CN217691110U

CN217691110U - Positioning jacking mechanism of dry etching machine

Info

Publication number: CN217691110U
Application number: CN202221510142.9U
Authority: CN
Inventors: 黄鹏飞; 刘毅; 何昌武
Original assignee: Jiangsu Jinyuda Semiconductor Co ltd
Current assignee: Jiangsu Jinyuda Semiconductor Co ltd
Priority date: 2022-06-15
Filing date: 2022-06-15
Publication date: 2022-10-28
Anticipated expiration: 2032-06-15

Abstract

The utility model discloses a location climbing mechanism of dry etching machine, location climbing mechanism includes silicon chip strutting arrangement and silicon chip positioner, and silicon chip strutting arrangement includes a plurality of spinal branch vaulting poles, and silicon chip positioner includes a plurality of locating levers, is equipped with supported hole and locating hole on the place the platform, and bracing piece fixed mounting is on the supporting seat, and locating lever fixed mounting is on the positioning seat, radially sets up the slide bar on the supporting seat, has seted up the bar through-hole on the positioning seat, and the positioning seat suit is on the supporting seat, and the slide bar retrains in the bar through-hole, and the bracing piece drives the bracing piece through supporting location straight line power device and reciprocates between support station and first standby station, and the locating lever drives the positioning seat through the supporting seat and reciprocates between location station and second standby station; the mechanism can support the silicon wafer and enables the silicon wafer to accurately fall into the placement area through matching and positioning with the positioning rod, so that the etching accuracy is ensured, and the yield is improved.

Description

Positioning jacking mechanism of dry etching machine

Technical Field

The utility model relates to a location climbing mechanism of dry etching machine is applicable to the field that the semiconductor manufacture was made.

Background

Dry etching is a technique for etching a thin film using plasma, and when gas exists in the form of plasma, it has two characteristics: on one hand, the chemical activity of the gases in the plasma is much stronger than that of the gases in the normal state, and the gases can react with the materials more quickly by selecting proper gases according to different etched materials, so that the aim of etching removal is fulfilled; on the other hand, the electric field can be used for guiding and accelerating the plasma, so that the plasma has certain energy, and when the plasma bombards the surface of an etched object, atoms of the material of the etched object can be knocked out, so that the aim of etching is fulfilled by utilizing physical energy transfer, the etched substance is changed into volatile gas, and the volatile gas is pumped out through an air pumping system, and finally the depth required to be realized is etched according to the requirement of a designed pattern; at present, a dry etching device comprises a workbench, a lower bin body for dry etching of a silicon wafer is mounted on the workbench, a feed inlet is formed in the lower bin body, a feed inlet opening and closing mechanism is mounted at the feed inlet, a placing platform is arranged in the lower bin body, a silicon wafer placing area is arranged on the placing platform, a support rod capable of sliding in a lifting mode is arranged on the placing platform and used for supporting the silicon wafer fed from the feed inlet, a cooling groove for back cooling is formed in the placing platform, the silicon wafer is placed in the placing area and covers the cooling groove, cooling gas is introduced into the cooling groove to cool the silicon wafer in the etching process, however, errors can be generated in the feeding process of a feeding manipulator, and the support rod supports the silicon wafer to be connected, so that the silicon wafer cannot be accurately placed in the placing area and covers the cooling gas, gas in the cooling groove can leak and enter a vacuum reaction bin, the leaked gas influences the vacuum degree, and can influence the etching of plasma gas, thereby causing the reduction of etching quality, and the cooling gas can cause the heat dissipation of the silicon wafer which cannot be well leaked in the etching process, and the processed silicon wafer is deformed, and the yield is low.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the positioning jacking mechanism of the dry etching machine can support a silicon wafer and is matched with a positioning rod to position the silicon wafer accurately in a placement area, so that the etching accuracy is ensured, and the yield is improved.

