CN217973395U - Silicon chip feeding and discharging cooling device of chemical vapor deposition equipment - Google Patents

Abstract

The utility model discloses a silicon chip feeding and discharging cooling device of chemical vapor deposition equipment, comprises a workbench, a reaction chamber is arranged on the workbench, a feeding hole is arranged on the reaction chamber, a reaction platform and a reaction housing are arranged in the reaction chamber, the reaction platform is rotatably arranged on the workbench and is positioned in the reaction housing, the feeding hole is arranged on the reaction housing, a plurality of holding grooves are uniformly distributed on the circumference of the reaction platform, a feeding station is arranged near the feeding hole, a cooling station and a buffer station are arranged on the workbench, a cooling device is also arranged at the cooling station, a buffer platform is arranged at the buffer station, an execution end of a manipulator is provided with a clamping fixed part, clamping lugs are uniformly distributed on the clamping fixed part, avoidance grooves are arranged around the holding grooves, and a telescopic power device is arranged on the clamping fixed part; the device can accurately clamp the silicon wafer and place the silicon wafer in the accommodating groove, and can be taken out in time for cooling, so that the thermal deformation is reduced, and the production quality is improved.

Description

Silicon chip feeding and discharging cooling device of chemical vapor deposition equipment

Technical Field

The utility model relates to a silicon chip business turn over material cooling device of chemical vapor deposition equipment is applicable to the semiconductor material field of making

Background

In the field of semiconductor manufacturing, surface deposition is often used in a surface treatment process of a silicon wafer, and the chemical vapor deposition method is utilized to enable the silicon wafer to chemically react with gas, so that an oxide layer is deposited on the surface of the silicon wafer, reflected light on the surface of the silicon wafer is reduced or eliminated, the light transmittance is increased, and the photoelectric conversion efficiency of the silicon wafer is further improved; at present, chemical vapor deposition equipment comprises a workbench, a reaction chamber for performing chemical vapor deposition on a silicon wafer is arranged on the workbench, a feeding port for placing the silicon wafer is arranged on the reaction chamber, a reaction platform is arranged in the reaction chamber, a plurality of working stations are arranged on the reaction platform, a rotatable and liftable rotating platform is arranged at the center of the reaction platform, a plurality of pairs of supporting rods are arranged on the rotating platform, each working station corresponds to one pair of supporting rods, a sinking groove for facilitating the sinking of the supporting rods is arranged on the working station, the mechanical arm of the current silicon wafer is a conventional plate-shaped mechanical arm which can be lifted and deflected, so that the silicon wafer is conveniently fed into any position, the execution end of the mechanical arm is a vacuum adsorption plate, the silicon wafer is sucked through negative pressure to be transferred after the vacuum adsorption plate is contacted with the bottom of the silicon wafer, when vapor deposition is carried out, the silicon wafer is sent into the reaction chamber through the mechanical arm, the rotating table ascends at the moment and is supported by the supporting rod, then the silicon wafer is placed on the first station to be subjected to first-step reaction after the rotating table rotates by one station, after the reaction is completed, the rotating table ascends to support the silicon wafer on the first station, meanwhile, the second silicon wafer is conveniently received, after the second silicon wafer is received, the rotating table descends after rotating by one station, at the moment, the silicon wafer on the first station enters the second station, meanwhile, a new silicon wafer is arranged on the first station, after the rotating table descends, the supporting rod sinks into the sinking groove, and the silicon wafer can be flatly placed on the reaction platform. After the silicon wafer is subjected to a plurality of process steps, the support rod on the rotating table supports the reacted silicon wafer, and the manipulator takes out the reacted silicon wafer and then sends the silicon wafer into a new silicon wafer. However, the structure and the process steps are complicated, when the silicon wafer is subjected to chemical vapor deposition, a large amount of heat is generated, the silicon wafer is directly taken out by a manipulator and placed in a wafer box, the wafer box is overheated to cause that workers cannot move, and the accommodating groove for accommodating the silicon wafer in the wafer box can only support the edge position of the silicon wafer, so that the temperature of the silicon wafer is too high, the integral support cannot cause thermal deformation, and the yield is possibly low.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the utility model provides a silicon chip business turn over material cooling device, the device can accurate centre gripping silicon chip place in holding the recess, and can in time take out and cool off after the silicon chip accomplishes chemical vapor deposition, reduces the heat altered shape, improves production quality.

