CN109496078A - A kind of manufacture craft of thickness copper sheet - Google Patents
A kind of manufacture craft of thickness copper sheet Download PDFInfo
- Publication number
- CN109496078A CN109496078A CN201811434412.0A CN201811434412A CN109496078A CN 109496078 A CN109496078 A CN 109496078A CN 201811434412 A CN201811434412 A CN 201811434412A CN 109496078 A CN109496078 A CN 109496078A
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- Prior art keywords
- plate
- thickness
- copper
- sheet
- manufacture craft
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The present invention provides a kind of manufacture crafts of thick copper sheet, comprising the following steps: A, sawing sheet, B pattern transfer, C, Etching, D, AOI scanning, E, welding resistance, F, text, G, combined plate, H, drilling, I, V-CUT, J, shape, K, OSP, L, FQA, M, packaging and N, warehousing finished products.The present invention solves the problems, such as that plate bursting, layering, layer is inclined, wraping plate, pressure resistance is insufficient, thickness is inadequate, route is rubescent, plate face is uneven, guarantees the size qualification of line width, and plate compressive resistance is high, and plate thickness is uniform.
Description
Technical field
The present invention relates to pcb board technical field of manufacturing process more particularly to a kind of manufacture crafts of thick copper sheet.
Background technique
PCB (Printed Circuit Board), Chinese is printed wiring board, and abbreviation printed board is electronics industry
One of important component.Almost every kind of electronic equipment, it is small to arrive electronic watch, calculator, arrive computer greatly, communication electronic device,
Military issue weapons system, for the electric interconnection between them, will use printing as long as there is the electronic components such as integrated circuit
Plate.The quality and cost that design and manufacture quality and directly influence entire product of printed board, even result in commercial competition at
It loses.Existing pcb board manufacture craft, turmeric step be all after character silk printing, due in liquid medicine tank there may be phosphorus from
Son, phosphonium ion can be deposited on the character face of pcb board during turmeric, and phosphonium ion is when pcb board carries out wave-soldering, through high temperature
It reacts and redness phenomenon occurs, so causing to will appear the rubescent situation of character after the completion of element welding, influence electronic product
Appearance and quality.
Outer layer completion copper thickness >=2oz is generally defined as thick copper sheet, thick copper sheet is mainly used for power supply product, voltage and current
It is used when relatively high.It is the basic material of PCB, also known as substrate.Thick copper sheet is in the production process due to medium, plate and work
The problems such as skill process, is easy to appear plate bursting, layering, wraping plate, the problems such as pressure resistance is insufficient, size is exceeded and plate face is uneven, therefore needs
The prior art is improved.
Summary of the invention
In order to solve the above-mentioned technical problems, the present invention provides a kind of manufacture crafts of thick copper sheet, it is intended to solve existing skill
The problems such as plate bursting, layering and pressure resistance deficiency are easy to appear in art in thick copper sheet production method.
The invention provides following technical scheme, a kind of manufacture craft of thickness copper sheet, comprising the following steps:
A, sawing sheet: requiring to select corresponding plate according to MI, and adjustment needs the size of sawing sheet, cuts first plate and carries out batch
Production；
B, pattern transfer: the plate for holding material successfully passes sequentially through route nog plate, ink coating, continuous tunnel furnace baking, exposure and shows
Shadow carries out the production of internal layer circuit to plate；
C, Etching: the plate for completing pattern transfer expands dissolution by alkaline solution and anti-plate resist dry film
Reaction, the dry film of removal plate face covering, exposes the extra copper foil of non-plating corrosion resistant metal, by the extra copper of non-plating corrosion resistant metal
Foil is removed by etching solution corrosion dissolution, and the figure of plating corrosion resistant metal remains, and forms the conductive circuit pattern of needs；
D, AOI is scanned: being utilized image technology, is compared whether the route for completing the plate of Etching and mark Huaihe River image have difference
It is different, to judge whether the plate for completing Etching meets mark Huaihe River；
E, welding resistance: the plate after inspection passes sequentially through welding resistance nog plate, silk-screen, low-temperature bake, contraposition exposure and imaging, makes to hinder
Solder paste ink is uniformly coated on plate；
F, the production and baking sheet of text text: are carried out to the plate for completing welding resistance；
G, combined plate: the edges of boards size of upper pin or wrapper sheet, general plate beats pin side greater than using on one side for 5mm
Formula, it is on the contrary then combined with wrapper sheet mode, multi-layer board and two plates are bored without combination, directly by technological parameter after platen installs pin
Loading board；
H, it drills: setting drilling parameter, drilling depth and work origin being required according to MI, in 20 ± 3 DEG C of temperature, humidity
60% ± 20% working environment does first plate, is produced in batches after QC examines judgement initial workpiece qualified；
I, V-CUT: a rule cut-off rule of the plate in specific position cutter well cutting of drilling is completed；
J, the plate gong of well cutting cut-off rule shape: is gone out into finished product shape；
K, OSP: on the naked copper surface of plate cleaning, one layer of organic guarantor is formed in the method for chemistry and welds film, is protected securely
Protect the fresh copper surface of plate；
L, FQA: finished product inspection, whether plate functional and problem of appearance for confirmation；
M, it packs: by the Plate material package of passed examination；
N, warehousing finished products.
