CN114762024A - 柔性透明电子器件的制造方法以及物品 - Google Patents

柔性透明电子器件的制造方法以及物品 Download PDF

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Publication number
CN114762024A
CN114762024A CN202080085332.8A CN202080085332A CN114762024A CN 114762024 A CN114762024 A CN 114762024A CN 202080085332 A CN202080085332 A CN 202080085332A CN 114762024 A CN114762024 A CN 114762024A
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CN
China
Prior art keywords
flexible transparent
electronic device
release layer
resin
base material
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Pending
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CN202080085332.8A
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English (en)
Chinese (zh)
Inventor
满居畅子
松村和纪
川上玲美
垰幸宏
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AGC Inc
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Asahi Glass Co Ltd
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Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of CN114762024A publication Critical patent/CN114762024A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
CN202080085332.8A 2019-12-26 2020-12-18 柔性透明电子器件的制造方法以及物品 Pending CN114762024A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019235574 2019-12-26
JP2019-235574 2019-12-26
PCT/JP2020/047563 WO2021132106A1 (ja) 2019-12-26 2020-12-18 フレキシブル透明電子デバイスの製造方法及び物品

Publications (1)

Publication Number Publication Date
CN114762024A true CN114762024A (zh) 2022-07-15

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CN202080085332.8A Pending CN114762024A (zh) 2019-12-26 2020-12-18 柔性透明电子器件的制造方法以及物品

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JP (1) JPWO2021132106A1 (enrdf_load_stackoverflow)
CN (1) CN114762024A (enrdf_load_stackoverflow)
WO (1) WO2021132106A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116014051A (zh) * 2021-10-22 2023-04-25 隆达电子股份有限公司 微型发光二极管封装结构
WO2023090335A1 (ja) * 2021-11-19 2023-05-25 Ａｇｃ株式会社 透明電子デバイス、合わせガラス、及び透明電子デバイスの製造方法
JP7667373B2 (ja) * 2022-03-29 2025-04-22 株式会社ジャパンディスプレイ 表示装置、及び表示装置の製造方法

Citations (13)

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US20030024635A1 (en) * 2001-07-24 2003-02-06 Seiko Epson Corporation Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance
JP2003142666A (ja) * 2001-07-24 2003-05-16 Seiko Epson Corp 素子の転写方法、素子の製造方法、集積回路、回路基板、電気光学装置、ｉｃカード、及び電子機器
CN101038857A (zh) * 2006-03-03 2007-09-19 株式会社半导体能源研究所 制造半导体装置的方法
JP2007264609A (ja) * 2006-03-03 2007-10-11 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
CN102208547A (zh) * 2011-04-18 2011-10-05 电子科技大学 一种柔性光电子器件用基板及其制备方法
CN102596565A (zh) * 2009-08-27 2012-07-18 旭硝子株式会社 挠性基材-支撑体的层叠结构体、带有支撑体的电子装置用面板、以及电子装置用面板的制造方法
CN104910400A (zh) * 2014-03-12 2015-09-16 新日铁住金化学株式会社 显示装置及其制造方法、以及显示装置用的聚酰亚胺膜
CN105336873A (zh) * 2015-11-05 2016-02-17 南京济民信息技术有限公司 一种柔性光电子器件用基板及其制备方法
JP2016038556A (ja) * 2014-08-11 2016-03-22 株式会社ジャパンディスプレイ フレキシブル表示装置の製造方法
TW201618625A (zh) * 2014-11-14 2016-05-16 Wisechip Semiconductor Inc 具電子元件之可撓式基板的製造方法
WO2016200122A1 (ko) * 2015-06-08 2016-12-15 주식회사 엘지화학 금속배선층이 형성된 적층체 및 이를 제조하는 방법
CN109343307A (zh) * 2018-11-19 2019-02-15 中国科学技术大学 基于纳米压印光刻的金属图案转移方法以及系统
WO2019146634A1 (ja) * 2018-01-25 2019-08-01 Ａｇｃ株式会社 透明表示装置、及び透明表示装置を備えた合わせガラス

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102009727B1 (ko) * 2012-11-26 2019-10-22 삼성디스플레이 주식회사 표시 장치, 표시 장치의 제조 방법 및 표시 장치를 제조하기 위한 캐리어 기판

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030024635A1 (en) * 2001-07-24 2003-02-06 Seiko Epson Corporation Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance
JP2003142666A (ja) * 2001-07-24 2003-05-16 Seiko Epson Corp 素子の転写方法、素子の製造方法、集積回路、回路基板、電気光学装置、ｉｃカード、及び電子機器
CN101038857A (zh) * 2006-03-03 2007-09-19 株式会社半导体能源研究所 制造半导体装置的方法
JP2007264609A (ja) * 2006-03-03 2007-10-11 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
CN102596565A (zh) * 2009-08-27 2012-07-18 旭硝子株式会社 挠性基材-支撑体的层叠结构体、带有支撑体的电子装置用面板、以及电子装置用面板的制造方法
CN102208547A (zh) * 2011-04-18 2011-10-05 电子科技大学 一种柔性光电子器件用基板及其制备方法
CN104910400A (zh) * 2014-03-12 2015-09-16 新日铁住金化学株式会社 显示装置及其制造方法、以及显示装置用的聚酰亚胺膜
JP2015187987A (ja) * 2014-03-12 2015-10-29 新日鉄住金化学株式会社 表示装置及びその製造方法、並びに表示装置用のポリイミドフィルム
JP2016038556A (ja) * 2014-08-11 2016-03-22 株式会社ジャパンディスプレイ フレキシブル表示装置の製造方法
TW201618625A (zh) * 2014-11-14 2016-05-16 Wisechip Semiconductor Inc 具電子元件之可撓式基板的製造方法
WO2016200122A1 (ko) * 2015-06-08 2016-12-15 주식회사 엘지화학 금속배선층이 형성된 적층체 및 이를 제조하는 방법
CN105336873A (zh) * 2015-11-05 2016-02-17 南京济民信息技术有限公司 一种柔性光电子器件用基板及其制备方法
WO2019146634A1 (ja) * 2018-01-25 2019-08-01 Ａｇｃ株式会社 透明表示装置、及び透明表示装置を備えた合わせガラス
CN109343307A (zh) * 2018-11-19 2019-02-15 中国科学技术大学 基于纳米压印光刻的金属图案转移方法以及系统

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