In order to solve the technical problem, the technical scheme of the utility model is that: the utility model provides a silicon chip business turn over material cooling device of chemical vapor deposition equipment, includes the workstation, be equipped with the reaction cavity who is used for carrying on silicon chip chemical vapor deposition on the workstation, be equipped with on the reaction cavity and make things convenient for the manipulator to stretch into the feed inlet of placing the silicon chip, including reaction platform and reaction housing in the reaction cavity, reaction platform rotary installation just is located the reaction housing on the workstation, the feed inlet is established on the reaction housing, reaction platform circumference evenly distributed has a plurality of to conveniently place the silicon chip hold the recess, the workstation below is equipped with and is used for driving the rotatory platform rotary power device of reaction platform, the reaction platform is close to feed inlet department and is equipped with the material loading station, be provided with cooling station and buffer station on the workstation, cooling station department still is provided with and is used for placing the silicon chip and refrigerated cooling device, buffer station department installs the buffer platform, manipulator lift deflection is equipped with on the workstation, the drive corresponds the manipulator lift deflection power device that switches between material loading station, cooling station and buffer station, the manipulator, the execution end of manipulator is equipped with the centre gripping fixed position, evenly distributed on the centre gripping fixed position is used for the centre gripping lug, it has the radial fixed lug to hold the recess all around with the radial fixed lug and is used for dodging the centre gripping lug.

As a preferred scheme, the clamping fixing part is a clamping ring, and the clamping lugs are circumferentially distributed below the clamping ring.

Preferably, the clamping lug comprises a bottom supporting plate part for supporting the bottom of the silicon wafer and a side wall supporting plate part for clamping the edge of the silicon wafer, and the power end of the telescopic power device is connected with the side wall supporting plate part.

Preferably, the inner side of the side wall support plate portion is provided with a guide slope.

As a preferred scheme, flexible power device includes small-size cylinder, small-size cylinder fixed mounting is in centre gripping ring below, small-size cylinder includes cylinder body, piston and piston rod, piston movable mounting separates into preceding cavity and back cavity with the cylinder body in the cylinder body, the piston rod run through the front end of cylinder body and with the front end of piston is connected, be provided with the compression spring in precompression between the tail end of piston and cylinder body in the back cavity, be provided with on the cylinder body with the inlet port of preceding cavity intercommunication, this inlet port and gas circuit system intercommunication.

As a preferred scheme, an annular gas path distribution cavity is arranged on the clamping ring, the gas path distribution cavity is communicated with the gas inlet hole on the cylinder body, and the gas path distribution cavity is communicated with a gas path system.

Preferably, the bottom supporting plate extends outwards and is provided with a limiting plate, and the limiting plate is in limiting fit with the tail of the cylinder body.

As a preferred scheme, the cooling device comprises a cooling seat, a cooling platform for placing the silicon wafer is arranged on the cooling seat, and sliding grooves convenient for the clamping convex blocks to move up and down are circumferentially distributed on the cooling seat.

Preferably, the structure of the buffer platform is the same as that of the cooling device.

After the technical scheme is adopted, the utility model discloses an effect is: the silicon wafer feeding and discharging cooling device of the chemical vapor deposition equipment comprises a workbench, wherein a reaction chamber for performing chemical vapor deposition on a silicon wafer is arranged on the workbench, a feeding hole for conveniently enabling a mechanical arm to extend into the reaction chamber for placing the silicon wafer is formed in the reaction chamber, the reaction chamber comprises a reaction platform and a reaction housing, the reaction platform is rotatably arranged on the workbench and located in the reaction housing, the feeding hole is formed in the reaction housing, a plurality of accommodating grooves for conveniently placing the silicon wafer are uniformly distributed on the circumference of the reaction platform, a platform rotating power device for driving the reaction platform to rotate is arranged below the workbench, a feeding station is arranged close to the feeding hole of the reaction platform, a cooling station and a storage station are arranged on the workbench, a cooling device for placing and cooling the silicon wafer is further arranged at the cooling station, a cache platform is arranged at the cache station, the mechanical arm is arranged on the workbench in a lifting and deflecting manner, a lifting and deflection power device for driving the corresponding mechanical arm to switch among the feeding station, the cooling station and the cache station is arranged below the workbench, a clamping and fixing part is arranged at the clamping fixing part, a plurality of clamping lugs are uniformly arranged on the clamping fixing part, and a telescopic driving actuating device for radially arranging the telescopic lugs corresponding to the clamping lugs in a radial direction;

