CN115088061B - 试样观察系统以及图像处理方法 - Google Patents

试样观察系统以及图像处理方法

Info

Publication number
CN115088061B
CN115088061B CN202180013541.6A CN202180013541A CN115088061B CN 115088061 B CN115088061 B CN 115088061B CN 202180013541 A CN202180013541 A CN 202180013541A CN 115088061 B CN115088061 B CN 115088061B
Authority
CN
China
Prior art keywords
image
learning
defect
reference image
defective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180013541.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN115088061A (zh
Inventor
近藤直明
原田实
岭川阳平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Publication of CN115088061A publication Critical patent/CN115088061A/zh
Application granted granted Critical
Publication of CN115088061B publication Critical patent/CN115088061B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/04—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/82—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V20/00—Scenes; Scene-specific elements
    • G06V20/60—Type of objects
    • G06V20/69—Microscopic objects, e.g. biological cells or cellular parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • Databases & Information Systems (AREA)
  • Computing Systems (AREA)
  • Artificial Intelligence (AREA)
  • Software Systems (AREA)
  • Chemical & Material Sciences (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
CN202180013541.6A 2020-03-06 2021-01-08 试样观察系统以及图像处理方法 Active CN115088061B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-038745 2020-03-06
JP2020038745A JP7262409B2 (ja) 2020-03-06 2020-03-06 試料観察システム及び画像処理方法
PCT/JP2021/000484 WO2021176841A1 (ja) 2020-03-06 2021-01-08 試料観察システム及び画像処理方法

Publications (2)

Publication Number Publication Date
CN115088061A CN115088061A (zh) 2022-09-20
CN115088061B true CN115088061B (zh) 2026-04-28

Family

ID=77613622

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180013541.6A Active CN115088061B (zh) 2020-03-06 2021-01-08 试样观察系统以及图像处理方法

Country Status (6)

Country Link
US (1) US12333695B2 (https=)
JP (1) JP7262409B2 (https=)
KR (1) KR102808816B1 (https=)
CN (1) CN115088061B (https=)
TW (1) TWI793496B (https=)
WO (1) WO2021176841A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240005473A1 (en) * 2020-11-30 2024-01-04 Konica Minolta, Inc. Analysis apparatus, inspection system, and learning apparatus
JP7847075B2 (ja) * 2022-01-27 2026-04-16 株式会社日立ハイテク 欠陥観察方法、装置、およびプログラム
JP2023177058A (ja) * 2022-06-01 2023-12-13 株式会社豊田中央研究所 顕微鏡像取得制御装置、顕微鏡像取得制御プログラム
JP2024092743A (ja) * 2022-12-26 2024-07-08 株式会社日立ハイテク マルチ荷電粒子ビーム装置と通信可能なプロセッサシステム、およびその方法
CN121112997B (zh) * 2025-11-17 2026-03-17 中国电建集团西北勘测设计研究院有限公司 海上光伏支架的应变监测方法、装置、程序产品与设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184565A (ja) * 2005-12-07 2007-07-19 Hitachi High-Technologies Corp 欠陥レビュー方法及びその装置
JP2018205163A (ja) * 2017-06-06 2018-12-27 株式会社デンソー 外観検査装置、変換データ生成装置、及びプログラム

