JP2007165056A - Manufacturing method of anisotropic conductive film, and anisotropic conductive film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an anisotropic conductive film capable of preventing that an insulating adhesive film and a substrate arranged with conductive particle are pasted excessively and capable of improving yield of manufacturing, and an anisotropic conductive film. <P>SOLUTION: The manufacturing method of an anisotropic conductive film comprises a process of arranging the conductive particles 12 on the surface of a substrate (magnetic medium 3) and a process of contacting the surface of the insulating adhesive film 11 on the surface of a magnetic medium 3 and transferring the conductive particles 12 on the magnetic medium on the insulating adhesive film 11. In the process of transferring the conductive particles 12 on the insulating adhesive film 11, the temperature of the surface of the adhesive film 11 is made 5°C or less. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for producing an anisotropic conductive film and an anisotropic conductive film.

In recent years, the need for fine circuit connection such as connection between a liquid crystal display (LCD) and a tape carrier package (TCP) and connection between a TCP and a printed circuit board (PCB) has increased. As the connection method, a method using an anisotropic conductive film in which conductive particles are dispersed in an insulating adhesive film is used.
In this method, an anisotropic conductive film is sandwiched between terminals to be connected, and heated and pressed to maintain electrical insulation between adjacent terminals in the plane direction, and electrically conduct between upper and lower terminals. .

The anisotropic conductive film used for such connection is manufactured as follows.
First, conductive particles are dispersed on an electrode substrate or the like. Then, electroconductive particle is transcribe | transferred to the film which has an adhesion layer.

JP 2002-75580 A

However, the technique of Patent Document 1 has room for improvement in the following points.
When transferring the conductive particles to the adhesive layer of the film, the adhesive layer is affixed to the electrode substrate or the like on which the conductive particles are arranged. At this time, the adhesive layer excessively sticks to the electrode substrate or the like. . Therefore, it becomes difficult to peel off the adhesive layer from the electrode substrate or the like, and the manufacturing yield may be reduced.

  An object of the present invention is to provide an anisotropic conductive film manufacturing method that can prevent an insulating adhesive film and a substrate on which conductive particles are disposed from being excessively bonded, and can improve yield. And providing an anisotropic conductive film.

  According to the present invention, in the method for producing an anisotropic conductive film having an insulating adhesive film and conductive particles fixed to the insulating adhesive film, the conductive particles are arranged on the surface of the substrate. And a step of bringing the surface of the insulating adhesive film into contact with the surface of the base material, and transferring the conductive particles on the base material to the insulating adhesive film. The insulating adhesive film has a tack force at 5 ° C. of 0.01 N / 5 mmφ or more and 0.3 N / 5 mmφ or less, and a tack force at 25 ° C. of 0.1 N / 5 mmφ or more and 1 N / 5 mmφ or less. In the step of transferring the conductive particles on the material to the insulating adhesive film, a temperature of the insulating adhesive film is set to 5 ° C. or less, and a method for producing an anisotropic conductive film is provided. Is .

According to the present invention, the insulating adhesive film having a tack force at 5 ° C. of 0.3 N / 5 mmφ or less is used, and in the step of transferring the conductive particles to the insulating adhesive film, Since the temperature of the adhesive adhesive film is 5 ° C. or less, the insulating adhesive film can be prevented from excessively sticking to the base material. Thereby, after transferring electroconductive particle, an insulating adhesive film and a base material can be isolate | separated smoothly, and the yield of manufacture of an anisotropic conductive film can be improved.
In addition, when the tack force at 5 ° C. of the insulating adhesive film is less than 0.01 N / 5 mmφ, the conductive particles are hardly fixed to the insulating adhesive film, and the conductive particles on the substrate are It may be difficult to transfer to an insulating adhesive film.

In the present invention, since the tack force at 25 ° C. of the insulating adhesive film is 0.1 N / 5 mmφ or more, the manufactured anisotropic conductive film can be easily temporarily fixed to an adherend such as an LCD. Can do.
In addition, when the tack force at 25 ° C. of the insulating adhesive film exceeds 1 N / 5 mmφ, the tack force is too high, and the anisotropic conductive film may be difficult to handle.
For example, when the insulating adhesive film is cut to a desired width with a slitter while the release film is pasted on the back side of the insulating adhesive film, the insulating adhesive film is stuck to the slitter blade and is insulated. The insulating adhesive film may be peeled off from the release film attached to the back surface of the adhesive film.
Also, for example, the anisotropic conductive film is stored in a roll shape with the release film attached to the back surface of the insulating adhesive film. At this time, the surface of the insulating adhesive film is The film may stick to the release film and the anisotropic conductive film cannot be pulled out.

  At this time, a release film is attached to the back surface of the insulating adhesive film, and the adhesive tape peeling force of the contact surface of the release film with the back surface of the insulating adhesive film is 100 N / It is preferable that it is 25 mm or more and 1500 N / 25 mm or less.

