-shaped through holes corresponding to the sliding rods one to one are formed in the positioning seat, the positioning seat is sleeved on the support seat, the sliding rods are constrained in the strip-shaped through holes, the support rod at a first standby station is lower than the positioning rod at a second standby station, the support rod at a supporting station is higher than the positioning rod at a positioning station, a positioning force application structure for keeping the positioning rod at the positioning station is arranged between the positioning seat and the workbench, the first power device and the second power device adopt a set of supporting and positioning linear power devices, and the supporting and positioning linear power devices are connected with the support seat.
3. The silicon wafer self-positioning dry etching device according to claim 2, wherein: the positioning and force applying structure comprises a force applying spring arranged between the positioning seat and the workbench, the positioning seat is forced to move from the second standby station to the positioning station by the elasticity of the force applying spring, and the force applying spring is in a free state when the positioning seat is positioned at the positioning station.
4. The silicon wafer self-positioning dry etching device according to claim 2, wherein: the positioning force application structure comprises a plurality of damping rings, and the damping rings are arranged in the positioning holes or are sleeved and fixed on the positioning rods.
5. The silicon wafer self-positioning dry etching device according to claim 3 or 4, characterized in that: the pressing structure comprises a pressing ring, a plurality of guide rods are arranged on the pressing ring, the upper ends of the guide rods are penetrated through the upper mounting plate, the upper ends of the guide rods are fixed with limiting blocks in surface contact with the upper mounting plate, the guide rods are sleeved with buffer springs, and the buffer springs are located between the upper mounting plate and the pressing ring.
6. The silicon wafer self-positioning dry etching device according to claim 5, wherein: positioning plugs which correspond to the positioning holes one by one and block the positioning holes are fixed on the periphery of the pressure ring; the end part of the positioning plug is conical.
7. The silicon wafer self-positioning dry etching device according to claim 6, wherein: the top of the positioning rod is provided with an inclination angle which is convenient for the silicon chip to fall into the silicon chip placing area when the supporting rod falls.
8. The silicon wafer self-positioning dry etching device according to claim 7, wherein: the feed inlet opening and closing mechanism comprises a door frame arranged on the edge of the feed inlet, a chute is arranged on the door frame, a door sealing plate is installed in the chute, and the feed inlet is opened or closed by the door sealing plate driven by a linear power device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210677726.3A CN115172241A (en) | 2022-06-15 | 2022-06-15 | Silicon chip self-positioning dry etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210677726.3A CN115172241A (en) | 2022-06-15 | 2022-06-15 | Silicon chip self-positioning dry etching device |
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| CN115172241A true CN115172241A (en) | 2022-10-11 |
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| CN202210677726.3A Pending CN115172241A (en) | 2022-06-15 | 2022-06-15 | Silicon chip self-positioning dry etching device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117438370A (en) * | 2023-12-21 | 2024-01-23 | 无锡星微科技有限公司杭州分公司 | Precise ejection mechanism of automatic wafer sorting machine |
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2022
- 2022-06-15 CN CN202210677726.3A patent/CN115172241A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117438370A (en) * | 2023-12-21 | 2024-01-23 | 无锡星微科技有限公司杭州分公司 | Precise ejection mechanism of automatic wafer sorting machine |
| CN117438370B (en) * | 2023-12-21 | 2024-03-19 | 无锡星微科技有限公司杭州分公司 | Precise ejection mechanism of automatic wafer sorting machine |
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