placing a silicon wafer to be processed on a cache platform, moving a fixed clamping part of a manipulator to the position above the cache platform, driving the manipulator to descend by a lifting and rotating power device, driving a clamping lug to contract by a stretching and contracting power device, wherein the clamping lug is lower than the silicon wafer, then driving the clamping lug to extend out of the clamping and fixing silicon wafer by a stretching and contracting power device, driving a reaction platform to deflect a containing groove to a feeding station by a platform rotating power device, the manipulator extends into a feeding port, the clamping lug is aligned with a avoiding groove, descending the manipulator to enable the clamping lug to fall into the avoiding groove, driving the clamping lug to contract by the stretching power device, the silicon wafer falls into the containing groove, placing the silicon wafer to be processed on the cache platform, driving the reaction platform to deflect by the platform rotating power device to enable an empty containing groove to deflect to the feeding station, placing the silicon wafer into the containing groove on the reaction platform by the manipulator, placing the silicon wafer into the containing groove on the reaction platform, carrying out of chemical vapor deposition in a reaction chamber, after the completion of chemical vapor deposition, placing and clamping the silicon wafer on a cooling device, placing the manipulator on the cooling device and cooling the silicon wafer, and clamping the cooling device again; the device can accurately clamp the silicon wafer and place the silicon wafer in the accommodating groove, simplifies the placing steps, and can timely take out the silicon wafer for cooling after the silicon wafer is subjected to chemical vapor deposition, so that the thermal deformation is reduced, the production quality is improved, and the production efficiency is improved.

The clamping fixing part is a clamping ring, and the clamping lugs are circumferentially distributed below the clamping ring; the clamping ring and the silicon wafer are circular, so that the clamping lug can be clamped conveniently.

The clamping lug comprises a bottom supporting plate part for supporting the bottom of the silicon chip and a side wall supporting plate part for clamping the edge of the silicon chip, and the power end of the telescopic power device is connected with the side wall supporting plate part; the bottom supporting plate part can support a silicon wafer, the side wall supporting plate part can clamp the silicon wafer, and therefore the clamping can be rapidly positioned when the silicon wafer is loaded, the clamping efficiency is effectively improved, and the positioning is accurate.

And because the inner side of the side wall supporting plate part is provided with the guide inclined plane which can form a certain inclination angle, the silicon wafer can fall on the bottom supporting plate part and the side wall supporting plate part can be accurately clamped by the guide inclined plane because a certain deviation can occur when the silicon wafer is placed on the cooling device or the standby platform, and the guide area from large to small is formed by the guide inclined plane, so that the accuracy of placing the silicon wafer is ensured.

The telescopic power device comprises a small cylinder, the small cylinder is fixedly installed below the clamping ring, the small cylinder comprises a cylinder body, a piston and a piston rod, the piston is movably installed in the cylinder body to divide the cylinder body into a front cavity and a rear cavity, the piston rod penetrates through the front end of the cylinder body and is connected with the front end of the piston, a compression spring pre-compressed between the tail end of the piston and the cylinder body is arranged in the rear cavity, an air inlet hole communicated with the front cavity is formed in the cylinder body and is communicated with an air path system, therefore, when the clamping lug needs to be extended, the air path system stops ventilation, the compression spring releases pressure to push the piston to drive the piston rod to extend, the clamping lug can position the clamping silicon wafer, when the clamping lug needs to be retracted, the compression spring needs to be compressed, air is introduced into the air path system from the air inlet hole, the air enters the front cavity, the pressure in the front cavity is increased, and when the pressure of the compression spring is higher than the compression spring, the piston and the piston rod are pushed to retract the clamping lug, so that the clamping efficiency is effectively improved.

And because the clamping ring is provided with an annular gas path distribution cavity which is communicated with the gas inlet hole on the cylinder body, the gas path distribution cavity is communicated with the gas path system, and the clamping convex block can be synchronously driven to extend or retract after gas is introduced, so that the clamping stability is improved.

