CN213106896U

CN213106896U - High-efficient grabbing device of wafer

Info

Publication number: CN213106896U
Application number: CN202021685056.2U
Authority: CN
Inventors: 李佳森; 裴文龙; 陈晨; 张少阳; 谷晓东
Original assignee: Suzhou Core Silicon Electronics Technology Co ltd
Current assignee: Suzhou Core Silicon Electronics Technology Co ltd
Priority date: 2020-08-13
Filing date: 2020-08-13
Publication date: 2021-05-04
Anticipated expiration: 2030-08-13

Abstract

The utility model discloses a high-efficient grabbing device of wafer, including being cylindric base, the equipartition has a set of gripping piece around the outer periphery of base, a slide bar has set firmly on the gripping piece, the slide bar at least part runs through the base extends and arranges in the holding intracavity of base, a driving piece that can reciprocate has set firmly on the base, the driving piece can drive the gripping piece face or move dorsad to the axis of base; the bottom of the base is further fixedly provided with an air blowing plate, and the air blowing plate is further provided with air blowing holes. The beneficial effects of the utility model are mainly embodied in that: when the device snatchs the wafer, there is the gas flow between gas hole and the wafer, produces small clearance to make directly contact not between wafer and the base, reduce the pollution to the wafer, reduce the damage to the wafer when snatching, improve the yields.

Description

High-efficient grabbing device of wafer

Technical Field

The utility model relates to a semiconductor manufacturing field particularly, especially relates to a high-efficient grabbing device of wafer.

Background

In the field of Insulated Gate Bipolar Transistor (IGBT) in the semiconductor industry, ultra-thin wafers are commonly used, and for an IGBT device with a specific withstand voltage index, the thickness of a chip needs to be reduced to 100-200 μm, even 80 μm. When the wafer is ground to be thin, the subsequent processing is difficult, and particularly, for a large silicon wafer with the size of more than 8 inches, the wafer is extremely easy to break, and the operation difficulty is higher.

Among the prior art, what some wafer grabbing devices adopted is the vacuum adsorption principle, for example vacuum suction pen, and vacuum suction pen comprises plastics or rubber housing, vacuum generator (pneumatic type), vacuum chuck, elbow and reelpipe (pneumatic type), and when the transmission wafer, wafer vacuum suction pen front end can follow the wafer box and absorb the wafer.

The wafer grabbing mode has large contact area to the wafer, is easy to pollute the wafer, and has great destructiveness to large-size wafers and ultrathin wafers.

The invention provides a high-efficiency wafer grabbing device, which aims to reduce pollution to a wafer and damage to the wafer when the wafer is grabbed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the not enough of prior art existence, provide a high-efficient grabbing device of wafer.

The purpose of the utility model is realized through the following technical scheme:

a high-efficiency wafer grabbing device comprises a cylindrical base, wherein a group of grabbing blocks are uniformly distributed on the periphery of the outer circumferential surface of the base, a sliding rod is fixedly arranged on each grabbing block, at least part of the sliding rod penetrates through the base and extends into an accommodating cavity of the base, a driving piece capable of moving up and down is fixedly arranged on the base, and the driving piece can drive the grabbing blocks to move towards or away from the central axis of the base; the bottom of the base is further fixedly provided with an air blowing plate, and the air blowing plate is further provided with air blowing holes.

Preferably, the driving member comprises a support rod and a pressing block fixedly arranged on the support rod, and the center point of the pressing block is on the central axis of the support rod; the pressing block comprises a cylindrical end fixedly connected with the supporting rod and supporting ends which are symmetrically arranged on the cylindrical end and are integrally formed with the cylindrical end, the end surface of the supporting end, far away from the cylindrical end, is an inclined surface, and an inner wedge block is fixedly arranged on the inclined surface; the sliding rod is fixedly provided with an outer wedge block, and the outer wedge block is provided with a dovetail groove matched with the inner wedge block.

Preferably, a bearing block is fixedly arranged at one end of the support rod, which is far away from the pressing block, a spring is sleeved on the support rod, and the spring is positioned between the bearing block and the pressing block.

Preferably, the base is further provided with a substrate fixedly connected with the base, the substrate is provided with an opening, and the bearing block is arranged in the opening and can slide up and down.

Preferably, the bearing block is sleeved with a bushing, and the bushing is located between the bearing block and the base plate and is tightly attached to the bearing block and the base plate.

