CN115020266A - 一种2.5D Chiplet绑定后测试电路 - Google Patents
一种2.5D Chiplet绑定后测试电路 Download PDFInfo
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- CN115020266A CN115020266A CN202210931419.3A CN202210931419A CN115020266A CN 115020266 A CN115020266 A CN 115020266A CN 202210931419 A CN202210931419 A CN 202210931419A CN 115020266 A CN115020266 A CN 115020266A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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Application Number | Priority Date | Filing Date | Title |
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CN202210931419.3A CN115020266B (zh) | 2022-08-04 | 2022-08-04 | 一种2.5D Chiplet绑定后测试电路 |
PCT/CN2023/071577 WO2024027110A1 (zh) | 2022-08-04 | 2023-01-10 | 一种2.5d chiplet绑定后测试电路及测试方法 |
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CN202210931419.3A CN115020266B (zh) | 2022-08-04 | 2022-08-04 | 一种2.5D Chiplet绑定后测试电路 |
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CN115020266A true CN115020266A (zh) | 2022-09-06 |
CN115020266B CN115020266B (zh) | 2022-11-04 |
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CN202210931419.3A Active CN115020266B (zh) | 2022-08-04 | 2022-08-04 | 一种2.5D Chiplet绑定后测试电路 |
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WO (1) | WO2024027110A1 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115295065A (zh) * | 2022-10-09 | 2022-11-04 | 南京邮电大学 | 一种基于灵活可配置模块的芯粒测试电路 |
CN115547404A (zh) * | 2022-11-30 | 2022-12-30 | 普赛微科技(杭州)有限公司 | 用于先进封装mram存储器的测试架构及方法 |
CN115598495A (zh) * | 2022-09-16 | 2023-01-13 | 深圳市奇普乐芯片技术有限公司(Cn) | 芯片测试配置生成方法、测试方法、装置及电子设备 |
CN116256620B (zh) * | 2023-05-15 | 2023-07-14 | 中诚华隆计算机技术有限公司 | Chiplet集成芯片的检测方法、装置、电子设备及存储介质 |
CN116718902A (zh) * | 2023-08-11 | 2023-09-08 | 中诚华隆计算机技术有限公司 | 一种基于Chiplet的芯片内置自测试方法和系统 |
CN116859226A (zh) * | 2023-09-04 | 2023-10-10 | 中国电子科技集团公司第五十八研究所 | 一种面向2.5d双芯粒互连封装系统的测试电路 |
CN117056279A (zh) * | 2023-10-12 | 2023-11-14 | 之江实验室 | 可重构电路、可重构芯粒间互联的装置及其方法 |
CN117236263A (zh) * | 2023-11-15 | 2023-12-15 | 之江实验室 | 一种多芯粒互联仿真方法、装置、存储介质及电子设备 |
WO2024027110A1 (zh) * | 2022-08-04 | 2024-02-08 | 南京邮电大学 | 一种2.5d chiplet绑定后测试电路及测试方法 |
CN117872103A (zh) * | 2024-03-11 | 2024-04-12 | 南京邮电大学 | 一种通用测试芯粒 |
Citations (4)
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JPS63241791A (ja) * | 1987-03-27 | 1988-10-07 | Matsushita Electric Ind Co Ltd | 半導体記憶装置 |
CN109473361A (zh) * | 2018-10-24 | 2019-03-15 | 深圳赛意法微电子有限公司 | 半导体功率器件的并行测试方法 |
CN111183517A (zh) * | 2018-01-17 | 2020-05-19 | 默升科技集团有限公司 | 具有中介层的并行prbs测试的ic裸片 |
CN112595966A (zh) * | 2021-03-03 | 2021-04-02 | 南京邮电大学 | 一种基于IEEE标准Chiplet电路测试方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010159989A (ja) * | 2009-01-06 | 2010-07-22 | Renesas Electronics Corp | テスト回路 |
CN102880536B (zh) * | 2012-09-07 | 2015-06-03 | 杭州中天微系统有限公司 | 一种多核处理器的jtag调试方法 |
CN114253184A (zh) * | 2021-11-29 | 2022-03-29 | 山东云海国创云计算装备产业创新中心有限公司 | 一种jtag控制装置 |
CN115020266B (zh) * | 2022-08-04 | 2022-11-04 | 南京邮电大学 | 一种2.5D Chiplet绑定后测试电路 |
-
2022
- 2022-08-04 CN CN202210931419.3A patent/CN115020266B/zh active Active
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2023
- 2023-01-10 WO PCT/CN2023/071577 patent/WO2024027110A1/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63241791A (ja) * | 1987-03-27 | 1988-10-07 | Matsushita Electric Ind Co Ltd | 半導体記憶装置 |
CN111183517A (zh) * | 2018-01-17 | 2020-05-19 | 默升科技集团有限公司 | 具有中介层的并行prbs测试的ic裸片 |
CN109473361A (zh) * | 2018-10-24 | 2019-03-15 | 深圳赛意法微电子有限公司 | 半导体功率器件的并行测试方法 |
CN112595966A (zh) * | 2021-03-03 | 2021-04-02 | 南京邮电大学 | 一种基于IEEE标准Chiplet电路测试方法 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024027110A1 (zh) * | 2022-08-04 | 2024-02-08 | 南京邮电大学 | 一种2.5d chiplet绑定后测试电路及测试方法 |
CN115598495B (zh) * | 2022-09-16 | 2024-01-30 | 深圳市奇普乐芯片技术有限公司 | 芯片测试配置生成方法、测试方法、装置及电子设备 |
CN115598495A (zh) * | 2022-09-16 | 2023-01-13 | 深圳市奇普乐芯片技术有限公司(Cn) | 芯片测试配置生成方法、测试方法、装置及电子设备 |
CN115295065B (zh) * | 2022-10-09 | 2022-12-13 | 南京邮电大学 | 一种基于灵活可配置模块的芯粒测试电路 |
CN115295065A (zh) * | 2022-10-09 | 2022-11-04 | 南京邮电大学 | 一种基于灵活可配置模块的芯粒测试电路 |
WO2023231276A1 (zh) * | 2022-10-09 | 2023-12-07 | 南京邮电大学 | 一种基于灵活可配置模块的芯粒测试电路 |
CN115547404A (zh) * | 2022-11-30 | 2022-12-30 | 普赛微科技(杭州)有限公司 | 用于先进封装mram存储器的测试架构及方法 |
CN116256620B (zh) * | 2023-05-15 | 2023-07-14 | 中诚华隆计算机技术有限公司 | Chiplet集成芯片的检测方法、装置、电子设备及存储介质 |
CN116718902A (zh) * | 2023-08-11 | 2023-09-08 | 中诚华隆计算机技术有限公司 | 一种基于Chiplet的芯片内置自测试方法和系统 |
CN116718902B (zh) * | 2023-08-11 | 2023-10-20 | 中诚华隆计算机技术有限公司 | 一种基于Chiplet的芯片内置自测试方法和系统 |
CN116859226A (zh) * | 2023-09-04 | 2023-10-10 | 中国电子科技集团公司第五十八研究所 | 一种面向2.5d双芯粒互连封装系统的测试电路 |
CN116859226B (zh) * | 2023-09-04 | 2023-11-17 | 中国电子科技集团公司第五十八研究所 | 一种面向2.5d双芯粒互连封装系统的测试电路 |
CN117056279A (zh) * | 2023-10-12 | 2023-11-14 | 之江实验室 | 可重构电路、可重构芯粒间互联的装置及其方法 |
CN117056279B (zh) * | 2023-10-12 | 2024-01-26 | 之江实验室 | 可重构电路、可重构芯粒间互联的装置及其方法 |
CN117236263B (zh) * | 2023-11-15 | 2024-02-06 | 之江实验室 | 一种多芯粒互联仿真方法、装置、存储介质及电子设备 |
CN117236263A (zh) * | 2023-11-15 | 2023-12-15 | 之江实验室 | 一种多芯粒互联仿真方法、装置、存储介质及电子设备 |
CN117872103A (zh) * | 2024-03-11 | 2024-04-12 | 南京邮电大学 | 一种通用测试芯粒 |
CN117872103B (zh) * | 2024-03-11 | 2024-05-10 | 南京邮电大学 | 一种通用测试芯粒 |
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WO2024027110A1 (zh) | 2024-02-08 |
CN115020266B (zh) | 2022-11-04 |
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Application publication date: 20220906 Assignee: Zhangjiagang Meimei Intelligent Sensing Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980046621 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231113 Application publication date: 20220906 Assignee: Zhangjiagang Xinliwei Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980046619 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231114 Application publication date: 20220906 Assignee: Nanjing Erxin Electronic Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980046617 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231113 |
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Application publication date: 20220906 Assignee: NANJING YUANGAN MICROELECTRONIC CO.,LTD. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048124 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231127 |
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Application publication date: 20220906 Assignee: Nanjing Aiqi Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048488 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Haihe Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048485 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Xiaojiang Jiahu (Nanjing) Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048562 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231130 Application publication date: 20220906 Assignee: Xiaosu Accompanying Clinic (Nanjing) Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048561 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231130 Application publication date: 20220906 Assignee: Nanjing Youxin Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048560 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231130 Application publication date: 20220906 Assignee: Nanjing Zhimeng Rehabilitation Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048559 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231130 Application publication date: 20220906 Assignee: Qihe Technology (Nanjing) Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048558 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231129 Application publication date: 20220906 Assignee: Shuangqing Doctor Group (Hainan) Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048557 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231129 Application publication date: 20220906 Assignee: Shuangxin Internet Hospital (Hainan) Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048554 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231129 Application publication date: 20220906 Assignee: Xixiayuan (Ningxia) Agricultural Development Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048553 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Tongyou Engineering Services Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048552 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing xinwindows Information Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048550 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Yangbang Enterprise Management Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048549 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Yixuntong Information Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048547 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Youda Medical Information Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048545 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Youda Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048541 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Hancai Electronics Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048538 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Hancai Optoelectronic Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048534 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Jianhai Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048527 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Qingyou Information Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048525 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Nanjing Shuangzi Zhitong Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048523 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: NANJING PENGYUDA INFORMATION TECHNOLOGY CO.,LTD. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048517 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Edge Intelligent Security Technology (Zhenjiang) Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048515 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Edge Intelligence Research Institute Nanjing Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048511 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Huiyi IoT Technology (Zhenjiang) Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048504 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 Application publication date: 20220906 Assignee: Jiangsu Hongyi Medical Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980048500 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231128 |
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Application publication date: 20220906 Assignee: Deloitte (Jiangsu) Education Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049533 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing Youqi Intelligent Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049531 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing Tuanyuan Intelligent Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049522 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing fandilang Information Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049497 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Dingshan Technology Incubation (Nanjing) Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049483 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing Jinxiang Experimental Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049478 