According to such a configuration, the release film is affixed to the back surface of the insulating adhesive film. However, as described above, the insulating adhesive film may stick to the substrate excessively. Therefore, after the conductive particles are transferred, the insulating adhesive film can be prevented from being peeled off from the release film when the insulating adhesive film and the substrate are separated.
In addition, since the adhesive tape peeling force of the contact surface with the back surface of the insulating adhesive film of the release film is set to 100 N / 25 mm or more, the insulating adhesive film is peeled off from the release film. It can be surely prevented.
In addition, when using the manufactured anisotropic conductive film and connecting the terminals, the release film is peeled off from the insulating adhesive film. Since the adhesive tape peeling force of the contact surface with the back surface is set to 1500 N / 25 mm or less, it is possible to prevent the release film from being easily peeled off from the insulating adhesive film.

  Under the present circumstances, the storage elastic modulus of the said insulating adhesive film in 5 degreeC measured using the dynamic viscoelasticity apparatus, the frequency of 0.1 Hz, and the temperature increase rate of 10 degree-C / min shall be 5000 Pa or more and 100000 Pa or less. preferable.

Since the storage elastic modulus of the insulating adhesive film is 5000 Pa or more, the conductive particles are completely embedded in the insulating adhesive film when transferring the conductive particles on the base material to the insulating adhesive film. Can be prevented. When the surface of the conductive particles is exposed from the insulating adhesive film, the capture rate of the conductive particles (the number of conductive particles existing between the terminals after connecting the terminals / present between the terminals before connecting the terminals) The number of conductive particles to be improved). That is, when connecting the terminals arranged up and down across the anisotropic conductive film, the conductive particles exposed from the insulating adhesive film can be pressed by the terminals, so that the conductive particles are It can be prevented that it stays between the terminals and flows outward (between adjacent terminals in the surface direction).
Moreover, since the storage elastic modulus of the insulating adhesive film is set to 100000 Pa or less, the conductive particles can be embedded with the insulating adhesive film, and the conductive particles can be reliably embedded in the insulating adhesive film. Can be fixed.

Further, in the present invention, in the step of transferring the conductive particles to the insulating adhesive film, the surface of the insulating adhesive film is brought into contact with the surface of the base material, and the base material and the insulating material are brought into contact with each other. It is preferable to transfer the conductive particles to the insulating adhesive film by sandwiching a conductive adhesive film.
Thus, by sandwiching the base material and the insulating adhesive film, the conductive particles can be reliably transferred to the insulating adhesive film.

  Further, in the present invention, in the step of disposing the conductive particles on a base material, a magnetic medium is used as the base material, magnetic recording is performed on a specific area of the magnetic medium, and the specification of the magnetic medium is performed. It is preferable to dispose conductive particles on the region.

According to the present invention, it has an insulating adhesive film and conductive particles fixed to the insulating adhesive film, and has a tack force at 5 ° C. of 0.01 N / 5 mmφ or more and 0.3 N / 5 mmφ or less. An anisotropic conductive film characterized by having a tack force at 25 ° C. of 0.1 N / 5 mmφ or more and 1 N / 5 mmφ or less is also provided.
Such an anisotropic conductive film can be obtained, for example, by the manufacturing method as described above.

  Under the present circumstances, it is preferable that the storage elastic modulus of the insulating adhesive film in 5 degreeC measured using the dynamic viscoelasticity apparatus, the frequency of 0.1 Hz, and the temperature increase rate of 10 degree-C / min is 5000 Pa or more and 100000 Pa or less. .

  ADVANTAGE OF THE INVENTION According to this invention, it can prevent that an insulating adhesive film and the base material by which electroconductive particle is arrange | positioned excessively stick, and the anisotropic conductive film which can improve the yield of manufacture. A manufacturing method and an anisotropic conductive film are provided.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a cross-sectional view of the anisotropic conductive film 1.
First, an outline of the anisotropic conductive film 1 will be described.
The anisotropic conductive film 1 has an insulating adhesive film 11 and conductive particles 12 fixed to the insulating adhesive film 11, and the insulating adhesive film 11 has a tack force of 0 at 5 ° C. 0.01 N / 5 mmφ or more and 0.3 N / 5 mmφ or less, and tack force at 25 ° C. is 0.1 N / 5 mmφ or more and 1 N / 5 mmφ or less.