And the bottom supporting plate extends outwards and is provided with the limiting plate, the limiting plate is in limiting fit with the tail of the cylinder body, the limiting plate can limit the maximum telescopic range of the clamping lug, and after the limiting plate is contacted with the tail of the cylinder body, the extending lengths of the clamping lug are the same, so that the silicon wafer is positioned accurately, and the clamping accuracy is ensured.

And as the cooling device comprises the cooling seat, the cooling platform for placing the silicon wafer is arranged on the cooling seat, and sliding grooves which are convenient for the clamping lugs to move up and down are distributed on the circumference of the cooling seat, the sliding grooves can avoid collision with the cooling seat when the clamping lugs clamp the silicon wafer, and the safety of the device is improved.

And because the structure of the cache platform is the same as that of the cooling device, the cache platform and the cooling device can be used as the cooling device to place a silicon wafer for cooling or used as the cache platform to place a silicon wafer to be processed, so that the production efficiency of the device is higher.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a perspective view of an embodiment of the present invention;

fig. 2 is a top view of an embodiment of the invention;

FIG. 3 is a schematic structural view of a clamping ring portion according to an embodiment of the present invention;

fig. 4 is a cross-sectional view of a clamping tab according to an embodiment of the present invention; in the drawings: 1. a work table; 2. a reaction platform; 3. a reaction housing; 31. a feed inlet; 4. a stepping motor; 5. an accommodating recess; 6. avoiding the groove; 7. a feeding station; 8. a cooling station; 9. caching a station; 10. a cooling seat; 11. a cooling platform; 12. a sliding groove; 13. a caching platform; 14. a manipulator; 15. clamping the circular ring; 151. a gas path distribution chamber; 16. a small cylinder; 17. clamping the bump; 171. a bottom support plate portion; 172. a side wall support plate portion; 18. a guide slope; 19. a limiting plate; 20. a piston; 21. a piston rod; 22. a cylinder body; 221. a front chamber; 222. a rear chamber; 23. a compression spring; 24. an air inlet hole.

Detailed Description

The present invention will be described in further detail with reference to the following specific examples.

As shown in fig. 1 to fig. 4, a silicon chip business turn over material cooling device of chemical vapor deposition equipment, including workstation 1, be equipped with the reaction cavity who is used for carrying on silicon chip chemical vapor deposition on workstation 1, be equipped with on the reaction cavity and make things convenient for manipulator 14 to stretch into the feed inlet 31 of placing the silicon chip, include reaction platform 2 and reaction housing 3 in the reaction cavity, 2 rotatory installations on workstation 1 of reaction platform and be located reaction housing 3, feed inlet 31 is established on reaction housing 3, 2 circumference evenly distributed of reaction platform has a plurality of to conveniently place the silicon chip hold recess 5, 1 below of workstation is equipped with and is used for driving the rotatory platform rotary power device of reaction platform 2, reaction platform 2 is close to feed inlet 31 department and is equipped with material loading station 7, be provided with cooling station 8 and buffer storage station 9 on workstation 1, cooling station 8 departments still are provided with and are used for placing the silicon chip and carry out refrigerated cooling device, buffer storage station 9 department installs buffer storage platform 13, manipulator 14 deflects and installs on workstation 1, manipulator 14 is equipped with the drive manipulator 14 and corresponds manipulator 14 and is equipped with the deflection power device that manipulator 14 and switch between material loading station 7, cooling station 9, the deflection of manipulator 8 is equipped with the fixed lug and is equipped with the fixed lug 17 and is equipped with the fixed lug and is used for holding device around the fixed lug and is equipped with the fixed lug and is used for holding the fixed lug 17 and is used for holding the clamp position 17.