In order to solve the technical problem, the technical scheme of the utility model is that: the utility model provides a location climbing mechanism of dry etching machine, location climbing mechanism installs on the workstation, fixed mounting has place the platform on the workstation, it places region, its characterized in that to be equipped with the silicon chip on the place the platform: the positioning jacking mechanism comprises a silicon wafer supporting device and a silicon wafer positioning device, the silicon wafer supporting device comprises a plurality of axial telescopic supporting rods and a plurality of axial telescopic positioning rods, the supporting rods stretch out of a silicon wafer placing area and are used for supporting the silicon wafer, the silicon wafer positioning device comprises a plurality of axial telescopic positioning rods, the positioning rods stretch out of the silicon wafer placing area and are used for positioning the silicon wafer, supporting holes and positioning holes which correspond to the supporting rods and the positioning rods one to one are formed in a placing platform, the supporting rods are fixedly mounted on a supporting seat, the positioning rods are fixedly mounted on a positioning seat, two sliding rods which correspond to each other are uniformly radially arranged on the supporting seat, axially extending bar-shaped through holes which correspond to the sliding rods one to one are formed in the positioning seat, the positioning seat is sleeved on the supporting seat, the sliding rods are constrained in the bar-shaped through holes, the supporting rods drive the supporting rods to reciprocate between the supporting station and a first standby station through a supporting positioning linear power device, the positioning rods drive the positioning seat to reciprocate between the positioning station and a second standby station through the supporting seat, and the supporting rod is higher than the positioning rod which is positioned at the positioning station.

As a preferred scheme, the working platform comprises an upper working platform, a middle working platform and a lower working platform, the supporting and positioning linear power device is fixedly installed on the lower working platform, the positioning seat and the supporting seat are installed on the middle working platform, and the placing platform is fixedly installed on the upper working platform; and a positioning force application structure for keeping the positioning rod at the positioning station is arranged between the positioning seat and the middle working platform.

As a preferred scheme, the positioning force application structure comprises a force application spring arranged between the positioning seat and the middle working platform, the positioning seat is forced to move from the second standby station to the positioning station by the elasticity of the force application spring, and when the positioning seat is located at the positioning station, the force application spring is in a free state.

As a preferred scheme, a plurality of spring holes for containing the force application springs are formed in the middle working platform, and guide rods which stretch into the spring holes and correspond to the spring holes one to one are arranged below the positioning seats.

As a preferable scheme, the positioning force application structure comprises a plurality of damping rings, and the damping rings are arranged in the positioning holes or are sleeved and fixed on the positioning rods.

As a preferable scheme, a guide inclined plane convenient for guiding the silicon wafer is arranged at the top end of the positioning rod, and the guide inclined plane is in contact fit with the edge of the silicon wafer.

After the technical scheme is adopted, the utility model discloses an effect is: because the location climbing mechanism of dry process etching machine, location climbing mechanism installs on the workstation, fixed mounting has place the platform on the workstation, it places region, its characterized in that to be equipped with the silicon chip on the place the platform: the positioning jacking mechanism comprises a silicon wafer supporting device and a silicon wafer positioning device, the silicon wafer supporting device comprises a plurality of axially telescopic supporting rods and positioning rods, the supporting rods axially telescopic supporting rods extend out of a silicon wafer placing area and are used for supporting a silicon wafer, the silicon wafer positioning device comprises a plurality of axially telescopic positioning rods extending out of the silicon wafer placing area and surrounding the silicon wafer placing area and used for positioning the silicon wafer, supporting holes and positioning holes in one-to-one correspondence with the supporting rods and the positioning rods are formed in a placing platform, the supporting rods are fixedly mounted on a supporting seat, the positioning rods are fixedly mounted on a positioning seat, two or more sliding rods are radially and uniformly arranged on the supporting seat, axially extending strip-shaped through holes in one-to-one correspondence with the sliding rods are formed in the positioning seat, the positioning seat is sleeved on the supporting seat, the sliding rods are restrained in the strip-shaped through holes, the supporting rods are driven to reciprocate between a supporting station and a first standby station through a supporting and positioning linear power device, the positioning rod drives the positioning seat to reciprocate between the positioning station and a second standby station through the supporting seat, and the supporting rod at the supporting station is higher than the positioning rod at the positioning station; firstly, a supporting and positioning linear power device drives a supporting seat to move to a supporting station, when a sliding rod is in contact with the upper part of a strip-shaped through hole of a positioning seat, a positioning seat is driven to ascend until a supporting rod on the supporting seat reaches the supporting station, a positioning rod on the positioning seat also reaches the positioning station, a silicon wafer is placed on the supporting rod at the moment, then the supporting and positioning linear power device drives the supporting seat to move to a first standby machine, the supporting rod descends, the edge of the silicon wafer is in contact with the positioning rod for positioning, when the sliding rod is in contact with the upper part of the strip-shaped through hole of the positioning seat, the positioning seat is driven to descend until the supporting rod returns to the first standby station, the positioning rod returns to a second standby station, and the silicon wafer accurately falls into a silicon wafer placing area; the silicon wafer positioning mechanism can support a silicon wafer and enables the silicon wafer to accurately fall into a placement area through matching positioning of the positioning rod, etching accuracy is guaranteed, yield is improved, actions of the positioning rod and the supporting rod are linked with each other and driven through a set of supporting and positioning linear power device, the actions are accurate and reliable, and cost is low.