Below, the anisotropic conductive film 1 is demonstrated in detail.
The insulating adhesive film 11 of the anisotropic conductive film 1 extends in a long shape. For example, the thickness of the insulating adhesive film 11 is preferably about 10 μm to 20 μm in the connection between the LCD panel and the TCP.
As described above, the insulating adhesive film 11 has a tack force at 5 ° C. of 0.01 N / 5 mmφ or more. Especially, it is preferable that it is 0.04N / 5mmphi or more.
Moreover, the insulating adhesive film 11 has a tack force at 5 ° C. of 0.3 N / 5 mmφ or less as described above. Especially, it is preferable that it is 0.1 N / 5mmphi or less.
Furthermore, the insulating adhesive film 11 has a tack force at 25 ° C. of 0.1 N / 5 mmφ or more. Especially, it is preferable that it is 0.4N / 5mmphi or more.
Moreover, the insulating adhesive film 11 has a tack force at 25 ° C. of 1 N / 5 mmφ or less. Especially, it is preferable that it is 0.7 N / 5mmphi or less.
The tack force at 25 ° C. of the insulating adhesive film 11 is larger than the tack force at 5 ° C.

Here, a method for measuring the tack force will be described.
As a sample, first, an approximately 10 cm square insulating adhesive film 11 (thickness 15 mm) is prepared. A PET release film 13 is affixed to the back surface of the insulating adhesive film 11.
Next, the insulating adhesive film 11 is placed on the stage (25 ° C. or 5 ° C.) of the probe tack measuring apparatus (trade name: manufactured by TACII RHESCA Reska Co.) so that the surface of the insulating adhesive film 11 faces up. Install.
After 1 minute, the force that pushes and tears off the lobe with 2N force is detected. The peak value detected in the probe tack test is taken as the measurement value.
When measuring the tack force at 25 ° C., the stage of the probe tack measuring device is set to 25 ° C., and the insulating adhesive film 11 is placed on the stage, and the measurement is performed one minute later. The surface of the adhesive film 11 is considered to be 25 ° C.
When measuring the tack force at 5 ° C., the stage of the probe tack measuring device is set to 5 ° C., and the insulating adhesive film 11 is placed on the stage, and the measurement is performed after 1 minute. The surface of the adhesive film 11 is considered to be 5 ° C.

The insulating adhesive film 11 has a storage elastic modulus of 5000 Pa or more at 5 ° C. measured using a dynamic viscoelasticity device, a frequency of 0.1 Hz, and a heating rate of 10 ° C./min. 100000 Pa or less.
Especially, it is preferable that the storage elastic modulus of the insulating adhesive film 11 is 10,000 Pa or more. Furthermore, the storage elastic modulus of the insulating adhesive film 11 is preferably 70000 Pa or less.

Here, a method for measuring the storage elastic modulus will be described.
An insulating adhesive film 11 having a thickness of 100 μm was prepared, and a rheometer (manufactured by HAAKE, RheoStress, RS150) having a frequency of 0.1 Hz, a heating rate of 10 ° C./min, and a measurement temperature range of −30 It is set as the measurement conditions of ℃ -250 ℃, constant strain / stress detection. Based on such measurement conditions, the storage elastic modulus of the insulating adhesive film at 5 ° C. is calculated.

As the composition of the insulating adhesive film 11 having the tack force and the storage elastic modulus as described above, various compositions can be considered.
(I) Reactive elastomer, epoxy resin, coupling agent, one containing a latent curing agent, or
(Ii) Those containing reactive elastomers, (meth) acrylate resins, coupling agents, and organic peroxides are preferred.

The reactive elastomer in the composition of (i) and (ii) is not particularly limited, but has a film-forming property, such as phenoxy resin, polyester resin, polyurethane resin, polyimide resin, polybutadiene, Polypropylene, styrene-butadiene-styrene copolymer, polyvinyl acetal resin, polyvinyl butyral resin, butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-methacrylic acid copolymer, acrylonitrile-butadiene-styrene copolymer A polymer, a polyvinyl acetate resin, nylon, a styrene-isoprene copolymer, a styrene-butylene-styrene block copolymer, and the like can be used, or a single type or a mixture of two or more types may be used.
As the elastomer, a resin having a nitrile group and an epoxy group can be used. As such a resin, for example, acrylic rubber can be used.
Examples of the acrylic rubber include a polymer or copolymer having at least one of acrylic acid, acrylic acid ester, methacrylic acid ester or acrylonitrile as a monomer component, including glycidyl acrylate and glycidyl methacrylate containing a glycidyl ether group. A copolymer acrylic rubber is preferably used.

  Specifically, the acrylic rubber can be, for example, a compound represented by the following general formula (1).

However, in the said General formula (1), R < ₁ >, R < ₂ > shows either hydrogen, a methyl group, an ethyl group, a propyl group, and a butyl group each independently. R ₁ and R ₂ may be the same group or different groups.
R ₃ represents either hydrogen or a methyl group.
Moreover, in the said General formula (1), X is 40 mol% or more and 98.5 mol% or less, Y is 1 mol% or more and 50 mol% or less, Z is 0.5 mol% or more and 10 mol% or less. The molecular weight of the acrylic rubber represented by the general formula (1) is, for example, 10,000 or more and 1500,000 or less. By using the acrylic rubber represented by the general formula (1), the adhesion and connection reliability can be further improved.

