CN208961259U - A kind of automation wafer cutting and positioning device - Google Patents
A kind of automation wafer cutting and positioning device Download PDFInfo
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- CN208961259U CN208961259U CN201821520286.6U CN201821520286U CN208961259U CN 208961259 U CN208961259 U CN 208961259U CN 201821520286 U CN201821520286 U CN 201821520286U CN 208961259 U CN208961259 U CN 208961259U
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- mobile base
- guide rail
- mounting rack
- lead screw
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Abstract
The utility model relates to wafer cutting device technical field more particularly to a kind of automation wafer cutting and positioning devices, comprising: pedestal, air lifter, vacuum ceramic sucker, mounting rack；The pedestal is rectangular plate-like structure；The upside of pedestal is arranged in the air lifter, and air lifter is bolted with pedestal and is connected；The upside of air lifter is arranged in the vacuum ceramic sucker, and vacuum ceramic sucker is bolted with air lifter and is connected；The upside of pedestal is arranged in the mounting rack, and mounting rack is connected with pedestal by welding manner；Improvement on through the above structure, the device have the advantages that process that registration is convenient, cutting efficiency is high, effect is good, high degree of automation and versatility are high, thus the problem of effective solution existing apparatus and deficiency.
Description
Technical field
The utility model relates to wafer cutting device technical field more particularly to a kind of automation wafer cutting positioning dresses
It sets.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC product for having specific electrical functionality；Wafer needs
After cutting is blocking, it is re-used as processor cores use, but existing wafer cutting device has the following deficiencies:
In existing wafer dicing process, it is also the most common Wafer Dicing that multi-pass, which crosses diamond saw blade and carries out scribing,
Mode is acted directly on wafer by mechanical force, and scribing processes easily lead to wafer damage, and blade is easy to wear to be needed often
Replacement needs replacing different blades when different wafers carries out scribing cutting, can not be general, and processing efficiency is low and adds
Work precision is low.
Utility model content
The purpose of this utility model is to provide a kind of automation wafer cutting and positioning devices, to solve above-mentioned background technique
The existing wafer cutting device processing efficiency of middle proposition is low, blade cannot it is general, machining accuracy is low, easily leads to wafer damage
The problem of and deficiency.
The purpose of this utility model and effect are reached by technical solution in detail below:
A kind of automation wafer cutting and positioning device, comprising: pedestal, air lifter, vacuum ceramic sucker, mounting rack, X
Axis rail, X-axis Mobile base, first servo motor, Y-axis lead screw, shaft coupling, bearing block, Y-axis guide rail, fixed block, Y-axis Mobile base,
Second servo motor, X-axis lead screw, nut Mobile base, laser cutter；The pedestal is rectangular plate-like structure；The pneumatic liter
The upside of pedestal is arranged in drop platform, and air lifter is bolted with pedestal and is connected；The vacuum ceramic sucker is set
It sets in the upside of air lifter, and vacuum ceramic sucker is bolted with air lifter and is connected；The mounting rack
The upside of pedestal is set, and mounting rack is connected with pedestal by welding manner；The upper of mounting rack is arranged in the X-axis guide rail
Portion, and X-axis guide rail is bolted with mounting rack and is connected；The upside of X-axis guide rail, and X-axis is arranged in the X-axis Mobile base
Mobile base is connected with X-axis guide rail by embedded mode；One end of X-axis Mobile base, and is arranged in the first servo motor
One servo motor is bolted with X-axis Mobile base to be connected；The upside of X-axis Mobile base, and Y is arranged in the Y-axis lead screw
Axial filament thick stick is connected with X-axis Mobile base by bearing block；One end of Y-axis lead screw is arranged in the shaft coupling, and Y-axis lead screw passes through
Shaft coupling is connected to first servo motor main shaft；The top of mounting rack, and Y-axis guide rail and mounting rack is arranged in the Y-axis guide rail
It is bolted and is connected；One end of the fixed block setting Y-axis guide rail, and fixed block is bolted to connection to installation
Frame；The upside of Y-axis guide rail is arranged in the Y-axis Mobile base, and Y-axis Mobile base is connected with Y-axis guide rail by embedded mode；Institute
One end that Y-axis Mobile base is arranged in the second servo motor is stated, and the second servo motor is bolted with Y-axis Mobile base and is connected
It connects；The upside of Y-axis Mobile base is arranged in the X-axis lead screw, and X-axis lead screw is connected with Y-axis Mobile base by bearing block；It is described
Nut Mobile base is arranged in the middle part of Y-axis Mobile base, and nut Mobile base with Y-axis Mobile base by being connected through mode；Institute
The downside that nut Mobile base is arranged in laser cutter is stated, and laser cutter is bolted with nut Mobile base and is connected
It connects.
