CN1148760C - 具有导电复合物的限流装置及制造导电复合物的方法 - Google Patents
具有导电复合物的限流装置及制造导电复合物的方法 Download PDFInfo
- Publication number
- CN1148760C CN1148760C CNB981160115A CN98116011A CN1148760C CN 1148760 C CN1148760 C CN 1148760C CN B981160115 A CNB981160115 A CN B981160115A CN 98116011 A CN98116011 A CN 98116011A CN 1148760 C CN1148760 C CN 1148760C
- Authority
- CN
- China
- Prior art keywords
- conductive
- curing agent
- conductive powder
- powder
- current limiting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 87
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000004593 Epoxy Substances 0.000 claims abstract description 45
- 239000000843 powder Substances 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 27
- 230000009477 glass transition Effects 0.000 claims abstract 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 100
- 150000001875 compounds Chemical class 0.000 claims description 26
- 229920000647 polyepoxide Polymers 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 5
- 239000011968 lewis acid catalyst Substances 0.000 claims description 4
- 238000009834 vaporization Methods 0.000 claims description 4
- 230000008016 vaporization Effects 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000003999 initiator Substances 0.000 claims description 3
- 150000003254 radicals Chemical class 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 13
- 229920000151 polyglycol Polymers 0.000 claims 13
- 239000010695 polyglycol Substances 0.000 claims 13
- 239000004902 Softening Agent Substances 0.000 claims 4
- 230000006835 compression Effects 0.000 claims 4
- 238000007906 compression Methods 0.000 claims 4
- 150000008065 acid anhydrides Chemical class 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000011230 binding agent Substances 0.000 abstract description 18
- 125000003700 epoxy group Chemical group 0.000 abstract description 14
- 229920001223 polyethylene glycol Polymers 0.000 abstract description 10
- 239000002202 Polyethylene glycol Substances 0.000 abstract description 9
- 229910052759 nickel Inorganic materials 0.000 description 35
- 239000000463 material Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 7
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 241000446313 Lamella Species 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Conductive Materials (AREA)
- Emergency Protection Circuit Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/896,874 US6191681B1 (en) | 1997-07-21 | 1997-07-21 | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite |
| US896874 | 1997-07-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1206203A CN1206203A (zh) | 1999-01-27 |
| CN1148760C true CN1148760C (zh) | 2004-05-05 |
Family
ID=25406994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB981160115A Expired - Fee Related CN1148760C (zh) | 1997-07-21 | 1998-07-13 | 具有导电复合物的限流装置及制造导电复合物的方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6191681B1 (enExample) |
| EP (1) | EP0896344A3 (enExample) |
| JP (1) | JP4212151B2 (enExample) |
| CN (1) | CN1148760C (enExample) |
| TW (1) | TW584869B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6191681B1 (en) * | 1997-07-21 | 2001-02-20 | General Electric Company | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite |
| DE19754976A1 (de) * | 1997-12-11 | 1999-06-17 | Abb Research Ltd | Schutzelement |
| US6459358B1 (en) * | 1999-09-27 | 2002-10-01 | Eaton Corporation | Flexible moldable conductive current-limiting materials |
| US7755652B2 (en) * | 2002-01-07 | 2010-07-13 | Samsung Electronics Co., Ltd. | Color flat panel display sub-pixel rendering and driver configuration for sub-pixel arrangements with split sub-pixels |