The working platform comprises an upper working platform, a middle working platform and a lower working platform, the supporting and positioning linear power device is fixedly arranged on the lower working platform, the positioning seat and the supporting seat are arranged on the middle working platform, and the placing platform is fixedly arranged on the upper working platform; the positioning force application structure for keeping the positioning rod at the positioning station is arranged between the positioning seat and the middle working platform, and the positioning rod cannot descend along with the sliding rod before the sliding rod is contacted with the lower part of the strip-shaped through hole in the descending process of the supporting rod.

The positioning force application structure comprises a force application spring arranged between the positioning seat and the middle working platform, the positioning seat is forced to move from the second standby station to the positioning station by the elasticity of the force application spring, and when the positioning seat is positioned at the positioning station, the force application spring is in a free state; the middle working platform is provided with a plurality of spring holes for containing force application springs, guide rods which extend into the spring holes and correspond to the spring holes one by one are arranged below the positioning seat, the force application springs are placed in the spring holes, when the positioning rod is positioned at a second standby station, the guide rods are positioned in the spring holes and compress the force application springs, when the supporting rod moves towards a supporting station, the force application springs release pressure, the supporting seat and the positioning seat rise together until the force application springs are in a free state, the positioning seat cannot rise, the positioning rod reaches the positioning station, the supporting rod continues to rise until the supporting station is reached, when the supporting rod moves towards a first standby station, the positioning seat descends, the force application springs have certain elasticity, the positioning seat keeps still until the sliding rod contacts with the lower part of the strip-shaped through hole, the positioning seat is driven to descend, the guide rods compress the force application springs, and the next force application springs release pressure; the guide rod is positioned in the spring hole, so that the force application spring is prevented from generating deviation when compressing or releasing pressure, the positioning rod is not lifted in place, the positioning accuracy can be ensured by adopting the guide rod, and the positioning rod and the supporting rod are driven by one power at the same time.

Because the locating force application structure comprises a plurality of damping rings, the damping rings are arranged in the locating holes or are sleeved and fixed on the locating rods, the locating rods are kept at locating stations under the damping action of the damping rings in the downward moving process of the supporting rods, the silicon wafers descend along with the supporting rods and are located by the locating rods, then the sliding rods are in contact with the lower portions of the strip-shaped through holes to drive the locating seats to move downward, finally the silicon wafers fall into a silicon wafer placing area, the locating rods and the supporting rods are respectively located at a second standby station and a first standby station, and similarly, the locating rods and the supporting rods can be driven by one power at the same time.

And because the top end of the positioning rod is provided with a guide inclined plane convenient for guiding the silicon wafer, the guide inclined plane is in contact fit with the edge of the silicon wafer, and after the edge of the silicon wafer is in contact with the guide inclined plane, the silicon wafer is guided to be positioned along with the descending of the supporting rod, so that the silicon wafer can accurately fall into a silicon wafer placing area, the etching is accurate, and the yield is improved.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a perspective view of an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of the embodiment of the present invention installed on a workbench;

FIG. 3 is a schematic view of a half-section of an embodiment of the present invention using a damping ring;

FIG. 4 is a schematic half-sectional view of an embodiment of the present invention using a force applying spring;

in the drawings: 1. an upper working platform; 2. a middle working platform; 3. a lower working platform; 4. placing a platform; 41. a silicon wafer placement area; 5. a support hole; 6. positioning holes; 7. a supporting seat; 71. a slide bar; 8. positioning seats; 81. a strip-shaped through hole; 9. a support bar; 10. positioning a rod; 101. a guide slope; 11. a linear cylinder; 12. a force application spring; 13. a spring hole; 14. a guide bar; 15. a damping ring.

Detailed Description

The present invention will be described in further detail with reference to the following specific examples.

As shown in fig. 1 to 4, a location climbing mechanism of dry etching machine, location climbing mechanism installs on the workstation, fixed mounting has place the platform 4 on the workstation, place the regional 41, its characterized in that are placed to last silicon chip that is equipped with of platform: the positioning jacking mechanism comprises a silicon wafer supporting device and a silicon wafer positioning device, the silicon wafer supporting device comprises a plurality of axial telescopic devices and a supporting rod 9 extending out of a silicon wafer placing area 41 and used for supporting a silicon wafer, the silicon wafer positioning device comprises a plurality of axial telescopic devices and a positioning rod 10 extending out of the silicon wafer placing area 41 and used for positioning the silicon wafer, a supporting hole 5 and a positioning hole 6 which correspond to the supporting rod 9 and the positioning rod 10 one to one are formed in a placing platform 4, the supporting rod 9 is fixedly installed on a supporting seat 7, the positioning rod 10 is fixedly installed on the positioning seat 8, two or more sliding rods 71 are radially and uniformly arranged on the supporting seat 7, axially extending bar-shaped through holes 81 which correspond to the sliding rods 71 one to one are formed in the positioning seat 8, the positioning seat 8 is sleeved on the supporting seat 7, the sliding rods 71 are constrained in the bar-shaped through holes 81, the supporting rod 9 drives the supporting seat 7 to reciprocate between a supporting station and a first standby station through a supporting positioning linear power device, the positioning rod 10 drives the positioning seat 8 to reciprocate between the positioning station and a second standby station, and the supporting rod 9 is higher than the positioning station.

In this embodiment, the working platform includes an upper working platform 1, a middle working platform 2 and a lower working platform 3, the supporting and positioning linear power device is fixedly installed on the lower working platform 3, the positioning seat 8 and the supporting seat 7 are installed on the middle working platform 2, and the placement platform 4 is fixedly installed on the upper working platform 1; a positioning force application structure for keeping the positioning rod 10 at a positioning station is arranged between the positioning seat 8 and the middle working platform 2, the positioning linear power device comprises a linear cylinder 11, the linear cylinder 11 can control the lifting of the supporting seat 7 through the stretching of the guide rod, and the supporting seat 7 controls the lifting of the positioning seat 8, so that the cost is effectively reduced by adopting one set of power device.

As shown in fig. 3, the positioning force application structure includes a force application spring 12 disposed between the positioning seat 8 and the middle working platform 2, the positioning seat 8 is forced to move from the second standby station to the positioning station by the elastic force of the force application spring 12, and when the positioning seat 8 is at the positioning station, the force application spring 12 is in a free state; the middle working platform 2 is provided with a plurality of spring holes 13 for accommodating force application springs 12, guide rods 14 which extend into the spring holes 13 and correspond to the spring holes 13 one by one are arranged below the positioning seat 8, the force application springs 12 are placed in the spring holes 13, when the positioning rod 10 is located at a second standby station, the guide rods 14 are located in the spring holes 13 and compress the force application springs 12, when the supporting rod 9 moves towards the supporting station, the force application springs 12 release pressure, the supporting seat 7 and the positioning seat 8 rise together until the force application springs 12 are in a free state, the positioning seat 8 cannot rise, the positioning rod 10 reaches the positioning station, the supporting rod 9 continues to rise until the supporting station, so that silicon wafers can be placed on the supporting rod 9, when the supporting rod 9 moves towards the first standby station, the positioning seat 8 descends, the force application springs 12 have certain elasticity, the positioning seat 8 remains motionless until the sliding rod 71 contacts with the lower part of the strip-shaped through hole 81, the positioning seat 8 descends, the guide rods 14 compress the force application springs 12, and waits for the next time when the force application springs 12 release pressure; the guide rod 14 is arranged in the spring hole 13, so that the force application spring 12 can be prevented from generating deviation when compressing or releasing pressure, the deviation can cause the positioning rod 10 not to ascend in place, the guide rod 14 can ensure accurate positioning, and one power can drive the positioning rod 10 and the supporting rod 9 at the same time.

As shown in fig. 4, the positioning force application structure includes a plurality of damping rings 15, and the damping rings 15 are disposed in the positioning holes 6 or fixed on the positioning rod 10 in a sleeving manner; when the damping ring 15 is arranged on the positioning rod 10, the linear air cylinder 11 drives the supporting seat 7 to ascend, and when the sliding rod 71 is in contact with the upper part of the strip-shaped through hole 81, the positioning seat 8 is driven to ascend, so that the damping ring 15 arranged on the positioning rod 10 is positioned in the positioning hole 6, the supporting rod 9 descends to return to the first standby station, and as the damping ring 15 has certain resistance, the positioning rod 10 is kept still before the sliding rod 71 is in contact with the lower part of the strip-shaped through hole 81, and the positioning rod 10 is driven to descend after the contact, so that the effective positioning can be realized; similarly, when damping ring 15 sets up in locating hole 6, behind damping ring 15 contact in locating lever 10 and the locating hole 6, can't further stretch into, drive locating lever 10 and stretch into in damping ring 15 after slide bar 71 contacts with bar through-hole 81 upper portion, move to first standby work when bracing piece 9, locating lever 10 is in damping ring 15, just can't remove, slide bar 71 just drives locating lever 10 and descends after contacting with bar through-hole 81 lower part, the silicon chip that is finally on bracing piece 9 falls into silicon chip and places regional 41, locating lever 10 and bracing piece 9 are in second standby work position and first standby work position respectively simultaneously, also can realize a power and drive locating lever 10 and bracing piece 9 simultaneously.

In this embodiment, the supporting rod 9 at the first standby station is lower than the positioning rod 10 at the second standby station, and the supporting rod 9 at the supporting station is higher than the positioning rod 10 at the positioning station; the supporting rod 9 at the supporting station needs to carry out loading and unloading of the silicon chip, so that when the supporting rod 9 at the supporting station is higher than the positioning rod 10 at the positioning station, the loading and unloading of the silicon chip cannot be blocked, and the manipulator is convenient to place; when positioning is carried out, the supporting rod 9 is required to descend, the edge of the silicon wafer is in contact with the positioning rod 10, the position is accurately positioned, the supporting seat 7 drives the positioning seat 8 to descend through the sliding rod 71, therefore, the supporting rod 9 at the first standby station is lower than the positioning rod 10 at the second standby station, and the silicon wafer positioning is ensured.

As shown in fig. 1, a guide inclined plane 101 for facilitating the guidance of the silicon wafer is arranged at the top end of the positioning rod 10, and the guide inclined plane 101 is in contact fit with the edge of the silicon wafer; after the edge of the silicon wafer is contacted with the guide inclined plane 101, the guide inclined plane 101 guides the silicon wafer to be positioned along with the descending of the supporting rod 9, so that the silicon wafer can accurately fall into the silicon wafer placing area 41, the etching is accurate, and the yield is improved. The utility model discloses a theory of operation: firstly, a linear cylinder 11 drives a positioning driving supporting seat 7 to ascend, a sliding rod 71 on the supporting seat 7 is contacted with the upper part of a strip-shaped through hole 81 and then drives a positioning seat 8 to ascend, a damping ring 15 on a positioning rod 10 enters a positioning hole 6 until a supporting rod 9 reaches a supporting station, the positioning rod 10 reaches the positioning station, a silicon wafer is placed on the supporting rod 9 at the moment, the linear cylinder 11 drives the supporting rod 9 to move towards a first standby station, the positioning rod 10 keeps still, the edge of the silicon wafer is contacted with the positioning rod 10 to be positioned until the sliding rod 71 is contacted with the lower part of the strip-shaped through hole 81 to drive the positioning seat 8 to descend, the silicon wafer falls into a placing area, the supporting rod 9 returns to the first standby station, the positioning rod 10 returns to a second standby station, and jacking positioning can be carried out by repeating the operations.

The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.

Claims

1. The utility model provides a location climbing mechanism of dry etching machine, location climbing mechanism installs on the workstation, fixed mounting has place the platform on the workstation, it places region, its characterized in that to be equipped with the silicon chip on the place the platform: the positioning jacking mechanism comprises a silicon wafer supporting device and a silicon wafer positioning device, the silicon wafer supporting device comprises a plurality of axial telescopic devices and a supporting rod extending out of a silicon wafer placing area and used for supporting a silicon wafer, the silicon wafer positioning device comprises a plurality of axial telescopic devices and a positioning rod extending out of the silicon wafer placing area and used for positioning the silicon wafer, a supporting hole and a positioning hole are formed in a placing platform and correspond to the supporting rod and the positioning rod one to one, the supporting rod is fixedly mounted on a supporting seat, the positioning rod is fixedly mounted on a positioning seat, two sliding rods and more than two sliding rods are uniformly and radially arranged on the supporting seat, a strip-shaped through hole extending in the axial direction corresponding to the sliding rods one to one is formed in the positioning seat, the positioning seat is sleeved on the supporting seat, the sliding rods are constrained in the strip-shaped through hole, the supporting rod drives the supporting rod to reciprocate between a supporting station and a first standby station through a supporting and positioning linear power device, the positioning rod drives the positioning seat to reciprocate between the positioning station and a second standby station through the supporting seat, and the supporting rod is higher than the positioning rod at the positioning station.

2. The positioning and jacking mechanism of the dry etching machine according to claim 1, wherein: the working platform comprises an upper working platform, a middle working platform and a lower working platform, the supporting and positioning linear power device is fixedly arranged on the lower working platform, the positioning seat and the supporting seat are arranged on the middle working platform, and the placing platform is fixedly arranged on the upper working platform; and a positioning force application structure for keeping the positioning rod at a positioning station is arranged between the positioning seat and the middle working platform.

3. The positioning and jacking mechanism of the dry etching machine according to claim 2, wherein: the positioning force application structure comprises a force application spring arranged between the positioning seat and the middle working platform, the positioning seat is forced to move from the second standby station to the positioning station by the elasticity of the force application spring, and when the positioning seat is positioned at the positioning station, the force application spring is in a free state.

4. The positioning and jacking mechanism of the dry etching machine, as recited in claim 3, wherein: the middle working platform is provided with a plurality of spring holes for accommodating force application springs, and guide rods which stretch into the spring holes and correspond to the spring holes one to one are arranged below the positioning seats.

5. The positioning and jacking mechanism of the dry etching machine according to claim 2, wherein: the positioning force application structure comprises a plurality of damping rings, and the damping rings are arranged in the positioning holes or are sleeved and fixed on the positioning rods.

6. The positioning and jacking mechanism of the dry etching machine, as recited in any one of claims 1 to 5, wherein: the top end of the positioning rod is provided with a guide inclined plane convenient for guiding the silicon wafer, and the guide inclined plane is in contact fit with the edge of the silicon wafer.