Preferably, the bushing is further sleeved with a sealing ring, and the sealing ring is located on two sides of the bushing and is tightly attached to the bearing block and the base plate.

Preferably, a protruding part is fixedly arranged at the bottom of the grabbing block and is positioned below the joint of the grabbing block and the sliding rod.

Preferably, a positioning rod is fixedly arranged at the bottom of the grabbing block.

Preferably, the base is further provided with an air blowing channel communicated with the air blowing hole.

Preferably, the base is further provided with a cover plate, and the cover plate is located in the opening.

The beneficial effects of the utility model are mainly embodied in that:

1. when the device grabs the wafer, gas flows between the gas blowing holes and the wafer to generate a tiny gap, so that the wafer is not directly contacted with the base, the pollution to the wafer is reduced, the damage to the wafer during grabbing is reduced, and the yield is improved;

2. the inner wedge-shaped block and the outer wedge-shaped block are matched with each other to drive the grabbing block to move for grabbing, corresponding adjustment can be made according to the actual size of the wafer, the inner wedge-shaped block and the outer wedge-shaped block can be adaptive to wafers of different specifications, and the inner wedge-shaped block and the outer wedge-shaped block have wide applicability;

3. after the grabbing is finished, the spring applies a reverse acting force to reset the supporting rod, the pressing block and the bearing block, so that the working efficiency is greatly improved;

4. the device structure is exquisite, and the installation of being convenient for, dismantlement and maintenance greatly improve work efficiency.

Drawings

The technical scheme of the utility model is further explained by combining the attached drawings as follows:

FIG. 1: the utility model discloses a perspective view of the preferred embodiment;

FIG. 2: the utility model discloses the perspective view of the preferred embodiment, at this moment, remove the base plate;

FIG. 3: the cross-sectional view of the preferred embodiment of the present invention, at this time, the substrate is removed;

FIG. 4: the utility model discloses the perspective view of the piece is executed to the preferred embodiment.

Detailed Description

The present invention will be described in detail below with reference to specific embodiments shown in the drawings. However, these embodiments are not limited to the present invention, and structural, method, or functional changes made by those skilled in the art according to these embodiments are all included in the scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in fig. 1 to 4, the utility model discloses a high-efficient grabbing device of wafer, including being cylindric base 1, the equipartition all around of the outer periphery of base 1 has a set of piece 2 of snatching, it has set firmly a slide bar 3 on the piece 2 to snatch, slide bar 3 runs through at least partially base 1 extends and arranges in the holding intracavity of base 1, it can reciprocate to set firmly a driving piece 4 on base 1, driving piece 4 can drive it towards or dorsad to snatch piece 2 the axis of base 1 removes, so that it accomplishes snatching or releasing the wafer to snatch piece 2. The structure is exquisite, the driving piece 4 drives the grabbing block 2 to move towards or back to the base 1, corresponding adjustment can be carried out according to the actual size of the wafer, the wafer grabbing device can be adaptive to wafers of different specifications, and the wafer grabbing device has wide applicability.

In the above, the bottom of the grabbing block 2 is fixedly provided with the protruding part 21, the protruding part 21 is located below the joint of the grabbing block 2 and the sliding rod 3, and the protruding parts 21 are mutually matched to clamp the wafer. And a positioning rod 22 is fixedly arranged at the bottom of each grabbing block 2.

In the preferred embodiment, the driving member 4 includes a supporting rod 41 and a pressing block 42 fixed on the supporting rod 41, and a center point of the pressing block 42 is on a central axis of the supporting rod 41. Specifically, the pressing block 42 includes a cylindrical end 421 fixedly connected to the support rod 41 and support ends 422 symmetrically disposed on the cylindrical end 421 and integrally formed therewith, an end surface of the support end 422 far away from the cylindrical end 421 is an inclined surface 423, and the inclined surface 423 is fixedly provided with an inner wedge block 43. An outer wedge block 31 is fixedly arranged on the sliding rod 3, a dovetail groove 32 matched with the inner wedge block 43 is formed in the outer wedge block 31, and the outer wedge block 31 can move up and down on the inner wedge block 43 through the dovetail groove 32 to drive the grabbing block 2 to move towards or back to the base 1.