As advanced optimizing for the technical program, a kind of automation wafer cutting and positioning device of the utility model, installation
Frame overlooks rectangular frame structure, and four corners of mounting rack are provided with supporting leg at one.
As advanced optimizing for the technical program, a kind of automation wafer cutting and positioning device of the utility model, X-axis is led
Rail is provided at two altogether, and X-axis guide rail is separately positioned on the front and back edge on mounting rack top at two.
As advanced optimizing for the technical program, a kind of automation wafer cutting and positioning device of the utility model, X-axis is moved
It is sliding block in the middle part of dynamic seat and Y-axis Mobile base, and the lower part at the both ends of X-axis Mobile base and Y-axis Mobile base is provided with sliding slot.
As advanced optimizing for the technical program, a kind of automation wafer cutting and positioning device of the utility model, Y-axis is led
Rail is provided at two altogether, and Y-axis guide rail is separately positioned on the left and right edge on mounting rack top at two.
As advanced optimizing for the technical program, a kind of automation wafer cutting and positioning device of the utility model is fixed
The both ends of Y-axis guide rail are arranged in block, and there is setting at the both ends of Y-axis guide rail at two.
As advanced optimizing for the technical program, a kind of automation wafer cutting and positioning device of the utility model, X-axis silk
Thick stick one end is connected to the second servo motor by shaft coupling, and the other end of X-axis lead screw is fixed to Y-axis movement by bearing block
Seat.
Due to the application of the above technical scheme, the utility model has the advantage that compared with prior art
1, a kind of automation wafer cutting and positioning device of the utility model passes through setting vacuum ceramic sucker and Pneumatic elevation
Platform facilitates the fixed processing of wafer, more convenient to use, time saving and energy saving.
2, a kind of automation wafer cutting and positioning device of the utility model carries out X-axis and Y for cutter device by setting
Axis mobile guide rail, lead screw and Mobile base, are driven by servo motor, so that the device has processing cutting positioning accurate
Really, high degree of automation, the high advantage of cutting efficiency.
3, a kind of automation wafer cutting and positioning device of the utility model at setting one by being used to install laser cutter
Nut Mobile base, wafer cutting is carried out by laser, with good cutting effect, wafer is damaged small, and can be directed to more
The step of kind wafer is cut, and replacement cutting blade is eliminated, the high advantage of versatility.
4, the utility model through the above structure on improvement, have that processing registration is convenient, cutting efficiency is high, effect
Good, high degree of automation and the high advantage of versatility, thus the problem of effective solution existing apparatus and deficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the overlooking structure diagram of the utility model；
Fig. 3 is the side structure schematic view of the utility model.
In figure: pedestal 1, air lifter 2, vacuum ceramic sucker 3, mounting rack 4, X-axis guide rail 5, X-axis Mobile base 6, first
Servo motor 7, Y-axis lead screw 8, shaft coupling 9, bearing block 10, Y-axis guide rail 11, fixed block 12, Y-axis Mobile base 13, the second servo electricity
Machine 14, X-axis lead screw 15, nut Mobile base 16, laser cutter 17.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
It please refers to Fig.1 to Fig.3, the utility model provides a kind of automation wafer cutting and positioning device technical solution:
A kind of automation wafer cutting and positioning device, comprising: pedestal 1, air lifter 2, vacuum ceramic sucker 3, installation
Frame 4, X-axis Mobile base 6, first servo motor 7, Y-axis lead screw 8, shaft coupling 9, bearing block 10, Y-axis guide rail 11, is consolidated X-axis guide rail 5
Determine block 12, Y-axis Mobile base 13, the second servo motor 14, X-axis lead screw 15, nut Mobile base 16, laser cutter 17；Pedestal 1 is
Rectangular plate-like structure；The upside of pedestal 1 is arranged in air lifter 2, and air lifter 2 is bolted phase with pedestal 1
Connection；The upside of air lifter 2 is arranged in vacuum ceramic sucker 3, and vacuum ceramic sucker 3 and air lifter 2 pass through spiral shell
Bolt is connected to a fixed；The upside of pedestal 1 is arranged in mounting rack 4, and mounting rack 4 is connected with pedestal 1 by welding manner；X-axis
The top of mounting rack 4 is arranged in guide rail 5, and X-axis guide rail 5 is bolted with mounting rack 4 and is connected；X-axis Mobile base 6 is arranged
In the upside of X-axis guide rail 5, and X-axis Mobile base 6 is connected with X-axis guide rail 5 by embedded mode；The setting of first servo motor 7 exists
One end of X-axis Mobile base 6, and first servo motor 7 is bolted with X-axis Mobile base 6 and is connected；The setting of Y-axis lead screw 8 exists
The upside of X-axis Mobile base 6, and Y-axis lead screw 8 is connected with X-axis Mobile base 6 by bearing block 10；Shaft coupling 9 is arranged in Y-axis silk
One end of thick stick 8, and Y-axis lead screw 8 is connected to 7 main shaft of first servo motor by shaft coupling 9；Y-axis guide rail 11 is arranged in mounting rack 4
Top, and Y-axis guide rail 11 is bolted with mounting rack 4 and is connected；One end of Y-axis guide rail 11 is arranged in fixed block 12, and
Fixed block 12 is bolted to connection to mounting rack 4；The upside of Y-axis guide rail 11 is arranged in Y-axis Mobile base 13, and Y-axis is mobile
Seat 13 is connected with Y-axis guide rail 11 by embedded mode；One end of Y-axis Mobile base 13, and is arranged in second servo motor 14
Two servo motors 14 are bolted with Y-axis Mobile base 13 to be connected；The upside of Y-axis Mobile base 13 is arranged in X-axis lead screw 15,
And X-axis lead screw 15 is connected with Y-axis Mobile base 13 by bearing block；The middle part of Y-axis Mobile base 13 is arranged in nut Mobile base 16,
And nut Mobile base 16 with Y-axis Mobile base 13 by being connected through mode；The setting of laser cutter 17 is mobile in nut
The downside of seat 16, and laser cutter 17 is bolted with nut Mobile base 16 and is connected.
Specifically, mounting rack 4 overlooks rectangular frame structure, and four corners of mounting rack 4 are provided with supporting leg at one,
It is used to support fixed frame 4.
Specifically, X-axis guide rail 5 is provided at two altogether, and X-axis guide rail 5 is separately positioned on the front and back on 4 top of mounting rack at two
It is mobile to carry out X axis for cutter device for edge.
Specifically, the middle part of X-axis Mobile base 6 and Y-axis Mobile base 13 is sliding block, and X-axis Mobile base 6 and Y-axis Mobile base
The lower part at 13 both ends is provided with sliding slot, and the mobile guide and XY for nut Mobile base slide axially.
Specifically, Y-axis guide rail 11 is provided at two altogether, and Y-axis guide rail 11 is separately positioned on the left side on 4 top of mounting rack at two
It is mobile to carry out Y-axis for cutter device for right edge.
Specifically, the both ends of Y-axis guide rail 11 are arranged in fixed block 12, and there is setting at the both ends of Y-axis guide rail 11 at two,
It is limited for guide rail.
Specifically, 15 one end of X-axis lead screw is connected to the second servo motor 14 by shaft coupling, and X-axis lead screw 15 is another
End is fixed to Y-axis Mobile base 13 by bearing block.
Specifically used method and effect:
When using the device, wafer is placed into vacuum ceramic sucker 3 and is fixed on the positioning, is adjusted by air lifter 2
The height for saving vacuum ceramic sucker 3 and wafer is cut by laser after device 17 carries out Wafer Dicing, then by traditional handicraft by its
It is kept completely separate, in the scribing processes of laser cutter 17, first servo motor 7 drives Y-axis lead screw 8 to rotate, to drive
Dynamic nut Mobile base 16 is moved by Y-axis Mobile base 13 along Y-axis guide rail 11, realizes that the Y-axis of cutter device is mobile, together
When the second servo motor 14 X-axis lead screw 15 can be driven to rotate, to drive nut Mobile base 16 by X-axis Mobile base 6 along X-axis
Guide rail 5 is moved, and realizes that the X axis of cutter device is mobile and non-interference in moving process, easy to process high-efficient,
And nut Mobile base 16 is matched with the middle part slide block structure of X-axis Mobile base 6 and Y-axis Mobile base 13, can be nut Mobile base
16 provide effective support and auxiliary displacement.
In summary: a kind of automation wafer cutting and positioning device passes through setting vacuum ceramic sucker and Pneumatic elevation
Platform, setting carry out guide rail, lead screw and the Mobile base of X-axis and Y-axis movement for cutter device, are driven by servo motor,
It is arranged at one for installing the nut Mobile base of laser cutter, wafer cutting is carried out by laser, effective solution is existing
Wafer cutting device processing efficiency is low, blade cannot it is general, machining accuracy is low, easily leads to the problem of wafer damage.
It should be noted that in the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or two with
On；The orientation of the instructions such as term " on ", "lower", "left", "right", "inner", "outside", " front end ", " rear end ", " head ", " tail portion "
Or positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, and
It is not that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore
It is not considered as limiting the invention.
In addition, term " first ", " second ", " third " etc. are used for description purposes only, it is not understood to indicate or imply
Relative importance.
Meanwhile in the description of the present invention unless specifically defined or limited otherwise, term " connected ", " connection " should be done
It broadly understood, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be mechanical connection,
It is also possible to be electrically connected；It can be directly connected, it can also be indirectly connected through an intermediary.For the common skill of this field
For art personnel, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (7)
1. a kind of automation wafer cutting and positioning device, comprising: pedestal (1), air lifter (2), vacuum ceramic sucker (3),
Mounting rack (4), X-axis guide rail (5), X-axis Mobile base (6), first servo motor (7), Y-axis lead screw (8), shaft coupling (9), bearing block
(10), Y-axis guide rail (11), fixed block (12), Y-axis Mobile base (13), the second servo motor (14), X-axis lead screw (15), nut move
Dynamic seat (16), laser cutter (17)；It is characterized by: the pedestal (1) is rectangular plate-like structure；The air lifter
(2) it is arranged in the upside of pedestal (1), and air lifter (2) is bolted with pedestal (1) and is connected；The vacuum pottery
Porcelain sucker (3) setting is in the upside of air lifter (2), and vacuum ceramic sucker (3) and air lifter (2) are solid by bolt
Surely it is connected；Mounting rack (4) setting is in the upside of pedestal (1), and mounting rack (4) passes through welding manner phase with pedestal (1)
Connection；The X-axis guide rail (5) is arranged on the top of mounting rack (4), and X-axis guide rail (5) is bolted with mounting rack (4)
It is connected；The X-axis Mobile base (6) is arranged in the upside of X-axis guide rail (5), and X-axis Mobile base (6) passes through with X-axis guide rail (5)
Embedded mode is connected；The first servo motor (7) is arranged in one end of X-axis Mobile base (6), and first servo motor (7)
