CN115043654A - 一种电子烟雾化芯用多孔陶瓷基体组合物、多孔陶瓷基体及其制备方法、电子烟雾化芯 - Google Patents

一种电子烟雾化芯用多孔陶瓷基体组合物、多孔陶瓷基体及其制备方法、电子烟雾化芯 Download PDF

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CN115043654A
CN115043654A CN202110249903.3A CN202110249903A CN115043654A CN 115043654 A CN115043654 A CN 115043654A CN 202110249903 A CN202110249903 A CN 202110249903A CN 115043654 A CN115043654 A CN 115043654A
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porous ceramic
ceramic matrix
parts
matrix composition
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徐述荣
刘双任
江品颐
林信平
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BYD Co Ltd
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Abstract

本发明提供了一种电子烟雾化芯用多孔陶瓷基体组合物、多孔陶瓷基体及其制备方法、电子烟雾化芯,所述多孔陶瓷基体组合物包括陶瓷粉、造孔剂和有机助剂,所述陶瓷粉、所述造孔剂和所述有机助剂的体积比为(50‑70):(30‑50):(80‑150),所述有机助剂包括石蜡、聚苯乙烯、丙烯酸树脂、乙烯‑醋酸乙烯酯共聚物和邻苯二甲酸二辛酯。本发明提供的多孔陶瓷基体组合物解决了现有的多孔陶瓷强度低、成型精度不足的问题。

