KR102808816B1 - 시료 관찰 시스템 및 화상 처리 방법 - Google Patents

시료 관찰 시스템 및 화상 처리 방법 Download PDF

Info

Publication number
KR102808816B1
KR102808816B1 KR1020227027317A KR20227027317A KR102808816B1 KR 102808816 B1 KR102808816 B1 KR 102808816B1 KR 1020227027317 A KR1020227027317 A KR 1020227027317A KR 20227027317 A KR20227027317 A KR 20227027317A KR 102808816 B1 KR102808816 B1 KR 102808816B1
Authority
KR
South Korea
Prior art keywords
image
learning
defect
reference image
defect image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227027317A
Other languages
English (en)
Korean (ko)
Other versions
KR20220123708A (ko
Inventor
나오아끼 곤도
미노루 하라다
요헤이 미네까와
Original Assignee
주식회사 히타치하이테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 히타치하이테크 filed Critical 주식회사 히타치하이테크
Publication of KR20220123708A publication Critical patent/KR20220123708A/ko
Application granted granted Critical
Publication of KR102808816B1 publication Critical patent/KR102808816B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/04—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/82—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V20/00—Scenes; Scene-specific elements
    • G06V20/60—Type of objects
    • G06V20/69—Microscopic objects, e.g. biological cells or cellular parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Computing Systems (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • Medical Informatics (AREA)
  • Databases & Information Systems (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Image Analysis (AREA)
KR1020227027317A 2020-03-06 2021-01-08 시료 관찰 시스템 및 화상 처리 방법 Active KR102808816B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020038745A JP7262409B2 (ja) 2020-03-06 2020-03-06 試料観察システム及び画像処理方法
JPJP-P-2020-038745 2020-03-06
PCT/JP2021/000484 WO2021176841A1 (ja) 2020-03-06 2021-01-08 試料観察システム及び画像処理方法

Publications (2)

Publication Number Publication Date
KR20220123708A KR20220123708A (ko) 2022-09-08
KR102808816B1 true KR102808816B1 (ko) 2025-05-19

Family

ID=77613622

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227027317A Active KR102808816B1 (ko) 2020-03-06 2021-01-08 시료 관찰 시스템 및 화상 처리 방법

Country Status (5)

Country Link
US (1) US12333695B2 (https=)
JP (1) JP7262409B2 (https=)
KR (1) KR102808816B1 (https=)
TW (1) TWI793496B (https=)
WO (1) WO2021176841A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4253943A4 (en) * 2020-11-30 2024-05-01 Konica Minolta, Inc. ANALYSIS DEVICE, INSPECTION SYSTEM AND LEARNING DEVICE
JP7847075B2 (ja) * 2022-01-27 2026-04-16 株式会社日立ハイテク 欠陥観察方法、装置、およびプログラム
JP2023177058A (ja) * 2022-06-01 2023-12-13 株式会社豊田中央研究所 顕微鏡像取得制御装置、顕微鏡像取得制御プログラム
JP2024092743A (ja) * 2022-12-26 2024-07-08 株式会社日立ハイテク マルチ荷電粒子ビーム装置と通信可能なプロセッサシステム、およびその方法
CN121112997B (zh) * 2025-11-17 2026-03-17 中国电建集团西北勘测设计研究院有限公司 海上光伏支架的应变监测方法、装置、程序产品与设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184565A (ja) 2005-12-07 2007-07-19 Hitachi High-Technologies Corp 欠陥レビュー方法及びその装置
JP2010161247A (ja) 2009-01-09 2010-07-22 Hitachi High-Technologies Corp Ｓｅｍを用いた欠陥観察方法及びその装置
JP2018205163A (ja) 2017-06-06 2018-12-27 株式会社デンソー 外観検査装置、変換データ生成装置、及びプログラム

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08136466A (ja) * 1994-11-10 1996-05-31 Dainippon Screen Mfg Co Ltd 画像パターン検査装置
JP3612247B2 (ja) * 1999-09-14 2005-01-19 株式会社東芝 半導体検査装置及び半導体検査方法
JP3893825B2 (ja) 1999-12-28 2007-03-14 株式会社日立製作所 半導体ウェーハの欠陥観察方法及びその装置
JP2004349515A (ja) * 2003-05-23 2004-12-09 Hitachi High-Technologies Corp Ｓｅｍ式外観検査装置，レビュー装置、およびアライメント座標設定方法
JP2004354251A (ja) * 2003-05-29 2004-12-16 Nidek Co Ltd 欠陥検査装置
US7333650B2 (en) 2003-05-29 2008-02-19 Nidek Co., Ltd. Defect inspection apparatus
JP5006520B2 (ja) * 2005-03-22 2012-08-22 株式会社日立ハイテクノロジーズ 欠陥観察装置及び欠陥観察装置を用いた欠陥観察方法
US7764826B2 (en) * 2005-12-07 2010-07-27 Hitachi High-Technologies Corporation Method and apparatus of reviewing defects on a semiconductor device
JP5948262B2 (ja) * 2013-01-30 2016-07-06 株式会社日立ハイテクノロジーズ 欠陥観察方法および欠陥観察装置
WO2016092640A1 (ja) * 2014-12-10 2016-06-16 株式会社 日立ハイテクノロジーズ 欠陥観察装置および欠陥観察方法
JP2016148747A (ja) 2015-02-12 2016-08-18 株式会社ニューフレアテクノロジー 画像作成方法、検査方法および画像作成装置
JP6546826B2 (ja) * 2015-10-08 2019-07-17 株式会社日立パワーソリューションズ 欠陥検査方法、及びその装置
US10402688B2 (en) 2016-12-07 2019-09-03 Kla-Tencor Corporation Data augmentation for convolutional neural network-based defect inspection
JP6668278B2 (ja) * 2017-02-20 2020-03-18 株式会社日立ハイテク 試料観察装置および試料観察方法
WO2018167965A1 (ja) * 2017-03-17 2018-09-20 株式会社日立ハイテクノロジーズ 欠陥観察装置及び欠陥観察方法
EP3499459A1 (en) * 2017-12-18 2019-06-19 FEI Company Method, device and system for remote deep learning for microscopic image reconstruction and segmentation
JP7042118B2 (ja) * 2018-03-08 2022-03-25 株式会社東芝 検査装置、検査方法、及びプログラム
US10789703B2 (en) * 2018-03-19 2020-09-29 Kla-Tencor Corporation Semi-supervised anomaly detection in scanning electron microscope images
WO2019216303A1 (ja) 2018-05-09 2019-11-14 レーザーテック株式会社 検査装置、検査方法、学習方法、及びプログラム
CN110619618B (zh) * 2018-06-04 2023-04-07 杭州海康威视数字技术股份有限公司 一种表面缺陷检测方法、装置及电子设备
JP2020043266A (ja) * 2018-09-12 2020-03-19 株式会社日立ハイテクノロジーズ 半導体ウェハの欠陥観察システム及び欠陥観察方法
US11450012B2 (en) * 2019-10-31 2022-09-20 Kla Corporation BBP assisted defect detection flow for SEM images

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184565A (ja) 2005-12-07 2007-07-19 Hitachi High-Technologies Corp 欠陥レビュー方法及びその装置
JP2010161247A (ja) 2009-01-09 2010-07-22 Hitachi High-Technologies Corp Ｓｅｍを用いた欠陥観察方法及びその装置
JP2018205163A (ja) 2017-06-06 2018-12-27 株式会社デンソー 外観検査装置、変換データ生成装置、及びプログラム

Also Published As

Publication number Publication date
KR20220123708A (ko) 2022-09-08
TW202135119A (zh) 2021-09-16
US20230005123A1 (en) 2023-01-05
JP2021141231A (ja) 2021-09-16
US12333695B2 (en) 2025-06-17
CN115088061A (zh) 2022-09-20
JP7262409B2 (ja) 2023-04-21
WO2021176841A1 (ja) 2021-09-10
TWI793496B (zh) 2023-02-21

Similar Documents

Publication Publication Date Title
KR102808816B1 (ko) 시료 관찰 시스템 및 화상 처리 방법
JP6668278B2 (ja) 試料観察装置および試料観察方法
TWI684921B (zh) 圖案檢查裝置及圖案檢查方法
KR102350416B1 (ko) 결함 관찰 장치
JP5581286B2 (ja) 欠陥検査方法および欠陥検査装置
JP5783953B2 (ja) パターン評価装置およびパターン評価方法
JP2007218711A (ja) 電子顕微鏡装置を用いた計測対象パターンの計測方法
JP2017198589A (ja) パターン検査方法及びパターン検査装置
CN114556516B (zh) 使用基于扩散的模型的数值补偿sem-诱发充电
US12154264B2 (en) Defect inspecting system and defect inspecting method
TWI867273B (zh) 縮減掃描電子顯微鏡影像中之樣本充電效應的方法、電子束檢測系統以及電腦產品
TWI874699B (zh) 檢驗半導體樣品的系統及方法和包含指令之非暫時性電腦可讀媒體
WO2023280489A1 (en) Method and system for anomaly-based defect inspection
CN115088061B (zh) 试样观察系统以及图像处理方法
JP4262269B2 (ja) パターンマッチング方法及び装置
JP4262288B2 (ja) パターンマッチング方法及び装置
JP6255191B2 (ja) 検査装置および検査方法
WO2018167965A1 (ja) 欠陥観察装置及び欠陥観察方法
TWI896378B (zh) 判定複數個資料集之間的偏移之方法與系統及相關聯電腦程式產品
TW202544739A (zh) 用於提供一或多個半導體取樣的資訊的圖像之間的配準的系統和方法
TW202420133A (zh) 參數化檢測影像模擬
TW202437309A (zh) 用於疊對模型建立和應用之系統、方法及軟體

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20220808

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20220808

Comment text: Request for Examination of Application

PG1501 Laying open of application
E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20250401

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20250513

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20250514

End annual number: 3

Start annual number: 1

PG1601 Publication of registration