It is bolted and is connected with X-axis Mobile base (6)；The Y-axis lead screw (8) is arranged in the upside of X-axis Mobile base (6), and Y-axis
Lead screw (8) is connected with X-axis Mobile base (6) by bearing block (10)；The shaft coupling (9) is arranged the one of Y-axis lead screw (8)
End, and Y-axis lead screw (8) is connected to first servo motor (7) main shaft by shaft coupling (9)；Y-axis guide rail (11) setting is being pacified
The top of (4) is shelved, and Y-axis guide rail (11) is bolted with mounting rack (4) and is connected；Y is arranged in the fixed block (12)
One end of axis rail (11), and fixed block (12) is bolted to connection to mounting rack (4)；The Y-axis Mobile base (13) sets
The upside in Y-axis guide rail (11) is set, and Y-axis Mobile base (13) is connected with Y-axis guide rail (11) by embedded mode；Described second
Servo motor (14) setting is in one end of Y-axis Mobile base (13), and the second servo motor (14) and Y-axis Mobile base (13) pass through spiral shell
Bolt is connected to a fixed；X-axis lead screw (15) setting is in the upside of Y-axis Mobile base (13), and X-axis lead screw (15) and Y-axis are mobile
Seat (13) is connected by bearing block；Nut Mobile base (16) setting is at the middle part of Y-axis Mobile base (13), and nut is mobile
Seat (16) is with Y-axis Mobile base (13) by being connected through mode；The laser cutter (17) is arranged in nut Mobile base
(16) downside, and laser cutter (17) is bolted with nut Mobile base (16) and is connected.
2. a kind of automation wafer cutting and positioning device according to claim 1, it is characterised in that: the mounting rack (4)
Rectangular frame structure is overlooked, and four corners of mounting rack (4) are provided with supporting leg at one.
3. a kind of automation wafer cutting and positioning device according to claim 1, it is characterised in that: the X-axis guide rail (5)
It is provided at two altogether, and X-axis guide rail (5) is separately positioned on the front and back edge on mounting rack (4) top at two.
4. a kind of automation wafer cutting and positioning device according to claim 1, it is characterised in that: the X-axis Mobile base
It (6) and is sliding block in the middle part of Y-axis Mobile base (13), and X-axis Mobile base (6) and the lower part at the both ends of Y-axis Mobile base (13) are equal
It is provided with sliding slot.
5. a kind of automation wafer cutting and positioning device according to claim 1, it is characterised in that: the Y-axis guide rail
(11) it is provided at two altogether, and Y-axis guide rail (11) is separately positioned on the left and right edge on mounting rack (4) top at two.
6. a kind of automation wafer cutting and positioning device according to claim 1, it is characterised in that: the fixed block (12)
Both ends in Y-axis guide rail (11) are set, and there is setting at the both ends of Y-axis guide rail (11) at two.
7. a kind of automation wafer cutting and positioning device according to claim 1, it is characterised in that: the X-axis lead screw
(15) one end is connected to the second servo motor (14) by shaft coupling, and the other end of X-axis lead screw (15) is fixed by bearing block
To Y-axis Mobile base (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821520286.6U CN208961259U (en) | 2018-09-18 | 2018-09-18 | A kind of automation wafer cutting and positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821520286.6U CN208961259U (en) | 2018-09-18 | 2018-09-18 | A kind of automation wafer cutting and positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208961259U true CN208961259U (en) | 2019-06-11 |
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ID=66755155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821520286.6U Active CN208961259U (en) | 2018-09-18 | 2018-09-18 | A kind of automation wafer cutting and positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208961259U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109175726A (en) * | 2018-09-18 | 2019-01-11 | 苏州斯尔特微电子有限公司 | A kind of automation wafer cutting and positioning device |
-
2018
- 2018-09-18 CN CN201821520286.6U patent/CN208961259U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109175726A (en) * | 2018-09-18 | 2019-01-11 | 苏州斯尔特微电子有限公司 | A kind of automation wafer cutting and positioning device |
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