Further, in step, the plate of 4oz or more is greater than for copper thickness, using diamond guillotine come sawing sheet.
Further, in the ink coating of step B, copper thickness is less than 4oz plate below, and the coating layer thickness of ink is in 8 μ
M-12 μm, copper thickness is greater than the plate of 4oz or more, and the coating layer thickness of ink is greater than 12 μm.
Further, in step C, the plate of 4oz or more is greater than for copper thickness, needs to etch twice, and guarantee ink
Coating must it is sufficiently thick, do not fall film when can guarantee second etch.
Further, in step E, the plate of 3oz or more is greater than for copper thickness, the plate after inspection passes sequentially through welding resistance
Nog plate, a silk-screen, a low-temperature bake, secondary silk-screen, secondary low-temperature bake, contraposition exposure and imaging, keep solder mask equal
Even is coated on plate.
Further, in step E, the plate of 5oz or more is greater than for copper thickness, mask line technique need to be used, and
It is handled using silk-screen twice.
Preferably, copper thickness quiescent time after the plate silk-screen of Hoz is >=15min, and copper thickness is in 1oz- in step E
Quiescent time is >=30min after the plate silk-screen of 2oz, and copper thickness quiescent time after the plate silk-screen of 3oz or more is >=60min,
It can be put into oven according to first up and then down sequence and carry out low-temperature bake, the board direction of plate is consistent with oven air-out direction,
Plate minimum 5cm at a distance from furnace wall.
Preferably, in step E, the plate of 3oz or more is greater than for copper thickness, when silk-screen, needs to print along line alignment
Brush, to fill and lead up ink between route.
Further, in steph, doing first plate must be subdrilling 1PNL working plate and 1PNL and working plate comparable size
Red film, and red film is not allow for the burnt phenomenon of folding line or hole periphery.
Further, in steph, copper thickness reduces 1PNL/ on the basis of the plate of 2oz is in general aluminum substrate and folds, copper
Thickness reduces 2PNL/ on the basis of the plate of 3oz is in general aluminum substrate and folds, and copper thickness is being more than a piece of brill of plate of 4oz.
The invention has the benefit that the present invention provides a kind of manufacture craft of thick copper sheet, solve plate bursting, layering,
Layer partially, wraping plate, the problem that pressure resistance is insufficient, thickness is inadequate, route is rubescent, plate face is uneven, guarantee that the size qualification of line width, plate are resistance to
Compressive Strength is high, and plate thickness is uniform.
Specific embodiment
In order to make goal of the invention of the invention, technical solution and technical effect are more clearly understood, below with reference to specific reality
Applying mode, the present invention is described further.It should be understood that specific embodiment described herein, for explaining only the invention,
It is not intended to limit the present invention.
