CN117690824A - Semiconductor wafer warp deformation test equipment - Google Patents
Semiconductor wafer warp deformation test equipment Download PDFInfo
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- CN117690824A CN117690824A CN202311689912.XA CN202311689912A CN117690824A CN 117690824 A CN117690824 A CN 117690824A CN 202311689912 A CN202311689912 A CN 202311689912A CN 117690824 A CN117690824 A CN 117690824A
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- 238000012360 testing method Methods 0.000 title claims abstract description 128
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000005485 electric heating Methods 0.000 claims abstract description 4
- 238000005192 partition Methods 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims description 35
- 238000005086 pumping Methods 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 13
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 238000004321 preservation Methods 0.000 claims description 3
- 230000035515 penetration Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 35
- 238000001514 detection method Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 230000000630 rising effect Effects 0.000 abstract 1
- 230000006978 adaptation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to semiconductor wafer warp deformation testing equipment, which comprises an annular conveying mechanism and a testing box fixed above the annular conveying mechanism, wherein the inner cavity of the testing box is partitioned by a partition plate into a plurality of testing cavities, and the inner cavities of the testing cavities are internally provided with electric heating devices. This semiconductor wafer warp deformation test equipment can carry out the detection under the different temperatures to a plurality of wafers when step by step to the wafer rises step by step in removal in-process temperature, can prevent when having practiced thrift the energy consumption that the wafer from rising fast and leading to influencing the condition of testing result to appear, and can effectively reduce the air under the sealed environment that nitrogen gas filled and be heated the expansion to shooting the interference that the module produced.
Description
Technical Field
The invention relates to the technical field of wafer warpage deformation testing, in particular to semiconductor wafer warpage deformation testing equipment.
Background
In the semiconductor wafer manufacturing process, heat treatment is necessary, for example, a silicon oxide film is used as an isolation layer, or a reflow process is applied to a flowing film; however, different batches or types of semiconductor wafers have different highest temperature-receiving capacities, and when the temperature exceeds the bearable temperature, the semiconductor wafers will warp, resulting in defective products.
According to the semiconductor wafer warp deformation testing device described in the patent number CN110763149B, when testing, the testing efficiency is low, only a single wafer can be tested in sequence, and when different wafers are replaced, a large amount of heat can be easily dissipated, and the temperature needs to be reduced under the condition of having a certain temperature base inside to test different temperatures.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides semiconductor wafer warp deformation testing equipment, which solves the problems.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the semiconductor wafer warp deformation testing equipment comprises an annular conveying mechanism and a testing box fixed above the annular conveying mechanism, wherein a plurality of testing cavities are partitioned by partition plates in the inner cavity of the testing box, an electric heating device is arranged in the inner cavity of each testing cavity, the temperature of each testing cavity is gradually increased from left to right, a plurality of testing tools are connected to the surface of a conveying belt of the annular conveying mechanism in a transmission manner, the plurality of testing tools are connected in a clamping manner, and the head and the tail of each testing tool are mutually clamped, and a penetrating groove for penetrating the testing tool is formed in the inner cavity of the testing box;
an inner groove is formed in the inner cavity of the test tool, a sealing cover plate is connected to the inner cavity of the inner groove in a rotating mode through a rotating motor, a wafer is arranged in a sealing cavity formed by the sealing cover plate and the inner groove, and a plurality of vacuum pumping mechanisms are arranged in the inner cavities of the test cavities;
the vacuum pumping mechanism comprises a vacuum pumping pipeline fixed in the inner cavity of the test cavity and communicated with a vacuum pump, a vacuum pumping head driven by a driving cylinder is communicated with the bottom end of the vacuum pumping pipeline through a gold wire hose, an air suction groove matched with the vacuum pumping head is formed in the top of the sealing cover plate, a pressing ball valve is arranged in the inner cavity of the air suction groove, a test tool is fixed above the annular conveying mechanism through a limiting rod and a clamping groove when the vacuum pumping mechanism is used, two test tools are connected first, the sealing cover plate is opened to put a wafer into the annular conveying mechanism, then the first test tool is conveyed into the first test cavity through the annular conveying mechanism, the temperature of the test cavity is gradually increased from left to right, the test cavity is sequentially tested, then the test cavity is conveyed into the first test cavity, the first test cavity is driven by the driving cylinder, the air suction groove is pressed down, the pressing ball valve is opened, then the sealing cover plate is opened through a rotating motor, the heated by contact of the heated nitrogen gas and the wafer, the heated by the contact of the wafer, the heated nitrogen gas and the wafer are detected, the temperature of the test tool is detected by the upper test tool, the temperature of the upper test tool is increased, the temperature of the test cavity is increased from left to right, the temperature of the test cavity is increased gradually, and the temperature of the wafer is not increased gradually, and the temperature is detected by the test cavity is increased gradually, and the temperature is simultaneously, the temperature is increased under the conditions that the test conditions of the test cavity is different than the test cavity and the test cavity is simultaneously, and the temperature is reduced.
