JP7308292B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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Publication number
JP7308292B2
JP7308292B2 JP2021567195A JP2021567195A JP7308292B2 JP 7308292 B2 JP7308292 B2 JP 7308292B2 JP 2021567195 A JP2021567195 A JP 2021567195A JP 2021567195 A JP2021567195 A JP 2021567195A JP 7308292 B2 JP7308292 B2 JP 7308292B2
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Prior art keywords
substrate
laser
region
wafer
laser light
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JP2021567195A
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Japanese (ja)
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JPWO2021131710A1 (https=
JPWO2021131710A5 (https=
Inventor
陽平 山下
隼斗 田之上
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
JP2021567195A 2019-12-26 2020-12-09 基板処理装置及び基板処理方法 Active JP7308292B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019236287 2019-12-26
JP2019236287 2019-12-26
PCT/JP2020/045883 WO2021131710A1 (ja) 2019-12-26 2020-12-09 基板処理装置及び基板処理方法

Publications (3)

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JPWO2021131710A1 JPWO2021131710A1 (https=) 2021-07-01
JPWO2021131710A5 JPWO2021131710A5 (https=) 2022-08-31
JP7308292B2 true JP7308292B2 (ja) 2023-07-13

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JP2021567195A Active JP7308292B2 (ja) 2019-12-26 2020-12-09 基板処理装置及び基板処理方法

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JP (1) JP7308292B2 (https=)
CN (1) CN114830293A (https=)
WO (1) WO2021131710A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023032833A1 (https=) * 2021-09-06 2023-03-09

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260036558A (ko) * 2023-07-05 2026-03-17 도쿄엘렉트론가부시키가이샤 처리 시스템 및 처리 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013179237A (ja) 2012-02-29 2013-09-09 Disco Abrasive Syst Ltd リフトオフ装置
JP2013239650A (ja) 2012-05-16 2013-11-28 Tokyo Ohka Kogyo Co Ltd 支持体分離方法および支持体分離装置
JP2015144192A (ja) 2014-01-31 2015-08-06 株式会社ディスコ リフトオフ方法
JP2017084910A (ja) 2015-10-26 2017-05-18 東京応化工業株式会社 支持体分離方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3809681B2 (ja) * 1996-08-27 2006-08-16 セイコーエプソン株式会社 剥離方法
JP6450637B2 (ja) * 2015-04-21 2019-01-09 株式会社ディスコ リフトオフ方法及び超音波ホーン
CN106910678B (zh) * 2017-03-09 2019-05-21 华中科技大学 图案化掩膜版、其制备方法及使用其进行激光剥离的方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013179237A (ja) 2012-02-29 2013-09-09 Disco Abrasive Syst Ltd リフトオフ装置
JP2013239650A (ja) 2012-05-16 2013-11-28 Tokyo Ohka Kogyo Co Ltd 支持体分離方法および支持体分離装置
JP2015144192A (ja) 2014-01-31 2015-08-06 株式会社ディスコ リフトオフ方法
JP2017084910A (ja) 2015-10-26 2017-05-18 東京応化工業株式会社 支持体分離方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023032833A1 (https=) * 2021-09-06 2023-03-09
JP7690038B2 (ja) 2021-09-06 2025-06-09 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
JPWO2021131710A1 (https=) 2021-07-01
WO2021131710A1 (ja) 2021-07-01
CN114830293A (zh) 2022-07-29
TW202129742A (zh) 2021-08-01

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