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing Baoxing Intelligent Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049437 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Jiangsu Anbo Intelligent Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049425 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing Shihong Intelligent Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049398 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing Self Postal Transfer Technology Transfer Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049391 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing Lvran Agricultural Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049370 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing Huijue Intelligent Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049366 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing jinshuxin Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049360 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Nanjing Jingliheng Electronic Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049351 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 Application publication date: 20220906 Assignee: Jiangsu Dixin Metrology Testing Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980049330 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231203 |
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Application publication date: 20220906 Assignee: Nanjing yist Packaging Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980050260 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231207 |
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Application publication date: 20220906 Assignee: Jiangsu Liebao Network Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980052022 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231212 Application publication date: 20220906 Assignee: Jiangsu Chaoxin Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980052021 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231212 Application publication date: 20220906 Assignee: Speed Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980051704 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231212 Application publication date: 20220906 Assignee: Nanjing Zouma Information Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980051703 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231212 Application publication date: 20220906 Assignee: Nanjing Heyue Information Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980051698 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231212 Application publication date: 20220906 Assignee: Nantong Zhicheng Network Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980051315 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231212 |
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Application publication date: 20220906 Assignee: NANJING PAIAI ELECTRONICS Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980052109 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231215 Application publication date: 20220906 Assignee: NANJING JULIAN TRANSMISSION INSTALLATION CO.,LTD. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980052103 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231215 Application publication date: 20220906 Assignee: Nanjing Shuhui Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980052024 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231213 Application publication date: 20220906 Assignee: Nanjing Qinghong Network Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980052023 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231213 Application publication date: 20220906 Assignee: Nanjing Jianwu Electronic Technology Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980051905 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231213 Application publication date: 20220906 Assignee: NANJING HEYI ELECTRONIC CO.,LTD. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980051876 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231213 |
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Application publication date: 20220906 Assignee: NANJING HUADONG ELECTRONICS VACUUM MATERIAL Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980053414 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231222 Application publication date: 20220906 Assignee: Nanjing Hefeng Operation Management Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980053384 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231222 |
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Application publication date: 20220906 Assignee: NANJING CREATCOMM TECHNOLOGY CO.,LTD. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980054276 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231227 Application publication date: 20220906 Assignee: Jiangsu Quanyijia Electronic Commerce Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980054141 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231227 Application publication date: 20220906 Assignee: NANJING NENGRUI AUTOMATION EQUIPMENT Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980054131 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231227 Application publication date: 20220906 Assignee: NANJING YIZHIHENG SOFTWARE TECHNOLOGY Co.,Ltd. Assignor: NANJING University OF POSTS AND TELECOMMUNICATIONS Contract record no.: X2023980054071 Denomination of invention: A 2.5D Chiplet bound test circuit Granted publication date: 20221104 License type: Common License Record date: 20231227 |
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