CN114729234A - Method for producing film-wound body and connected body - Google Patents
Method for producing film-wound body and connected body Download PDFInfo
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- CN114729234A CN114729234A CN202080082203.3A CN202080082203A CN114729234A CN 114729234 A CN114729234 A CN 114729234A CN 202080082203 A CN202080082203 A CN 202080082203A CN 114729234 A CN114729234 A CN 114729234A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/67—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material
- B65D85/671—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form
- B65D85/672—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form on cores
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Abstract
Provided is a film wound body which can release an adhesive film exhibiting excellent adhesiveness even in thermocompression bonding at a low temperature for a short time, and which can suppress the occurrence of blocking even when the adhesive film is wound for a long time. Specifically disclosed is a film roll which is obtained by winding a roll core with an adhesive film comprising a release base and an adhesive layer provided on the release base, wherein the adhesive layer comprises (A) a radically polymerizable (meth) acrylic compound, (B) an epoxy resin and (C) an epoxy resin curing agent, the component (B) comprises an epoxy resin which is solid at room temperature, and the component (C) comprises an epoxy resin curing agent which is solid at room temperature.
Description
Technical Field
The present invention relates to a film-wound body and a method for producing a connected body using the film-wound body.
Background
As means for bonding electronic components and circuit boards, an adhesive Film such as an Anisotropic Conductive Film (ACF) is widely used. For example, the anisotropic conductive film is typically used in a case (FOB) in which a terminal of a Flexible Printed Circuit (FPC) and a terminal of a rigid substrate are connected in an FPD module or the like, and is used in a case in which various terminals are bonded to each other and electrically connected.
As the adhesive film, an adhesive film containing an epoxy resin as an insulating adhesive resin has been used in the past in view of excellent adhesiveness and good connection reliability (for example, patent document 1).
In recent years, in order to reduce thermal stress to a terminal portion of a rigid substrate or the like, it has been required to reduce a temperature at the time of thermocompression bonding using an adhesive film, and in order to improve productivity as well as to reduce thermal stress, it has been required to shorten a bonding time. From such a viewpoint, there has been proposed an adhesive film using a radical polymerizable (meth) acrylic compound curable at a low temperature in a short time as an insulating adhesive resin, instead of an epoxy resin which generally requires high-temperature and long-time thermocompression bonding (for example, patent documents 2 and 3). As for adhesive films using a radical polymerizable (meth) acrylic compound, there is room for improvement in adhesiveness, and as an insulating adhesive resin, there has been proposed an adhesive film using such a radical polymerizable (meth) acrylic compound in combination with an epoxy resin having excellent adhesiveness (for example, patent documents 4 and 5).
On the other hand, an adhesive film such as an anisotropic conductive film is generally prepared in a state of a laminated film (layer structure: adhesive layer/release substrate) including a release substrate such as a PET film and an adhesive layer containing an insulating adhesive resin provided on the release substrate. As shown in fig. 1, the adhesive film (adhesive layer 2/release base material 3) is cut to a predetermined width, and then stored and shipped in a state of the film wound body 1 wound around the winding core 5 of the reel 4. Here, in the case of an adhesive film having a narrow width (for example, less than 10mm, and used for the purpose of narrowing the width of a normal adhesive film in the present invention), the adhesive film is usually wound around a winding core 5 provided with a side plate (flange) 6. In use, the adhesive films 2 and 3 are pulled out from the film roll 1, cut into a desired length, and used for bonding electronic components and the like.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 62-141083,
patent document 2: japanese patent laid-open publication No. 2011-202173,
patent document 3: japanese patent laid-open publication No. 2018-110120,
patent document 4: japanese patent laid-open publication No. 2013-138013,
patent document 5: japanese patent laid-open No. 2007-224228.
Disclosure of Invention
Problems to be solved by the invention
According to the adhesive films described in patent documents 4 and 5 in which a radical polymerizable (meth) acrylic compound and an epoxy resin are used in combination, it is expected that good adhesion can be achieved by thermocompression bonding at low temperature for a short time. Therefore, the present inventors have made an attempt to use a bisphenol F type epoxy resin as an epoxy resin in an embodiment considered to be particularly preferable among the techniques described in patent documents 4 and 5, and have made a film wound body in an attempt to bond electronic parts and the like on the assumption of actual use.
As a result, it was found that in the prepared film roll, the adhesive layers protruded from the exposed side surfaces of the adhesive film, and the adhesive layers were stuck over the release substrate, thereby causing a problem of poor drawability of the adhesive film from the film roll (hereinafter, also referred to as "blocking"). Such blocking is more pronounced as the wound adhesive film is longer, and particularly in the case of a narrow-width adhesive film, the adhesive layer that has overflowed from the exposed side surface of the adhesive film is also likely to adhere to the side plate (flange) of the reel by coming into contact therewith, and therefore blocking is more severe. Although blocking can be reduced by shortening the length of the adhesive film, in this case, the frequency of replacing the film wound body increases, the production line needs to be stopped every time, and the like, and a reduction in production efficiency cannot be avoided (from the viewpoint of productivity, the adhesive film is required to be long for the production of the connected body (use of the adhesive film)).
The invention provides a film wound body which can release an adhesive film exhibiting excellent adhesiveness even in thermocompression bonding at a low temperature for a short time and can suppress the occurrence of blocking even when the adhesive film is wound for a long time.
Means for solving the problems
The present inventors have conducted intensive studies on the above-mentioned problems, and as a result, have found that the above-mentioned problems can be solved by a film wound body having the following structure, and have completed the present invention.
That is, the present invention includes the following.
[1] A film wound body in which an adhesive film including a release base material and an adhesive layer provided on the release base material is wound around a winding core,
the adhesive layer contains (A) a radical polymerizable (meth) acrylic compound, (B) an epoxy resin, and (C) an epoxy resin curing agent,
the component (B) contains an epoxy resin which is solid at room temperature,
the component (C) contains an epoxy resin curing agent which is solid at room temperature.
[2] The film roll package according to item [1], wherein the total of the epoxy resin that is solid at room temperature and the epoxy resin curing agent that is solid at room temperature is 2% by volume or more, assuming that the total of the nonvolatile components of the adhesive layer is 100% by volume.
[3] The film roll package according to item [1] or [2], wherein the adhesive layer further contains a radical polymerization initiator.
[4] The film roll package according to any one of [1] to [3], wherein the radical polymerization initiator contains a radical polymerization initiator which is solid at room temperature.