First embodiment:
A kind of manufacture craft of thick copper sheet of the copper thickness less than or equal to 3oz, comprising the following steps:
A, sawing sheet: requiring to select corresponding plate according to MI, and adjustment needs the size of sawing sheet, cuts first plate and carries out batch
Production；
B, pattern transfer: the plate for holding material successfully passes sequentially through route nog plate, ink coating, continuous tunnel furnace baking, exposure and shows
Shadow carries out the production of internal layer circuit to plate, and the coating layer thickness of the ink of plate is at 8 μm -12 μm；
C, Etching: the plate for completing pattern transfer expands dissolution by alkaline solution and anti-plate resist dry film
Reaction, the dry film of removal plate face covering, exposes the extra copper foil of non-plating corrosion resistant metal, by the extra copper of non-plating corrosion resistant metal
Foil is removed by etching solution corrosion dissolution, and the figure of plating corrosion resistant metal remains, and forms the conductive circuit pattern of needs；
D, AOI is scanned: being utilized image technology, is compared whether the route for completing the plate of Etching and mark Huaihe River image have difference
It is different, to judge whether the plate for completing Etching meets mark Huaihe River；
E, welding resistance: the plate after inspection passes sequentially through welding resistance nog plate, silk-screen, low-temperature bake, contraposition exposure and imaging, makes to hinder
Solder paste ink is uniformly coated on plate, and specifically, copper thickness quiescent time after the plate silk-screen of Hoz is >=15min, and copper thickness exists
Quiescent time is >=30min after the plate silk-screen of 1oz-2oz, and oven can be put into according to first up and then down sequence and carries out low temperature baking
Roasting, the board direction of plate is consistent with oven air-out direction, plate minimum 5cm at a distance from furnace wall；
F, the production and baking sheet of text text: are carried out to the plate for completing welding resistance；
G, combined plate: the edges of boards size of upper pin or wrapper sheet, general plate beats pin side greater than using on one side for 5mm
Formula, it is on the contrary then combined with wrapper sheet mode, multi-layer board and two plates are bored without combination, directly by technological parameter after platen installs pin
Loading board；
H, it drills: setting drilling parameter, drilling depth and work origin being required according to MI, in 20 ± 3 DEG C of temperature, humidity
60% ± 20% working environment does first plate, is produced in batches after QC examines judgement initial workpiece qualified, specifically, doing first plate must
It must be the red film of subdrilling 1PNL working plate and 1PNL and working plate comparable size, and red film is not allow for folding line or hole periphery
Burnt phenomenon, and copper thickness reduces 1PNL/ on the basis of the plate of 2oz is in general aluminum substrate and folds, and plate of the copper thickness in 3oz exists
It is folded that 2PNL/ is reduced on the basis of general aluminum substrate；
I, V-CUT: a rule cut-off rule of the plate in specific position cutter well cutting of drilling is completed；
J, the plate gong of well cutting cut-off rule shape: is gone out into finished product shape；
K, OSP: on the naked copper surface of plate cleaning, one layer of organic guarantor is formed in the method for chemistry and welds film, is protected securely
Protect the fresh copper surface of plate；
L, FQA: finished product inspection, whether plate functional and problem of appearance for confirmation；
M, it packs: by the Plate material package of passed examination；
N, warehousing finished products.
Second embodiment:
A kind of copper thickness is greater than the manufacture craft of 3oz and the thick copper sheet less than or equal to 4oz, comprising the following steps:
A, sawing sheet: requiring to select corresponding plate according to MI, and adjustment needs the size of sawing sheet, cuts first plate and carries out batch
Production；
B, pattern transfer: the plate for holding material successfully passes sequentially through route nog plate, ink coating, continuous tunnel furnace baking, exposure and shows
Shadow carries out the production of internal layer circuit to plate, and the coating layer thickness of the ink of plate is at 8 μm -12 μm；
C, Etching: the plate for completing pattern transfer expands dissolution by alkaline solution and anti-plate resist dry film
Reaction, the dry film of removal plate face covering, exposes the extra copper foil of non-plating corrosion resistant metal, by the extra copper of non-plating corrosion resistant metal
Foil is removed by etching solution corrosion dissolution, and the figure of plating corrosion resistant metal remains, and forms the conductive circuit pattern of needs；
D, AOI is scanned: being utilized image technology, is compared whether the route for completing the plate of Etching and mark Huaihe River image have difference
It is different, to judge whether the plate for completing Etching meets mark Huaihe River；
E, welding resistance: the plate after inspection passes sequentially through welding resistance nog plate, a silk-screen, a low-temperature bake, secondary silk-screen, two
Secondary low-temperature bake, contraposition exposure and imaging, are coated in solder mask uniformly on plate, specifically, static after plate silk-screen
Time is >=60min, and oven can be put into according to first up and then down sequence and carries out low-temperature bake, the board direction and oven of plate
Air-out direction is consistent, plate minimum 5cm at a distance from furnace wall, it is preferable that when silk-screen, need to print along line alignment, so as to
Ink between route is filled and led up；
F, the production and baking sheet of text text: are carried out to the plate for completing welding resistance；
G, combined plate: the edges of boards size of upper pin or wrapper sheet, general plate beats pin side greater than using on one side for 5mm
Formula, it is on the contrary then combined with wrapper sheet mode, multi-layer board and two plates are bored without combination, directly by technological parameter after platen installs pin
Loading board；
H, it drills: setting drilling parameter, drilling depth and work origin being required according to MI, in 20 ± 3 DEG C of temperature, humidity
60% ± 20% working environment does first plate, is produced in batches after QC examines judgement initial workpiece qualified, specifically, doing first plate must
It must be the red film of subdrilling 1PNL working plate and 1PNL and working plate comparable size, and red film is not allow for folding line or hole periphery
Burnt phenomenon, it is folded that copper thickness reduces 2PNL/ on the basis of the plate of 3oz is in general aluminum substrate；
I, V-CUT: a rule cut-off rule of the plate in specific position cutter well cutting of drilling is completed；
J, the plate gong of well cutting cut-off rule shape: is gone out into finished product shape；
K, OSP: on the naked copper surface of plate cleaning, one layer of organic guarantor is formed in the method for chemistry and welds film, is protected securely
Protect the fresh copper surface of plate；
L, FQA: finished product inspection, whether plate functional and problem of appearance for confirmation；
M, it packs: by the Plate material package of passed examination；
N, warehousing finished products.
3rd embodiment:
A kind of manufacture craft of thick copper sheet of the copper thickness greater than 4oz, comprising the following steps:
A, it sawing sheet: is required to select corresponding plate according to MI, adjustment is needed the size of sawing sheet, cut using diamond guillotine
First plate is simultaneously produced in batches；
B, pattern transfer: the plate for holding material successfully passes sequentially through route nog plate, ink coating, continuous tunnel furnace baking, exposure and shows
Shadow carries out the production of internal layer circuit to plate, and the coating layer thickness of the ink of plate is greater than 12 μm；
C, Etching: the plate for completing pattern transfer expands dissolution by alkaline solution and anti-plate resist dry film
Reaction, the dry film of removal plate face covering, exposes the extra copper foil of non-plating corrosion resistant metal, by the extra copper of non-plating corrosion resistant metal
Foil is removed by etching solution corrosion dissolution, and the figure of plating corrosion resistant metal remains, and forms the conductive circuit pattern of needs,
And plate needs to etch twice, and guarantees that the coating of ink must be sufficiently thick, does not fall film when can guarantee second etch；
D, AOI is scanned: being utilized image technology, is compared whether the route for completing the plate of Etching and mark Huaihe River image have difference
It is different, to judge whether the plate for completing Etching meets mark Huaihe River；
E, welding resistance: the plate after inspection passes sequentially through welding resistance nog plate, a silk-screen, a low-temperature bake, secondary silk-screen, two
Secondary low-temperature bake, contraposition exposure and imaging, be coated in solder mask uniformly on plate, and for copper thickness be greater than 5oz with
On plate, mask line technique need to be used, while being handled using silk-screen twice, specifically, quiescent time after plate silk-screen
For >=60min, it can be put into oven according to first up and then down sequence and carry out low-temperature bake, the board direction and oven outlet air of plate
Direction is consistent, plate minimum 5cm at a distance from furnace wall, it is preferable that when silk-screen, needs to print along line alignment, so as to by line
Ink is filled and led up between road；
F, the production and baking sheet of text text: are carried out to the plate for completing welding resistance；
G, combined plate: the edges of boards size of upper pin or wrapper sheet, general plate beats pin side greater than using on one side for 5mm
Formula, it is on the contrary then combined with wrapper sheet mode, multi-layer board and two plates are bored without combination, directly by technological parameter after platen installs pin
Loading board；
H, it drills: setting drilling parameter, drilling depth and work origin being required according to MI, in 20 ± 3 DEG C of temperature, humidity
60% ± 20% working environment does first plate, is produced in batches after QC examines judgement initial workpiece qualified, specifically, doing first plate must
It must be the red film of subdrilling 1PNL working plate and 1PNL and working plate comparable size, and red film is not allow for folding line or hole periphery
Burnt phenomenon, copper thickness are being more than a piece of brill of plate of 4oz；
I, V-CUT: a rule cut-off rule of the plate in specific position cutter well cutting of drilling is completed；
J, the plate gong of well cutting cut-off rule shape: is gone out into finished product shape；
K, OSP: on the naked copper surface of plate cleaning, one layer of organic guarantor is formed in the method for chemistry and welds film, is protected securely
Protect the fresh copper surface of plate；
L, FQA: finished product inspection, whether plate functional and problem of appearance for confirmation；
M, it packs: by the Plate material package of passed examination；
N, warehousing finished products.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, architectural form cans be flexible and changeable, can be with derivative series product.It only makes several
Simple deduction or replace all shall be regarded as belonging to present invention scope of patent protection determined by the appended claims.
Claims (10)
1. a kind of manufacture craft of thickness copper sheet, it is characterised in that: the following steps are included:
A, sawing sheet: requiring to select corresponding plate according to MI, and adjustment needs the size of sawing sheet, cuts first plate and carries out batch life
It produces；
B, pattern transfer: the plate for holding material successfully passes sequentially through route nog plate, ink coating, continuous tunnel furnace baking, exposure and imaging, right
The production of plate progress internal layer circuit；
C, Etching: the plate for completing pattern transfer expands dissolution instead by alkaline solution and anti-plate resist dry film
It answers, the dry film of removal plate face covering exposes the extra copper foil of non-plating corrosion resistant metal, by the extra copper foil of non-plating corrosion resistant metal
It is removed by etching solution corrosion dissolution, and the figure of plating corrosion resistant metal remains, and forms the conductive circuit pattern of needs；
D, AOI is scanned: image technology is utilized, the route for completing the plate of Etching is compared and whether mark Huaihe River image is variant,
To judge whether the plate for completing Etching meets mark Huaihe River；
E, welding resistance: the plate after inspection passes sequentially through welding resistance nog plate, silk-screen, low-temperature bake, contraposition exposure and imaging, keeps welding resistance oily
It is black to be uniformly coated on plate；
F, the production and baking sheet of text text: are carried out to the plate for completing welding resistance；
G, combined plate: the edges of boards size of upper pin or wrapper sheet, general plate beats pin mode greater than using on one side for 5mm, instead
Then combined with wrapper sheet mode, multi-layer board and two bore plates without combination, directly by technological parameter loading board after platen installs pin；
H, drill: setting drilling parameter, drilling depth and work origin required according to MI, 20 ± 3 DEG C of temperature, humidity 60% ±
20% working environment does first plate, is produced in batches after QC examines judgement initial workpiece qualified；
I, V-CUT: a rule cut-off rule of the plate in specific position cutter well cutting of drilling is completed；
J, the plate gong of well cutting cut-off rule shape: is gone out into finished product shape；
K, OSP: on the naked copper surface of plate cleaning, one layer of organic guarantor is formed in the method for chemistry and welds film, is protect securely
The fresh copper surface of plate；
L, FQA: finished product inspection, whether plate functional and problem of appearance for confirmation；
M, it packs: by the Plate material package of passed examination；
N, warehousing finished products.
2. the manufacture craft of thickness copper sheet as described in claim 1, it is characterised in that: in step, be greater than 4oz for copper thickness
Above plate, using diamond guillotine come sawing sheet.
3. the manufacture craft of thickness copper sheet as claimed in claim 2, it is characterised in that: in the ink coating of step B, copper thickness is small
In 4oz plate below, for the coating layer thickness of ink at 8 μm -12 μm, copper thickness is greater than the plate of 4oz or more, the coating layer thickness of ink
Greater than 12 μm.
4. the manufacture craft of thickness copper sheet as claimed in claim 3, it is characterised in that: in step C, be greater than 4oz for copper thickness
Above plate needs to etch twice, and guarantees that the coating of ink must be sufficiently thick, does not fall film when can guarantee second etch.
5. the manufacture craft of thickness copper sheet as claimed in claim 4, it is characterised in that: in step E, be greater than 3oz for copper thickness
Above plate, the plate after inspection pass sequentially through a welding resistance nog plate, silk-screen, a low-temperature bake, secondary silk-screen, secondary low
Temperature baking, contraposition exposure and imaging, are coated in solder mask uniformly on plate.
6. the manufacture craft of thickness copper sheet as claimed in claim 5, it is characterised in that: in step E, be greater than 5oz for copper thickness
Above plate need to use mask line technique, and be handled using silk-screen twice.
7. the manufacture craft of thickness copper sheet as described in claim 1, it is characterised in that: in step E, plate of the copper thickness in Hoz
Quiescent time is >=15min after silk-screen, and copper thickness quiescent time after the plate silk-screen of 1oz-2oz is >=30min, and copper thickness is in 3oz
Quiescent time is >=60min after above plate silk-screen, and oven can be put into according to first up and then down sequence and carries out low-temperature bake,
The board direction of plate is consistent with oven air-out direction, plate minimum 5cm at a distance from furnace wall.
8. the manufacture craft of the thick copper sheet as described in claim 5-7 any one, it is characterised in that: in step E, for copper
Thickness is greater than the plate of 3oz or more, when silk-screen, needs to print along line alignment, to fill and lead up ink between route.
9. the manufacture craft of thickness copper sheet as described in claim 1, it is characterised in that: in steph, doing first plate must be subdrilling
The red film of 1PNL working plate and 1PNL and working plate comparable size, and red film is not allow for folding line or hole periphery is burnt existing
As.
10. the manufacture craft of thickness copper sheet as claimed in claim 9, it is characterised in that: in steph, plate of the copper thickness in 2oz
It reduces 1PNL/ on the basis of general aluminum substrate to fold, copper thickness reduces 2PNL/ on the basis of the plate of 3oz is in general aluminum substrate
Folded, copper thickness is being more than a piece of brill of plate of 4oz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811434412.0A CN109496078A (en) | 2018-11-28 | 2018-11-28 | A kind of manufacture craft of thickness copper sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811434412.0A CN109496078A (en) | 2018-11-28 | 2018-11-28 | A kind of manufacture craft of thickness copper sheet |
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| CN109496078A true CN109496078A (en) | 2019-03-19 |
Family
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| CN201811434412.0A Pending CN109496078A (en) | 2018-11-28 | 2018-11-28 | A kind of manufacture craft of thickness copper sheet |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490134A (en) * | 2021-01-07 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate processing method of double-sided OSP process |
| CN114885531A (en) * | 2022-05-27 | 2022-08-09 | 东莞联桥电子有限公司 | Manufacturing process of high-quality multilayer circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050014767A (en) * | 2003-07-31 | 2005-02-07 | 후지 샤신 필름 가부시기가이샤 | Pattern production system, exposure apparatus and exposure method |
| CN101692757A (en) * | 2009-09-07 | 2010-04-07 | 皆利士多层线路版(中山)有限公司 | Process for manufacturing 12OZ thick copper multilayer circuit board |
| CN102917542A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for manufacturing copper PCB (Printed Circuit Board) circuit |
| CN103552125A (en) * | 2013-09-29 | 2014-02-05 | 胜宏科技（惠州）股份有限公司 | Machining method of red rubber sheet through hole |
| CN104684257A (en) * | 2013-11-29 | 2015-06-03 | 深南电路有限公司 | Processing method of thick copper circuit board |
| CN105451428A (en) * | 2014-08-26 | 2016-03-30 | 深南电路有限公司 | Laminated circuit board processing method and laminated circuit board |
| CN107613678A (en) * | 2017-10-24 | 2018-01-19 | 深圳市昶东鑫线路板有限公司 | A kind of manufacture craft of thick copper coin |
-
2018
- 2018-11-28 CN CN201811434412.0A patent/CN109496078A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050014767A (en) * | 2003-07-31 | 2005-02-07 | 후지 샤신 필름 가부시기가이샤 | Pattern production system, exposure apparatus and exposure method |
| CN101692757A (en) * | 2009-09-07 | 2010-04-07 | 皆利士多层线路版(中山)有限公司 | Process for manufacturing 12OZ thick copper multilayer circuit board |
| CN102917542A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for manufacturing copper PCB (Printed Circuit Board) circuit |
| CN103552125A (en) * | 2013-09-29 | 2014-02-05 | 胜宏科技（惠州）股份有限公司 | Machining method of red rubber sheet through hole |
| CN104684257A (en) * | 2013-11-29 | 2015-06-03 | 深南电路有限公司 | Processing method of thick copper circuit board |
| CN105451428A (en) * | 2014-08-26 | 2016-03-30 | 深南电路有限公司 | Laminated circuit board processing method and laminated circuit board |
| CN107613678A (en) * | 2017-10-24 | 2018-01-19 | 深圳市昶东鑫线路板有限公司 | A kind of manufacture craft of thick copper coin |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112490134A (en) * | 2021-01-07 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate processing method of double-sided OSP process |
| CN114885531A (en) * | 2022-05-27 | 2022-08-09 | 东莞联桥电子有限公司 | Manufacturing process of high-quality multilayer circuit board |
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Address after: 516100 Lianhu, left side of Yangping Road, Lianhu group, Licun village, Yangcun Town, BOLUO County, Huizhou City, Guangdong Province Applicant after: CHINA BRILLIANT ELECTRONIC Co.,Ltd. Address before: 516000, Guangdong, Huizhou province Boluo County town of Yang Lake Industrial Zone Applicant before: CHINA BRILLIANT ELECTRONIC Co.,Ltd. |
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Application publication date: 20190319 |