CN114914186A - 一种dbc板夹紧定位机构 - Google Patents

一种dbc板夹紧定位机构 Download PDF

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CN114914186A
CN114914186A CN202210453567.9A CN202210453567A CN114914186A CN 114914186 A CN114914186 A CN 114914186A CN 202210453567 A CN202210453567 A CN 202210453567A CN 114914186 A CN114914186 A CN 114914186A
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dbc
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CN114914186B (zh
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姜威
赵登
张晴
朱鑫阳
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Zhihuixuantian Intelligent System Hangzhou Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

本发明适用于DBC板夹紧定位领域，提供了本发明是这样实现的，一种DBC板夹紧定位机构，包括：DD旋转马达，所述DD旋转马达的转动部固定连接有机构底板，所述机构底板固定连接有DBC限位治具板，沿所述DBC限位治具板周向固定设置有多个DBC斜压导轨，所述DBC斜压导轨均滑动连接有DBC压紧块；相邻的两个DBC压紧块之间设置有驱动机构，所述驱动机构与机构底板固定连接，所述驱动机构能够通过伸缩运动的方式带动相邻的两个DBC压紧块同时沿DBC斜压导轨进行滑动。通过压紧推力气缸带动安装固定板在前后移动导轨上移动，凸轮滚子也随之前后移动，滑动块通过气缸推力传递块带动DBC压紧块沿DBC斜压导轨进行滑动，从而实现产品的压紧与打开。