As a further scheme of the invention: the contact part of the penetrating groove and the test tool is provided with an elastic sealing gasket, and the elastic sealing gasket is always in a sealing state when the test tool moves.
As a further scheme of the invention: the sealing structure is formed among the test box, the annular conveying conveyer belt and the test fixture, the contact surface is provided with the sealing rubber strip for heat preservation, so that the temperature dissipation can be effectively prevented, the test of a plurality of temperatures can be carried out step by step from front to back, and the test efficiency is higher.
As a further scheme of the invention: the surface fixedly connected with gag lever post of annular conveying mechanism conveyer belt, the joint groove with the surface adaptation of gag lever post is seted up to the inner chamber of test fixture, can effectually fix the test fixture in annular conveying mechanism top through gag lever post and joint groove adaptation and carry.
As a further scheme of the invention: the right side of test box still cuts off there is the cooling chamber, the inner chamber in cooling chamber is built-in to have the cooling subassembly, carries out the output after cooling, prevents to scald the staff.
As a further scheme of the invention: the test cavity is filled with nitrogen, the shooting module is arranged in the test cavity, and the test cavity is filled with nitrogen more safely and can effectively prevent the sampling of the shooting module from being influenced.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, detection can be carried out on a plurality of wafers at different temperatures step by step simultaneously, the temperature of the wafers is increased step by step in the moving process, the energy consumption is saved, the condition that the detection result is affected due to rapid temperature increase of the wafers can be prevented, and the interference of air thermal expansion on a shooting module can be effectively reduced in a sealing environment filled with nitrogen.
2. According to the invention, the plurality of test tools can be arranged to rapidly feed the wafer, so that the interference caused by the external environment can be effectively prevented.
3. According to the invention, the vacuumizing head is pressed down into the air extraction groove, the pressing ball valve is opened by pressing, then the air between the sealing cover plate and the inner groove is extracted, then the sealing cover plate is opened by rotating the motor, and the heated nitrogen contacts with the wafer to heat the wafer, so that the interference caused by the air can be effectively prevented.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a top plan view of the structure of the present invention;
FIG. 3 is a cross-sectional view of a test fixture of the present invention in an open configuration;
FIG. 4 is an enlarged view of a portion of the invention at A in FIG. 1;
fig. 5 is a partial enlarged view of the present invention at B in fig. 1.
In the figure: 1. an annular conveying mechanism; 2. a test box; 3. a test chamber; 4. testing a tool; 5. a limit rod; 6. a clamping groove; 7. a rotating motor; 8. sealing the cover plate; 9. an air extraction groove; 10. a push type ball valve; 11. a vacuum pumping pipeline; 12. a driving cylinder; 13. a vacuum head is pumped; 14. an inner groove; 15. a through groove; 16. and a cooling cavity.
Detailed Description
In order to further describe the technical means and effects adopted by the present invention for achieving the intended purpose, the following detailed description will refer to the specific implementation, structure, characteristics and effects according to the present invention with reference to the accompanying drawings and preferred embodiments.
Referring to fig. 1-5, the present invention provides a technical solution: the semiconductor wafer warp deformation testing equipment comprises an annular conveying mechanism 1 and a testing box 2 fixed above the annular conveying mechanism 1, wherein a plurality of testing cavities 3 are partitioned by partition plates in the inner cavity of the testing box 2, electric heating devices are arranged in the inner cavities of the testing cavities 3, the temperature of the testing cavities 3 rises step by step from left to right, a plurality of testing tools 4 are connected to the surface of a conveying belt of the annular conveying mechanism 1 in a transmission manner, the testing tools 4 are arranged, the heads and the tails of the testing tools are mutually clamped, and a penetrating groove 15 for penetrating the testing tools 4 is formed in the inner cavity of the testing box 2;
an inner groove 14 is formed in the inner cavity of the test tool 4, a sealing cover plate 8 is connected in a rotating mode through a rotating motor 7 in the inner cavity of the inner groove 14, a wafer is arranged in a sealing cavity formed by the sealing cover plate 8 and the inner groove 14, and a vacuum pumping mechanism is arranged in the inner cavities of the plurality of test cavities 3;
the vacuumizing mechanism comprises a vacuumizing pipeline 11 fixed in the inner cavity of the test cavity 3 and communicated with a vacuum pump, the bottom end of the vacuumizing pipeline 11 is communicated with a vacuumizing head 13 driven by a driving cylinder 12 through a gold wire hose, the top of the sealing cover plate 8 is provided with an air suction groove 9 matched with the vacuumizing head 13, the inner cavity of the air suction groove 9 is provided with a push type ball valve 10, when in use, the test fixture 4 is fixed above the annular conveying mechanism 1 through a limit rod 5 and a clamping groove 6 for conveying, the two test fixtures 4 are connected first, the sealing cover plate 8 is opened for placing a wafer, then the first test fixture 4 is conveyed into the first test cavity 3 through the annular conveying mechanism 1 for testing at a first temperature, the temperature of the test cavity 3 is gradually increased from left to right for testing in sequence, and then when the test fixture is conveyed into the first test cavity 3, the vacuum pumping head 13 is driven by the driving cylinder 12 to be pressed down into the air pumping groove 9, the pressing ball valve 10 is opened by pressing, then the air between the sealing cover plate 8 and the inner groove 14 is pumped out, then the sealing cover plate 8 is opened by rotating the motor 7, heated nitrogen contacts with the wafer at the moment, the heated nitrogen is shot and sampled by the shooting module for detection, a testing tool 4 is sequentially added after the detection is finished at one temperature, then the last testing tool 4 is moved into the next testing cavity 3 for the detection of different temperatures by repeating the steps, a plurality of wafers can be detected at different temperatures step by step, the temperature of the wafers is gradually increased in the moving process, the energy consumption is saved, the condition that the rapid temperature rise of the wafers influences the detection result is prevented, and the interference of air thermal expansion on the shooting module can be effectively reduced in the sealing environment filled with nitrogen.
An elastic sealing gasket is arranged at the contact part of the through groove 15 and the test tool 4, and the elastic sealing gasket is always in a sealing state when the test tool 4 moves.
The sealing structure is formed between the test box 2, the conveying belt of the annular conveying mechanism 1 and the test tool 4, the contact surface is provided with the sealing rubber strip for heat preservation, so that the temperature dissipation can be effectively prevented, the test of a plurality of temperatures can be carried out step by step from front to back, and the test efficiency is higher.
The surface fixedly connected with gag lever post 5 of annular conveying mechanism 1 conveyer belt, the joint groove 6 with the surface adaptation of gag lever post 5 is seted up to the inner chamber of test fixture 4, can effectually carry test fixture 4 fixed in annular conveying mechanism 1 top through gag lever post 5 and joint groove 6 adaptation.
The rightmost side of the test box 2 is also partitioned with a cooling cavity 16, a cooling component is arranged in the inner cavity of the cooling cavity 16, and the cooling component is output after cooling, so that scalding of workers is prevented.
The test cavity 3 is filled with nitrogen, and is internally provided with a shooting module, so that the nitrogen is filled with the nitrogen more safely, and the influence on the sampling of the shooting module can be effectively prevented.
The present invention is not limited to the above embodiments, but is capable of modification and variation in detail, and other modifications and variations can be made by those skilled in the art without departing from the scope of the present invention.
Claims (6)
1. The utility model provides a semiconductor wafer warpage deformation test equipment, includes annular conveying mechanism (1) and fixes test box (2) in annular conveying mechanism (1) top, its characterized in that: the inner cavity of the test box (2) is partitioned by a partition plate to form a plurality of test cavities (3), an electric heating device is arranged in the inner cavities of the test cavities (3), the temperature of the test cavities (3) rises step by step from left to right, the surface of a conveying belt of the annular conveying mechanism (1) is in transmission connection with a plurality of test tools (4), the test tools (4) are provided with a plurality of test tools, the heads and the tails are mutually clamped, and a through groove (15) for the penetration of the test tools (4) is formed in the inner cavity of the test box (2);
an inner groove (14) is formed in an inner cavity of the test tool (4), a sealing cover plate (8) is rotatably connected to the inner cavity of the inner groove (14) through a rotating motor (7), a wafer is arranged in a sealing cavity formed by the sealing cover plate (8) and the inner groove (14), and a plurality of vacuum pumping mechanisms are arranged in the inner cavities of the test cavities (3);
the vacuum pumping mechanism comprises a vacuum pumping pipeline (11) which is fixed in the inner cavity of the test cavity (3) and communicated with a vacuum pump, a vacuum pumping head (13) driven by a driving cylinder (12) is communicated with the bottom end of the vacuum pumping pipeline (11) through a gold wire hose, an air pumping groove (9) which is matched with the vacuum pumping head (13) is formed in the top of the sealing cover plate (8), and a pressing ball valve (10) is arranged in the inner cavity of the air pumping groove (9).
2. The semiconductor wafer warp deformation testing apparatus of claim 1, wherein: an elastic sealing gasket is arranged at the contact position of the penetrating groove (15) and the test tool (4).
3. The semiconductor wafer warp deformation testing apparatus of claim 1, wherein: sealing structures are formed among the test box (2), the conveying belt of the annular conveying mechanism (1) and the test tool (4), and sealing rubber strips are arranged on contact surfaces for heat preservation.
4. The semiconductor wafer warp deformation testing apparatus of claim 1, wherein: the surface of the conveying belt of the annular conveying mechanism (1) is fixedly connected with a limiting rod (5), and a clamping groove (6) matched with the surface of the limiting rod (5) is formed in the inner cavity of the testing tool (4).
5. The semiconductor wafer warp deformation testing apparatus of claim 1, wherein: the right side of the test box (2) is further partitioned with a cooling cavity (16), and a cooling component is arranged in the inner cavity of the cooling cavity (16).
6. The semiconductor wafer warp deformation testing apparatus of claim 1, wherein: the test cavity (3) is filled with nitrogen, and a shooting module is arranged in the test cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311689912.XA CN117690824A (en) | 2023-12-11 | 2023-12-11 | Semiconductor wafer warp deformation test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311689912.XA CN117690824A (en) | 2023-12-11 | 2023-12-11 | Semiconductor wafer warp deformation test equipment |
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| Publication Number | Publication Date |
|---|---|
| CN117690824A true CN117690824A (en) | 2024-03-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311689912.XA Pending CN117690824A (en) | 2023-12-11 | 2023-12-11 | Semiconductor wafer warp deformation test equipment |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117889773A (en) * | 2024-03-15 | 2024-04-16 | 深圳市铨兴科技有限公司 | Wafer warp deformation test equipment |
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- 2023-12-11 CN CN202311689912.XA patent/CN117690824A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117889773A (en) * | 2024-03-15 | 2024-04-16 | 深圳市铨兴科技有限公司 | Wafer warp deformation test equipment |
| CN117889773B (en) * | 2024-03-15 | 2024-05-14 | 深圳市铨兴科技有限公司 | Wafer warp deformation test equipment |
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