CN114792646A - 吸附垫及基板输送装置 - Google Patents

吸附垫及基板输送装置 Download PDF

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Publication number
CN114792646A
CN114792646A CN202111467312.XA CN202111467312A CN114792646A CN 114792646 A CN114792646 A CN 114792646A CN 202111467312 A CN202111467312 A CN 202111467312A CN 114792646 A CN114792646 A CN 114792646A
Authority
CN
China
Prior art keywords
layer
substrate
suction
arm
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111467312.XA
Other languages
English (en)
Chinese (zh)
Inventor
稻尾吉浩
对马修吾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ameco Technology Co ltd
Process Equipment Business Division Preparation Co ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN114792646A publication Critical patent/CN114792646A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroluminescent Light Sources (AREA)
CN202111467312.XA 2021-01-26 2021-12-03 吸附垫及基板输送装置 Pending CN114792646A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-010060 2021-01-26
JP2021010060A JP7465550B2 (ja) 2021-01-26 2021-01-26 吸着パッド及び基板搬送装置

Publications (1)

Publication Number Publication Date
CN114792646A true CN114792646A (zh) 2022-07-26

Family

ID=82460294

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111467312.XA Pending CN114792646A (zh) 2021-01-26 2021-12-03 吸附垫及基板输送装置

Country Status (4)

Country Link
JP (1) JP7465550B2 (ja)
KR (1) KR20220107948A (ja)
CN (1) CN114792646A (ja)
TW (1) TW202231429A (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10156778A (ja) * 1996-12-04 1998-06-16 Smc Corp 吸着用パッド
JP2003191191A (ja) 2001-12-20 2003-07-08 Shinko Electric Co Ltd 真空吸着装置
JP2005288595A (ja) 2004-03-31 2005-10-20 Nippon Pisuko:Kk 吸着パッド装置
JP5494369B2 (ja) 2010-09-07 2014-05-14 株式会社デンソー 吸着装置および搬送装置
JP2020035841A (ja) 2018-08-29 2020-03-05 日本電産サンキョー株式会社 搬送ロボット

Also Published As

Publication number Publication date
KR20220107948A (ko) 2022-08-02
TW202231429A (zh) 2022-08-16
JP2022113985A (ja) 2022-08-05
JP7465550B2 (ja) 2024-04-11

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Date Code Title Description
PB01 Publication
PB01 Publication
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20230608

Address after: Ibaraki

Applicant after: Ameco Technology Co.,Ltd.

Address before: Kanagawa, Japan

Applicant before: Process Equipment Business Division Preparation Co.,Ltd.

Effective date of registration: 20230608

Address after: Kanagawa, Japan

Applicant after: Process Equipment Business Division Preparation Co.,Ltd.

Address before: Kanagawa County, Japan

Applicant before: TOKYO OHKA KOGYO Co.,Ltd.

SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination