CN115083981A - Adsorption jacking device of dry etching machine - Google Patents

Adsorption jacking device of dry etching machine Download PDF

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Publication number
CN115083981A
CN115083981A CN202210677719.3A CN202210677719A CN115083981A CN 115083981 A CN115083981 A CN 115083981A CN 202210677719 A CN202210677719 A CN 202210677719A CN 115083981 A CN115083981 A CN 115083981A
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China
Prior art keywords
positioning
silicon wafer
supporting
station
seat
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Pending
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CN202210677719.3A
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Chinese (zh)
Inventor
陆春辉
刘毅
黄鹏飞
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Jiangsu Jinyuda Semiconductor Co ltd
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Jiangsu Jinyuda Semiconductor Co ltd
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Priority to CN202210677719.3A priority Critical patent/CN115083981A/en
Publication of CN115083981A publication Critical patent/CN115083981A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses an adsorption jacking device of a dry etching machine, wherein a lower bin body is provided with a silicon wafer supporting device and a silicon wafer positioning device, the silicon wafer supporting device comprises a supporting rod, the silicon wafer positioning device comprises a positioning rod, the supporting rod is driven by a first power device to reciprocate between a supporting station and a first standby station, the positioning rod is driven by a second power device to reciprocate between the positioning station and a second standby station, a supporting hole and a positioning hole are formed in a placing platform, a cooling groove for cooling a silicon wafer is formed in a silicon wafer placing area on the placing platform, and an air inlet interface for communicating cooling gas to enter the cooling groove is formed in a working table; the workbench is also provided with an adsorption device for adsorbing the silicon wafer on the placing platform; the device can place the silicon chip in the silicon chip and place the regional time accurate placing through the locating lever, and effectively fix the silicon chip, avoids revealing of cooling gas, makes the silicon chip accurately carry out the sculpture, guarantees production efficiency and production quality.

Description

Adsorption jacking device of dry etching machine
Technical Field
The invention relates to an adsorption jacking device of a dry etching machine, which is suitable for the field of semiconductor production and manufacturing.
Background
Dry etching is a technique for etching a thin film using plasma, and when gas exists in the form of plasma, it has two characteristics: on one hand, the chemical activity of the gases in the plasma is much stronger than that of the gases in a normal state, and the gases can react with the materials more quickly by selecting proper gases according to the difference of the etched materials, so that the aim of etching removal is fulfilled; on the other hand, the electric field can be used for guiding and accelerating the plasma, so that the plasma has certain energy, atoms of the material of the etched object can be knocked out when the plasma bombards the surface of the etched object, the aim of etching is achieved by utilizing physical energy transfer, the etched substance is changed into volatile gas, the volatile gas is extracted through an air extraction system, and finally the depth required to be achieved by people is etched according to the requirement of a design pattern; at present, a dry etching device comprises a workbench, a lower bin body for dry etching a silicon wafer is mounted on the workbench, a feed inlet is arranged on the lower bin body, a feed inlet opening and closing mechanism is mounted at the feed inlet, a placing platform is arranged in the lower bin body, a silicon wafer placing area is arranged on the placing platform, a support rod capable of sliding in a lifting manner is arranged on the placing platform and used for supporting the silicon wafer fed from the feed inlet, a cooling groove for back cooling is arranged on the placing platform, the silicon wafer is placed in the placing area and then covers the cooling groove, cooling gas is introduced into the cooling groove to cool the silicon wafer in the etching process, however, errors can exist in the feeding process of the silicon wafer by a feeding manipulator, and errors can also be generated when the support rod supports the silicon wafer to be connected, so that the silicon wafer cannot be accurately placed in the placing area and cover the cooling gas, therefore, the gas for cooling the groove can leak and enter the vacuum reaction bin, the leaked gas influences the vacuum degree and the etching of the plasma gas, so that the etching quality is reduced, the leakage of the cooling gas in the etching process can not well dissipate heat, and the processed silicon wafer is deformed, so that the yield is low.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the utility model provides an absorption jacking device of dry etching machine, the device can place the silicon chip in the silicon chip and place regional time through the locating lever accuracy and place, and effectively fixed to the silicon chip, avoids revealing of cooling gas, makes the silicon chip accurately carry out the sculpture, guarantees production efficiency and production quality.
In order to solve the technical problems, the technical scheme of the invention is as follows: an adsorption jacking device of a dry etching machine comprises a workbench, wherein a lower bin body for dry etching of a silicon wafer is mounted on the workbench, a feed inlet is formed in the lower bin body, a feed inlet opening and closing mechanism is mounted at the feed inlet, a placing platform is arranged in the lower bin body, a silicon wafer placing area is arranged on the placing platform, a silicon wafer supporting device and a silicon wafer positioning device are arranged on the lower bin body, the silicon wafer supporting device comprises a plurality of supporting rods which axially extend and retract and extend out of the silicon wafer placing area for supporting the silicon wafer, the silicon wafer positioning device comprises a plurality of positioning rods which axially extend and retract and extend out of the silicon wafer placing area for positioning the silicon wafer, the supporting rods are driven by a first power device to reciprocate between a supporting station and a first standby station, and the positioning rods are driven by a second power device to reciprocate between the positioning station and a second standby station, the silicon wafer cooling device comprises a placing platform, a cooling groove, a workbench and a cooling gas inlet port, wherein the placing platform is provided with supporting holes and positioning holes which correspond to supporting rods and positioning rods one to one, the placing platform is positioned in a silicon wafer placing area and is internally provided with the cooling groove for cooling a silicon wafer, and the workbench is provided with the gas inlet port for communicating cooling gas to enter the cooling groove; and the workbench is also provided with an adsorption device for adsorbing the silicon wafer on the placing platform.
As a preferable scheme, the supporting rod is fixedly arranged on the supporting seat, the positioning rod is fixedly arranged on the positioning seat, two or more sliding rods are uniformly arranged on the supporting seat in the radial direction, strip-shaped through holes which are axially extended and correspond to the sliding rods one by one are arranged on the positioning seat, the positioning seat is sleeved on the supporting seat, the sliding rod is restrained in the strip-shaped through hole, the supporting rod at the first standby station is lower than the positioning rod at the second standby station, the supporting rod at the supporting station is higher than the positioning rod at the positioning station, a positioning force application structure which enables the positioning rod to be kept at a positioning station is arranged between the positioning seat and the workbench, the first power device and the second power device adopt a set of supporting and positioning linear power device, and the supporting and positioning linear power device is connected with the supporting seat.
As a preferred scheme, the positioning force application structure comprises a force application spring arranged between the positioning seat and the workbench, the positioning seat is forced to move from the second standby station to the positioning station by the elasticity of the force application spring, and when the positioning seat is located at the positioning station, the force application spring is in a free state.
As a preferable scheme, the positioning force application structure comprises a plurality of damping rings, and the damping rings are arranged in the positioning holes or sleeved and fixed on the positioning rods.
As an optimal scheme, a positioning guide inclined plane is arranged at the top of the positioning rod and is used for guiding the silicon wafer to fall into a silicon wafer placing area when the supporting rod falls down conveniently.
As a preferred scheme, feed inlet closing mechanism including set up in the door frame on the mouth edge of feed inlet, be provided with the spout on the door frame, install the door shrouding in the spout, the door shrouding is opened or is closed the feed inlet by the drive of door shrouding linear power device.
As a preferred scheme, a switch device which is matched with the positioning rod to block the positioning hole is arranged in the placing platform.
As a preferred scheme, switching device includes a plurality of slidable mounting be used for the shutoff block of shutoff locating hole in place the platform, be equipped with the slip region with the shutoff block one-to-one in the place the platform, the shutoff block afterbody is equipped with the resilient means who is connected with the slip region, the shutoff block be equipped with locating lever complex friction inclined plane, the upper end of locating lever be provided with the application of force inclined plane that the friction inclined plane contacted.
Preferably, the adsorption device is an electrostatic adsorption device.
After the technical scheme is adopted, the invention has the effects that: the adsorption jacking device of the dry etching machine comprises a workbench, a lower bin body for dry etching of a silicon wafer is mounted on the workbench, a feed inlet is arranged on the lower bin body, a feed inlet opening and closing mechanism is mounted at the feed inlet, a placing platform is arranged in the lower bin body, a silicon wafer placing area is arranged on the placing platform, a silicon wafer supporting device and a silicon wafer positioning device are arranged on the lower bin body, the silicon wafer supporting device comprises a plurality of supporting rods which axially extend and retract and extend out from the silicon wafer placing area for supporting the silicon wafer, the silicon wafer positioning device comprises a plurality of positioning rods which axially extend and retract and extend out from the silicon wafer placing area for positioning the silicon wafer, the supporting rods are driven by a first power device to reciprocate between a supporting station and a first standby station, and the positioning rods are driven by a second power device to reciprocate between the positioning station and a second standby station, the silicon wafer cooling device comprises a placing platform, a cooling groove, a working table and a cooling gas inlet port, wherein the placing platform is provided with supporting holes and positioning holes which are in one-to-one correspondence with supporting rods and positioning rods; the workbench is also provided with an adsorption device for adsorbing the silicon wafer on the placing platform; therefore, firstly, the opening and closing mechanism of the feeding hole is opened, the first power device drives the supporting rod to ascend to the supporting station, the mechanical arm places the silicon wafer on the supporting rod, the feeding hole is closed, the second power device drives the positioning rod to ascend to the positioning station, then the supporting rod descends gradually, the silicon wafer is positioned through the positioning rod until the supporting rod returns to the first standby station, the silicon wafer falls into the silicon wafer placing area, the positioning rod also descends to the second standby station, at the moment, the adsorption device firmly adsorbs the silicon wafer in the silicon wafer placing area, the silicon wafer is ensured to be attached to the cooling groove and accurately cover the cooling groove, and meanwhile, cooling gas is introduced from the gas inlet interface, so that the next etching operation can be carried out; after the silicon wafer is finished, the supporting rod jacks up the silicon wafer, the feeding hole is opened, and the silicon wafer is replaced through the manipulator; the device can place the silicon chip in the silicon chip and place the regional time accurate placing through the locating lever, and effectively fix the silicon chip, avoids revealing of cooling gas, makes the silicon chip accurately carry out the sculpture, guarantees production efficiency and production quality.
The support rod is fixedly arranged on the support seat, the positioning rod is fixedly arranged on the positioning seat, two or more sliding rods are uniformly arranged on the support seat in the radial direction, the positioning seat is provided with axially extending strip-shaped through holes which correspond to the sliding rods one by one, the positioning seat is sleeved on the support seat, the sliding rods are restrained in the strip-shaped through holes, the support rod at a first standby station is lower than the positioning rod at a second standby station, the support rod at a supporting station is higher than the positioning rod at a positioning station, a positioning force application structure for keeping the positioning rod at the positioning station is arranged between the positioning seat and the workbench, the first power device and the second power device adopt a set of supporting and positioning linear power devices, and the supporting and positioning linear power devices are connected with the support seat; when the supporting and positioning linear power device drives the supporting rod on the supporting seat to move towards the supporting station, the sliding rod slides upwards in the strip-shaped through hole, when the sliding rod is contacted with the upper part of the strip-shaped through hole, the positioning seat is driven to move upwards, then the supporting rod continuously moves upwards to the supporting station, the positioning rod continuously moves upwards to the positioning station, and the supporting rod is higher than the positioning rod to facilitate the feeding of the silicon wafer; when the bracing piece on the supporting seat during to first standby station removes, the slide bar lapse, the positioning seat is owing to fix a position application of force structure also keeps at the location station, the bracing piece is less than the locating lever this moment gradually, the silicon chip consequently can fix a position, when slide bar and the contact of bar through-hole lower part, drive the positioning seat lapse, make the silicon chip accuracy fall into the silicon chip and place the region, also drive the positioning seat lapse simultaneously to the second standby station, the structure of simplifying like this, the cost is reduced, and improve production quality.
And because the positioning force application structure comprises a force application spring arranged between the positioning seat and the workbench, the elastic force of the force application spring forces the positioning seat to move from the second standby station to the positioning station, when the positioning seat is positioned at the positioning station, the force application spring is in a free state, when the supporting rod arrives at the supporting station from the first standby station, the positioning seat ascends along with the force application spring, and after the positioning seat arrives at the positioning station, the force application spring is in a free state and does not ascend, so that the supporting rod is higher than the positioning rod, when the supporting rod returns to the first standby station from the supporting station, the force application spring has certain elastic force to place the positioning seat and descend along with the force application spring until the sliding rod contacts with the lower part of the strip-shaped through hole to drive the positioning seat to descend to the second standby station, at the moment, the force application spring is compressed, and after rebounding, the next positioning seat can arrive at the positioning station, and the silicon wafer is accurately positioned.
