CN114830293A - 基板处理装置和基板处理方法 - Google Patents

基板处理装置和基板处理方法 Download PDF

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Publication number
CN114830293A
CN114830293A CN202080086729.9A CN202080086729A CN114830293A CN 114830293 A CN114830293 A CN 114830293A CN 202080086729 A CN202080086729 A CN 202080086729A CN 114830293 A CN114830293 A CN 114830293A
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CN
China
Prior art keywords
substrate
laser light
laser
wafer
absorption layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080086729.9A
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English (en)
Chinese (zh)
Inventor
山下阳平
田之上隼斗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN114830293A publication Critical patent/CN114830293A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
CN202080086729.9A 2019-12-26 2020-12-09 基板处理装置和基板处理方法 Pending CN114830293A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019236287 2019-12-26
JP2019-236287 2019-12-26
PCT/JP2020/045883 WO2021131710A1 (ja) 2019-12-26 2020-12-09 基板処理装置及び基板処理方法

Publications (1)

Publication Number Publication Date
CN114830293A true CN114830293A (zh) 2022-07-29

Family

ID=76575478

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080086729.9A Pending CN114830293A (zh) 2019-12-26 2020-12-09 基板处理装置和基板处理方法

Country Status (3)

Country Link
JP (1) JP7308292B2 (https=)
CN (1) CN114830293A (https=)
WO (1) WO2021131710A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7690038B2 (ja) * 2021-09-06 2025-06-09 東京エレクトロン株式会社 基板処理方法及び基板処理装置
KR20260036558A (ko) * 2023-07-05 2026-03-17 도쿄엘렉트론가부시키가이샤 처리 시스템 및 처리 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125929A (ja) * 1996-08-27 1998-05-15 Seiko Epson Corp 剥離方法
JP2013179237A (ja) * 2012-02-29 2013-09-09 Disco Abrasive Syst Ltd リフトオフ装置
JP2013239650A (ja) * 2012-05-16 2013-11-28 Tokyo Ohka Kogyo Co Ltd 支持体分離方法および支持体分離装置
JP2016207801A (ja) * 2015-04-21 2016-12-08 株式会社ディスコ リフトオフ方法及び超音波ホーン
CN106910678A (zh) * 2017-03-09 2017-06-30 华中科技大学 图案化掩膜版、其制备方法及使用其进行激光剥离的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015144192A (ja) * 2014-01-31 2015-08-06 株式会社ディスコ リフトオフ方法
JP6564301B2 (ja) * 2015-10-26 2019-08-21 東京応化工業株式会社 支持体分離方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125929A (ja) * 1996-08-27 1998-05-15 Seiko Epson Corp 剥離方法
JP2013179237A (ja) * 2012-02-29 2013-09-09 Disco Abrasive Syst Ltd リフトオフ装置
JP2013239650A (ja) * 2012-05-16 2013-11-28 Tokyo Ohka Kogyo Co Ltd 支持体分離方法および支持体分離装置
JP2016207801A (ja) * 2015-04-21 2016-12-08 株式会社ディスコ リフトオフ方法及び超音波ホーン
CN106910678A (zh) * 2017-03-09 2017-06-30 华中科技大学 图案化掩膜版、其制备方法及使用其进行激光剥离的方法

Also Published As

Publication number Publication date
JPWO2021131710A1 (https=) 2021-07-01
WO2021131710A1 (ja) 2021-07-01
JP7308292B2 (ja) 2023-07-13
TW202129742A (zh) 2021-08-01

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