In the embodiment, the platform rotation power device comprises a stepping motor 4, the stepping motor 4 is controlled to start and stop accurately in the process of driving the reaction platform 2 to rotate, so that the accommodating groove 5 can be accurately positioned at the feeding station 7 every time, the clamping and fixing part on the lifting and deflection power device driving manipulator 14 extends into the feeding port 31 and is also positioned above the feeding station 7 and corresponds to the feeding station 7, the clamping protrusion just falls into the avoiding groove 6 when a silicon wafer is placed, the avoiding groove 6 and the clamping protrusion are further positioned, the accuracy of placing the silicon wafer on the accommodating groove 5 is effectively improved, the accommodating groove 5 can also limit the position of the silicon wafer in the deflection process of the reaction platform 2, the silicon wafer cannot be deviated, the feeding can be clamped quickly between the clamping and fixing part and the accommodating groove 5, the time is saved, and the feeding efficiency is improved; the deflecting portion of the robot 14 and the lifting and deflecting power unit portion of the robot 14 are conventional and therefore will not be described in detail herein.

As shown in fig. 2 and 3, the clamping fixing part is a clamping ring 15, the clamping lugs 17 are circumferentially distributed below the clamping ring 15, four clamping lugs 17 are arranged on the clamping ring 15, the clamping lugs 17 are distributed in four directions below the clamping ring 15, the clamping ring 15 is circular, the clamping lugs 17 are driven by a telescopic power device to stretch and retract so as to accurately position and clamp the silicon wafer, the clamping lugs 17 are convenient to clamp, the diameter of the clamping ring 15 is larger than that of a cooling device, and collision in the process of clamping the silicon wafer in a lifting mode is effectively prevented.

In this embodiment, the holding projection 17 comprises a bottom supporting plate 171 for supporting the bottom of the silicon wafer and a side wall supporting plate 172 for holding the edge of the silicon wafer, and the power end of the telescopic power unit is connected to the side wall supporting plate 172; the bottom supporting plate portion 171 is fixedly mounted below the side wall supporting plate portion 172 and moves synchronously with the side wall supporting plate portion 172, when the manipulator 14 clamps a silicon wafer, the bottom supporting plate supports the silicon wafer, and the position of the silicon wafer is adjusted by the side wall supporting plate portion 172, so that the silicon wafer is accurately and reliably clamped.

Further, the inner side of the side wall supporting plate part 172 is provided with the guide inclined surface 18, and since the silicon wafer is deviated when being placed on the buffer storage platform 13 or the cooling device, the clamping is inaccurate, so that in the process of clamping the silicon wafer upwards by the manipulator 14, the four guide inclined surfaces 18 form a guide area, so that the silicon wafer falls into the accurate area, and the clamping accuracy is ensured.

As shown in fig. 4, the telescopic power device includes a small cylinder 16, the small cylinder 16 is fixedly installed below the clamping ring 15, the small cylinder 16 includes a cylinder body 22, a piston 20 and a piston rod 21, the piston 20 is movably installed in the cylinder body 22 to divide the cylinder body 22 into a front chamber 221 and a rear chamber 222, the piston rod 21 penetrates through the front end of the cylinder body 22 and is connected with the front end of the piston 20, a compression spring 23 pre-compressed between the tail end of the piston 20 and the cylinder body 22 is arranged in the rear chamber 222, an air inlet 24 communicated with the front chamber 221 is arranged on the cylinder body 22, and the air inlet 24 is communicated with an air path system; when the clamping lug 17 needs to extend to clamp the silicon wafer, the air path system stops supplying air, the pressure in the front cavity 221 disappears, and the compression spring 23 in the rear cavity 222 releases the pressure to push the piston 20 and the piston rod 21 to extend; when the clamping bump 17 needs to be retracted to place a silicon wafer, the gas supply system starts to supply gas, the gas enters the front cavity 221 from the gas inlet hole 24, the pressure in the front cavity 221 gradually increases, the pressure in the front cavity 221 is greater than the pressure of the compression spring 23 in the rear cavity 222, the piston 20 and the piston rod 21 retract, the compression spring 23 is compressed, and the clamping efficiency is effectively improved.

As shown in fig. 3, an annular air path distribution cavity 151 is provided on the clamping ring 15, the air path distribution cavity 151 is communicated with the air inlet 24 on the cylinder 22, and the air path distribution cavity 151 is communicated with an air path system; after gas is introduced, the clamping convex blocks 17 can be synchronously driven to extend or retract, so that the silicon wafer is accurately and reliably clamped or placed, and the clamping stability is improved.

