CN115104183A - 电路结构和电子设备 - Google Patents

电路结构和电子设备 Download PDF

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Publication number
CN115104183A
CN115104183A CN202080096697.0A CN202080096697A CN115104183A CN 115104183 A CN115104183 A CN 115104183A CN 202080096697 A CN202080096697 A CN 202080096697A CN 115104183 A CN115104183 A CN 115104183A
Authority
CN
China
Prior art keywords
substrate
chip
cable
circuit structure
cable connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080096697.0A
Other languages
English (en)
Inventor
张童龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN115104183A publication Critical patent/CN115104183A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电路结构以及电子设备，该电路结构(100)包括：第一基板(10)、第二基板(12)和芯片(11)；其中，芯片(11)和第二基板(12)均被承载在第一基板(10)上；第二基板(12)上设置有线缆连接区域(121)；芯片(11)通过跳线或者第一基板(10)上的布线层与第二基板(12)上的线缆连接区域(121)电性连接。该电路结构(100)可以实现与芯片(11)电性连接的线缆(13)数目的灵活设置。

Description

PCT国内申请，说明书已公开。

Claims (11)

  1. PCT国内申请，权利要求书已公开。
CN202080096697.0A 2020-03-05 2020-03-05 电路结构和电子设备 Pending CN115104183A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/077872 WO2021174470A1 (zh) 2020-03-05 2020-03-05 电路结构和电子设备

Publications (1)

Publication Number Publication Date
CN115104183A true CN115104183A (zh) 2022-09-23

Family

ID=77612807

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080096697.0A Pending CN115104183A (zh) 2020-03-05 2020-03-05 电路结构和电子设备

Country Status (2)

Country Link
CN (1) CN115104183A (zh)
WO (1) WO2021174470A1 (zh)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101017785A (zh) * 2006-02-10 2007-08-15 矽品精密工业股份有限公司 半导体堆栈结构及其制法
CN100521179C (zh) * 2006-11-21 2009-07-29 日月光半导体制造股份有限公司 可堆栈式半导体封装结构
CN101252105A (zh) * 2008-03-28 2008-08-27 友达光电股份有限公司 电路板结构、覆晶电路和驱动电路的布线结构
US20110147908A1 (en) * 2009-12-17 2011-06-23 Peng Sun Module for Use in a Multi Package Assembly and a Method of Making the Module and the Multi Package Assembly
CN106206559A (zh) * 2015-05-04 2016-12-07 葳天科技股份有限公司 模块化的发光装置
KR102511832B1 (ko) * 2016-08-26 2023-03-20 삼성전자주식회사 반도체 패키지 장치

Also Published As

Publication number Publication date
WO2021174470A1 (zh) 2021-09-10

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