A bearing block 44 is fixedly arranged at one end of the support rod 41 far away from the pressing block 42, a spring 45 is sleeved on the support rod 41, and the spring 45 is positioned between the bearing block 44 and the pressing block 42. After the spring 45 finishes grabbing, the spring 45 can apply reverse acting force, so that the supporting rod, the pressing block and the bearing block reset, and the working efficiency is greatly improved.

In this embodiment, the base 1 is further provided with a substrate 11 fixedly connected with the base, and the substrate 11 is used for preventing impurities such as dust from entering the base 1, ensuring cleanness inside the base and prolonging service life. An opening 12 is formed in the substrate 11, the bearing block 44 is disposed in the opening 12 and can slide up and down, and the opening can play a guiding role. Preferably, the bearing block 44 is sleeved with a bushing 46, and the bushing 46 is located between the bearing block 44 and the base plate 11 and is tightly attached thereto. The bush 46 is further sleeved with a sealing ring 47, the sealing ring 47 is located on two sides of the bush 46 and is tightly attached to the bearing block 44 and the substrate 11, and the sealing ring 47 can play a role in sealing.

The bottom of base 1 still sets firmly an adsorption plate 5, still be equipped with the adsorption hole on the adsorption plate 5, the adsorption hole with set up adsorption channel 13 intercommunication on the base 1.

It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.

The above list of details is only for the practical implementation of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the present invention should be included in the scope of the present invention.

Claims

1. High-efficient grabbing device of wafer, including being cylindric base (1), its characterized in that: a group of grabbing blocks (2) are uniformly distributed around the outer circumferential surface of the base (1), a sliding rod (3) is fixedly arranged on each grabbing block (2), at least part of each sliding rod (3) penetrates through the base (1) and extends into the containing cavity of the base (1), a driving piece (4) capable of moving up and down is fixedly arranged on the base (1), and the driving piece (4) can drive the grabbing blocks (2) to move towards or away from the central axis of the base (1); the bottom of base (1) still sets firmly an adsorption plate (5), still be equipped with the absorption hole on adsorption plate (5).

2. The wafer efficient gripping device of claim 1, wherein: the driving piece (4) comprises a supporting rod (41) and a pressing block (42) fixedly arranged on the supporting rod (41), and the central point of the pressing block (42) is positioned on the central axis of the supporting rod (41); the pressing block (42) comprises a cylindrical end (421) fixedly connected with the supporting rod (41) and supporting ends (422) which are symmetrically arranged on the cylindrical end (421) and integrally formed with the cylindrical end, the end surface, far away from the cylindrical end (421), of each supporting end (422) is an inclined surface (423), and an inner wedge block (43) is fixedly arranged on each inclined surface (423); an outer wedge block (31) is fixedly arranged on the sliding rod (3), and a dovetail groove (32) matched with the inner wedge block (43) is formed in the outer wedge block (31).

3. The wafer efficient gripping device of claim 2, wherein: one end of the support rod (41) far away from the pressing block (42) is fixedly provided with a bearing block (44), the support rod (41) is sleeved with a spring (45), and the spring (45) is positioned between the bearing block (44) and the pressing block (42).

4. The wafer efficient gripping device of claim 3, wherein: the base (1) is further provided with a base plate (11) fixedly connected with the base plate, the base plate (11) is provided with an opening (12), and the bearing block (44) is arranged in the opening (12) and can slide up and down.

5. The wafer efficient gripping device of claim 4, wherein: the bearing block (44) is sleeved with a bushing (46), and the bushing (46) is positioned between the bearing block (44) and the substrate (11) and is tightly attached to the bearing block.

6. The wafer efficient gripping device of claim 5, wherein: and a sealing ring (47) is further sleeved on the lining (46), and the sealing ring (47) is positioned on two sides of the lining (46) and is tightly attached to the bearing block (44) and the base plate (11).

7. The wafer efficient gripping device of claim 6, wherein: the bottom of the grabbing block (2) is fixedly provided with a protruding part (21), and the protruding part (21) is located below the joint of the grabbing block (2) and the sliding rod (3).

8. The wafer efficient gripping device of claim 7, wherein: and a positioning rod (22) is fixedly arranged at the bottom of the grabbing block (2).

9. The wafer efficient gripping device of claim 8, wherein: the base (1) is also provided with an adsorption channel (13) communicated with the adsorption hole.

10. The wafer efficient gripping device of claim 9, wherein: the base (1) is further provided with a cover plate (14), and the cover plate (14) is located in the opening (12).