[5] The film roll package according to any one of [1] to [4], wherein the length of the adhesive film is 5m or more.
[6] The film roll package according to any one of [1] to [5], wherein a width of the adhesive film is 5mm or less.
[7] The film roll package according to any one of [1] to [6], wherein the adhesive film is wound around a roll core provided with a side plate.
[8] The film roll package according to any one of [1] to [7], wherein the adhesive layer further contains conductive particles.
[9] A method for producing a connector, comprising a step of sandwiching the film package according to any one of [1] to [8] between a 1 st electronic component and a 2 nd electronic component, and crimping the 1 st electronic component and the 2 nd electronic component.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a film wound body can be provided which can release an adhesive film exhibiting excellent adhesiveness even in thermocompression bonding at a low temperature for a short time and can suppress the occurrence of blocking even when the adhesive film is wound for a long time.
Drawings
FIG. 1 is a schematic view showing an example of a film wound body.
FIG. 2 is a schematic view showing a spill test of a film wound body.
Detailed Description
Hereinafter, the present invention will be described in detail based on preferred embodiments of the present invention. In the description, the drawings are referred to, but the shapes, sizes, and arrangements of the constituent elements are schematically shown in the drawings to an extent that the invention can be understood. The present invention is not limited to the following description, and various components may be appropriately modified within a range not departing from the gist of the present invention.
[ wound film body ]
The film roll package of the present invention is a film roll package in which an adhesive film including a release base material and an adhesive layer provided on the release base material is wound around a roll core,
the adhesive layer contains (A) a radical polymerizable (meth) acrylic compound, (B) an epoxy resin, and (C) an epoxy resin curing agent,
the component (B) contains an epoxy resin which is solid at room temperature,
the component (C) contains an epoxy resin curing agent which is solid at room temperature.
According to the adhesive film using a radical polymerizable (meth) acrylic compound and an epoxy resin in combination, it is expected to bring about good adhesion by thermocompression bonding at a low temperature for a short time, and originally contributes to improvement in production efficiency and quality of target products such as FPD modules. However, when a film wound body is prepared on the assumption of actual use of such an adhesive film and the adhesive film is used for adhesion of electronic parts or the like, it has been found that, as described above, in the prepared film wound body, the adhesive layer sometimes protrudes from the exposed side surface of the adhesive film, and the adhesive layer portions stick to each other over the release base material, thereby causing blocking. The frequency of replacing the adhesive film is directly related to the productivity of the connecting process because the production line is stopped. In the case of a long size, the frequency of replacement is small, and therefore, it is desirable, but the risk of occurrence of sticking increases. In contrast, the present inventors have found that, in a resin system using a radical polymerizable (meth) acrylic compound and an epoxy resin in combination, by using an epoxy resin which is solid at ordinary temperature and an epoxy resin curing agent which is solid at ordinary temperature in combination, the advantage of using a radical polymerizable (meth) acrylic compound and an epoxy resin in combination is achieved, and that the remarkable effect of suppressing the occurrence of blocking can be obtained even when an adhesive film is wound for a long time (in particular, even when a narrow-width adhesive film which is likely to cause blocking or a serious handling is wound for a long time). The film roll of the present invention contributes significantly to improvement in production efficiency and quality of target products represented by FPD modules.
FIG. 1 is a schematic view showing an example of a film wound body. In fig. 1, a film wound body 1 is formed by winding adhesive films 2 and 3 around a winding core 5 of a reel 4. The reel shaft 4 includes at least a winding core 5 for winding the adhesive film, and the winding core 5 has a shaft hole into which a rotation shaft for rotating the reel shaft 4 is inserted. In the case of winding an adhesive film having a narrow width (for example, less than 10mm), the winding core 4 is generally provided with side plates (flanges) 6 provided at both ends of the winding core 5 (fig. 1 shows the winding core 4 provided with the side plates 6). Therefore, in one embodiment, the adhesive film is wound around a winding core provided with a side plate.
One end of the adhesive film in the longitudinal direction (such a fixed portion is also referred to as a "joint portion") is fixed to the winding core 5, and the adhesive film is wound. The adhesive film is wound around the core 5 of the reel 4 in a state of a laminated film (adhesive layer 2/release substrate 3) including a release substrate 3 and an adhesive layer 2 provided on the release substrate. The adhesive film may be wound so that the adhesive layer 2 is on the inner periphery side, or may be wound so that the release substrate 3 is on the inner periphery side. In order to prevent the adhesive layer 2 from being contaminated, a release substrate (so-called cover film) may be provided on both surfaces.
The shape and size of the winding shaft 4 (the winding core 5 and the side plates 6) are not particularly limited as long as the adhesive film having a desired width and length can be wound, and any shape and size can be used as long as they are conventionally known. The width of the adhesive film and the effective width of the roll 4 (the distance between the side plates) can be adjusted according to blocking and easy film pull-out.
< adhesive film >
The adhesive film constituting the wound film body of the present invention will be described in detail below.
In the present invention, the adhesive film includes a release substrate and an adhesive layer provided on the release substrate.
(Release substrate)
The release substrate is not particularly limited as long as it is a film-like material that can support the adhesive layer and can be released from the adhesive layer at a desired timing. Examples of the material of the release substrate include polyesters such as polyethylene terephthalate (PET), polyolefins such as polypropylene (PP), and plastic materials such as poly-4-methyl-1-pentene (PMP) and Polytetrafluoroethylene (PTFE). The release substrate may be a substrate having a release layer on the surface on the side bonded to the adhesive layer, and the release layer may contain a release agent such as a silicone resin or a polyolefin resin.
The thickness of the release substrate is not particularly limited, but is preferably 100 μm or less, more preferably 80 μm or less, further preferably 60 μm or less, and further preferably 50 μm or less, from the viewpoint of efficiently forming a wound film body in a long roll. The lower limit of the thickness of the release substrate is not particularly limited, but is preferably 8 μm or more from the viewpoint of workability in the production of the adhesive film, the slitting process, and the winding onto a core.
(adhesive layer)
In the film roll package of the present invention, the adhesive layer is characterized by containing (a) a radical polymerizable (meth) acrylic compound, (B) an epoxy resin, and (C) an epoxy resin curing agent, the component (B) containing an epoxy resin that is solid at room temperature, and the component (C) containing an epoxy resin curing agent that is solid at room temperature.
(A) a radical polymerizable (meth) acrylic compound-
The adhesive layer contains a radical polymerizable (meth) acrylic compound as an insulating adhesive resin. This enables adhesion to be exhibited even in thermocompression bonding at a low temperature for a short time. The term "(meth) acrylic compound" means both an acrylic compound and a methacrylic compound. The same applies to the expressions "(meth) acryloyl group" and "(meth) acrylate".
The radical polymerizable (meth) acrylic compound is not particularly limited as long as it has a (meth) acryloyl group in the molecule and can undergo radical polymerization, and may be used in any state of a monomer and an oligomer, or may be used in combination.
Examples of the radically polymerizable (meth) acrylic compound include methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, isooctyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, phosphate-type (meth) acrylate, bisphenoxyethanol fluorene di (meth) acrylate, 2- (meth) acryloyloxyethylsuccinic acid, isobornyl (meth) acrylate, tricyclodecanedimethanol di (meth) acrylate, tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, and mixtures thereof, Diglycidyl ether phthalate (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, 2-hydroxy-1, 3-di (meth) acryloyloxypropane, 2-bis [4- ((meth) acryloyloxymethyl) phenyl ] propane, 2-bis [4- ((meth) acryloyloxypolyethoxy) phenyl ] propane, dicyclopentenyl (meth) acrylate, tricyclodecyl (meth) acrylate, tris ((meth) acryloyloxyethyl) isocyanurate and urethane (meth) acrylate. Further, 1 or more hydrogen atoms in the molecule may be substituted with a substituent such as a hydroxyl group or a carboxyl group as long as the radical polymerization is possible. These can be used alone in 1 or a combination of 2 or more.
The content of the polymerizable (meth) acrylic compound in the adhesive layer is preferably 5% by volume or more, more preferably 10% by volume or more, and even more preferably 15% by volume or more, from the viewpoint that adhesiveness can be exhibited even by thermocompression bonding at low temperature for a short time. The upper limit of the content is not particularly limited, but is preferably 60% by volume or less, more preferably 55% by volume or less, still more preferably 50% by volume or less, yet still more preferably 45% by volume or less, and particularly preferably 40% by volume or less.
In the present invention, unless otherwise specified, the content of each component in the adhesive layer is a value when the total of nonvolatile components in the adhesive layer is 100 vol%.
- (B) epoxy resin-
The adhesive layer contains an epoxy resin as an insulating adhesive resin. By containing an epoxy resin in combination with the radical polymerizable (meth) acrylic compound, not only can adhesion be developed even by thermocompression bonding at low temperature for a short time, but also high adhesion can be achieved immediately after thermocompression bonding and after holding for a long time in a high-temperature and high-humidity environment.
The epoxy resin is not particularly limited as long as it has an epoxy group in a molecule and can be thermally cured, but from the viewpoint of achieving good heat resistance and adhesion, an epoxy resin containing 2 or more epoxy groups in 1 molecule is preferable. The content of the epoxy resin having 2 or more epoxy groups in 1 molecule is preferably 50% by volume or more, more preferably 60% by volume or more, further preferably 70% by volume or more, and further preferably 80% by volume or more, assuming that the nonvolatile content of the epoxy resin is 100% by volume. The upper limit of the content is not particularly limited, and may be 100 vol%.
In the present invention, it is important that the epoxy resin contains an epoxy resin which is solid at room temperature (hereinafter, also simply referred to as "solid epoxy resin"). By using the solid epoxy resin in combination with a cured epoxy resin which is solid at normal temperature described later, the occurrence of blocking can be suppressed even when the adhesive film is wound long (in particular, even when a narrow adhesive film which is likely to cause blocking or handling to be serious is wound long). Here, the normal temperature refers to a temperature range of 5 to 35 ℃ (hereinafter the same) specified in JIS Z8703 in the standard state of the test site.
The solid epoxy resin is not particularly limited as long as it is solid at room temperature, and examples thereof include bisphenol a type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, phenol novolac type epoxy resin, biphenyl type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, tetraphenylethane type epoxy resin, and the like. These can be used alone in 1 or a combination of 2 or more. Among them, epoxy resins having a softening point or a melting point are preferable, and for example, epoxy resins having a softening point (ring and ball method) or a melting point of preferably 40 ℃ or higher, more preferably 50 ℃ or higher, further preferably 60 ℃ or higher, further preferably 70 ℃ or higher, and particularly preferably 80 ℃ or higher are preferable. The upper limit of the softening point or the melting point is not particularly limited, but is preferably 150 ℃ or lower, more preferably 145 ℃ or lower, and still more preferably 140 ℃ or lower.
Specific examples of the solid epoxy resin commercially available include "jER 1001", "jER 1003", and "jER 1007" manufactured by mitsubishi chemical corporation.
The content of the solid epoxy resin in the epoxy resin is preferably 70 vol% or more, more preferably 75 vol% or more, further preferably 80 vol% or more, further preferably 85 vol% or more, and particularly preferably 90 vol% or more, when the total of the nonvolatile components of the epoxy resin is 100 vol%. The upper limit of the content is not particularly limited, and may be 100 vol%.
The epoxy resin may contain an epoxy resin that is liquid at room temperature (hereinafter, also simply referred to as "liquid epoxy resin") as long as it contains a solid epoxy resin. The liquid epoxy resin is not particularly limited as long as it is liquid at ordinary temperature, and examples thereof include bisphenol F type epoxy resin, bisphenol a type epoxy resin, phenol novolac type epoxy resin, naphthalene type epoxy resin, and the like. Specific examples of commercially available liquid epoxy resins include "jER 806" and "jER 807" manufactured by mitsubishi chemical corporation. From the viewpoint of remarkably suppressing blocking, the epoxy resin preferably contains only a solid epoxy resin.
The epoxy equivalent of the epoxy resin is preferably 2500 or less, more preferably 2200 or less, still more preferably 2000 or less, still more preferably 1800 or less, particularly preferably 1600 or less, and most preferably 1500 or less. The lower limit of the epoxy equivalent is preferably 100 or more, more preferably 200 or more, and further preferably 300 or more. The epoxy equivalent can be measured according to JIS K7236.
The content of the epoxy resin in the adhesive layer is preferably 2 vol% or more, more preferably 4 vol% or more, and even more preferably 5 vol% or more, from the viewpoint of exhibiting high adhesiveness even in hot press bonding at low temperature for a short time. The upper limit of the content is not particularly limited, but is preferably 40% by volume or less, more preferably 30% by volume or less, still more preferably 25% by volume or less, still more preferably 20% by volume or less, and particularly preferably 15% by volume or less.
- (C) curing agent for epoxy resin-
The adhesive layer contains an epoxy resin curing agent. This enables the epoxy resin to be cured smoothly during thermocompression bonding.
In the present invention, the epoxy resin curing agent is a latent curing agent which does not react at normal temperature and which undergoes a reaction within a short time (for example, several seconds) at the thermocompression bonding temperature during mounting. Thus, the curing reaction does not occur during storage and transportation of the film roll, and the curing reaction proceeds and completes when the film roll is used for bonding electronic components and the like, thereby achieving desired adhesiveness. Preference is given to using: a latent curing agent which, when heated at 10 ℃/minute in Differential Scanning Calorimetry (DSC), generates an exothermic peak in a range of 80 ℃ or higher and not higher than the thermocompression bonding temperature at the time of mounting.
In the present invention, it is important that the epoxy resin curing agent contains an epoxy resin curing agent which is solid at room temperature (hereinafter, also simply referred to as "solid epoxy curing agent"). By using the solid epoxy curing agent in combination with the solid epoxy resin, the occurrence of blocking can be suppressed even when the adhesive film is wound long (in particular, even when a narrow adhesive film, which is likely to cause blocking or handling to be serious, is wound long).
The solid epoxy curing agent is not particularly limited as long as it is solid at room temperature, and examples thereof include amine-based, imidazole-based, hydrazide-based, boron trifluoride-amine complex, sulfonium salt, aminimide, dicyandiamide salt, and modified products thereof. These can be used alone in 1 or a combination of 2 or more.
Specific examples of commercially available solid epoxy curing agents include diaminodiphenylmethane (DDM), metaphenylene diamine (MPD), and diaminodiphenylsulfone (DDS) which can be obtained from tokyo chemical industry, etc.
The content of the solid epoxy curing agent in the epoxy resin curing agent is preferably 70 vol% or more, more preferably 75 vol% or more, further preferably 80 vol% or more, further preferably 85 vol% or more, and particularly preferably 90 vol% or more, assuming that the total of the nonvolatile components of the epoxy resin curing agent is 100 vol%. The upper limit of the content is not particularly limited, and may be 100 vol%.
The epoxy resin curing agent may contain an epoxy resin curing agent which is liquid at normal temperature (hereinafter, also simply referred to as "liquid epoxy curing agent") as long as it contains a solid epoxy curing agent. The liquid epoxy curing agent is not particularly limited as long as it is liquid at room temperature, and examples thereof include amine-based curing agents and imidazole-based curing agents. Specific examples of commercially available liquid epoxy resins include 2-ethyl-4-methylimidazole (2E4MZ) available from the four kingdom chemical industry (ltd.) and the like. From the viewpoint of remarkably suppressing blocking, the epoxy resin curing agent preferably contains only a solid epoxy curing agent.
The content of the epoxy resin curing agent in the adhesive layer is not particularly limited, but is preferably 0.5 vol% or more, more preferably 0.8 vol% or more, and further preferably 1 vol% or more, from the viewpoint of high adhesiveness even in hot press bonding at low temperature for a short time. The upper limit of the content is not particularly limited, but is preferably 5% by volume or less, more preferably 4% by volume or less, still more preferably 3% by volume or less, and still more preferably 2% by volume or less.
From the viewpoint of significantly suppressing the occurrence of blocking even when the adhesive film is wound long (particularly, when a narrow-width adhesive film which is likely to cause blocking or handling to be serious is wound long), the total content of the solid epoxy resin and the solid epoxy curing agent in the adhesive layer is preferably 2% by volume or more, more preferably 3% by volume or more, and still more preferably 4% by volume or more. Although good adhesion can be achieved even by thermocompression bonding at low temperature for a short time by using the radical polymerizable (meth) acrylic compound and the epoxy resin in combination as described above, the present inventors have found that particularly excellent adhesion can be achieved even immediately after thermocompression bonding and after holding for a long time in a high-temperature and high-humidity environment when the total content of the solid epoxy resin and the solid epoxy curing agent in the adhesive layer is 4% by volume or more. The total content is more preferably 5% by volume or more, still more preferably 6% by volume or more, particularly preferably 8% by volume or more, and most preferably 10% by volume or more. The upper limit of the total content is not particularly limited, but is preferably 45 vol% or less, more preferably 40 vol% or less, still more preferably 35 vol% or less, yet more preferably 30 vol% or less, particularly preferably 25 vol% or less, and most preferably 20 vol% or less. From the viewpoint of achieving particularly excellent adhesiveness, the upper limit of the total content is preferably 30 vol% or less.
In the film roll package of the present invention, the adhesive layer of the adhesive film may further contain a radical polymerization initiator, a film-forming resin, conductive particles, and the like.
Radical polymerization initiators
The adhesive layer may contain a radical polymerization initiator. The radical polymerization initiator is not particularly limited as long as it can generate a radical at the thermocompression bonding temperature at the time of mounting to cause the polymerization reaction of the radical polymerizable (meth) acrylic compound to proceed, and it can be appropriately selected in consideration of the bonding temperature, time, and the like at the time of thermocompression bonding.
Examples of the radical polymerization initiator include a peroxide compound and an azo compound. The peroxide compound is preferably an organic peroxide, and examples thereof include lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauroyl peroxide, dibutyl peroxide, dicarbonate peroxide, and benzoyl peroxide. These can be used alone in 1 or a combination of 2 or more.
From the viewpoint of significantly suppressing the occurrence of blocking, the radical polymerization initiator preferably contains a radical polymerization initiator that is solid at room temperature (hereinafter also simply referred to as "solid radical polymerization initiator"). The content of the solid radical polymerization initiator is preferably 70% by volume or more, more preferably 75% by volume or more, still more preferably 80% by volume or more, further preferably 85% by volume or more, and particularly preferably 90% by volume or more, assuming that the total of nonvolatile components of the radical polymerization initiator is 100% by volume. The upper limit of the content is not particularly limited, and may be 100 vol%. From the viewpoint of remarkably suppressing blocking, the radical polymerization initiator preferably contains only a solid radical polymerization initiator.
The content of the radical polymerization initiator in the adhesive layer is not particularly limited, but is preferably 1 vol% or more, more preferably 2 vol% or more, 3 vol% or more, or 5 vol% or more, from the viewpoint that adhesiveness can be exhibited even by thermocompression bonding at a low temperature for a short time. The upper limit of the content is not particularly limited, but is preferably 15% by volume or less, more preferably 10% by volume or less, and still more preferably 8% by volume or less.
Film-forming resins
The adhesive layer may contain a film-forming resin. The film-forming resin is not particularly limited, and may be appropriately selected according to the purpose, and examples thereof include phenoxy resins, unsaturated polyester resins, saturated polyester resins, polyurethane resins, butadiene resins, polyimide resins, polyamide resins, and polyolefin resins. These can be used alone in 1 or a combination of 2 or more.
From the viewpoint of film-forming properties, the number average molecular weight (Mn) of the film-forming resin in terms of polystyrene is preferably 10000 or more, more preferably 15000 or more, and still more preferably 20000 or more. The upper limit of Mn is not particularly limited, but is preferably 80000 or less, more preferably 70000 or less, and may be 60000 or less. So long as they are appropriately selected according to other admixtures or the purpose of use. The Mn in terms of polystyrene of the film-forming resin can be measured by a Gel Permeation Chromatography (GPC) method and calculated using a calibration curve of standard polystyrene.
The content of the film-forming resin in the adhesive layer is not particularly limited, and may be appropriately determined according to the purpose, and is preferably 10% by volume or more, more preferably 20% by volume or more, further preferably 25% by volume or more, and further preferably 30% by volume or more. The upper limit of the content is not particularly limited, but is preferably 60% by volume or less, and more preferably 50% by volume or less.
Conductive particles-
The adhesive layer may contain conductive particles. By containing the conductive particles, the adhesive film can be used as a conductive film or an Anisotropic Conductive Film (ACF).
As the conductive particles, known conductive particles that can be used for an anisotropic conductive film can be used. Examples of the conductive particles include metal particles such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, and gold, alloy particles of these metals, and coated particles in which a metal is coated on the surface of particles such as metal oxide, carbon, graphite, glass, ceramic, and resin. When metal-coated resin particles in which a metal is coated on the surface of the resin particles are used, examples of the material of the resin particles include epoxy resins, phenol resins, acrylic resins, acrylonitrile-styrene (AS) resins, benzoguanamine resins, divinylbenzene-based resins, styrene-based resins, and the like. The conductive particles may be particles subjected to an insulation treatment, such as particles having a surface further coated with an insulating film or particles having insulating particles adhered to the surface, so long as they do not interfere with the conduction performance after connection, in order to avoid the risk of short-circuiting between terminals. These conductive particles can be used alone in 1 or a combination of 2 or more.
The average particle diameter of the conductive particles is not particularly limited and may be appropriately determined according to the purpose, and is preferably 40 μm or less, more preferably 30 μm or less, further preferably 25 μm or less, and further preferably 20 μm or less. The lower limit of the average particle size is not particularly limited, but is preferably 1 μm or more, more preferably 2 μm or more, and still more preferably 3 μm or more. The average particle diameter of the conductive particles may be determined by measuring the particle diameters of a plurality (n.gtoreq.10) of conductive particles and calculating the average value thereof, for example, by observing the particles by Scanning Electron Microscope (SEM). Alternatively, the measurement value (N =1000 or more) may be measured by using an image-based particle size distribution measuring apparatus (for example, FPIA-3000 (Malvern corporation)).
When the conductive particles are used, the content of the conductive particles in the adhesive layer is not particularly limited and may be appropriately determined according to the purpose, and is preferably 1 vol% or more, more preferably 1.5 vol% or more, and further preferably 2 vol% or more. From the viewpoint of obtaining a desired anisotropic conductivity, the upper limit of the content is preferably 40% by volume or less, more preferably 30% by volume or less, still more preferably 25% by volume or less, and still more preferably 20% by volume or less.
In the film roll package of the present invention, the adhesive layer of the adhesive film may contain other components as necessary. Examples of such components include fillers that do not inhibit conduction, such as insulating inorganic fillers (e.g., silica fillers), and known additives that can be used in the production of adhesive films (adhesives), such as surface modifiers, flame retardants, coupling agents, and colorants.
The thickness of the adhesive layer is not particularly limited and may be appropriately determined according to the purpose, and is preferably 1 μm or more, more preferably 3 μm or more, and still more preferably 5 μm or more. The upper limit of the thickness of the adhesive layer is not particularly limited, but is preferably 100 μm or less, more preferably 80 μm or less, still more preferably 60 μm or less, and still more preferably 50 μm or less.
The film wound body of the present invention can be produced by any production method as long as a film wound body in which an adhesive film having the above-described predetermined adhesive layer composition is wound on a reel can be obtained. For example, a film wound body can be produced by preparing an adhesive film, slitting the adhesive film, and winding the adhesive film on a reel. An example of a method for producing a film wound body is described below.
For example, an adhesive film can be prepared by mixing each component including the components (a) to (C) with an organic solvent as needed to prepare a uniformly mixed resin composition (adhesive composition), applying the resin composition onto a release substrate, and drying the resin composition to form an adhesive layer. The resin composition can be applied using a coating device such as a bar coater. A known adhesive film coating method such as a doctor blade method can be used.
Next, the adhesive film is slit so that the width of the adhesive film is within a desired range. In the cutting process, a coating film may be provided on the exposed surface of the adhesive layer in order to prevent the adhesive layer from being contaminated with chips and the like. The cover film may be a known film that can be used when the adhesive film is cut. In the present invention in which a solid epoxy resin and a solid epoxy curing agent are used in combination in a resin system in which a radical polymerizable (meth) acrylic compound and an epoxy resin are used in combination, the adhesive layer can be significantly suppressed from sticking to a dicing blade at the time of slitting, and the slitting can be smoothly performed to a desired width.
After the slitting process, the adhesive film having a desired width is wound on a reel to obtain a film wound body.
In the film roll of the present invention, the width of the adhesive film is not particularly limited and may be appropriately determined according to the purpose. As described above, in the present invention, blocking can be significantly suppressed even when a narrow-width adhesive film is wound long. In a preferred embodiment, the width of the adhesive film may be less than 10mm, and may be made 5mm or less. The width of the adhesive film can be reduced to 4mm or less, 3mm or less, or 2mm or less, for example. The lower limit of the width of the adhesive film is not particularly limited, and may be 0.1mm or more, preferably 0.3mm or more, and more preferably 0.5mm or more.