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08136466A (ja) * 1994-11-10 1996-05-31 Dainippon Screen Mfg Co Ltd 画像パターン検査装置
JP3612247B2 (ja) 1999-09-14 2005-01-19 株式会社東芝 半導体検査装置及び半導体検査方法
JP3893825B2 (ja) 1999-12-28 2007-03-14 株式会社日立製作所 半導体ウェーハの欠陥観察方法及びその装置
JP4118703B2 (ja) * 2002-05-23 2008-07-16 株式会社日立ハイテクノロジーズ 欠陥分類装置及び欠陥自動分類方法並びに欠陥検査方法及び処理装置
JP2004349515A (ja) * 2003-05-23 2004-12-09 Hitachi High-Technologies Corp Ｓｅｍ式外観検査装置，レビュー装置、およびアライメント座標設定方法
JP2004354251A (ja) 2003-05-29 2004-12-16 Nidek Co Ltd 欠陥検査装置
US7333650B2 (en) 2003-05-29 2008-02-19 Nidek Co., Ltd. Defect inspection apparatus
JP5006520B2 (ja) * 2005-03-22 2012-08-22 株式会社日立ハイテクノロジーズ 欠陥観察装置及び欠陥観察装置を用いた欠陥観察方法
US7764826B2 (en) * 2005-12-07 2010-07-27 Hitachi High-Technologies Corporation Method and apparatus of reviewing defects on a semiconductor device
JP5325580B2 (ja) * 2009-01-09 2013-10-23 株式会社日立ハイテクノロジーズ Ｓｅｍを用いた欠陥観察方法及びその装置
JP2013148349A (ja) * 2010-04-23 2013-08-01 Hitachi High-Technologies Corp レビュー方法、およびレビュー装置
JP5948262B2 (ja) 2013-01-30 2016-07-06 株式会社日立ハイテクノロジーズ 欠陥観察方法および欠陥観察装置
WO2016092640A1 (ja) * 2014-12-10 2016-06-16 株式会社 日立ハイテクノロジーズ 欠陥観察装置および欠陥観察方法
JP2016148747A (ja) 2015-02-12 2016-08-18 株式会社ニューフレアテクノロジー 画像作成方法、検査方法および画像作成装置
JP6546826B2 (ja) * 2015-10-08 2019-07-17 株式会社日立パワーソリューションズ 欠陥検査方法、及びその装置
US10402688B2 (en) 2016-12-07 2019-09-03 Kla-Tencor Corporation Data augmentation for convolutional neural network-based defect inspection
JP6668278B2 (ja) 2017-02-20 2020-03-18 株式会社日立ハイテク 試料観察装置および試料観察方法
US11087454B2 (en) * 2017-03-17 2021-08-10 Hitachi High-Tech Corporation Defect observation device and defect observation method
FR3070084B1 (fr) * 2017-08-10 2019-08-30 Safran Procede de controle automatique non destructif de pieces mecaniques
EP3499459A1 (en) * 2017-12-18 2019-06-19 FEI Company Method, device and system for remote deep learning for microscopic image reconstruction and segmentation
JP7042118B2 (ja) * 2018-03-08 2022-03-25 株式会社東芝 検査装置、検査方法、及びプログラム
US10789703B2 (en) 2018-03-19 2020-09-29 Kla-Tencor Corporation Semi-supervised anomaly detection in scanning electron microscope images
JP7058324B2 (ja) 2018-05-09 2022-04-21 レーザーテック株式会社 検査装置、検査方法、学習方法、及びプログラム
CN110619618B (zh) * 2018-06-04 2023-04-07 杭州海康威视数字技术股份有限公司 一种表面缺陷检测方法、装置及电子设备
JP2020043266A (ja) * 2018-09-12 2020-03-19 株式会社日立ハイテクノロジーズ 半導体ウェハの欠陥観察システム及び欠陥観察方法
US11450012B2 (en) * 2019-10-31 2022-09-20 Kla Corporation BBP assisted defect detection flow for SEM images

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184565A (ja) * 2005-12-07 2007-07-19 Hitachi High-Technologies Corp 欠陥レビュー方法及びその装置
JP2018205163A (ja) * 2017-06-06 2018-12-27 株式会社デンソー 外観検査装置、変換データ生成装置、及びプログラム

Also Published As

Publication number Publication date
CN115088061A (zh) 2022-09-20
US12333695B2 (en) 2025-06-17
TWI793496B (zh) 2023-02-21
KR20220123708A (ko) 2022-09-08
KR102808816B1 (ko) 2025-05-19
WO2021176841A1 (ja) 2021-09-10
TW202135119A (zh) 2021-09-16
JP7262409B2 (ja) 2023-04-21
JP2021141231A (ja) 2021-09-16
US20230005123A1 (en) 2023-01-05

Similar Documents

Publication Publication Date Title
CN115088061B (zh) 试样观察系统以及图像处理方法
US11170483B2 (en) Sample observation device and sample observation method
JP4199939B2 (ja) 半導体検査システム
JP5581286B2 (ja) 欠陥検査方法および欠陥検査装置
TWI724827B (zh) 缺陷觀察裝置
JP2020115131A (ja) 試験片の調査の方法およびそのシステム
JP6909886B2 (ja) 画像推定方法およびシステム
JP2016507058A (ja) パターン化された欠陥の輪郭ベースのアレイ検査
TWI876176B (zh) 用於校正檢測影像之失真的方法及設備及相關聯非暫時性電腦可讀媒體
US12154264B2 (en) Defect inspecting system and defect inspecting method
JP2015099054A (ja) オーバーレイ計測方法および計測装置
TWI867273B (zh) 縮減掃描電子顯微鏡影像中之樣本充電效應的方法、電子束檢測系統以及電腦產品
KR102774622B1 (ko) 반도체 시편의 3차원 재구성
JP4262269B2 (ja) パターンマッチング方法及び装置
JP4262288B2 (ja) パターンマッチング方法及び装置
TWI896378B (zh) 判定複數個資料集之間的偏移之方法與系統及相關聯電腦程式產品
TW202420133A (zh) 參數化檢測影像模擬
TW202544739A (zh) 用於提供一或多個半導體取樣的資訊的圖像之間的配準的系統和方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant