CN114885531A - Manufacturing process of high-quality multilayer circuit board - Google Patents
Manufacturing process of high-quality multilayer circuit board Download PDFInfo
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- CN114885531A CN114885531A CN202210592757.9A CN202210592757A CN114885531A CN 114885531 A CN114885531 A CN 114885531A CN 202210592757 A CN202210592757 A CN 202210592757A CN 114885531 A CN114885531 A CN 114885531A
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- circuit board
- baking
- solder mask
- layer
- multilayer circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a manufacturing process of a high-quality multilayer circuit board, which comprises the following steps: cutting → drilling 1 → plating 1 → one dry film → one etching → AOI1 → tree plug → grinding → pressing → drilling 2 → plating 2 → outer dry film → outer etching → AOI2 → one solder mask → secondary solder mask → third solder mask → gold-plating → testing → FQC1 → rubberizing → pressing → character → draging → FQC2 → OQC → shipment. By adjusting the production flow, the line distance position of the circuit board is filled smoothly after the circuit is completed, the problem of edge breakage is reduced, and the conditions of inner short, inner opening and gluing wrinkling are avoided, so that the quality of the circuit board is improved.
Description
Technical Field
The invention relates to the field of multilayer circuit board processing, in particular to a manufacturing process of a high-quality multilayer circuit board.
Background
The printed circuit board, also called printed circuit board, has the main advantages of greatly reducing errors of wiring and assembly and improving automation level and production labor rate. The printed circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit boards.
In the daily production and processing process, for the thickness of the plate of the original material is 0.1mm, the thickness of the copper of the inner layer is more than 5OZ, the 12-layer plate is formed by pressing 6 inner-layer core plates, all the inner-layer core plates need to be drilled, electroplated, wired and etched, and the common problems are as follows by adopting the conventional processing method: 1. the board edges are easy to break because the board is thinner; 2. after the circuit is completed, the height difference of the line distance position is large, and the board surface is uneven after lamination; 3. the hot melting operation during the pressing process has the problem of layer deviation after a long time.
Disclosure of Invention
In view of the above problems, the present invention provides a process for manufacturing a high-quality multi-layer circuit board.
In order to achieve the purpose, the invention is solved by the following technical scheme:
a manufacturing process of a high-quality multilayer circuit board comprises the following steps: cutting → drilling 1 → plating 1 → one dry film → one etching → AOI1 → tree plug → grinding → pressing → drilling 2 → plating 2 → outer dry film → outer etching → AOI2 → one solder mask → secondary solder mask → third solder mask → gold-plating → testing → FQC1 → rubberizing → pressing → character → draging → FQC2 → OQC → shipment.
Further, cutting six layers, and grooving and distinguishing each layer; drilling holes in layers, wherein holes are drilled in the middle of each layer; the expansion and shrinkage proportion of each layer of drilled holes is as follows: x is 100.03%, and y is 100.03%.
Further, electroplating is needed twice in the electroplating step 1, and the inner diameter of the copper hole is 1.45-1.9 mil; in the primary dry film, the thickness of the dry film is 1.5 mil; after the primary etching is finished, horizontally and manually taking and placing the plate; the outer layer etching speed was 1 m/min.
Further, in the step of plugging the tree, the thickness of the tree plugging area is X, and X is more than or equal to 0.4 mm; the L1-1 layer and the L12-1 layer are copper surfaces, and tree plugging is not performed; and (4) filling gaps after the tree is plugged, wherein the difference between a gap filling area and a copper foil area is M, and M is less than or equal to 0.1 mm.
Further, grinding equipment is adopted for grinding procedures, and the copper surface of the circuit needs to be exposed; in addition to L1 and L12, the other copper face edges allow for the residue of resin that is not easily ground.
Further, in the laminating step, 100% of plates after hot melting are subjected to X-RAY irradiation layer deviation detection, and 100% of plates lacking a tail strip of a hot melting strip are subjected to laminating to confirm layer deviation; after pressing, edge dragging and ceramic grinding are carried out to treat PP powder on the surface; the fishing size is retracted by 2mm and the fishing edge size is ensured to be consistent.
Further, in the step 2, drilling is carried out by one drill, the aperture of a drill point is 0.5mm, the rotating speed is 75krpm, the feed speed is 30mm/sec, the withdrawal speed is 3000mm/sec, and the hole limit is 600 holes; processing the flash by using a dry brushing machine; before the step 2 of electroplating, high-pressure water washing is carried out at the speed of 2.5 m/min; electroplating is performed twice in the electroplating 2 step.
Further, in the outer layer dry film step, the film pressing pressure is set to be 5kg/cm 2 (ii) a The unilateral copper exposure size is 1-2 mm; the outer layer etching step is carried out at a speed of 1.4m/minEtching twice; in the AOI2 step, AOI full scan detection is carried out.
Further, the primary solder mask comprises the following steps of pretreatment → printing surface along X direction → vacuumizing → pre-baking, wherein the unilateral of the front side of the printing surface is 10mil larger, the vacuumizing is carried out for 30min, the pre-baking temperature is 70 ℃, and the pre-baking time is 30 min; the secondary solder mask comprises the following steps of printing the surface along the X direction → standing → pre-baking → exposing → developing → post-baking, wherein the unilateral of the front side of the printed surface is 10mil larger, the printed surface is kept standing for 40min, the pre-baking temperature is 71 ℃, the pre-baking time is 40min, the unilateral of the front side of the exposed surface is 4mil larger, the post-baking temperature is 80 ℃ for 30min and the post-baking temperature is 120 ℃ for 30 min; the third solder mask comprises the following steps of pretreating a light brush → an aluminum mesh plug hole → a printing surface along the Y direction → standing → a pre-baking tunnel → exposure → development → post-baking, and standing for 1 hour.
Further, the rubberizing comprises the following steps of cutting the rubberizing → dragging the rubberizing → pre-rubberizing → fixing an iron → pressing and pressing the rubberizing, wherein before the rubberizing, foreign matters on the welding-proof surface are processed flatly, and after the rubberizing iron is fixed, 100% full inspection is carried out.
The invention has the beneficial effects that: by adjusting the production flow, the line distance position of the circuit board is filled smoothly after the circuit is completed, the problem of edge breakage is reduced, and the conditions of inner short, inner opening and gluing wrinkling are avoided, so that the quality of the circuit board is improved.
Detailed Description
The present invention will be described in further detail with reference to specific embodiments in order to provide a further understanding of the nature and technical means of the invention, as well as the specific objects and functions attained by the invention.
A manufacturing process of a high-quality multilayer circuit board comprises the following steps: cutting → drilling 1 → plating 1 → one dry film → one etching → AOI1 → tree plug → grinding → pressing → drilling 2 → plating 2 → outer dry film → outer etching → AOI2 → one solder mask → secondary solder mask → third solder mask → gold-plating → testing → FQC1 → rubberizing → pressing → character → draging → FQC2 → OQC → shipment.
In the cutting step, six layers are cut, and grooves are punched in each layer for distinguishing; drilling holes in layers, wherein holes are drilled in the middle of each layer; the expansion and shrinkage proportion of each layer of drilled holes is as follows: x is 100.03%, and y is 100.03%.
Electroplating twice in the step 1, wherein the inner diameter of the hole copper is 1.45-1.9 mil; in the primary dry film, the thickness of the dry film is 1.5 mil; after the primary etching is finished, horizontally and manually taking and placing the plate; the outer layer etching speed was 1 m/min.
In the step of plugging the tree, the thickness of the tree plugging area is X, and X is more than or equal to 0.4 mm; the L1-1 layer and the L12-1 layer are copper surfaces, and tree plugging is not performed; and (4) filling gaps after the tree is plugged, wherein the difference between a gap filling area and a copper foil area is M, and M is less than or equal to 0.1 mm.
In the grinding step, grinding equipment is adopted for grinding, and the copper surface of the circuit needs to be exposed; in addition to L1 and L12, the other copper face edges allow for the residue of resin that is not easily ground.
In the laminating step, 100% of the plates are subjected to X-RAY irradiation layer deviation detection after hot melting, and 100% of the plates are subjected to lamination to confirm layer deviation after the plates lack of the tail strips of the hot melting strips; after pressing, edge dragging and ceramic grinding are carried out to treat PP powder on the surface; the inner size of the fishing type is shortened by 2mm, the fishing edge size is kept consistent, and the flowing glue is fished out badly. In actual operation, the residual board surface of the PP powder of the pressing board is not treated, and the PP powder can form an anti-corrosion layer during etching, so that the inner part is short, therefore, the PP powder is treated by additionally arranging the ceramic grinding process in the embodiment, and the condition of the inner part is avoided. The laminated layer is deviated due to the defect of the hot melting strip, and an open circuit can be formed when a drill hole is not drilled to a corresponding position, so that 100% of the laminated layer after hot melting is detected and distinguished by X-RAY irradiation, and the condition that the laminated layer is deviated to cause inward opening is avoided.
In the step 2 of drilling, one drill is used, the aperture of a drill point is 0.5mm, the rotating speed is 75krpm, the feed speed is 30mm/sec, the withdrawal speed is 3000mm/sec, and the hole limit is 600 holes; processing the flash by using a dry brushing machine; before the step 2 of electroplating, high-pressure water washing is carried out at the speed of 2.5 m/min; electroplating is performed twice in the electroplating 2 step.
In the outer layer dry film step, the film pressing pressure is set to be 5kg/cm 2 (ii) a The single-side copper exposure size is 1-2 mm, so that the problem of edge breakage is reduced; etching twice at the speed of 1.4m/min in the outer layer etching step; in the AOI2 step, AOI full scan detection is carried out.
The one-time solder mask comprises the following steps of pretreatment → printing surface along X direction → vacuumizing → pre-baking, wherein the single edge of the printed surface is 10mil larger, the vacuumizing is carried out for 30min, the pre-baking temperature is 70 ℃, and the pre-baking time is 30 min.
The secondary solder mask comprises the following steps of printing the surface along the X direction → standing → pre-baking → exposing → developing → post-baking, wherein the unilateral of the printed surface is 10mil larger than the gear point, standing is carried out for 40min, the pre-baking temperature is 71 ℃, the pre-baking time is 40min, the unilateral of the printed surface is 4mil larger than the gear point, the post-baking temperature is 80 ℃ and 30min, and the temperature is 120 ℃.
The third solder mask comprises the following steps of pretreating a light brush → an aluminum mesh plug hole → a printing surface along the Y direction → standing → a pre-baking tunnel → exposure → development → post-baking, and standing for 1 hour.
The types of the ink adopted in the primary solder mask and the secondary solder mask are EC23, the type of the ink adopted in the tertiary solder mask is Shanghao BK3-S1, and the using sequence of the ink cannot be changed in order to ensure good processing effect.
The adhesive sticking comprises the following steps of cutting adhesive → dragging adhesive → pre-sticking → fixing an iron → pressing and pressing adhesive, wherein before the adhesive sticking, the welding-proof surface foreign matter is processed flatly, and after the adhesive sticking iron is fixed, 100% full inspection is carried out. The foreign matter and plate scraps need to be cleaned in the rubberizing process, and the problems of foreign matter, reverse pasting, folding, poor pasting and the like are detected by 100% after the rubberizing iron is fixed, so that the rubberizing quality is ensured. In this embodiment, the iron is used to iron the plastic surface, thereby avoiding wrinkling.
The above examples only show 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A manufacturing process of a high-quality multilayer circuit board is characterized by comprising the following steps: cutting → drilling 1 → plating 1 → one dry film → one etching → AOI1 → tree plug → grinding → pressing → drilling 2 → plating 2 → outer dry film → outer etching → AOI2 → one solder mask → secondary solder mask → third solder mask → gold-plating → testing → FQC1 → rubberizing → pressing → character → draging → FQC2 → OQC → shipment.
2. The process for manufacturing a high-quality multilayer circuit board according to claim 1, wherein six layers are cut, and each layer is grooved; drilling in layers, wherein holes are drilled in the middle of each layer; the expansion and shrinkage proportion of each layer of drilled holes is as follows: x is 100.03%, and y is 100.03%.
3. The manufacturing process of a high-quality multilayer circuit board according to claim 2, wherein electroplating is required twice in the electroplating 1, and the inner diameter of hole copper is 1.45-1.9 mil; in the primary dry film, the thickness of the dry film is 1.5 mil; after the primary etching is finished, horizontally and manually taking and placing the plate; the outer layer etching speed was 1 m/min.
4. The manufacturing process of a high-quality multilayer circuit board according to claim 3, wherein in the step of plugging the tree, the thickness of the tree plug area is X, and X is more than or equal to 0.4 mm; the L1-1 layer and the L12-1 layer are copper surfaces, and tree plugging is not performed; and (4) filling gaps after the tree is plugged, wherein the difference between a gap filling area and a copper foil area is M, and M is less than or equal to 0.1 mm.
5. The process for manufacturing a high-quality multilayer circuit board according to claim 1, wherein a grinding process is performed by using grinding equipment, and the copper surface of the circuit is exposed; in addition to L1 and L12, the other copper face edges allow for the residue of resin that is not easily ground.
6. The manufacturing process of a high-quality multi-layer circuit board according to claim 1, wherein in the laminating step, 100% of the laminated plates after hot melting are detected by X-RAY photography, and 100% of the laminated plates after laminating are confirmed for the plates without the tail strip of the hot melting strip; after pressing, edge dragging and ceramic grinding are carried out to treat PP powder on the surface; the fishing size is retracted by 2mm and the fishing edge size is ensured to be consistent.
7. The process for manufacturing a high-quality multilayer circuit board according to claim 1, wherein in the step 2, a drill is used, the diameter of the drill point is 0.5mm, the rotating speed is 75krpm, the feed speed is 30mm/sec, the withdrawal speed is 3000mm/sec, and the hole limit is 600 holes; processing the flash by using a dry brushing machine; before the step 2 of electroplating, high-pressure water washing is carried out at the speed of 2.5 m/min; electroplating is performed twice in the electroplating 2 step.
8. The process according to claim 1, wherein in the step of drying the outer layer film, the pressure of the squeeze film is set to 5kg/cm 2 (ii) a The unilateral copper exposure size is 1-2 mm; etching twice at the speed of 1.4m/min in the outer layer etching step; in the AOI2 step, AOI full scan detection is carried out.
9. The manufacturing process of a high-quality multilayer circuit board according to claim 1, wherein the one-time solder mask comprises the following steps of pretreatment → printing surface along X direction → vacuum pumping → pre-baking, wherein the single edge of the printed surface is 10mil larger, the vacuum pumping is carried out for 30min, the pre-baking temperature is 70 ℃, and the pre-baking time is 30 min;
the secondary solder mask comprises the following steps of printing the surface along the X direction → standing → pre-baking → exposing → developing → post-baking, wherein the unilateral of the printed surface is 10mil larger than the neutral point, standing is carried out for 40min, the pre-baking temperature is 71 ℃, the pre-baking time is 40min, the unilateral of the exposed neutral point is 4mil larger than the neutral point, the post-baking temperature is 80 ℃, baking is 30min, and the temperature is 120 ℃ baking is 30 min;
the third solder mask comprises the following steps of pretreating a light brush → an aluminum mesh plug hole → a printing surface along the Y direction → standing → a pre-baking tunnel → exposure → development → post-baking, and standing for 1 hour.
10. The manufacturing process of a high-quality multilayer circuit board according to claim 1, wherein the gluing comprises the following steps of glue cutting → glue fetching → pre-pasting → iron fixing → pressing and gluing, the foreign matter on the solder mask surface is processed and leveled before gluing, and 100% full inspection is carried out after the gluing iron is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210592757.9A CN114885531A (en) | 2022-05-27 | 2022-05-27 | Manufacturing process of high-quality multilayer circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210592757.9A CN114885531A (en) | 2022-05-27 | 2022-05-27 | Manufacturing process of high-quality multilayer circuit board |
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| CN114885531A true CN114885531A (en) | 2022-08-09 |
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| CN202210592757.9A Pending CN114885531A (en) | 2022-05-27 | 2022-05-27 | Manufacturing process of high-quality multilayer circuit board |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060088144A (en) * | 2005-02-01 | 2006-08-04 | 주식회사 신협전자 | Manufacturing process of printed circuit board for double side hccl |
| CN105555043A (en) * | 2016-02-02 | 2016-05-04 | 东莞翔国光电科技有限公司 | Manufacturing process for ultra-thick copper PCB (printed circuit board) |
| CN109496078A (en) * | 2018-11-28 | 2019-03-19 | 博罗县鸿源华辉电子有限公司 | A kind of manufacture craft of thickness copper sheet |
| CN109640529A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of manufacture craft of two-sided super thick copper sheet |
| CN110099523A (en) * | 2019-03-29 | 2019-08-06 | 东莞联桥电子有限公司 | A kind of manufacture craft of multilayer circuit board |
| CN212046383U (en) * | 2019-12-31 | 2020-12-01 | 昆山晟丰精密机械有限公司 | Printing table for preventing PCB from being welded |
-
2022
- 2022-05-27 CN CN202210592757.9A patent/CN114885531A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060088144A (en) * | 2005-02-01 | 2006-08-04 | 주식회사 신협전자 | Manufacturing process of printed circuit board for double side hccl |
| CN105555043A (en) * | 2016-02-02 | 2016-05-04 | 东莞翔国光电科技有限公司 | Manufacturing process for ultra-thick copper PCB (printed circuit board) |
| CN109496078A (en) * | 2018-11-28 | 2019-03-19 | 博罗县鸿源华辉电子有限公司 | A kind of manufacture craft of thickness copper sheet |
| CN109640529A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of manufacture craft of two-sided super thick copper sheet |
| CN110099523A (en) * | 2019-03-29 | 2019-08-06 | 东莞联桥电子有限公司 | A kind of manufacture craft of multilayer circuit board |
| CN212046383U (en) * | 2019-12-31 | 2020-12-01 | 昆山晟丰精密机械有限公司 | Printing table for preventing PCB from being welded |
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