In a preferred embodiment, the length (winding length) of the adhesive film is 5m or more. In the present invention, since blocking can be significantly suppressed even when the winding is long, the length of the adhesive film may be, for example, 10m or more, 20m or more, 30m or more, 50m or more, and 100m or more, and the upper limit thereof may be, for example, 500m or less, 400m or less, and 300m or less.
The film roll can release an adhesive film which brings about excellent adhesiveness even in thermocompression bonding at low temperature for a short time, and can be suitably used as a means for adhering electronic components and the like. In addition, when the adhesive layer contains conductive particles, the adhesive layer can be used as an Anisotropic Conductive Film (ACF), and can be suitably used as means for anisotropically and electrically connecting the 1 st electronic component and the 2 nd electronic component, as described below. In the present invention in which the solid epoxy resin and the solid epoxy curing agent are used in combination in the resin system using the radical polymerizable (meth) acrylic compound and the epoxy resin in combination, curing shrinkage (shrink) due to thermocompression bonding can be favorably reduced, and therefore, even in the case where a plurality of electronic components are collectively mounted, occurrence of warpage of the substrate can be remarkably reduced.
[ method for producing linker ]
A connected body in which electronic parts are bonded to each other can be prepared using the film roll of the present invention.
The method for producing a connected body of the present invention includes a step of sandwiching and pressure-bonding the adhesive layer of the adhesive film drawn out from the film roll-up body of the present invention between the 1 st electronic component and the 2 nd electronic component.
The 1 st electronic component may be, for example, a general Printed Wiring Board (PWB), and examples thereof include a rigid board, a glass board, a ceramic board, a plastic board, and an FPC, and the 2 nd electronic component may be an FPC, an IC chip, and the like. By the method, the invention can prepare FOB (film On Board), FOG (film On grass), FOF (film On film), COG (chip On grass) and other multipurpose connectors.
In the method for producing a connected body of the present invention, first, the adhesive film is pulled out from the film roll, cut to a predetermined length, and then temporarily attached (bonded) to the 1 st electronic component. A temperature and a pressure below the temporary crimping described later may be applied. By using the film wound body of the present invention, the adhesive film can be smoothly pulled out without causing a problem of blocking.
After the temporary adhesion, the release base material is peeled off to expose the adhesive layer. Next, the electrodes (array) of the 1 st electronic component and the electrodes (array) of the 2 nd electronic component are aligned so as to face each other, and the 2 nd electronic component is mounted. Here, the temporary pressure bonding is preferably performed by a pressure bonding tool from the 2 nd electronic component side. The temperature, pressure and time for the temporary pressure bonding may be determined as appropriate according to the specific design, and may be set to, for example, 60 to 80 ℃, 0.5 to 2MPa, 0.5 to 2 seconds. Such temporary pressure bonding is preferably performed before the final pressure bonding described later, because the electronic components (the conductive parts of the respective components) can be aligned and connected with each other more accurately. By performing the temporary pressure bonding, it is expected that positional deviation at the time of the main pressure bonding in which the pressing is performed at a higher pressure is suppressed.
After the temporary press-bonding, the 2 nd electronic component is subjected to a final press-bonding with a press-bonding tool. The temperature, pressure and time at the time of final pressure bonding may be set to any known conditions that can be used when bonding electronic components using an adhesive film, and may be appropriately determined according to a specific design. The pressure bonding can be performed using a known device that can be used when bonding electronic components using an adhesive film. As described above, by using the film roll of the present invention in which the solid epoxy resin and the solid epoxy curing agent are used in combination in a resin system in which the radical polymerizable (meth) acrylic compound and the epoxy resin are used in combination, the 1 st electronic component and the 2 nd electronic component can be favorably bonded even by pressure bonding at a low temperature (for example, 200 ℃ or lower, 180 ℃ or lower, 160 ℃ or lower) and in a short time (for example, 10 seconds or lower, 8 seconds or lower, 6 seconds or lower).
Note that, in both the temporary pressure bonding and the permanent pressure bonding, a buffer material (for example, a buffer sheet) may be provided between the 2 nd electronic component and the pressure bonding tool. The buffer material, including whether or not it is used, may be appropriately adjusted and determined according to the combination of the electronic components.
The present invention has a remarkable effect of suppressing the occurrence of blocking even when the adhesive film is wound long (in particular, even when the adhesive film of a narrow width which is likely to cause blocking or serious handling is wound long), while enjoying such an advantage of good adhesiveness by thermocompression bonding at a low temperature for a short time, and remarkably contributes to improvement in production efficiency and quality of target products such as FPD modules.
Examples
The present invention will be specifically explained below by way of examples. However, the present invention is not limited to the embodiments shown below. In the following description, "parts" and "%" of the indicated amounts mean "parts by volume" and "% by volume", respectively, unless otherwise explicitly indicated.
[ example 1]
Preparation of adhesive composition
30 parts of urethane acrylate (trade name: U-2PPA, manufactured by Mitsuoka Chemical industry Co., Ltd.), 50 parts of acrylic monomer (trade name: A-200, manufactured by Mitsubishi Chemical industry Co., Ltd.), 20 parts of solid epoxy resin (trade name: JeR1007, manufactured by Mitsubishi Chemical corporation), 3 parts of solid epoxy curing agent (diaminodiphenylmethane (DDM), manufactured by Tokyo Chemical industry Co., Ltd.), 12 parts of organic peroxide (trade name: PEROYL, manufactured by Nippon fat and oil Co., Ltd.), 50 parts of phenoxy resin (trade name: YP-50, manufactured by PPONIN STEEL & Material Co., Ltd.), 50 parts of phenoxy resin (trade name: YD-019, NIPPON STEEL Chemical & Material Co., Ltd.) and 5 parts of conductive particles (Ni particles, average particle diameter 5 μm) were added to 150 parts of solvent, and uniformly mixing to obtain the adhesive composition.
Preparation of adhesive films
As a release substrate, a PET film (thickness: 50 μm) was prepared. The adhesive composition was uniformly applied to the release substrate so that the thickness of the adhesive layer after drying became 35 μm. Then, the film was dried at 60 ℃ for 5 minutes to form an adhesive layer on the release substrate, thereby obtaining an adhesive film.
Preparation of the Membrane wound body
A cover film was adhered to the exposed surface of the adhesive layer of the obtained adhesive film, and after cutting to a width of 2.0mm, the cover film was peeled off. Then, an adhesive film of 300m was wound around a winding core (the diameter of the winding core is 100mm) provided with side plates so that the adhesive layer was disposed on the inner peripheral side, to obtain a film wound body.
[ example 2]
An adhesive composition, an adhesive film, and a film roll were obtained in the same manner as in example 1, except that (i) the amount of the solid epoxy resin (trade name: jER1007, manufactured by mitsubishi chemical corporation) was changed from 20 parts to 5 parts, and (ii) the amount of the acrylic monomer (trade name: a-200, manufactured by shinkamura chemical industry) was changed from 50 parts to 65 parts.
[ example 3]
An adhesive composition, an adhesive film, and a film roll were obtained in the same manner as in example 1, except that (i) the amount of the solid epoxy resin (trade name: jER1007, manufactured by mitsubishi chemical corporation) was changed from 20 parts to 65 parts, and (ii) the amount of the acrylic monomer (trade name: a-200, manufactured by shinkamura chemical industry) was changed from 50 parts to 5 parts.
Comparative example 1
An adhesive composition, an adhesive film, and a film roll were obtained in the same manner as in example 1 except that (i) 5 parts of a liquid epoxy resin (trade name: jER828, manufactured by mitsubishi chemical corporation) was used instead of 20 parts of a solid epoxy resin (trade name: jER1007, manufactured by mitsubishi chemical corporation), and (ii) the blending amount of an acrylic monomer (trade name: a-200, manufactured by shinkamura chemical industry corporation) was changed from 50 parts to 65 parts.
Comparative example 2
An adhesive composition, an adhesive film and a film roll were obtained in the same manner as in example 1, except that (i) the epoxy resin was not blended and (ii) the blending amount of the acrylic monomer (trade name: a-200, manufactured by shinkamura chemical industries, ltd.) was changed from 50 parts to 70 parts.
Comparative example 3
An adhesive composition, an adhesive film, and a film roll were obtained in the same manner as in example 2, except that 3 parts of a liquid epoxy curing agent (2-ethyl-4-methylimidazole (2E4MZ, manufactured by shikawa chemical industries, ltd.) was used instead of 3 parts of a solid epoxy curing agent (DDM, manufactured by tokyo chemical industries, ltd.).
The test and evaluation methods are explained below. If all the evaluations are B or more, there is no problem in practical use.
< Overflow test >
The film wound bodies produced in examples and comparative examples were evaluated for the quality of the protrusion based on the amount of protrusion of the adhesive layer from the exposed side surface of the adhesive film. Such evaluation was performed by the overflow test shown below.
That is, as shown in fig. 2, the reel 4 of the film wound body produced in the example and the comparative example was mounted on the fixing rod 10 of the overflow test jig, and the weight 20 was added to the end of the adhesive film drawn out from the film wound body by a predetermined length while the rotation of the core was fixed, and a static load was applied (see japanese patent application laid-open No. 2017-137188 for details of the overflow test jig and details of the test procedure using the jig). In this test, the reel 4 was fixed so that the joining angle α (see the above-mentioned publication) was in the range of 90 to 180 °, and a static load was applied for 6 hours under the conditions that the length of the adhesive film pulled out from the film roll was 30cm, the weight of the weight 20 was 30g, and the ambient temperature was 30 ℃.
After a static load was applied for 6 hours, the appearance of the side surface in the radial direction was observed at a magnification of 175 times from the joining portion of the outer periphery of the winding core of the film roll package using a digital microscope. The case where the adhesive layer is stuck (joined) to the adhesive layer on the upper layer with the release substrate sandwiched therebetween is referred to as "overflow 1 layer", the case where the adhesive layer on the upper layer is stuck is referred to as "overflow 2 layers", and the number of overflow layers to decimal point 1 is determined from the state where the release substrate is sandwiched between the adhesive components. The film wound body was evaluated for the number of layers of the film wound body that had been overflowed, according to the following criteria.
(evaluation criteria)
A: the number of overflow layers is less than 1,
b: the number of overflow layers is less than 2,
c: the number of overflow layers is more than 2.
< evaluation of blocking >
After the overflow test, the adhesive film was pulled out from the film roll, and the presence or absence of blocking was observed. In this test, it was determined that blocking occurred when the adhesive layer peeled off or floated from the release substrate when the adhesive film was pulled out. In this test, the adhesive film was pulled out from the film roll package in the following 2 types of modes: (1) a direction parallel to the reel side plate (MD direction: an angle formed by the film drawing direction and the extending direction of the reel side plate is 0 °), and (2) a direction inclined to the reel side plate (30 ° with respect to the MD direction: an angle formed by the film drawing direction and the extending direction of the reel side plate is 30 °). Then, blocking of the film wound body was evaluated according to the following criteria.
(evaluation criteria)
A: no blocking occurred regardless of the pull-out direction,
b: when the tape is pulled out in a direction parallel to the reel side plate, no adhesion occurs, but when the tape is pulled out in a direction inclined to the reel side plate,
c: blocking occurs regardless of the pull-out direction.
< evaluation of adhesive Strength >
Preparation of the connecting body
The adhesive film was pulled out from the film wound bodies produced in examples and comparative examples, the adhesive layer from which the release base material was peeled was sandwiched between a flexible printed circuit board (FPC) and a rigid substrate, the FPC and the rigid substrate were thermocompression bonded, and all of the conductive portions facing the FPC and the rigid substrate were bonded by a cured product of the adhesive layer, thereby obtaining an anisotropically connected connector. Here, specifications of the FPC and the rigid board used in the test and conditions of thermocompression bonding are as follows.
FPC specification: the polyimide film thickness was 38 μm, the copper circuit thickness was 8 μm, and the copper circuit line width was 200 μm (pitch 400 μm, L/S = 1/1);
rigid substrate specification: glass epoxy substrate thickness 1.0mm, copper circuit thickness 35 μm, copper circuit line width 200 μm (pitch 400 μm, L/S = 1/1);
hot-press bonding conditions: 160 ℃/4MPa/5 seconds.
Determination and evaluation of the adhesive Strength
The obtained bonded body was held for 500 hours under high temperature and high humidity conditions of 85 ℃ and 85% RH immediately after bonding, and then the bonding strength was measured by a 90-degree peel test. Specifically, the FPC and the cured product were cut into a length of 10mm, the FPC having the length of 10mm was sandwiched between jigs, and the load (N/cm) from peeling off the FPC at room temperature (25 ℃) at a speed of 50 mm/min in the vertical direction until the FPC was peeled off from the rigid substrate was measured, and the adhesion strength was evaluated according to the following criteria. Incidentally, a TENSILON tester (OrionTech Co., Ltd., STA-1150) was used for the measurement.