In this embodiment, bottom sprag board portion 171 extends to the outside and is provided with limiting plate 19, this limiting plate 19 with the spacing cooperation of afterbody of cylinder body 22, the biggest flexible scope of centre gripping lug 17 can be injectd to limiting plate 19, and after the afterbody of limiting plate 19 and cylinder body 22 contacted, limiting plate 19 forced bottom sprag board portion 171 can't continue to stretch out, and bottom sprag board portion 171 links together with lateral wall bracing board portion 172, and lateral wall bracing board portion 172 also can't continue to move, makes the length that centre gripping lug 17 stretched out the same, makes the silicon chip location accurate, guarantees the centre gripping accuracy.

In this embodiment, the cooling device includes a cooling base 10, a cooling platform 11 for placing a silicon wafer is arranged on the cooling base 10, sliding grooves 12 are circumferentially distributed on the cooling base 10 for facilitating the lifting and the moving of the clamping lugs 17, the sliding grooves 12 can avoid collision between the clamping lugs 17 and the cooling base 10 when the silicon wafer is clamped by the clamping lugs 17, the safety of the device is improved, further, the cooling device is effectively cooled by air cooling or water cooling, when the air cooling is adopted, a plurality of air vents are arranged on the cooling platform 11, and an air inlet port penetrating through the workbench 1 and connected with the air vents is communicated below the cooling base 10; when water cooling is adopted, a circulating water path is arranged in the cooling platform 11, a cooling reflux device is arranged at the bottom of the cooling platform, and cooling liquid is injected to enable the cooling liquid to continuously flow through the cooling platform 11 so as to take away heat of the silicon wafer, so that the silicon wafer is prevented from thermal deformation, and the production quality is improved.

Further, the structure of the cache platform 13 is the same as that of the cooling device, so that the cache platform 13 can be used for cooling a silicon wafer, the cooling seat 10 on the cooling device can be used for placing the silicon wafer to be processed, in the feeding process, the silicon wafer to be processed is placed on the cache platform 13, the processed silicon wafer is placed on the cooling platform 11, the silicon wafer to be processed is placed in the accommodating groove 5 of the reaction platform 2 by the manipulator 14, then the reaction platform 2 is driven by the stepping motor 4 to enable the next accommodating groove 5 to reach the feeding station 7, the processed silicon wafer is clamped on the cache platform 13 by the manipulator 14 for cooling, the silicon wafer cooled on the cooling platform 11 is taken away to be placed, and therefore the silicon wafer to be processed can be used alternately, and the production efficiency is improved.

The utility model discloses a theory of operation: firstly, a silicon wafer to be processed is placed on a cache platform 13 or a cooling platform 11, then a clamping ring 15 of a mechanical hand 14 is driven to reach a corresponding cache station 9 or a corresponding cooling station 8, the mechanical hand 14 is lower than the cache platform 13 or the cooling platform 11, a small cylinder 16 drives a clamping lug 17 to extend out and the mechanical hand 14 to ascend, the clamping silicon wafer extends into a feed inlet 31 to a feeding station 7, meanwhile, a stepping motor 4 also drives an accommodating groove 5 on a reaction platform 2 to reach the feeding station 7, then the clamping lug 17 is aligned with an avoiding groove 6, the mechanical hand 14 descends until the clamping lug 17 falls into the avoiding groove 6, the small cylinder 16 drives the clamping lug 17 to retract so that the silicon wafer falls into the accommodating groove 5, the steps are repeated until the accommodating groove 5 on the reaction platform 2 is filled with the silicon wafer, and chemical vapor deposition is carried out in a reaction chamber, after the process is finished, the clamping ring 15 of the driving manipulator 14 extends into the feeding hole 31, meanwhile, the accommodating groove 5 in the reaction platform 2 reaches the feeding station 7, the silicon wafer subjected to chemical vapor deposition is clamped and placed on the cooling platform 11 to be cooled, the manipulator 14 clamps the silicon wafer to be processed on the buffer station 9 and places the silicon wafer on the feeding station 7 in the accommodating groove 5, the stepping motor 4 drives the reaction platform 2 to enable the next accommodating groove 5 to reach the feeding station 7, the manipulator 14 clamps the silicon wafer subjected to chemical vapor deposition and cools the silicon wafer on the buffer station 13, at the moment, the silicon wafer on the cooling platform 11 is cooled completely, the silicon wafer to be processed is placed after being taken away, the silicon wafer to be processed on the cooling platform 11 is placed in the accommodating groove 5 of the feeding station 7 through the manipulator 14, and the above actions are repeated to finish the process.

The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.

Claims (9)

1. The utility model provides a chemical vapor deposition equipment's silicon chip business turn over material cooling device, includes the workstation, be equipped with the reaction chamber who is used for carrying out silicon chip chemical vapor deposition on the workstation, be equipped with on the reaction chamber and make things convenient for the manipulator to stretch into the feed inlet of placing the silicon chip, its characterized in that: including reaction platform and reaction housing in the reaction cavity, reaction platform rotary installation just is located the reaction housing on the workstation, the feed inlet is established on the reaction housing, reaction platform circumference evenly distributed has a plurality of conveniently places the recess that holds of silicon chip, the workstation below is equipped with and is used for driving the rotatory platform rotary power device of reaction platform, reaction platform is close to feed inlet department and is equipped with the material loading station, be provided with cooling station and buffer station on the workstation, cooling station department still is provided with and is used for placing the silicon chip and carry out refrigerated cooling device, buffer station department installs the buffer memory platform, manipulator lift deflection is installed on the workstation, the workstation below is equipped with the lift deflection power device that the drive corresponds the manipulator and switches between feeding station, cooling station and buffer memory station, the execution end of manipulator is equipped with centre gripping fixed part, evenly distributed has a plurality of being used for the fixed centre gripping lug of silicon chip centre gripping on the centre gripping fixed part, it is equipped with all around and dodges the recess that corresponds with the centre gripping lug, be equipped with the flexible power device that is used for driving the radial flexible of centre gripping lug on the centre gripping fixed part.

2. The silicon wafer charging and discharging cooling device of the chemical vapor deposition apparatus according to claim 1, wherein: the clamping fixing part is a clamping ring, and the clamping lugs are circumferentially distributed below the clamping ring.

3. The silicon wafer feeding and discharging cooling device of the chemical vapor deposition apparatus as recited in claim 2, wherein: the clamping lug comprises a bottom supporting plate part for supporting the bottom of the silicon chip and a side wall supporting plate part for clamping the edge of the silicon chip, and the power end of the telescopic power device is connected with the side wall supporting plate part.

4. The silicon wafer feeding and discharging cooling device of the chemical vapor deposition apparatus according to claim 3, wherein: the inner side of the side wall supporting plate part is provided with a guide inclined plane.

5. The silicon wafer feeding and discharging cooling device of the chemical vapor deposition apparatus as recited in claim 4, wherein: the telescopic power device comprises a small air cylinder, the small air cylinder is fixedly installed below the clamping ring, the small air cylinder comprises a cylinder body, a piston and a piston rod, the piston is movably installed in the cylinder body to separate the cylinder body into a front cavity and a rear cavity, the piston rod penetrates through the front end of the cylinder body and is connected with the front end of the piston, a compression spring pre-compressed between the tail end of the piston and the cylinder body is arranged in the rear cavity, and an air inlet hole communicated with the front cavity is formed in the cylinder body and communicated with an air path system.

6. The silicon wafer charging and discharging cooling device of a chemical vapor deposition apparatus according to claim 5, wherein: the clamping ring is provided with an annular gas path distribution cavity, the gas path distribution cavity is communicated with the gas inlet hole in the cylinder body, and the gas path distribution cavity is communicated with a gas path system.

7. The silicon wafer charging and discharging cooling device of a chemical vapor deposition apparatus according to claim 6, wherein: the bottom supporting plate extends outwards and is provided with a limiting plate, and the limiting plate is in limiting fit with the tail of the cylinder body.

8. The silicon wafer charging and discharging cooling device of the chemical vapor deposition apparatus according to claim 2, wherein: the cooling device comprises a cooling seat, a cooling platform used for placing the silicon wafer is arranged on the cooling seat, and sliding grooves convenient for the clamping lugs to lift and move are circumferentially distributed on the cooling seat.

9. The silicon wafer charging and discharging cooling device of a chemical vapor deposition apparatus according to claim 8, wherein: the structure of the cache platform is the same as that of the cooling device.

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