Description

一种电子烟雾化芯用多孔陶瓷基体组合物、多孔陶瓷基体及 其制备方法、电子烟雾化芯
技术领域
本发明涉及电子烟技术领域,具体涉及一种电子烟雾化芯用多孔陶瓷基体组合物、多孔陶瓷基体及其制备方法、电子烟雾化芯。
背景技术
烟油型电子烟核心部件为多孔陶瓷雾化芯,该雾化芯采用多孔陶瓷的微孔结构储存烟油,采用丝印的方式在陶瓷基材上印刷发热电路,抽吸时通过加热发热电路把存储在多孔陶瓷微孔中的烟油雾化从而达到抽烟的效果,雾化芯中多孔陶瓷的强度对雾化效果、抽吸口感起着至关重要的作用。
目前制备多孔陶瓷的主要方法有干压成型和热压铸成型,主要难点为如何增加强度,提高烟油雾化效率,及如何降低成本。现有干压或热压铸成型但还没进行烧结的坯体存在强度不足、易脱落的问题,在成型、机加工过程中难以保证较好的成型精度,且在转运过程中易磨损导致最终烧结后的多孔陶瓷精度不足的问题。干压成型和热压铸成型工艺浆料很难混均匀,制备的多孔陶瓷强度低,效率低下,性能不稳定。
发明内容
针对现有的多孔陶瓷强度低、成型精度不足的问题,本发明提供了一种电子烟雾化芯用多孔陶瓷基体组合物、多孔陶瓷及其制备方法、、电子烟雾化芯。
本发明解决上述技术问题所采用的技术方案如下:
本发明提供了一种多孔陶瓷基体组合物,包括陶瓷粉、造孔剂和有机助剂,所述陶瓷粉、所述造孔剂和所述有机助剂的体积比为(50-70):(30-50):(80-150),所述有机助剂包括石蜡、聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物和邻苯二甲酸二辛酯。
根据本申请的实施例,所述有机助剂包括如下重量组分:13-15份石蜡、40-45 份聚苯乙烯、25-30份丙烯酸树脂、2-3份乙烯-醋酸乙烯酯共聚物和4-5份邻苯二甲酸二辛酯。
根据本申请的实施例,所述有机助剂还包括0-8份硬脂酸,0-8份司盘60。
根据本申请的实施例,所述陶瓷粉包括氧化锆、氧化铝、氧化硅中的一种或多种。
根据本申请的实施例,所述造孔剂选自碳粉、淀粉、碳酸盐、硝酸盐、铵盐和木屑中的一种或多种。
根据本申请的实施例,所述造孔剂的平均粒径为15-55μm。
根据本申请的实施例,所述造孔剂的平均粒径为25-55μm。
根据本申请的实施例,所述造孔剂的平均粒径为15-21μm。
另一方面,本发明还提供一种多孔陶瓷基体的制备方法,包括将陶瓷粉、造孔剂、有机助剂加入密炼机中进行密炼,所述有机助剂包括石蜡、聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物和邻苯二甲酸二辛酯,得到多孔陶瓷基体组合物;将所述多孔陶瓷基体组合物注塑成型,得到坯体;坯体进行脱脂、烧结,得到多孔陶瓷基体。
根据本申请的实施例,所述脱脂在25-450℃下进行。
根据本申请的实施例,所述烧结温度为1400-1500℃,烧结时间为1.5-3h。
另一方面,本发明还提供一种多孔陶瓷基体,由上述制备方法制备得到。
另一方面,本发明还提供一种电子烟雾化芯,包括多孔陶瓷基体以及位于多孔陶瓷基体表面的加热体;所述多孔陶瓷基体由所述的多孔陶瓷基体组合物经注塑、烧结而成。
根据本发明提供的多孔陶瓷基体组合物,在聚苯乙烯、丙烯酸树脂、乙烯- 醋酸乙烯酯共聚物、邻苯二甲酸二辛酯的共同作用下增加注塑成型后坯体的强度,避免坯体在转运和加工过程中产生磨损,进而提高多孔陶瓷的尺寸精度。石蜡具有润滑作用,在注塑喂料时,可增加多孔陶瓷基体组合物的流动性,降低粘度。在脱脂过程中聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物的分解温度不同,聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物的相互作用下降低了分解速率,使得聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物逐级分解脱除,降低脱脂速度,保证孔隙率稳定,防止成型后坯体开裂,保证多孔陶瓷的强度。
具体实施方式
为了使本发明所解决的技术问题、技术方案及有益效果更加清楚明白,以下结合实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
本发明实施例提供了一种多孔陶瓷基体组合物,包括陶瓷粉、造孔剂和有机助剂,所述陶瓷粉、所述造孔剂和所述有机助剂的体积比为(50-70):(30-50): (80-150),所述有机助剂包括石蜡、聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物和邻苯二甲酸二辛酯。
在本实施例中,在聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物、邻苯二甲酸二辛酯的共同作用下增加注塑喂料成型后坯体的强度,避免坯体在转运和加工过程中产生磨损,进而提高多孔陶瓷的尺寸精度。石蜡具有润滑作用,在注塑喂料时,可增加多孔陶瓷基体组合物的流动性,降低粘度。同时在脱脂过程中聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物的分解温度不同,聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物的相互作用下降低了分解速度,使得聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物逐级分解脱除,降低脱脂速度,保证孔隙率稳定,防止成型后坯体开裂,保证多孔陶瓷的强度。
在一些实施例中,所述有机助剂包括如下重量组分:13-15份石蜡、40-45 份聚苯乙烯、25-30份丙烯酸树脂、2-3份乙烯-醋酸乙烯酯共聚物和4-5份邻苯二甲酸二辛酯。通过调整有机助剂中各组分的含量,保证各组分在脱脂过程中逐级分解脱除,防止坯体开裂。
在一些实施例中,所述有机助剂还包括0-8份硬脂酸,0-8份司盘60。通过加入硬脂酸和司盘60提高陶瓷粉和其它组分之间的相容性,提高分散效果。
在一些实施例中,所述陶瓷粉包括氧化锆、氧化铝、氧化硅中的一种或多种。
在一些实施例中,所述造孔剂选自碳粉、淀粉、碳酸盐、硝酸盐、铵盐和木屑中的一种或多种。
在一些实施例中,所述造孔剂的平均粒径为15-55μm,通过选取不同粒径的造孔剂,多孔陶瓷中可形成不同大小的孔道。
在一些实施例中,所述造孔剂的平均粒径为25-55μm,可得到大孔径的多孔陶瓷。
在一些实施例中,所述造孔剂的平均粒径为15-21μm,可得到小孔径的多孔陶瓷。
另一方面,本发明一实施例还提供一种多孔陶瓷基体的制备方法,包括将陶瓷粉、造孔剂、有机助剂加入密炼机中进行密炼,所述有机助剂包括石蜡、聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物和邻苯二甲酸二辛酯,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体进行脱脂、烧结,得到多孔陶瓷基体。
