CN219677243U - Wafer pressing structure of insulating substrate wafer and wafer etching equipment - Google Patents
Wafer pressing structure of insulating substrate wafer and wafer etching equipment Download PDFInfo
- Publication number
- CN219677243U CN219677243U CN202320259472.3U CN202320259472U CN219677243U CN 219677243 U CN219677243 U CN 219677243U CN 202320259472 U CN202320259472 U CN 202320259472U CN 219677243 U CN219677243 U CN 219677243U
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- ejector pin
- wafer
- pin group
- thimble
- vertical direction
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- 239000000758 substrate Substances 0.000 title claims abstract description 25
- 238000005530 etching Methods 0.000 title claims abstract description 14
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 59
- 230000005540 biological transmission Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Abstract
The utility model discloses a wafer pressing structure of an insulating substrate wafer and wafer etching equipment, and relates to the technical field of semiconductors. The tabletting structure comprises: the slide holder is provided with at least three first through holes extending along the vertical direction and at least three second through holes extending along the vertical direction; the first ejector pin group comprises at least three first ejector pins; the second thimble group comprises at least three second thimbles; the driving mechanism is used for driving the first thimble to extend to a first preset position or return to a first initial position through the first through hole after moving in the vertical direction, and driving the second thimble to extend to a second preset position or return to a second initial position through the second through hole after moving in the vertical direction; the press ring is configured to be attached to the top of the slide holder when the first ejector pin group ejector pins are in the initial position. The tabletting structure provided by the utility model has a simple structure, and does not occupy the upper space of the reaction cavity.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a wafer pressing structure of an insulating substrate wafer and wafer etching equipment.
Background
With the rapid growth of the semiconductor industry, insulating substrate wafers have emerged. In the conventional process, in order to prevent the wafer from moving during etching, a high pressure is applied to the stage to adsorb the wafer on the surface of the stage. But such an approach is not suitable for insulating substrate wafers.
For insulating substrate wafers, in order to prevent the wafers from moving during etching, a pressing ring needs to be arranged in the reaction cavity, and the wafers are pressed by the pressing ring to limit the movement of the wafers. Structurally, the compression ring is fixed in the cavity, the carrier and the bearing part thereof are sealed with the reaction cavity through the corrugated pipe, so that the carrier can move up and down, when the wafer is conveyed to the upper part of the carrier in the cavity by the mechanical arm, two air cylinders are needed, one air cylinder drives the thimble to move up and down, the wafer is separated from the arm and placed on the carrier, and the other air cylinder drives the corrugated pipe and the carrier to move up and abut against the compression ring, so that the movement of the wafer is limited.
The fixing mode is a double-shaft double-control double-acting mode, two air cylinders are needed, the structure is complex, and the compression ring fixing structure occupies the upper space.
Disclosure of Invention
In order to solve at least one technical problem provided by the background art, the utility model provides a wafer pressing structure of an insulating substrate wafer and wafer etching equipment.
The utility model provides the following scheme:
a wafer pad structure for insulating a substrate wafer, comprising:
the slide holder is provided with at least three first through holes extending along the vertical direction and at least three second through holes extending along the vertical direction;
the first thimble group comprises at least three first thimbles, and the position of each first thimble corresponds to one first through hole;
the second thimble group comprises at least three second thimbles, and the position of each second thimble corresponds to one second through hole;
the driving mechanism is used for driving the first thimble to move in the vertical direction and then extend to a first preset position or return to a first initial position through the first through hole, and driving the second thimble to move in the vertical direction and then extend to a second preset position or return to a second initial position through the second through hole;
the press ring is configured to be attached to the top of the slide holder when the first ejector pin group is in the first initial position, and is ejected when the first ejector pin group moves upwards.
Optionally, the heights of all the first ejector pins are the same, and the heights of all the second ejector pins are the same;
and the height of the first ejector pin group is larger than that of the second ejector pin group at any position.