| GB0212977D0 (en) * | 2002-06-06 | 2002-07-17 | Vantico Ag | Actinic radiation curable compositions and their use |
| US7314583B2 (en) * | 2003-03-25 | 2008-01-01 | Tdk Corporation | Organic positive temperature coefficient thermistor device |
| TW200609953A (en) * | 2004-03-31 | 2006-03-16 | Tdk Corp | Organic positive temperature coefficient thermistor |
| JP2006013378A (ja) | 2004-06-29 | 2006-01-12 | Tdk Corp | サーミスタ素体形成用樹脂組成物及びサーミスタ |
| DE602005011021D1 (de) * | 2004-08-30 | 2008-12-24 | Kyushu Inst Of Technology Kita | Selbst-regenerierende strombegrenzungssicherung unter verwendung einer dielektrophoretischen kraft |
| JP5050265B2 (ja) * | 2007-11-09 | 2012-10-17 | 国立大学法人九州工業大学 | 自己回復性限流ヒューズ |
| MX2008013821A (es) * | 2008-10-28 | 2010-04-28 | Magnekon S A De C V | Alambre magneto con revestimiento adicionado con nanoestructuras tipo fulereno. |
| CN105058250B (zh) * | 2015-06-30 | 2019-04-09 | 浙江师范大学 | 一种导电柔性磨具及其制备方法 |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1149648B (de) | 1961-06-16 | 1963-05-30 | Bosch Gmbh Robert | Impulsgeber fuer elektrische Signalanlagen, wie Blinklichtanlagen, insbesondere zur Fahrtrichtungsanzeige von Kraftfahrzeugen |
| US3243753A (en) | 1962-11-13 | 1966-03-29 | Kohler Fred | Resistance element |
| US3673121A (en) | 1970-01-27 | 1972-06-27 | Texas Instruments Inc | Process for making conductive polymers and resulting compositions |
| US3648002A (en) | 1970-05-04 | 1972-03-07 | Essex International Inc | Current control apparatus and methods of manufacture |
| US4017715A (en) | 1975-08-04 | 1977-04-12 | Raychem Corporation | Temperature overshoot heater |
| JPS5262644A (en) | 1975-11-19 | 1977-05-24 | Tokai Rika Co Ltd | Overcurrent preventive limiting element |
| US4292261A (en) | 1976-06-30 | 1981-09-29 | Japan Synthetic Rubber Company Limited | Pressure sensitive conductor and method of manufacturing the same |
| US4101862A (en) | 1976-11-19 | 1978-07-18 | K.K. Tokai Rika Denki Seisakusho | Current limiting element for preventing electrical overcurrent |
| US4304987A (en) | 1978-09-18 | 1981-12-08 | Raychem Corporation | Electrical devices comprising conductive polymer compositions |
| US4237441A (en) | 1978-12-01 | 1980-12-02 | Raychem Corporation | Low resistivity PTC compositions |
| US4317027A (en) | 1980-04-21 | 1982-02-23 | Raychem Corporation | Circuit protection devices |
| US4583146A (en) | 1984-10-29 | 1986-04-15 | General Electric Company | Fault current interrupter |
| US4685025A (en) | 1985-03-14 | 1987-08-04 | Raychem Corporation | Conductive polymer circuit protection devices having improved electrodes |
| US4780371A (en) * | 1986-02-24 | 1988-10-25 | International Business Machines Corporation | Electrically conductive composition and use thereof |
| US5166658A (en) | 1987-09-30 | 1992-11-24 | Raychem Corporation | Electrical device comprising conductive polymers |
| US5068634A (en) | 1988-01-11 | 1991-11-26 | Electromer Corporation | Overvoltage protection device and material |
| NO880529L (no) | 1988-02-08 | 1989-08-09 | Ramu Int | Selvbegrensede elektrisk varmeelement. |
| JPH01225031A (ja) | 1988-03-02 | 1989-09-07 | Yaskawa Electric Mfg Co Ltd | 事故電流限流装置 |
| JPH02281707A (ja) * | 1989-04-24 | 1990-11-19 | Tdk Corp | ポリマーｐｔｃ素子 |
| SE465524B (sv) | 1990-02-08 | 1991-09-23 | Asea Brown Boveri | Anordning foer oeverlast- och kortslutningsskydd i elektriska anlaeggningar |
| JPH047801A (ja) | 1990-04-25 | 1992-01-13 | Daito Tsushinki Kk | Ｐｔｃ素子 |
| SE468026B (sv) | 1990-06-05 | 1992-10-19 | Asea Brown Boveri | Saett att framstaella en elektrisk anordning |
| US5260848A (en) | 1990-07-27 | 1993-11-09 | Electromer Corporation | Foldback switching material and devices |
| US5382938A (en) | 1990-10-30 | 1995-01-17 | Asea Brown Boveri Ab | PTC element |