The positioning force application structure comprises a plurality of damping rings, and the damping rings are arranged in the positioning holes or are sleeved and fixed on the positioning rods; consequently, at the bracing piece in the downstream in-process, the locating lever keeps in the location station because the damping effect of damping ring, and the silicon chip follows the bracing piece decline and is fixed a position by the locating lever like this, and then slide bar and bar through-hole lower part contact will drive the positioning seat and move down, and final silicon chip falls into the silicon chip and places the region, and locating lever and bracing piece are in second standby station and first standby station respectively simultaneously, also can realize a power and drive locating lever and bracing piece simultaneously.
And because the top of the positioning rod is provided with a positioning guide inclined plane which is convenient for guiding the silicon wafer to fall into the silicon wafer placing area when the supporting rod falls, the positioning guide inclined plane can guide the silicon wafer to fall into the silicon wafer placing area in the falling process of the supporting rod, and the accuracy is improved.
The silicon wafer etching device comprises a feeding hole, a feeding hole opening and closing mechanism and a feeding mechanism, wherein the feeding hole opening and closing mechanism is arranged on the feeding hole, the feeding hole opening and closing mechanism comprises a door frame arranged on the edge of the feeding hole, a sliding groove is formed in the door frame, a door sealing plate is installed in the sliding groove, the door sealing plate is driven by a door sealing plate linear power device to open or close the feeding hole, the silicon wafer needs to be subjected to etching reaction in a closed environment, but a manipulator is needed to perform feeding, the silicon wafer can be conveniently fed by opening the door sealing plate, and a closed cavity is formed after the door sealing plate is closed, so that the etching reaction can be performed.
A switch device which is matched with the positioning rod to block the positioning hole is arranged in the placing platform; the sealing performance is not good enough in the etching process of the positioning hole, so that the opening and closing of the positioning hole are controlled through the switch device, the good sealing performance is guaranteed, the vacuum degree in the vacuum reaction bin can be guaranteed to meet the etching requirement, and meanwhile, the phenomenon that gas enters from the positioning hole to cause the irregular flowing of etching gas in the vacuum reaction bin to cause the reduction of etching quality is avoided. .
The switch device comprises a plurality of plugging blocks which are arranged in the placing platform in a sliding mode and used for plugging positioning holes, sliding areas which correspond to the plugging blocks one to one are arranged in the placing platform, a rebound device connected with the sliding areas is arranged at the tail parts of the plugging blocks, the plugging blocks are provided with friction inclined planes matched with the positioning rods, and force application inclined planes which are contacted with the friction inclined planes are arranged at the upper ends of the positioning rods; when the locating lever moves to the location station with the shutoff piece contact, can open the shutoff piece through application of force inclined plane and friction inclined plane contact, the locating lever just can reach the location station like this, when the locating lever gets back to second standby station, can go back the shutoff piece top through resilient means, the shutoff locating hole again, the locating lever forms the linkage with the shutoff piece like this, improves the device flexibility, guarantees good leakproofness.
And because the adsorption device is an electrostatic adsorption device, static electricity generated by the electrostatic adsorption device is applied to the silicon wafer to be adsorbed, so that the silicon wafer with the static electricity can be firmly adsorbed in the silicon wafer placing area, the cooling groove is effectively covered, and the cooling efficiency is ensured.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a perspective view of an embodiment of the present invention;
FIG. 2 is a top view of an embodiment of the present invention;
FIG. 3 is a cross-sectional view of FIG. 2 at A-A;
FIG. 4 is a schematic structural view of a support rod and a positioning rod according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a cooling groove according to an embodiment of the present invention;
in the drawings: 1. a lower bin body; 2. an upper working platform; 3. a middle working platform; 4. a lower working platform; 5. a first cylinder; 6. a supporting seat; 61. a slide bar; 7. positioning seats; 71. a strip-shaped through hole; 8. a support bar; 9. positioning a rod; 91. a damping ring; 10. placing a platform; 101. a silicon wafer placement area; 102. a support hole; 103. positioning holes; 11. cooling the groove; 111. a strip-shaped groove; 12. a feed inlet; 13. a door seal plate; 14. a door frame; 141. a chute; 15. a second cylinder; 16. an air inlet interface; 17. a plugging block; 18. a sliding region; 19. a return spring.