Optionally, the driving mechanism is an air cylinder, the air cylinder is arranged below the slide holder, and the air cylinder is connected with the first ejector pin group and the second ejector pin group;
the tabletting mechanism further comprises a corrugated pipe, and the corrugated pipe is connected between the slide holder and the first ejector pin group and between the slide holder and the second ejector pin group;
the first ejector pin group and the second ejector pin group are configured to synchronously move upwards or synchronously move downwards.
Optionally, the number of the first thimble and the second thimble is three.
Optionally, the three first thimble are arranged in a triangle shape, and the three second thimble are arranged in a triangle shape.
Optionally, the second thimble group is located inside the compression ring.
Optionally, the first ejector pin group is located outside the second ejector pin group.
A wafer etching apparatus includes a wafer pad structure of the insulating substrate wafer.
According to the specific embodiment provided by the utility model, the utility model discloses the following technical effects:
the pressing structure of the insulating substrate wafer provided by the utility model adopts only one driving mechanism and adopts a coaxial single-control dual-function structure to realize pressing of the insulating substrate wafer. The device is coaxial, namely only one driving mechanism is adopted, only one driving mechanism is required to be controlled in a single control mode, and the device has double functions, namely, the movement of the pressing sheet and the movement of the wafer are realized, and compared with the prior art, the device has a simple and stable structure. In addition, the tablet is arranged above the carrying platform, so that the integration level with the carrying platform is high, and the tablet does not occupy the upper space of the reaction cavity.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a cross-sectional view of a wafer hold-down structure for an insulating substrate wafer in accordance with one embodiment of the present utility model;
FIG. 2 is a cross-sectional view of one state of a wafer hold-down structure for an insulating substrate wafer provided in accordance with one embodiment of the present utility model;
FIG. 3 is a cross-sectional view of another state of a wafer hold-down structure for an insulating substrate wafer provided in accordance with one embodiment of the present utility model;
fig. 4 is a schematic diagram showing a state change of a wafer pressing structure of an insulating substrate wafer according to an embodiment of the present utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the utility model, fall within the scope of protection of the utility model.
It should be noted that, the descriptions of the directions of "left", "right", "upper", "lower", "top", "bottom", and the like of the present utility model are defined based on the relation of orientations or positions shown in the drawings, and are only for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the structures must be constructed and operated in a specific orientation, and thus, the present utility model should not be construed as being limited thereto. In the description of the present utility model, the meaning of "plurality" is two or more unless specifically defined otherwise.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Aiming at the technical problems in the background art, the utility model provides a wafer pressing structure of an insulating substrate wafer and wafer etching equipment. Referring to fig. 1, and referring to fig. 2 and 3, the wafer pad structure of the insulating substrate wafer generally includes: slide holder 10, first thimble group, second thimble group, actuating mechanism 40 and clamping ring 50. At least three first through holes extending along the vertical direction and at least three second through holes extending along the vertical direction are formed in the slide holder 10. The first thimble group comprises at least three first thimbles 21, the position of each first thimble 21 corresponds to one first through hole, and each first thimble 21 can move up and down in the corresponding first through hole in a controlled manner. The second thimble group comprises at least three second thimbles 31, the position of each second thimble 31 corresponds to one second through hole, and each second thimble 31 can move up and down in the corresponding second through hole in a controlled manner. The driving mechanism 40 is configured to drive the first thimble 21 to move in the vertical direction and then extend to a first preset position or return to a first initial position through the first through hole, and drive the second thimble 31 to move in the vertical direction and then extend to a second preset position or return to a second initial position through the second through hole. Illustratively, the first preset position and the second preset position are both located above the stage 10, that is, the first ejector pin set and the second ejector pin set respectively extend out of the first through hole and the second through hole. Illustratively, the first initial position and the second initial position are both in the first through hole and the second through hole, that is, in the initial position, the first thimble 21 is located in the corresponding first through hole, and the second thimble 31 is located in the corresponding second through hole. The compression ring 50 is configured to engage the top of the stage 10 when the first ejector pin set is in the first initial position, and to be ejected when the first ejector pin set is moved upward.