| US5470622A (en) | 1990-11-06 | 1995-11-28 | Raychem Corporation | Enclosing a substrate with a heat-recoverable article |
| US5250228A (en) * | 1991-11-06 | 1993-10-05 | Raychem Corporation | Conductive polymer composition |
| JPH05295269A (ja) | 1991-11-29 | 1993-11-09 | General Electric Co <Ge> | 熱硬化性オルガノポリシロキサン組成物、予備生成済み潜伏性白金触媒およびそれの調製方法 |
| DE4142523A1 (de) | 1991-12-21 | 1993-06-24 | Asea Brown Boveri | Widerstand mit ptc - verhalten |
| SE470118C (sv) | 1992-04-16 | 1998-02-23 | Olof Karlstroem | Anordning för skydd mot överström i elektriska kretsar |
| US5378407A (en) * | 1992-06-05 | 1995-01-03 | Raychem Corporation | Conductive polymer composition |
| DE4221309A1 (de) | 1992-06-29 | 1994-01-05 | Abb Research Ltd | Strombegrenzendes Element |
| DE4228297A1 (de) | 1992-08-26 | 1994-03-03 | Siemens Ag | Veränderbarer Hochstromwiderstand, insbes. zur Anwendung als Schutzelement in der Leistungsschalttechnik, und Schaltung unter Verwendung des Hochstromwiderstandes |
| DE4232969A1 (de) | 1992-10-01 | 1994-04-07 | Abb Research Ltd | Elektrisches Widerstandselement |
| SE9203234L (sv) | 1992-11-02 | 1994-01-10 | Seldim I Vaesteraas Ak | Anordning för skydd mot överström i elektriska kretsar |
| US5451919A (en) | 1993-06-29 | 1995-09-19 | Raychem Corporation | Electrical device comprising a conductive polymer composition |
| EP0640995B1 (de) | 1993-08-25 | 1997-06-25 | Abb Research Ltd. | Elektrisches Widerstandselement und Verwendung dieses Widerstandselementes in einem Strombegrenzer |
| DE4330607A1 (de) | 1993-09-09 | 1995-03-16 | Siemens Ag | Limiter zur Strombegrenzung |
| SE514775C2 (sv) | 1994-04-22 | 2001-04-23 | Seldim I Vaesteraas Ab | För skydd mot överström i elektriska kretsar avsedd anordning |
| US5436274A (en) | 1994-09-30 | 1995-07-25 | General Electric Company | Preparation of silicone foams of low density and small cell size |
| DE4441280C2 (de) | 1994-11-19 | 1998-08-27 | Asea Brown Boveri | Kaltleiter und Vorrichtung zur Strombegrenzung mit mindestens einem Kaltleiter |
| US5912308A (en) * | 1994-11-30 | 1999-06-15 | Alliedsignal Inc. | Multifunctional cyanate ester and epoxy blends |
| US5581192A (en) | 1994-12-06 | 1996-12-03 | Eaton Corporation | Conductive liquid compositions and electrical circuit protection devices comprising conductive liquid compositions |
| DE19520869A1 (de) | 1995-06-08 | 1996-12-12 | Abb Research Ltd | PTC-Widerstand |
| US5614881A (en) * | 1995-08-11 | 1997-03-25 | General Electric Company | Current limiting device |
| US5808538A (en) | 1996-06-19 | 1998-09-15 | Littelfuse, Inc. | Electrical apparatus for overcurrent protection of electrical circuits |
| JPH10312905A (ja) | 1997-01-02 | 1998-11-24 | General Electric Co <Ge> | 電流制限装置 |
| US6191681B1 (en) * | 1997-07-21 | 2001-02-20 | General Electric Company | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite |
-
1997
- 1997-07-21 US US08/896,874 patent/US6191681B1/en not_active Expired - Fee Related
-
1998
- 1998-07-08 JP JP19222498A patent/JP4212151B2/ja not_active Expired - Fee Related
- 1998-07-08 TW TW087111076A patent/TW584869B/zh not_active IP Right Cessation
- 1998-07-13 CN CNB981160115A patent/CN1148760C/zh not_active Expired - Fee Related
- 1998-07-21 EP EP98305827A patent/EP0896344A3/en not_active Withdrawn
-
2000
- 2000-11-13 US US09/709,880 patent/US6362722B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6362722B1 (en) | 2002-03-26 |
| CN1206203A (zh) | 1999-01-27 |
| EP0896344A2 (en) | 1999-02-10 |
| TW584869B (en) | 2004-04-21 |
| JP4212151B2 (ja) | 2009-01-21 |
| US6191681B1 (en) | 2001-02-20 |
| JPH11126706A (ja) | 1999-05-11 |
| EP0896344A3 (en) | 1999-07-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040505 |