Detailed Description
The present invention is described in further detail below with reference to specific examples.
As shown in fig. 1 to 5, an absorption jacking device of a dry etching machine comprises a workbench, a lower bin body 1 for dry etching of a silicon wafer is mounted on the workbench, a feed inlet 12 is arranged on the lower bin body 1, a feed inlet 12 opening and closing mechanism is mounted at the feed inlet 12, a placing platform 10 is arranged in the lower bin body 1, and a silicon wafer placing area 101 is arranged on the placing platform 10, and is characterized in that: the lower bin body 1 is provided with a silicon wafer supporting device and a silicon wafer positioning device, the silicon wafer supporting device comprises a plurality of supporting rods 8 which are axially telescopic and extend out of the silicon wafer placing area 101 for supporting the silicon wafer, the silicon wafer positioning device comprises a plurality of positioning rods 9 which are axially telescopic and extend out around a silicon wafer placing area 101 for positioning a silicon wafer, the supporting rod 8 is driven by a first power device to reciprocate between a supporting station and a first standby station, the positioning rod 9 is driven by a second power device to reciprocate between a positioning station and a second standby station, the placing platform 10 is provided with a supporting hole 102 and a positioning hole 103 which are in one-to-one correspondence with the supporting rod 8 and the positioning rod 9, a cooling groove 11 for cooling the silicon wafer is arranged in the silicon wafer placing area 101 on the placing platform 10, the workbench is provided with an air inlet interface 16 for communicating cooling gas to enter the cooling groove 11; and the workbench is also provided with an adsorption device for adsorbing the silicon wafer on the placing platform 10.
As shown in fig. 2 and 5, the cooling groove 11 is annular, and further includes a strip groove 111 extending from a center of the circle and communicating with the cooling groove 11, the strip groove 111 corresponds to the support rods 8 one to one, and the support rods 8 extend from the strip groove 111, so that the silicon wafer is deformed due to heat generated during the etching process, the etching is inaccurate, the cooling gas is helium, when the silicon wafer is located in the silicon wafer placing region 101, the helium is introduced into the cooling groove 11 through the gas inlet port 16 and is uniformly distributed through the strip groove, the back of the silicon wafer is cooled, the temperature of the back is controlled to be about 20 ℃, the heat generation is effectively reduced, and the production quality is improved.
As shown in fig. 1 and 4, the support rod 8 is fixedly mounted on the support seat 6, the positioning rod 9 is fixedly mounted on the positioning seat 7, two or more sliding rods 61 are radially and uniformly arranged on the support seat 6, the positioning seat 7 is provided with axially extending strip-shaped through holes 71 corresponding to the sliding rods 61 one by one, the positioning seat 7 is sleeved on the support seat 6, the sliding rods 61 are constrained in the strip-shaped through holes 71, the support rod 8 at the first standby station is lower than the positioning rod 9 at the second standby station, the support rod 8 at the support station is higher than the positioning rod 9 at the positioning station, a positioning force application structure for keeping the positioning rod 9 at the positioning station is arranged between the positioning seat 7 and the workbench, and the first power device and the second power device adopt a set of supporting and positioning linear power device, the supporting and positioning linear power device is connected with the supporting seat 6; the supporting and positioning linear power device adopts a first cylinder 5, the workbench comprises three layers of working platforms, and comprises an upper working platform 2, a middle working platform 3 and a lower working platform 4, the placing platform 10 is fixedly arranged on the upper working platform 2, the first cylinder 5 is fixedly arranged on the lower working platform 4, a guide rod of the first cylinder 5 penetrates through the middle working platform 3 to be connected with a supporting seat 6, a positioning seat 7 is sleeved on the supporting seat 6, the bottoms of the positioning seat 7 and the supporting seat 6 are flush, a sliding rod 61 is positioned at the lower part of a strip-shaped through hole 71, the positioning seat 7 and the supporting seat 6 are arranged on the middle working platform 3, a support rod 8 fixed on the supporting seat 6 is driven upwards through the first cylinder 5, and the sliding rod 61 slides upwards in the strip-shaped through hole 71 until contacting with the upper part of the strip-shaped through hole 71 to drive the positioning seat 7 to move upwards, at the moment, the supporting rod 8 is higher