Description

一种DBC板夹紧定位机构
技术领域
本发明属于DBC板夹紧定位领域，尤其涉及一种DBC板夹紧定位机构。
背景技术
现代的半导体制造行业对于自动化设备生产要求很高，大多数企业要求设备同时具备体积小、生产速度快、合格率高以及自动化程度高等特点。
在半导体行业，DBC板的生产过程中需要在DBC板上进行插针工艺，插针工艺中DBC板的定位压紧一直是一个非常重要的环节，此环节直接关系到DBC板生产的合格率以及产能。
目前市场上类似DBC插针定位机构存在以下缺陷：
1、DBC板的材质为陶瓷，在对DBC板定位时，现有的DBC插针定位机构压力不匀易使DBC板开裂；
2、由于DBC板生产的工艺原因，输送到插针工位的DBC板并非完全是平板结构，大多存在一定的拱度，现有的DBC插针定位机构不带有整形功能；
3、DBC板大多数区域不能被接触压紧，现有的DBC插针定位机构固定效果较差；
4、DBC板定位压紧机构在配合自动化设备生产时问题重重，插针效率低。
为避免上述技术问题，确有必要提供一种DBC板夹紧定位机构以克服现有技术中的所述缺陷。
发明内容
本发明的目的在于提供一种DBC板夹紧定位机构，旨在解决DBC板快速以及有效固定的问题。
本发明是这样实现的，一种DBC板夹紧定位机构，包括：
DD旋转马达，所述DD旋转马达的转动部固定连接有机构底板，所述机构底板固定连接有DBC限位治具板，沿所述DBC限位治具板周向固定设置有多个DBC斜压导轨，所述DBC斜压导轨均滑动连接有DBC压紧块；
相邻的两个DBC压紧块之间设置有驱动机构，所述驱动机构与机构底板固定连接，所述驱动机构能够通过伸缩运动的方式带动相邻的两个DBC压紧块同时沿DBC斜压导轨进行滑动。
进一步的技术方案，所述驱动机构包括压紧推力气缸，所述压紧推力气缸与机构底板固定连接，所述机构底板固定连接有前后移动导轨，所述前后移动导轨均滑动连接有移动滑块，所述压紧推力气缸的头部固定连接有浮动接头，所述浮动接头固定连接有安装固定板，所述安装固定板的两端分别与一个移动滑块固定连接，所述安装固定板连接有联动组件，所述联动组件用于带动相邻的两个DBC压紧块同步运动。
进一步的技术方案，所述联动组件包括两个凸轮滚子，两个凸轮滚子均与安装固定板固定连接，所述凸轮滚子外侧均套设有滑动块，所述凸轮滚子插接在滑动块的腰形长槽中，所述滑动块均固定连接有气缸推力传递块，所述气缸推力传递块贯穿DBC限位治具板，且所述气缸推力传递块均与一个DBC压紧块固定连接。
进一步的技术方案，所述DBC斜压导轨有四个，且四个DBC斜压导轨呈矩形布置在DBC限位治具板中。
进一步的技术方案，所述DBC斜压导轨相对水平面倾斜向下设置。
进一步的技术方案，所述DBC限位治具板中间设置有多个真空孔，所述机构底板中间设置有空腔，所述空腔的上部固定密封有真空腔体密封板，所述空腔与真空孔连通，所述真空腔体密封板与外部真空气管连通。
进一步的技术方案，所述空腔为圆筒形。
相较于现有技术，本发明的有益效果如下：
本发明提供的一种DBC板夹紧定位机构，当DBC板放入DBC限位治具板中时，压紧推力气缸通气，压紧推力气缸的活塞杆向外伸出，通过压紧推力气缸带动安装固定板在前后移动导轨上移动，凸轮滚子也随之前后移动，从而带动滑动块移动；滑动块通过气缸推力传递块带动DBC压紧块沿DBC斜压导轨进行滑动，从而实现产品的压紧与打开。
本发明提供的一种DBC板夹紧定位机构，通过外部真空气管将DBC板吸附，防止DBC板在移动或插针的过程中晃动。
本发明提供的一种DBC板夹紧定位机构，机构可以与自动化设备实现自动无缝对接，无需人工干预，稳定性好；机构动作速度快，重复定位精度高；与产品接触零部件多为非标设计，本机构在固定过程中不会对产品造成任何损伤；
本机构对产品有矫正压平功能；机构体积精巧，不受限于使用场所。
附图说明
图1为本发明的结构示意图；
图2为图1的爆炸结构示意图。
附图中：DD旋转马达1、机构底板2、前后移动导轨3、压紧推力气缸4、浮动接头5、凸轮滚子6、滑动块7、气缸推力传递块8、DBC限位治具板9、DBC斜压导轨10、DBC板11、DBC压紧块12、真空腔体密封板13、安装固定板14、移动滑块15、空腔16。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
以下结合具体实施例对本发明的具体实现进行详细描述。
如图1-图2所示，为本发明提供的一种DBC板夹紧定位机构，包括：
DD旋转马达1，所述DD旋转马达1的转动部固定连接有机构底板2，所述机构底板2固定连接有DBC限位治具板9，沿所述DBC限位治具板9周向固定设置有多个DBC斜压导轨10，所述DBC斜压导轨10均滑动连接有DBC压紧块12；
相邻的两个DBC压紧块12之间设置有驱动机构，所述驱动机构与机构底板2固定连接，所述驱动机构能够通过伸缩运动的方式带动相邻的两个DBC压紧块12同时沿DBC斜压导轨10进行滑动；将DBC板11放置在DBC限位治具板9中间，驱动机构通过伸缩运动的方式带动相邻的两个DBC压紧块12同时沿DBC斜压导轨10进行滑动，所有DBC压紧块12在驱动机构的带动下同步运动对DBC板11进行夹紧固定，通过DD旋转马达1可以带动机构底板2进行转动。
在本发明实施例中，作为本发明的一种优选实施例，所述驱动机构包括压紧推力气缸4，所述压紧推力气缸4与机构底板2固定连接，所述机构底板2固定连接有前后移动导轨3，所述前后移动导轨3均滑动连接有移动滑块15，所述压紧推力气缸4的头部固定连接有浮动接头5，所述浮动接头5固定连接有安装固定板14，所述安装固定板14的两端分别与一个移动滑块15固定连接，所述安装固定板14连接有联动组件，所述联动组件用于带动相邻的两个DBC压紧块12同步运动；压紧推力气缸4通过浮动接头5推动安装固定板14，安装固定板14带动移动滑块15在前后移动导轨3上滑动，安装固定板14通过联动组件带动相邻的两个DBC压紧块12同步运动。
在本发明实施例中，作为本发明的一种优选实施例，所述联动组件包括两个凸轮滚子6，两个凸轮滚子6均与安装固定板14固定连接，所述凸轮滚子6外侧均套设有滑动块7，所述凸轮滚子6插接在滑动块7的腰形长槽中，所述滑动块7均固定连接有气缸推力传递块8，所述气缸推力传递块8贯穿DBC限位治具板9，且所述气缸推力传递块8均与一个DBC压紧块12固定连接；安装固定板14通过凸轮滚子6带动滑动块7运动，滑动块7通过气缸推力传递块8带动DBC压紧块12沿DBC斜压导轨10进行滑动的同时，凸轮滚子6在滑动块7中进行水平及竖向相对滑动。
本发明实施例中，作为本发明的一种优选实施例，所述DBC斜压导轨10有四个，且四个DBC斜压导轨10呈矩形布置在DBC限位治具板9中。
在本发明实施例中，作为本发明的一种优选实施例，所述DBC斜压导轨10相对水平面倾斜向下设置。
在本发明实施例中，作为本发明的一种优选实施例，所述DBC限位治具板9中间设置有多个真空孔，所述机构底板2中间设置有空腔16，所述空腔16的上部固定密封有真空腔体密封板13，所述空腔16与真空孔连通，所述真空腔体密封板13与外部真空气管连通；当DBC板11放入DBC限位治具板9中时，4个DBC压紧块12同时压紧产品，并且通过外部真空气管将DBC板11吸附，防止DBC板11在移动或插针的过程中晃动。
在本发明实施例中，作为本发明的一种优选实施例，所述空腔为圆筒形。
当DBC板11放入DBC限位治具板9中时，压紧推力气缸4通气，压紧推力气缸4的活塞杆向外伸出，通过压紧推力气缸4带动安装固定板14在前后移动导轨3上移动，凸轮滚子6也随之前后移动，从而带动滑动块7移动；滑动块7通过气缸推力传递块8带动DBC压紧块12沿DBC斜压导轨10进行滑动，从而实现产品的压紧与打开。压紧推力气缸4通过伸出与缩回，将力传递给DBC压紧块12，使DBC压紧块12能够实现水平与竖直方向的运动。DBC压紧块12在运动的同时，凸轮滚子6在滑动块7中进行水平及竖向相对滑动。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。

Claims (7)

1.一种DBC板夹紧定位机构，其特征在于，包括：
DD旋转马达，所述DD旋转马达的转动部固定连接有机构底板，所述机构底板固定连接有DBC限位治具板，沿所述DBC限位治具板周向固定设置有多个DBC斜压导轨，所述DBC斜压导轨均滑动连接有DBC压紧块；
相邻的两个DBC压紧块之间设置有驱动机构，所述驱动机构与机构底板固定连接，所述驱动机构能够通过伸缩运动的方式带动相邻的两个DBC压紧块同时沿DBC斜压导轨进行滑动。
2.根据权利要求1所述的DBC板夹紧定位机构，其特征在于，所述驱动机构包括压紧推力气缸，所述压紧推力气缸与机构底板固定连接，所述机构底板固定连接有前后移动导轨，所述前后移动导轨均滑动连接有移动滑块，所述压紧推力气缸的头部固定连接有浮动接头，所述浮动接头固定连接有安装固定板，所述安装固定板的两端分别与一个移动滑块固定连接，所述安装固定板连接有联动组件，所述联动组件用于带动相邻的两个DBC压紧块同步运动。
3.根据权利要求2所述的DBC板夹紧定位机构，其特征在于，所述联动组件包括两个凸轮滚子，两个凸轮滚子均与安装固定板固定连接，所述凸轮滚子外侧均套设有滑动块，所述凸轮滚子插接在滑动块的腰形长槽中，所述滑动块均固定连接有气缸推力传递块，所述气缸推力传递块贯穿DBC限位治具板，且所述气缸推力传递块均与一个DBC压紧块固定连接。
4.根据权利要求1所述的DBC板夹紧定位机构，其特征在于，所述DBC斜压导轨有四个，且四个DBC斜压导轨呈矩形布置在DBC限位治具板中。
5.根据权利要求1所述的DBC板夹紧定位机构，其特征在于，所述DBC斜压导轨相对水平面倾斜向下设置。
6.根据权利要求1所述的DBC板夹紧定位机构，其特征在于，所述DBC限位治具板中间设置有多个真空孔，所述机构底板中间设置有空腔，所述空腔的上部固定密封有真空腔体密封板，所述空腔与真空孔连通，所述真空腔体密封板与外部真空气管连通。
7.根据权利要求6所述的DBC板夹紧定位机构，其特征在于，所述空腔为圆筒形。
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