(evaluation criteria)
A: the concentration of the carbon dioxide is more than 10N/cm,
b: 5N/cm or more and less than 10N/cm,
c: less than 5N/cm.
< evaluation of on-resistance >
The connected body was obtained by the same procedure as the above < evaluation of adhesive strength >. The on-resistance of the resulting interconnector was measured and evaluated according to the following criteria. Note that the on-resistance was practically free from problems both in the initial stage and after the reliability test. For either linker, good (a evaluation).
In the early stage (evaluation standard)
A: below a level of 5 omega and below,
b: 5 omega or more and less than 10 omega,
c: 10 omega or more.
After reliability test (evaluation standard)
A: below a level of 10 omega and below,
b: 10 omega or more and less than 15 omega,
c: 15 omega or more.
The evaluation results of the examples and comparative examples are shown in table 1.
[ Table 1]
It was confirmed from examples 1 to 3 that the film roll of the present invention can release an adhesive film exhibiting excellent adhesiveness even in thermocompression bonding at a low temperature for a short time, and can suppress the occurrence of blocking even when the adhesive film is wound for a long time. In addition, it was confirmed that, when using other film-forming components such as polyester resin, polyurethane resin, butadiene resin, etc. instead of/in addition to phenoxy resin, other polymerizable (meth) acrylic compounds instead of/in addition to the specific urethane acrylate and acrylic monomer described in table 1, and other solid epoxy resin and solid epoxy curing agent instead of/in addition to the specific solid epoxy resin and solid epoxy curing agent described in table 1, the same results as in the above examples were obtained, although the degrees of these differences were different.
On the other hand, the film packages of comparative examples 1 and 3 using the polymerizable (meth) acrylic compound and the epoxy resin in combination showed good results in terms of adhesion, but since the solid epoxy resin (comparative example 1) or the solid epoxy curing agent (comparative example 3) was not contained, both of them had poor overflow property and blocking occurred. The film wound body of comparative example 2, which contained the polymerizable (meth) acrylic compound but did not contain the epoxy resin, was inferior in any of the results of adhesiveness, blooming property, and blocking.
Description of the symbols
1 a film roll-up body in which a film is wound,
2 a layer of adhesive, 2,
3 stripping off the base material to obtain a stripped base material,
4, a reel is arranged on the upper portion of the frame,
5 the core of the winding is formed,
6 side plates (flanges),
10 the bar is fixed by a fixing rod 10,
a weight of 20.
Claims (9)
1. A film wound body in which an adhesive film including a release base material and an adhesive layer provided on the release base material is wound around a winding core,
the adhesive layer contains (A) a radical polymerizable (meth) acrylic compound, (B) an epoxy resin, and (C) an epoxy resin curing agent,
the component (B) contains an epoxy resin which is solid at room temperature,
the component (C) contains an epoxy resin curing agent which is solid at room temperature.
2. The film roll according to claim 1, wherein the total of the epoxy resin that is solid at room temperature and the epoxy resin curing agent that is solid at room temperature is 2% by volume or more, assuming that the total of the nonvolatile components of the adhesive layer is 100% by volume.
3. The film roll package according to claim 1 or 2, wherein the adhesive layer further contains a radical polymerization initiator.
4. The film roll according to any one of claims 1 to 3, wherein the radical polymerization initiator contains a radical polymerization initiator that is solid at room temperature.
5. The film roll-up body according to any one of claims 1 to 4, wherein the length of the adhesive film is 5m or more.
6. The film roll-up body according to any one of claims 1 to 5, wherein the width of the adhesive film is 5mm or less.
7. The film roll assembly according to any one of claims 1 to 6, wherein the adhesive film is wound around a roll core provided with a side plate.
8. The film roll package according to any one of claims 1 to 7, wherein the adhesive layer further contains conductive particles.
9. A method for producing a connected body, comprising a step of sandwiching an adhesive layer of an adhesive film drawn from a film roll package according to any one of claims 1 to 8 between a 1 st electronic component and a 2 nd electronic component, and pressure-bonding the 1 st electronic component and the 2 nd electronic component.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2019219031A JP7446095B2 (en) | 2019-12-03 | 2019-12-03 | Manufacturing method of film wrapping body and connection body |
| JP2019-219031 | 2019-12-03 | ||
| PCT/JP2020/044379 WO2021112023A1 (en) | 2019-12-03 | 2020-11-27 | Film wound body and method for manufacturing connecting body |
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| CN114729234A true CN114729234A (en) | 2022-07-08 |
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| CN202080082203.3A Pending CN114729234A (en) | 2019-12-03 | 2020-11-27 | Method for producing film-wound body and connected body |
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| JP (1) | JP7446095B2 (en) |
| KR (1) | KR20220058611A (en) |
| CN (1) | CN114729234A (en) |
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| AU711287B2 (en) | 1996-05-16 | 1999-10-07 | Minnesota Mining And Manufacturing Company | Adhesive compositions and methods of use |
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| JP6271048B2 (en) | 2017-01-11 | 2018-01-31 | デクセリアルズ株式会社 | Anisotropic conductive film, connection method, and joined body |
| JP6442628B2 (en) | 2018-01-18 | 2018-12-19 | デクセリアルズ株式会社 | Anisotropic conductive film, and manufacturing method and bonded body of bonded body |
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2019
- 2019-12-03 JP JP2019219031A patent/JP7446095B2/en active Active
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2020
- 2020-11-27 KR KR1020227011334A patent/KR20220058611A/en not_active Application Discontinuation
- 2020-11-27 CN CN202080082203.3A patent/CN114729234A/en active Pending
- 2020-11-27 WO PCT/JP2020/044379 patent/WO2021112023A1/en active Application Filing
- 2020-12-03 TW TW109142582A patent/TW202128908A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014160546A (en) * | 2013-02-19 | 2014-09-04 | Dexerials Corp | Anisotropic conductive film, connection method and joined body |
| CN105683327A (en) * | 2013-11-08 | 2016-06-15 | 迪睿合株式会社 | Adhesive composition and film roll |
| CN105694745A (en) * | 2014-12-04 | 2016-06-22 | 古河电气工业株式会社 | Wafer processing tape |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7446095B2 (en) | 2024-03-08 |
| KR20220058611A (en) | 2022-05-09 |
| TW202128908A (en) | 2021-08-01 |
| WO2021112023A1 (en) | 2021-06-10 |
| JP2021088645A (en) | 2021-06-10 |
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