than the positioning rod 9 and is upward synchronously, the silicon wafer is guaranteed to be placed without being affected, the supporting rod 8 forms a supporting area for placing the silicon wafer, after the silicon wafer is placed, the supporting rod 8 is driven to move downwards through the first air cylinder 5, the sliding rod 61 slides to the lower part in the strip-shaped through hole 71 at the moment, the supporting rod 8 is lower than the positioning rod 9, the silicon wafer on the supporting rod 8 falls into the positioning area formed by the positioning rod 9, then the supporting seat 6 drives the positioning seat 7 to move downwards synchronously until the silicon wafer falls into the silicon wafer placing area 101, the silicon wafer is placed accurately, and the production quality is improved; the first standby station is a state that the supporting rod 8 and the supporting seat 6 are located on the middle working platform 3, the second standby station is a state that the positioning rod 9 and the positioning seat 7 are located on the middle working platform 3, and the supporting station is a state that the supporting rod 8 and the supporting seat 6 are located at the same time with the feeding port 12.
In this embodiment, the positioning and force-applying structure includes a force-applying spring disposed between the positioning seat 7 and the working table, the elastic force of the force-applying spring forces the positioning seat 7 to move from the second standby station to the positioning station, when the positioning seat 7 is at the positioning station, the force-applying spring is in a free state, the force-applying spring generates a force for jacking up and raising the positioning seat 7, when the supporting seat 6 and the positioning seat 7 are at the first standby station and the second standby station, the sliding rod 61 is located at the lower portion of the strip-shaped through hole 71, the supporting seat 6 presses the positioning seat 7, when the supporting seat 6 moves to the supporting station, the supporting seat 6 moves along with the force-applying spring until the positioning seat 7 reaches the positioning station, the force-applying spring does not continue to raise when the supporting seat 6 reaches the supporting station, and when the supporting seat 6 moves from the supporting station to the first standby station, the supporting seat 6 descends first, and the positioning seat 7 is kept still by the force application spring until the sliding rod 61 contacts with the lower part of the strip-shaped through hole 71 and then is driven to descend.
Further, another scheme can be adopted for the positioning force application structure, as shown in fig. 4, the positioning force application structure includes a plurality of damping rings 91, and the damping rings 91 are disposed in the positioning holes 103 or are fixed on the positioning rod 9 in a sleeved manner; consequently, at bracing piece 8 in the downstream in-process, the locating lever 9 keeps in the location station because damping ring 91's damping effect, the silicon chip follows the bracing piece 8 to descend and fix a position by locating lever 9 like this, then slide bar 61 will drive positioning seat 7 downstream with bar through-hole 71 lower part contact, final silicon chip falls into silicon chip and places regional 101, two kinds of schemes are when supporting seat 6 upwards or when the downstream, can not take place to be less than the bracing piece 9 when supporting the station or need fix a position the unable scheduling problem that descends alone of bracing piece 8, ensure the accuracy of location.
As shown in fig. 4, the top of the positioning rod 9 is provided with a positioning guide inclined plane which is convenient for the supporting rod 8 to fall and guides the silicon wafer to fall into the silicon wafer placing region 101, and the positioning guide inclined plane has a certain inclination, so that when the supporting rod 8 falls, the silicon wafer falls into the positioning region, the edge of the silicon wafer falls along the positioning guide inclined plane to be accurately positioned, and the placing accuracy is effectively ensured.
In this embodiment, the opening and closing mechanism of the feed inlet 12 includes a door frame 14 arranged on the edge of the feed inlet 12, a sliding groove 141 is formed in the door frame 14, a door sealing plate 13 is installed in the sliding groove 141, the door sealing plate 13 is driven by a linear power device of the door sealing plate 13 to open or close the feed inlet 12, the linear power device of the door sealing plate 13 includes a second cylinder 15, the second cylinder 15 is fixedly installed on the lower bin body 1, the opening and closing of the door sealing plate 13 are controlled through the extension of a guide rod of the second cylinder 15, the feeding of silicon wafers is facilitated, the feed inlet 12 can be sealed, and the sealing environment during etching is guaranteed.
As shown in fig. 3, a switch device which is matched with the positioning rod 9 to block the positioning hole 103 is arranged in the placing platform 10, the switch device includes a plurality of blocking blocks 17 which are slidably mounted in the placing platform 10 and used for blocking the positioning hole 103, sliding areas 18 which are in one-to-one correspondence with the blocking blocks 17 are arranged in the placing platform 10, a springback device connected with the sliding areas 18 is arranged at the tail of the blocking blocks 17, the blocking blocks 17 are provided with friction slopes matched with the positioning rod 9, and the upper end of the positioning rod 9 is provided with a force application slope which is in contact with the friction slopes; after the plugging block 17 is contacted with the positioning rod 9, the friction inclined plane and the force application inclined plane form a certain angle, when the positioning rod 9 is continuously jacked up, the plugging block 17 is gradually jacked up, the reset spring 19 in the sliding area 18 is compressed, when the positioning rod 9 returns to the second standby station, the reset spring 19 releases pressure, the plugging block 17 is jacked back, the positioning hole 103 is plugged again, so that the plugging block 17 is linked with the positioning rod 9, the plugging of the positioning hole 103 is facilitated, and the sealing is effective.
In this embodiment, the adsorption device is an electrostatic adsorption device, the electrostatic adsorption device adopts an electrostatic generator, the electrostatic generator is fixedly mounted on one side of the upper working platform 2, and static electricity generated by the electrostatic generator is applied to a silicon wafer to be adsorbed, so that the silicon wafer with the static electricity can be firmly adsorbed in the silicon wafer placing area 101, the cooling groove 11 is effectively covered, leakage is prevented, and cooling efficiency is ensured; the electrostatic generator is of a known construction and is therefore not shown in the figures.
The working principle of the invention is as follows: firstly, the first air cylinder 5 drives the supporting seat 6 to ascend, the sliding rod 61 on the supporting seat 6 is contacted with the upper part of the strip-shaped through hole 71 and then drives the positioning seat 7 to ascend, the blocking block 17 is jacked open when the positioning rod 9 ascends until the supporting rod 8 reaches the supporting station and the positioning rod 9 reaches the positioning station, then the second air cylinder 15 retracts into the guide rod and drives the door sealing plate 13 to ascend, the feeding hole 12 is opened, the silicon wafer to be etched is placed on the supporting rod 8 through the mechanical arm, the feeding hole 12 is closed, the first air cylinder 5 starts to drive the supporting rod 8 to move towards the first standby machine, the silicon wafer enters the positioning area and is contacted with the positioning guide inclined plane of the positioning rod 9, the sliding rod 61 slides from the upper part to the lower part of the strip-shaped through hole 71 and drives the positioning rod 9 to descend synchronously until the supporting rod 8 reaches the first standby station and the positioning rod 9 returns to the second standby station, the resetting spring 19 jacks the blocking block 17 back to the positioning hole 103, the silicon wafer accurately falls into the silicon wafer placing area 101, at the moment, the static generator generates static electricity to enable the silicon wafer to be adsorbed on the silicon wafer placing area 101, helium is introduced into the air inlet interface 16 to cool the back plate of the silicon wafer, after etching is completed, the supporting rod 8 and the positioning rod 9 repeat the steps to reach the supporting station and the positioning station, the feeding hole 12 is opened, the etched silicon wafer is taken out to place a new silicon wafer, and then the etching step is repeated.
The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.

