JP7262409B2 - 試料観察システム及び画像処理方法 - Google Patents

試料観察システム及び画像処理方法 Download PDF

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JP7262409B2
JP7262409B2 JP2020038745A JP2020038745A JP7262409B2 JP 7262409 B2 JP7262409 B2 JP 7262409B2 JP 2020038745 A JP2020038745 A JP 2020038745A JP 2020038745 A JP2020038745 A JP 2020038745A JP 7262409 B2 JP7262409 B2 JP 7262409B2
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image
learning
defect
reference image
observation system
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JP2021141231A5 (https=
JP2021141231A (ja
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直明 近藤
実 原田
陽平 嶺川
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Hitachi High Tech Corp
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Hitachi High Tech Corp
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Priority to JP2020038745A priority Critical patent/JP7262409B2/ja
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Priority to PCT/JP2021/000484 priority patent/WO2021176841A1/ja
Priority to CN202180013541.6A priority patent/CN115088061B/xx
Priority to KR1020227027317A priority patent/KR102808816B1/ko
Priority to US17/802,161 priority patent/US12333695B2/en
Priority to TW110100934A priority patent/TWI793496B/zh
Publication of JP2021141231A publication Critical patent/JP2021141231A/ja
Publication of JP2021141231A5 publication Critical patent/JP2021141231A5/ja
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/04—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75—Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • G06V10/751—Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/82—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V20/00—Scenes; Scene-specific elements
    • G06V20/60—Type of objects
    • G06V20/69—Microscopic objects, e.g. biological cells or cellular parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Computing Systems (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • Medical Informatics (AREA)
  • Databases & Information Systems (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Image Analysis (AREA)
JP2020038745A 2020-03-06 2020-03-06 試料観察システム及び画像処理方法 Active JP7262409B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020038745A JP7262409B2 (ja) 2020-03-06 2020-03-06 試料観察システム及び画像処理方法
CN202180013541.6A CN115088061B (zh) 2020-03-06 2021-01-08 试样观察系统以及图像处理方法
KR1020227027317A KR102808816B1 (ko) 2020-03-06 2021-01-08 시료 관찰 시스템 및 화상 처리 방법
US17/802,161 US12333695B2 (en) 2020-03-06 2021-01-08 Sample observation system and image processing method
PCT/JP2021/000484 WO2021176841A1 (ja) 2020-03-06 2021-01-08 試料観察システム及び画像処理方法
TW110100934A TWI793496B (zh) 2020-03-06 2021-01-11 試料觀察系統及畫像處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020038745A JP7262409B2 (ja) 2020-03-06 2020-03-06 試料観察システム及び画像処理方法

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JP2021141231A JP2021141231A (ja) 2021-09-16
JP2021141231A5 JP2021141231A5 (https=) 2022-06-15
JP7262409B2 true JP7262409B2 (ja) 2023-04-21

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JP (1) JP7262409B2 (https=)
KR (1) KR102808816B1 (https=)
TW (1) TWI793496B (https=)
WO (1) WO2021176841A1 (https=)

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Publication number Priority date Publication date Assignee Title
EP4253943A4 (en) * 2020-11-30 2024-05-01 Konica Minolta, Inc. ANALYSIS DEVICE, INSPECTION SYSTEM AND LEARNING DEVICE
JP7847075B2 (ja) * 2022-01-27 2026-04-16 株式会社日立ハイテク 欠陥観察方法、装置、およびプログラム
JP2023177058A (ja) * 2022-06-01 2023-12-13 株式会社豊田中央研究所 顕微鏡像取得制御装置、顕微鏡像取得制御プログラム
JP2024092743A (ja) * 2022-12-26 2024-07-08 株式会社日立ハイテク マルチ荷電粒子ビーム装置と通信可能なプロセッサシステム、およびその方法
CN121112997B (zh) * 2025-11-17 2026-03-17 中国电建集团西北勘测设计研究院有限公司 海上光伏支架的应变监测方法、装置、程序产品与设备

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JP2004354251A (ja) 2003-05-29 2004-12-16 Nidek Co Ltd 欠陥検査装置
JP2006269489A (ja) 2005-03-22 2006-10-05 Hitachi High-Technologies Corp 欠陥観察装置及び欠陥観察装置を用いた欠陥観察方法
JP2007184565A (ja) 2005-12-07 2007-07-19 Hitachi High-Technologies Corp 欠陥レビュー方法及びその装置
JP2010161247A (ja) 2009-01-09 2010-07-22 Hitachi High-Technologies Corp Ｓｅｍを用いた欠陥観察方法及びその装置
JP2014145694A (ja) 2013-01-30 2014-08-14 Hitachi High-Technologies Corp 欠陥観察方法および欠陥観察装置
JP2018137275A (ja) 2017-02-20 2018-08-30 株式会社日立ハイテクノロジーズ 試料観察装置および試料観察方法
JP2018205163A (ja) 2017-06-06 2018-12-27 株式会社デンソー 外観検査装置、変換データ生成装置、及びプログラム
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JP2001085482A (ja) 1999-09-14 2001-03-30 Toshiba Corp 半導体検査装置及び半導体検査方法
JP2004354251A (ja) 2003-05-29 2004-12-16 Nidek Co Ltd 欠陥検査装置
JP2006269489A (ja) 2005-03-22 2006-10-05 Hitachi High-Technologies Corp 欠陥観察装置及び欠陥観察装置を用いた欠陥観察方法
JP2007184565A (ja) 2005-12-07 2007-07-19 Hitachi High-Technologies Corp 欠陥レビュー方法及びその装置
JP2010161247A (ja) 2009-01-09 2010-07-22 Hitachi High-Technologies Corp Ｓｅｍを用いた欠陥観察方法及びその装置
JP2014145694A (ja) 2013-01-30 2014-08-14 Hitachi High-Technologies Corp 欠陥観察方法および欠陥観察装置
JP2018137275A (ja) 2017-02-20 2018-08-30 株式会社日立ハイテクノロジーズ 試料観察装置および試料観察方法
JP2018205163A (ja) 2017-06-06 2018-12-27 株式会社デンソー 外観検査装置、変換データ生成装置、及びプログラム
US20190287230A1 (en) 2018-03-19 2019-09-19 Kla-Tencor Corporation Semi-supervised anomaly detection in scanning electron microscope images

Also Published As

Publication number Publication date
KR20220123708A (ko) 2022-09-08
TW202135119A (zh) 2021-09-16
US20230005123A1 (en) 2023-01-05
JP2021141231A (ja) 2021-09-16
US12333695B2 (en) 2025-06-17
CN115088061A (zh) 2022-09-20
WO2021176841A1 (ja) 2021-09-10
KR102808816B1 (ko) 2025-05-19
TWI793496B (zh) 2023-02-21

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