根据本申请的实施例,所述脱脂在25-450℃下进行。
根据本申请的实施例,所述烧结温度为1400-1500℃,烧结时间为1.5-3h。
具体地,乙烯-醋酸乙烯酯共聚物、聚苯乙烯、丙烯酸树脂的分解温度依次减小,因此脱脂过程中乙烯-醋酸乙烯酯共聚物、聚苯乙烯、丙烯酸树脂逐级分解,降低脱脂速度,提高空隙的稳定性和均匀性。
另一方面,本发明一实施例还提供一种多孔陶瓷基体,由上述制备方法制备得到。
另一方面,本发明一实施例还提供一种电子烟雾化芯,包括多孔陶瓷基体以及位于多孔陶瓷基体表面的加热体;所述多孔陶瓷基体由所述的多孔陶瓷基体组合物经注塑、烧结而成。
以下通过实施例对本发明进行进一步的说明。其中EVA为乙烯-醋酸乙烯酯共聚物,DOP为邻苯二甲酸二辛酯。
实施例1
本实施例中,氧化锆粉、碳粉、有机助剂的体积比为53:47:111,按重量份将氧化锆粉279份、平均粒径为20μm的碳粉93份、硬脂酸4份、司盘60 4份、石蜡15份、聚苯乙烯45份、丙烯酸树脂25份、EVA 2份、DOP 5份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在450℃下脱脂,然后1500℃烧结2h得到多孔陶瓷基体。
实施例2
本实施例中,氧化锆粉、碳粉、有机助剂的体积比为63:37:108,按重量份将氧化锆粉335份、平均粒径为20μm的碳粉75份、硬脂酸4份、司盘60 4份、石蜡15份、聚苯乙烯45份、丙烯酸树脂25份、EVA 2份、DOP 5份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在450℃下脱脂,然后1500℃烧结2h得到多孔陶瓷基体。
实施例3
本实施例中,氧化锆粉、碳粉、有机助剂的体积比为58:42:130,按重量份将氧化锆粉290份、平均粒径为20μm的碳粉80份、硬脂酸8份、司盘60 8份、石蜡15份、聚苯乙烯45份、丙烯酸树脂30份、EVA 3份、DOP 5份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在450℃下脱脂,然后1500℃烧结2h得到多孔陶瓷基体。
实施例4
本实施例中,氧化锆粉、碳粉、有机助剂的体积比为54:46:140,按重量份将氧化锆粉220份、平均粒径为20μm的碳粉70份、石蜡15份、聚苯乙烯45 份、丙烯酸树脂30份、EVA 3份、DOP 5份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在 450℃下脱脂,然后1500℃烧结2h得到多孔陶瓷基体。
实施例5
本实施例中,氧化锆粉、碳酸铵、有机助剂的体积比为53:47:106,按重量份将氧化锆粉279份、平均粒径为20μm的碳酸铵93份、硬脂酸4份、司盘60 4份、石蜡15份、聚苯乙烯45份、丙烯酸树脂25份、EVA 2份、DOP 5份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在450℃下脱脂,然后1500℃烧结2h得到多孔陶瓷基体。
实施例6
本实施例中,氧化锆粉、碳粉、有机助剂的体积比为53:47:110,按重量份将氧化锆粉279份、平均粒径为50μm的碳粉93份、硬脂酸4份、司盘60 4份、石蜡15份、聚苯乙烯45份、丙烯酸树脂25份、EVA 2份、DOP 5份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在450℃下脱脂,然后1500℃烧结2h得到多孔陶瓷基体。
对比例1
本对比例中,氧化铝粉、碳粉、有机助剂的体积比为35:65:25,按重量份将氧化铝粉85份、平均粒径为20μm的碳粉85份、石蜡5份、聚乙烯10份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在450℃下脱脂,然后1400℃烧结2h得到多孔陶瓷基体。
对比例2
本对比例中,氧化锆粉、碳粉、有机助剂的体积比为53:47:102,按重量份将氧化锆粉279份、平均粒径为20μm的碳粉93份、硬脂酸4份、司盘60 4份、石蜡15份、聚苯乙烯45份、丙烯酸树脂25份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在450℃下脱脂,然后1500℃烧结2h得到多孔陶瓷基体。
对比例3
本对比例中,氧化锆粉、碳粉、有机助剂的体积比为53:47:83,按重量份将氧化锆粉279份、平均粒径为20μm的碳粉93份、硬脂酸4份、司盘60 4份、石蜡15份、聚苯乙烯45份、EVA 2份、DOP 5份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在450℃下脱脂,然后1500℃烧结2h得到多孔陶瓷基体。
对比例4
本对比例中,氧化锆粉、碳粉、有机助剂的体积比为53:37:133,将氧化锆粉279份、平均粒径为20μm的碳粉93份、硬脂酸4份、司盘60 4份、石蜡15 份、丙烯酸树脂25份、EVA 2份、DOP 5份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在 450℃下脱脂,然后1500℃烧结2h得到多孔陶瓷基体。
对比例5
本对比例中,氧化锆粉、碳粉、有机助剂的体积比为53:47:178,按重量份将氧化锆粉279份、平均粒径为20μm的碳粉93份、硬脂酸4份、石蜡15份、聚苯乙烯45份、EVA 2份、DOP5份加入密炼机中,进行密炼,得到多孔陶瓷基体组合物。将所述多孔陶瓷基体组合物注塑成型,得到坯体,坯体在450℃下脱脂,然后1500℃烧结2h得到多孔陶瓷基体。
对实施例1-6及对比例1-5的多孔陶瓷的强度、坯体强度和陶瓷尺寸精度、进行了测试,测试结果如表1所示。
多孔陶瓷的强度测试:制成50*12.7*1.8mm样条,按GBT4741-1999陶瓷材料抗弯强度试验方法测试。
坯体的强度测试:制成50*12.7*1.8mm样条,按GBT4741-1999陶瓷材料抗弯强度试验方法测试。
陶瓷尺寸精度测试:通过影像测量仪进行测试。
表1
Figure BDA0002965567690000071
从表1中可以看出,通过调整多孔陶瓷基体组合物中有机助剂的组分,可增强多孔陶瓷的坯体强度,进而提高了多孔陶瓷的尺寸精度。采用本发明提供的多孔陶瓷基体组合物烧结后得到的多孔陶瓷的强度明显增强,说明采用本发明提供有机助剂的组分能够有效在脱脂的过程中降低脱脂速度,形成逐级脱除的效果,避免过快的脱除速度对多孔陶瓷强度的不利影响。
通过实施例4的测试结果可知,通过增加有机助剂中聚苯乙烯、丙烯酸树脂和EVA在多孔陶瓷基体组合物中的含量,可使坯体强度明显增强。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。

Claims (13)

1.一种电子烟雾化芯用多孔陶瓷基体组合物,其特征在于,包括陶瓷粉、造孔剂和有机助剂,所述陶瓷粉、所述造孔剂和所述有机助剂的体积比为(50-70):(30-50):(80-150),所述有机助剂包括石蜡、聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物和邻苯二甲酸二辛酯。
2.根据权利要求1所述的多孔陶瓷基体组合物,其特征在于,所述有机助剂包括如下重量组分:13-15份石蜡、40-45份聚苯乙烯、25-30份丙烯酸树脂、2-3份乙烯-醋酸乙烯酯共聚物和4-5份邻苯二甲酸二辛酯。
3.根据权利要求2所述的多孔陶瓷基体组合物,其特征在于,所述有机助剂还包括0-8份硬脂酸,0-8份司盘60。
4.根据权利要求1所述的多孔陶瓷基体组合物,其特征在于,所述陶瓷粉包括氧化锆、氧化铝、氧化硅中的一种或多种。
5.根据权利要求1所述的多孔陶瓷基体组合物,其特征在于,所述造孔剂选自碳粉、淀粉、碳酸盐、硝酸盐、铵盐和木屑中的一种或多种。
6.根据权利要求5所述的多孔陶瓷基体组合物,其特征在于,所述造孔剂的平均粒径为15-55μm。
7.根据权利要求6所述的多孔陶瓷基体组合物,其特征在于,所述造孔剂的平均粒径为25-55μm。
8.根据权利要求6所述的多孔陶瓷基体组合物,其特征在于,所述造孔剂的平均粒径为15-21μm。
9.一种多孔陶瓷基体的制备方法,其特征在于,包括将陶瓷粉、造孔剂、有机助剂加入密炼机中进行密炼,所述有机助剂包括石蜡、聚苯乙烯、丙烯酸树脂、乙烯-醋酸乙烯酯共聚物和邻苯二甲酸二辛酯,得到多孔陶瓷基体组合物;将所述多孔陶瓷基体组合物注塑成型,得到坯体;坯体进行脱脂、烧结,得到多孔陶瓷基体。
10.根据权利要求9所述的制备方法,其特权在于,所述脱脂在25-450℃下进行。
11.根据权利要求10所述的制备方法,所述烧结温度为1400-1500℃,烧结时间为1.5-3h。
12.一种多孔陶瓷基体,其特征在于,由权利要求9-11任意一项所述的制备方法制备得到。
13.一种电子烟雾化芯,其特征在于,包括多孔陶瓷基体以及位于多孔陶瓷基体表面的加热体;所述多孔陶瓷基体由权利要求1-8任意一项所述的多孔陶瓷基体组合物经注塑、烧结而成,或所述多孔陶瓷基体为权利要求12所述的多孔陶瓷基体。
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CN111763090A (zh) * 2020-05-30 2020-10-13 浙江昶研新材料有限公司 一种粘结剂及其制备方法与应用

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