CN114762460A - 电路板及其制作方法 - Google Patents

电路板及其制作方法 Download PDF

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Publication number
CN114762460A
CN114762460A CN202080082747.XA CN202080082747A CN114762460A CN 114762460 A CN114762460 A CN 114762460A CN 202080082747 A CN202080082747 A CN 202080082747A CN 114762460 A CN114762460 A CN 114762460A
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CN
China
Prior art keywords
layer
copper
double
sided
circuit board
Prior art date
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Application number
CN202080082747.XA
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English (en)
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CN114762460B (zh
Inventor
彭超
何珂
陈志宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
Original Assignee
Avary Holding Shenzhen Co Ltd
Qing Ding Precision Electronics Huaian Co Ltd
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Application filed by Avary Holding Shenzhen Co Ltd, Qing Ding Precision Electronics Huaian Co Ltd filed Critical Avary Holding Shenzhen Co Ltd
Publication of CN114762460A publication Critical patent/CN114762460A/zh
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Publication of CN114762460B publication Critical patent/CN114762460B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout

Abstract

一种电路板的制作方法，包括：提供第一双面覆铜板，包括介电层和形成于所述介电层相对两表面的第一铜箔层和镀铜层，所述介电层中设有沟槽，所述镀铜层包括形成于所述沟槽内的第一镀铜部分和除此之外的第二镀铜部分；提供双面电路基板，包括基材层和形成于所述基材层相对两表面的两个第一导电线路层，每一所述第一导电线路层包括信号线，所述基材层中设有两个导电膏块，两个所述导电膏块位于所述信号线的两侧；分别在所述双面电路基板的两侧层叠一个所述第一双面覆铜板，使每一所述信号线位于所述沟槽中；压合，使得所述导电膏块电连接位于所述基材层两侧的所述第二镀铜部分。本申请还提供一种电路板。

Description

PCT国内申请，说明书已公开。

Claims (13)

  1. PCT国内申请，权利要求书已公开。
CN202080082747.XA 2020-05-20 2020-05-20 电路板及其制作方法 Active CN114762460B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/091423 WO2021232322A1 (zh) 2020-05-20 2020-05-20 电路板及其制作方法

Publications (2)

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CN114762460A true CN114762460A (zh) 2022-07-15
CN114762460B CN114762460B (zh) 2023-04-14

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Country Link
US (1) US20230007782A1 (zh)
CN (1) CN114762460B (zh)
TW (1) TWI737316B (zh)
WO (1) WO2021232322A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030071700A1 (en) * 1999-12-27 2003-04-17 Dynamic Solutions International, Inc., A Republic Of Korea Corporation Coaxial type signal line and manufacturing method thereof
JP2012234953A (ja) * 2011-04-28 2012-11-29 Fujitsu Component Ltd 多層基板
CN105828517A (zh) * 2016-05-11 2016-08-03 昆山龙朋精密电子有限公司 一种低损耗高柔性高频传输的fpc板的制备方法
CN106488642A (zh) * 2015-08-27 2017-03-08 富葵精密组件(深圳)有限公司 柔性线路板及其制作方法
CN106973483A (zh) * 2016-01-13 2017-07-21 富葵精密组件(深圳)有限公司 柔性电路板及其制作方法
CN108289368A (zh) * 2017-01-09 2018-07-17 鹏鼎控股(深圳)股份有限公司 高频信号传输结构及其制作方法
CN108966478A (zh) * 2017-05-17 2018-12-07 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7613010B2 (en) * 2004-02-02 2009-11-03 Panasonic Corporation Stereoscopic electronic circuit device, and relay board and relay frame used therein
KR100651335B1 (ko) * 2005-02-25 2006-11-29 삼성전기주식회사 경연성 인쇄회로기판 및 그 제조 방법
CN106332434B (zh) * 2015-06-24 2019-01-04 鹏鼎控股(深圳)股份有限公司 柔性线路板及其制作方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030071700A1 (en) * 1999-12-27 2003-04-17 Dynamic Solutions International, Inc., A Republic Of Korea Corporation Coaxial type signal line and manufacturing method thereof
JP2012234953A (ja) * 2011-04-28 2012-11-29 Fujitsu Component Ltd 多層基板
CN106488642A (zh) * 2015-08-27 2017-03-08 富葵精密组件(深圳)有限公司 柔性线路板及其制作方法
CN106973483A (zh) * 2016-01-13 2017-07-21 富葵精密组件(深圳)有限公司 柔性电路板及其制作方法
CN105828517A (zh) * 2016-05-11 2016-08-03 昆山龙朋精密电子有限公司 一种低损耗高柔性高频传输的fpc板的制备方法
CN108289368A (zh) * 2017-01-09 2018-07-17 鹏鼎控股(深圳)股份有限公司 高频信号传输结构及其制作方法
CN108966478A (zh) * 2017-05-17 2018-12-07 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制作方法

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Publication number Publication date
TWI737316B (zh) 2021-08-21
TW202145847A (zh) 2021-12-01
WO2021232322A1 (zh) 2021-11-25
US20230007782A1 (en) 2023-01-05
CN114762460B (zh) 2023-04-14

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