JP5494369B2 - 吸着装置および搬送装置 - Google Patents
吸着装置および搬送装置 Download PDFInfo
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- JP5494369B2 JP5494369B2 JP2010200127A JP2010200127A JP5494369B2 JP 5494369 B2 JP5494369 B2 JP 5494369B2 JP 2010200127 A JP2010200127 A JP 2010200127A JP 2010200127 A JP2010200127 A JP 2010200127A JP 5494369 B2 JP5494369 B2 JP 5494369B2
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- 238000001179 sorption measurement Methods 0.000 title claims description 31
- 238000012546 transfer Methods 0.000 title description 3
- 239000013013 elastic material Substances 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 description 11
- 238000012986 modification Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Die Bonding (AREA)
Description
吸着装置20では、減圧ポンプ等の負圧発生源によって負圧力が発生すると、各連通孔34a〜34dおよび各貫通孔41が負圧状態となる。このため、半導体チップ15が、各吸引口44に吸い付けられて、固定治具50の開口53a〜53dから露出する各吸着パッド40a〜40dの下端部43に吸着されることとなる。
(1)吸引部(33a〜33d)は、治具固定台32に4つ設けられることに限らず、治具固定台32に1つ〜3つ設けられてもよいし、5つ以上設けられてもよい。この場合、吸引部には、対応する吸着パッド40が取り付けられるとともに、固定治具50は、この吸着パッド40を対応する吸引部に対して押圧した状態でホルダ30に固定するように形成される。
20…吸着装置
30…ホルダ
32…治具固定台
33a〜33d…吸引部
34a〜34d…連通孔
40a〜40d…吸着パッド
44…吸引口
50…固定治具(固定部材)
53a〜53d…開口
Claims (3)
- 負圧発生源に連通する連通孔が吸引部に形成されるホルダと、
弾性材料からなり前記吸引部を挿入させることで当該吸引部の周囲を覆う貫通孔と前記貫通孔を介して前記連通孔に連通する吸引口とが形成される吸着パッドと、
を備える吸着装置であって、
前記吸着パッドを前記吸引部に対して押圧した状態で前記ホルダに固定される金属製の固定部材を備え、
前記固定部材には、前記吸引口が露出する開口が形成されることを特徴とする吸着装置。 - 前記ホルダには、前記吸引部が複数形成され、
前記固定部材は、複数の前記吸着パッドを前記複数の吸引部に対してそれぞれ押圧した状態で前記ホルダに固定されて、これら各吸着パッドの前記吸引口がそれぞれ露出するように前記開口が複数形成されることを特徴とする請求項1に記載の吸着装置。 - 請求項1または2に記載の吸着装置によりワークを吸着して搬送することを特徴とする搬送装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010200127A JP5494369B2 (ja) | 2010-09-07 | 2010-09-07 | 吸着装置および搬送装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010200127A JP5494369B2 (ja) | 2010-09-07 | 2010-09-07 | 吸着装置および搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012055993A JP2012055993A (ja) | 2012-03-22 |
JP5494369B2 true JP5494369B2 (ja) | 2014-05-14 |
Family
ID=46053719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010200127A Active JP5494369B2 (ja) | 2010-09-07 | 2010-09-07 | 吸着装置および搬送装置 |
Country Status (1)
Country | Link |
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JP (1) | JP5494369B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7465550B2 (ja) | 2021-01-26 | 2024-04-11 | Aiメカテック株式会社 | 吸着パッド及び基板搬送装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0843487A (ja) * | 1994-08-01 | 1996-02-16 | Tokyo Electron Ltd | 搬送装置 |
JP3782523B2 (ja) * | 1996-09-12 | 2006-06-07 | オリンパス株式会社 | 基板吸着部材および装置 |
JP2003062786A (ja) * | 2001-08-24 | 2003-03-05 | Komatsu Ltd | ロボットハンド |
JP2005288595A (ja) * | 2004-03-31 | 2005-10-20 | Nippon Pisuko:Kk | 吸着パッド装置 |
JP4519743B2 (ja) * | 2005-09-20 | 2010-08-04 | 株式会社安川電機 | 基板吸着装置、基板支持体、基板搬送装置、およびガラス基板搬送用ロボット。 |
JP2008132541A (ja) * | 2006-11-27 | 2008-06-12 | Toshiba Mach Co Ltd | ロボットハンド吸着装置 |
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2010
- 2010-09-07 JP JP2010200127A patent/JP5494369B2/ja active Active
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Publication number | Publication date |
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JP2012055993A (ja) | 2012-03-22 |
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