CN215988693U - Clamping device for cutting semiconductor chip - Google Patents
Clamping device for cutting semiconductor chip Download PDFInfo
- Publication number
- CN215988693U CN215988693U CN202122138859.7U CN202122138859U CN215988693U CN 215988693 U CN215988693 U CN 215988693U CN 202122138859 U CN202122138859 U CN 202122138859U CN 215988693 U CN215988693 U CN 215988693U
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- cavity
- semiconductor chip
- cutting
- screw rod
- plate body
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- Expired - Fee Related
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- Dicing (AREA)
Abstract
The utility model discloses a clamping device for cutting a semiconductor chip, which comprises a plate body, wherein a cavity fixedly connected with the plate body and vertical plates arranged on two sides of the cavity are arranged at the top of the plate body, a plurality of suckers communicated with the cavity are arranged on the cavity, a screw rod and polish rods arranged on two sides of the screw rod are connected between the vertical plates, one end of the screw rod extends out of the outer side of each vertical plate and is connected with a pulse motor, a sliding block is arranged on each screw rod and each polish rod, a linear motor is arranged at the bottom of each sliding block, the output end of each linear motor is connected with a hydraulic cylinder, the output end of each hydraulic cylinder is connected with a cutting device, a controller and an air pump communicated with the cavity are arranged at the bottom of the plate body, and the controller is respectively and electrically connected with the pulse motor, the linear motors, the hydraulic cylinders, the cutting devices and the air pumps. The utility model has the advantages that: the cutting machine can be used for transversely and longitudinally cutting a semiconductor chip, and is high in automation degree, high in cutting efficiency and low in labor intensity.
Description
Technical Field
The utility model relates to the technical field of semiconductor chip processing, in particular to a clamping device for cutting a semiconductor chip.
Background
Semiconductor chips are semiconductor devices which are manufactured by etching and wiring semiconductor wafers to realize certain functions, and on a semiconductor wafer, hundreds to thousands of chips are generally connected together, and the process of separating or separating each semiconductor chip with independent electrical performance is called scribing or cutting, and cutting is a very important link in the chip manufacturing process.
The clamping device for cutting the semiconductor chip in the prior art can only perform transverse or longitudinal cutting, the position of the semiconductor chip needs to be adjusted after the cutting is completed, the cutting can be continued, the automation degree is low, the cutting efficiency is low, and the labor intensity of workers is high.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem of overcoming the difficulties and provides a clamping device for cutting a semiconductor chip, which can be used for transversely and longitudinally cutting the semiconductor chip, and has the advantages of high automation degree, high cutting efficiency and low labor intensity.
In order to solve the technical problems, the technical scheme provided by the utility model is as follows: the utility model provides a clamping device for semiconductor chip cutting, the package rubbing board body, the top of plate body be equipped with plate body fixed connection's cavity and the riser of locating the cavity both sides, be equipped with the sucking disc that a plurality of and cavity are linked together on the cavity, connect the polished rod that is equipped with the screw rod and locates the screw rod both sides between the riser, the one end of screw rod is stretched out and is connected to the outside of riser and be equipped with pulse motor, be equipped with the slider on screw rod and the polished rod, the bottom of slider is equipped with linear electric motor, linear electric motor's output is connected and is equipped with the pneumatic cylinder, the output of pneumatic cylinder is connected and is equipped with cutting device, the bottom of plate body is equipped with the controller and the air extractor that is linked together with the cavity, the controller respectively with pulse motor, linear electric motor, pneumatic cylinder, cutting device and air extractor electric connection.
As an improvement, the suckers are uniformly arranged.
As an improvement, the air pump is communicated with the cavity through a pipeline.
As an improvement, the screw rod is in threaded connection with the sliding block, and the polished rod is in sliding connection with the sliding block.
As an improvement, the vertical plate and the polish rod are symmetrically arranged.
As an improvement, the bottom of the plate body is provided with uniformly arranged support legs.
Compared with the prior art, the utility model has the advantages that: the screw rod is matched with the pulse motor, so that the sliding block, the linear motor and the cutting device can be driven to transversely move, and the semiconductor chip is transversely cut; the linear motor can drive the hydraulic cylinder and the cutting device to move longitudinally, so that longitudinal cutting of the semiconductor chip is achieved, the air pump, the cavity and the sucker are matched, the semiconductor sheet can be fixedly adsorbed, and the semiconductor chip is prevented from moving in the cutting process and being damaged.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic structural view in a top view of the present invention.
As shown in the figure: 1. the plate comprises a plate body, 2, a cavity, 3, a vertical plate, 4, a sucker, 5, a screw rod, 6, a polished rod, 7, a pulse motor, 8, a sliding block, 9, a linear motor, 10, a hydraulic cylinder, 11, a cutting device, 12, a controller, 13, an air pump, 14, a pipeline, 15 and supporting legs.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
With reference to the accompanying drawings 1-2, a clamping device for cutting a semiconductor chip comprises a plate body 1, wherein a cavity 2 fixedly connected with the plate body 1 and vertical plates 3 arranged on two sides of the cavity 2 are arranged at the top of the plate body 1, a plurality of suckers 4 communicated with the cavity 2 are arranged on the cavity 2, screw rods 5 and polish rods 6 arranged on two sides of the screw rods 5 are connected between the vertical plates 3, one ends of the screw rods 5 extend out of the outer sides of the vertical plates 3 and are connected with pulse motors 7, sliders 8 are arranged on the screw rods 5 and the polish rods 6, linear motors 9 are arranged at the bottoms of the sliders 8, hydraulic cylinders 10 are connected with the output ends of the linear motors 9, cutting devices 11 are connected with the output ends of the hydraulic cylinders 10, a controller 12 and an air extractor 13 communicated with the cavity 2 are arranged at the bottom of the plate body 1, the controller 12 is respectively communicated with the pulse motors 7, The linear motor 9, the hydraulic cylinder 10, the cutting device 11 and the air pump 13 are electrically connected.
The device can realize that the worker places the semiconductor sheet on the sucking disc 4 at one time, and the cutting device 11 can transversely and longitudinally cut the semiconductor sheet, so that the device has high automation degree, high cutting efficiency and low labor intensity of the worker.
The suckers 4 are uniformly arranged.
The air pump 13 is communicated with the cavity 2 through a pipeline 14.
The screw rod 5 is in threaded connection with the sliding block 8, and the polish rod 6 is in sliding connection with the sliding block 8.
The vertical plate 3 and the polish rod 6 are symmetrically arranged.
The bottom of the plate body 1 is provided with evenly arranged support legs 15.
When the method is implemented specifically, a worker places a semiconductor sheet on the suction disc 4 on the cavity 2, then the air extractor 13 is started through the controller 12, the air extractor 13 extracts air in the cavity 2 to form negative pressure in the cavity 2, the suction disc 4 adsorbs the semiconductor sheet, then the worker starts the pulse motor 7, the linear motor 9, the hydraulic cylinder 10 and the cutting device 11 through the controller 12, the pulse motor 7 rotates to drive the screw rod 5 to rotate, the screw rod 5 drives the sliding block 8 to transversely move on the screw rod 5 and the polished rod 6 to further drive the sliding block 8 to move, the linear motor 9 drives the hydraulic cylinder 10 and the cutting device 11 to longitudinally move, and after the working position is reached, the hydraulic cylinder 10 extends to drive the cutting device 11 to downwards move, so that the cutting device 11 is in contact with the semiconductor sheet to cut the semiconductor sheet.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.
Claims (6)
1. A clamping device for cutting a semiconductor chip is characterized in that: the package rubbing board body, the top of plate body be equipped with plate body fixed connection's cavity and locate the riser of cavity both sides, be equipped with the sucking disc that a plurality of and cavity are linked together on the cavity, connect the polished rod that is equipped with the screw rod and locates the screw rod both sides between the riser, the one end of screw rod is stretched out and is connected to the outside of riser and be equipped with pulse motor, be equipped with the slider on screw rod and the polished rod, the bottom of slider is equipped with linear electric motor, linear electric motor's output is connected and is equipped with the pneumatic cylinder, the output connection of pneumatic cylinder is equipped with cutting device, the bottom of plate body is equipped with the controller and the air extractor that is linked together with the cavity, the controller respectively with pulse motor, linear electric motor, pneumatic cylinder, cutting device and air extractor electric connection.
2. The clamping device for dicing a semiconductor chip according to claim 1, wherein: the suckers are uniformly arranged.
3. The clamping device for dicing a semiconductor chip according to claim 1, wherein: the air pump is communicated with the cavity through a pipeline.
4. The clamping device for dicing a semiconductor chip according to claim 1, wherein: the screw rod is in threaded connection with the sliding block, and the polished rod is in sliding connection with the sliding block.
5. The clamping device for dicing a semiconductor chip according to claim 1, wherein: the vertical plate and the polish rod are symmetrically arranged.
6. The clamping device for dicing a semiconductor chip according to claim 1, wherein: the bottom of the plate body is provided with supporting legs which are uniformly arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122138859.7U CN215988693U8 (en) | 2021-09-06 | 2021-09-06 | Clamping device for cutting semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122138859.7U CN215988693U8 (en) | 2021-09-06 | 2021-09-06 | Clamping device for cutting semiconductor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN215988693U true CN215988693U (en) | 2022-03-08 |
| CN215988693U8 CN215988693U8 (en) | 2022-08-05 |
Family
ID=80467530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122138859.7U Expired - Fee Related CN215988693U8 (en) | 2021-09-06 | 2021-09-06 | Clamping device for cutting semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215988693U8 (en) |
-
2021
- 2021-09-06 CN CN202122138859.7U patent/CN215988693U8/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN215988693U8 (en) | 2022-08-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 264209 floor 5, block C, innovation and entrepreneurship base, No. 213, Huoju Road, gaoqu District, Weihai City, Shandong Province Patentee after: Weihai ailaifu Semiconductor Technology Co.,Ltd. Address before: 264202 floor 5, block C, innovation and entrepreneurship base, No. 213, Torch Road, Weihai high district, Weihai City, Shandong Province Patentee before: Weihai ailaifu Semiconductor Technology Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CU01 | Correction of utility model |
Correction item: Patentee Correct: Weihai ailaifu Semiconductor Technology Co.,Ltd. False: Weihai ailaifu Semiconductor Technology Co.,Ltd. Number: 10-01 Page: The title page Volume: 38 Correction item: Patentee Correct: Weihai ailaifu Semiconductor Technology Co.,Ltd. Number: 10-01 Volume: 38 |
|
| CU01 | Correction of utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220308 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |