JPWO2021132106A1 - - Google Patents
Info
- Publication number
- JPWO2021132106A1 JPWO2021132106A1 JP2021567414A JP2021567414A JPWO2021132106A1 JP WO2021132106 A1 JPWO2021132106 A1 JP WO2021132106A1 JP 2021567414 A JP2021567414 A JP 2021567414A JP 2021567414 A JP2021567414 A JP 2021567414A JP WO2021132106 A1 JPWO2021132106 A1 JP WO2021132106A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019235574 | 2019-12-26 | ||
| PCT/JP2020/047563 WO2021132106A1 (ja) | 2019-12-26 | 2020-12-18 | フレキシブル透明電子デバイスの製造方法及び物品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021132106A1 true JPWO2021132106A1 (enrdf_load_stackoverflow) | 2021-07-01 |
Family
ID=76574148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021567414A Pending JPWO2021132106A1 (enrdf_load_stackoverflow) | 2019-12-26 | 2020-12-18 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021132106A1 (enrdf_load_stackoverflow) |
| CN (1) | CN114762024A (enrdf_load_stackoverflow) |
| WO (1) | WO2021132106A1 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116014051A (zh) * | 2021-10-22 | 2023-04-25 | 隆达电子股份有限公司 | 微型发光二极管封装结构 |
| WO2023090335A1 (ja) * | 2021-11-19 | 2023-05-25 | Ａｇｃ株式会社 | 透明電子デバイス、合わせガラス、及び透明電子デバイスの製造方法 |
| CN118922877A (zh) * | 2022-03-29 | 2024-11-08 | 株式会社日本显示器 | 显示装置以及显示装置的制造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6814832B2 (en) * | 2001-07-24 | 2004-11-09 | Seiko Epson Corporation | Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance |
| JP2003142666A (ja) * | 2001-07-24 | 2003-05-16 | Seiko Epson Corp | 素子の転写方法、素子の製造方法、集積回路、回路基板、電気光学装置、ｉｃカード、及び電子機器 |
| US8173519B2 (en) * | 2006-03-03 | 2012-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5288581B2 (ja) * | 2006-03-03 | 2013-09-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN102596565B (zh) * | 2009-08-27 | 2014-09-10 | 旭硝子株式会社 | 挠性基材-支撑体的层叠结构体、带有支撑体的电子装置用面板、以及电子装置用面板的制造方法 |
| CN102208547B (zh) * | 2011-04-18 | 2013-11-20 | 电子科技大学 | 一种柔性光电子器件用基板及其制备方法 |
| KR102009727B1 (ko) * | 2012-11-26 | 2019-10-22 | 삼성디스플레이 주식회사 | 표시 장치, 표시 장치의 제조 방법 및 표시 장치를 제조하기 위한 캐리어 기판 |
| KR102367682B1 (ko) * | 2014-03-12 | 2022-02-25 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 표시장치 및 그 제조방법, 및 표시 장치용 폴리이미드 필름 |
| JP2016038556A (ja) * | 2014-08-11 | 2016-03-22 | 株式会社ジャパンディスプレイ | フレキシブル表示装置の製造方法 |
| TW201618625A (zh) * | 2014-11-14 | 2016-05-16 | Wisechip Semiconductor Inc | 具電子元件之可撓式基板的製造方法 |
| WO2016200122A1 (ko) * | 2015-06-08 | 2016-12-15 | 주식회사 엘지화학 | 금속배선층이 형성된 적층체 및 이를 제조하는 방법 |
| CN105336873B (zh) * | 2015-11-05 | 2018-12-07 | 广州竞择微电子技术有限公司 | 一种柔性光电子器件用基板及其制备方法 |
| JP7200949B2 (ja) * | 2018-01-25 | 2023-01-10 | Ａｇｃ株式会社 | 透明表示装置、及び透明表示装置を備えた合わせガラス |
| CN109343307A (zh) * | 2018-11-19 | 2019-02-15 | 中国科学技术大学 | 基于纳米压印光刻的金属图案转移方法以及系统 |
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2020
- 2020-12-18 JP JP2021567414A patent/JPWO2021132106A1/ja active Pending
- 2020-12-18 CN CN202080085332.8A patent/CN114762024A/zh active Pending
- 2020-12-18 WO PCT/JP2020/047563 patent/WO2021132106A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN114762024A (zh) | 2022-07-15 |
| WO2021132106A1 (ja) | 2021-07-01 |