The wafer pressing structure of the insulating substrate wafer is arranged in the reaction cavity, and the slide holder 10 is fixed, so that one driving mechanism 40 drives two groups of ejector pins to move up and down. As shown in fig. 4, (a) - (f) illustrate a variation, before the etching process begins, the driving mechanism 40 drives the first ejector pin set to move upwards to make the pressure ring 50 on the stage 10 move upwards to the first preset position, at the same time, the driving mechanism 40 drives the second ejector pin set to move upwards to the second preset position, generally, the first preset position is higher than the second preset position, then, the external transmission mechanism (such as a mechanical arm) moves the wafer 70 and places the wafer 70 on the second ejector pin set (see also fig. 2), the transmission mechanism withdraws (in the case of a mechanical arm, the wafer 70 can be placed on the second ejector pin set by using the Z-axis negative movement of the mechanical arm, and the wafer 70 can be separated from the mechanical arm by further lifting the second ejector pin set upwards), the driving mechanism 40 drives the second ejector pin set to move downwards to the second initial position to make the wafer 70 fall on the stage 10, and at the same time, the driving mechanism 40 drives the first ejector pin set to move downwards to the first initial position to make the pressure ring 70 press the wafer 70 on the first initial position (see also fig. 3).
The above-mentioned pressing structure of the insulating substrate wafer 70 adopts only one driving mechanism 40, and adopts a coaxial single-control dual-function structure to realize pressing of the insulating substrate wafer 70. The device is coaxial, namely only one driving mechanism 40 is adopted, only one driving mechanism 40 is required to be controlled in a single control mode, and the device has double functions, namely, the movement of the pressing sheet and the movement of the wafer 70 are realized, and compared with the prior art, the device has a simple and stable structure. In addition, the tablet is arranged above the slide holder 10, so that the integration level with the slide holder 10 is high, and the tablet does not occupy the upper space of the reaction cavity.
Specifically, in one example of the present utility model, the heights of all the first ejector pins 21 are the same, and the heights of all the second ejector pins 31 are the same, so that the first ejector pin group and the second ejector pin group are all in a plane after extending. And the height of the first ejector pin group is larger than that of the second ejector pin group at any position. The transfer mechanism is configured to move the wafer 70 above the second set of pins when the first set of pins is in the first preset position and the second set of pins is in the second preset position such that the wafer 70 is supported by the second set of pins.
Illustratively, in the present utility model, the driving mechanism 40 is a cylinder, which is disposed below the stage 10 and is connected to both the first ejector pin set and the second ejector pin set, so as to drive the first ejector pin set and the second ejector pin set simultaneously. The tabletting mechanism further comprises a corrugated pipe 60, and the corrugated pipe 60 is connected between the slide holder 10 and the first ejector pin group and between the slide holder 10 and the second ejector pin group. The first ejector pin group and the second ejector pin group are configured to synchronously move upwards or synchronously move downwards, namely, in the same movement, the movement directions of the first ejector pin group and the second ejector pin group are the same.
Illustratively, the number of the first thimble 21 and the second thimble 31 is three. Of course, it is understood that the number of the first ejector pins 21 and the second ejector pins 31 may be the same or different, and preferably the same. In other examples, the number of the first ejector pins 21 and the second ejector pins 31 may be other, which is not described in detail herein.
Further, the three first pins 21 are arranged in a triangle shape, and the three second pins 31 are arranged in a triangle shape, preferably in a regular triangle shape, so that the stress of each position of the pressure ring 50 and the wafer 70 is uniform.
Specifically, in one example of the present utility model, the second ejector pin group is located inside the pressing ring 50 to avoid interference with each other.
Further, the first ejector pin group is positioned outside the second ejector pin group.
Corresponding to the above-mentioned wafer pressing structure of the insulating substrate, the present utility model further provides a wafer etching apparatus, which includes the wafer pressing structure of the insulating substrate, and further includes the structures such as the reaction chamber and the transmission mechanism, and of course, it is understood that, in order to implement the etching function, the wafer 70 etching apparatus inevitably includes other components.
The above description of the technical solution provided by the present utility model has been provided in detail, and specific examples are applied to illustrate the structure and implementation of the present utility model, and the above examples are only used to help understand the method and core idea of the present utility model; also, it is within the scope of the present utility model to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the utility model.
Claims (8)
1. A wafer pressing structure of an insulating substrate wafer, comprising:
the slide holder is provided with at least three first through holes extending along the vertical direction and at least three second through holes extending along the vertical direction;
the first thimble group comprises at least three first thimbles, and the position of each first thimble corresponds to one first through hole;
the second thimble group comprises at least three second thimbles, and the position of each second thimble corresponds to one second through hole;
the driving mechanism is used for driving the first thimble to move in the vertical direction and then extend to a first preset position or return to a first initial position through the first through hole, and driving the second thimble to move in the vertical direction and then extend to a second preset position or return to a second initial position through the second through hole;
the press ring is configured to be attached to the top of the slide holder when the first ejector pin group is in the first initial position, and is ejected when the first ejector pin group moves upwards.
2. The tabletting structure of claim 1, wherein the heights of all the first thimbles are the same and the heights of all the second thimbles are the same;
and the height of the first ejector pin group is larger than that of the second ejector pin group at any position.
3. The tabletting structure of claim 1, wherein the driving mechanism is a cylinder, the cylinder is arranged below the slide holder, and the cylinder is connected with the first ejector pin group and the second ejector pin group;
the tabletting structure further comprises a corrugated pipe, and the corrugated pipe is connected between the slide holder and the first ejector pin group and between the slide holder and the second ejector pin group;
the first ejector pin group and the second ejector pin group are configured to synchronously move upwards or synchronously move downwards.
4. The tableting structure of claim 1, wherein the number of the first and second pins is three.
5. The tableting structure of claim 4, wherein three of the first pins are arranged in a triangular configuration and three of the second pins are arranged in a triangular configuration.
6. The compression structure of claim 1, wherein the second thimble group is located inside the compression ring.
7. The tableting structure according to claim 1, wherein the first ejector pin group is located outside the second ejector pin group.
8. A wafer etching apparatus comprising the wafer pressing structure of an insulating substrate wafer according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320259472.3U CN219677243U (en) | 2023-02-20 | 2023-02-20 | Wafer pressing structure of insulating substrate wafer and wafer etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320259472.3U CN219677243U (en) | 2023-02-20 | 2023-02-20 | Wafer pressing structure of insulating substrate wafer and wafer etching equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219677243U true CN219677243U (en) | 2023-09-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320259472.3U Active CN219677243U (en) | 2023-02-20 | 2023-02-20 | Wafer pressing structure of insulating substrate wafer and wafer etching equipment |
Country Status (1)
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| CN (1) | CN219677243U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117174644A (en) * | 2023-11-01 | 2023-12-05 | 江苏邑文微电子科技有限公司 | Wafer heating bearing device, wafer heating production line and wafer heating method |
| CN117457572A (en) * | 2023-12-25 | 2024-01-26 | 上海谙邦半导体设备有限公司 | Wafer exchange device and method for vacuum reaction cavity |
-
2023
- 2023-02-20 CN CN202320259472.3U patent/CN219677243U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117174644A (en) * | 2023-11-01 | 2023-12-05 | 江苏邑文微电子科技有限公司 | Wafer heating bearing device, wafer heating production line and wafer heating method |
| CN117174644B (en) * | 2023-11-01 | 2024-02-06 | 江苏邑文微电子科技有限公司 | Wafer heating bearing device, wafer heating production line and wafer heating method |
| CN117457572A (en) * | 2023-12-25 | 2024-01-26 | 上海谙邦半导体设备有限公司 | Wafer exchange device and method for vacuum reaction cavity |
| CN117457572B (en) * | 2023-12-25 | 2024-03-15 | 上海谙邦半导体设备有限公司 | Wafer exchange device for vacuum reaction cavity |
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