Claims (9)

1. The utility model provides an absorption jacking device of dry etching machine, includes the workstation, install the lower storehouse body that is used for carrying out dry etching to the silicon chip on the workstation, be provided with the feed inlet on the lower storehouse body, feed inlet department installs feed inlet closing mechanism, the internal place platform that is provided with of storehouse down, place platform is last to be equipped with the silicon chip and places region, its characterized in that: the lower bin body is provided with a silicon wafer supporting device and a silicon wafer positioning device, the silicon wafer supporting device comprises a plurality of supporting rods which are axially telescopic and extend out of the silicon wafer placing area for supporting the silicon wafer, the silicon wafer positioning device comprises a plurality of positioning rods which are axially telescopic and extend out from the silicon wafer placing area to position the silicon wafer, the supporting rod is driven by a first power device to reciprocate between a supporting station and a first standby station, the positioning rod is driven by a second power device to reciprocate between a positioning station and a second standby station, the silicon wafer cooling device comprises a placing platform, a cooling groove, a workbench and a cooling gas inlet port, wherein the placing platform is provided with supporting holes and positioning holes which correspond to supporting rods and positioning rods one to one, the placing platform is positioned in a silicon wafer placing area and is internally provided with the cooling groove for cooling a silicon wafer, and the workbench is provided with the gas inlet port for communicating cooling gas to enter the cooling groove; and the workbench is also provided with an adsorption device for adsorbing the silicon wafer on the placing platform.
2. The adsorption jacking device of the dry etching machine according to claim 1, wherein: the utility model discloses a support device, including bracing piece, locating lever, locating seat, slide bar, locating seat, locating lever and workstation, bracing piece fixed mounting is on the supporting seat, locating lever fixed mounting is on the locating seat, radially evenly be provided with two and above slide bar on the supporting seat, set up the axially extended bar through-hole with the slide bar one-to-one on the locating seat, the locating seat suit is on the supporting seat, the slide bar restraint in the bar through-hole, be in first standby station the bracing piece is less than and is in second standby station the locating lever, is in supporting station the bracing piece is higher than and is in positioning station the locating lever, be provided with the location application of force structure that makes the locating lever keep in positioning station between locating seat and the workstation, first power device and second power device adopt one set to support location straight line power device, support location straight line power device and supporting seat connection.
3. The adsorption jacking device of the dry etching machine according to claim 2, wherein: the positioning force application structure comprises a force application spring arranged between the positioning seat and the workbench, the positioning seat is forced to move from the second standby station to the positioning station by the elasticity of the force application spring, and when the positioning seat is positioned at the positioning station, the force application spring is in a free state.
4. The adsorption jacking device of the dry etching machine according to claim 2, wherein: the positioning force application structure comprises a plurality of damping rings, and the damping rings are arranged in the positioning holes or are sleeved and fixed on the positioning rods.
5. The adsorption jacking device of the dry etching machine as claimed in claim 3 or 4, wherein: and a positioning guide inclined plane which is convenient for guiding the silicon wafer to fall into the silicon wafer placing area when the supporting rod falls is arranged at the top of the positioning rod.
6. The adsorption jacking device of the dry etching machine according to claim 5, characterized in that: the feed inlet closing mechanism including set up in the door frame on the mouth edge of feed inlet, be provided with the spout on the door frame, install the door shrouding in the spout, the door shrouding is opened or is closed the feed inlet by the drive of door shrouding straight line power device.
7. The adsorption jacking device of the dry etching machine according to claim 6, wherein: and a switch device which is matched with the positioning rod to block the positioning hole is arranged in the placing platform.
8. The adsorption jacking device of the dry etching machine according to claim 7, wherein: the switching device comprises a plurality of plugging blocks which are slidably mounted in the placing platform and used for plugging the positioning holes, sliding areas which correspond to the plugging blocks one to one are arranged in the placing platform, the tail portions of the plugging blocks are provided with springback devices connected with the sliding areas, the plugging blocks are provided with friction inclined planes matched with the positioning rods, and force application inclined planes which are contacted with the friction inclined planes are arranged at the upper ends of the positioning rods.
9. The adsorption jacking device of the dry etching machine according to claim 8, characterized in that: the adsorption device is an electrostatic adsorption device.
CN202210677719.3A 2022-06-15 2022-06-15 Adsorption jacking device of dry etching machine Pending CN115083981A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210677719.3A CN115083981A (en) 2022-06-15 2022-06-15 Adsorption jacking device of dry etching machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210677719.3A CN115083981A (en) 2022-06-15 2022-06-15 Adsorption jacking device of dry etching machine

Publications (1)

Publication Number Publication Date
CN115083981A true CN115083981A (en) 2022-09-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210677719.3A Pending CN115083981A (en) 2022-06-15 2022-06-15 Adsorption jacking device of dry etching machine

Country Status (1)

Country Link
CN (1) CN115083981A (en)

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