  Although it does not specifically limit as a coupling agent in the composition of (i) and the composition of (ii), A silane coupling agent can be used conveniently, for example, (gamma) -glycidoxy propyl triethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, γ-ureidopropyltriethoxy Although silane etc. are mentioned, you may mix 1 type, or 2 or more types.

  The epoxy resin in the composition (i) is not particularly limited as long as it has at least two epoxy groups in one molecule. For example, a glycidyl ester type epoxy resin or a epoxy resin having a naphthalene skeleton can be used. By carrying out like this, hardening for a short time can be obtained reliably. Further, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, or the like may be used. The epoxy resin is not limited to these, and may be used alone or in combination. From the viewpoint of moisture resistance reliability, it is preferable that Na ions and Cl ions, which are ionic impurities in the epoxy resin, be as small as possible. it can.

The latent curing agent in the composition of (i) is a mixture with an epoxy resin and can be stored for a long time without changing its characteristics under a constant temperature condition. For example, when heated to a predetermined temperature, It is a curing agent that has a function of curing.
The latent curing agent can be obtained by coating the curing agent with a polyurethane-based or polyester-based polymer substance and encapsulating it. This is preferable because the pot life is extended.
Specific examples of the curing agent include imidazole, hydrazide, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide and the like. These can be used alone or in combination, and may be used by mixing a decomposition accelerator, an inhibitor and the like.
Among these, it is preferable to use a microencapsulated imidazole derivative epoxy compound as the latent curing agent.

  The microencapsulated imidazole derivative epoxy compound is not particularly limited as long as the reaction product of the imidazole derivative and the epoxy compound is microencapsulated into a fine powder. A compound in which a microencapsulated imidazole derivative epoxy compound and an isocyanate compound are reacted to improve chemical resistance and storage stability is further preferable.

  Examples of the epoxy compound used for the microencapsulated imidazole derivative epoxy compound include glycidyl ether type epoxy resins such as bisphenol A, bisphenol F, and brominated bisphenol A, dimer acid diglycidyl ester, and phthalic acid diglycidyl ester.

  Examples of imidazole derivatives used herein include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl- 2-methylimidazole, 1-benzyl-2-ethylimidazole, 1-benzyl-2-ethyl-5-methylimidazole, 2-phenyl-4-methyl-5-hydroxydimethylimidazole, 2-phenyl-4,5-dihydroxy And methyl imidazole.

Examples of the (meth) acrylate resin having the composition (ii) include urethane acrylate, polyester acrylate, and epoxy acrylate.
Examples of the organic peroxide having the composition (ii) include 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanate, t-butylperoxy-2-ethylhexanate, and t-hexyl. Peroxy-2-ethylhexanate, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane And bis (4-t-butylcyclohexyl) peroxydicarbonate. These peroxides may be used alone. Moreover, in order to control curability, it is also possible to mix and use two or more types of organic peroxides.
The insulating adhesive film 11 as described above has various additives such as a non-reactive diluent, a reactive diluent, etc. for improving various properties such as resin compatibility, stability, and workability. A thixotropic agent, a thickener, an inorganic filler, and the like may be added as appropriate.

As shown in FIG. 1, conductive particles 12 are disposed on one surface (front surface) of such an insulating adhesive film 11, and a release film 13 is fixed to the other surface (back surface). ing.
Some of the conductive particles 12 fixed to the insulating adhesive film 11 are primary particles, and the rest are aggregated secondary aggregate particles.

In addition, the conductive particles 12 are fixed to one surface side of the insulating adhesive film 11, and as shown in FIG. 1, some of the conductive particles 12 are insulated. It protrudes from the surface of the adhesive adhesive film 11 and is arrange | positioned. Other part of the conductive particles 12 is buried in the insulating adhesive film 11.
Here, although some of the conductive particles 12 are embedded in the insulating adhesive film 11, they are arranged so that all the conductive particles 12 are exposed from the insulating adhesive film 11. It may be.

Here, the composition of the conductive particles 12 is not particularly limited. For example, the conductive particles 12 may be metal particles, and as such metal particles, gold, silver, zinc, tin, solder, indium, palladium or the like may be used alone or in combination of two or more.
Alternatively, the conductive particles 12 may be particles obtained by coating a polymer core material with a metal. Polymer core material combined with one or more polymers such as epoxy resin, urethane resin, melamine resin, phenol resin, acrylic resin, polyester resin, polystyrene resin, styrene-butadiene copolymer, metal You may combine 1 type (s) or 2 or more types from gold | metal | money, nickel, silver, copper, zinc, tin, indium, palladium, aluminum etc. to a thin film film.

  Although there is no restriction | limiting in particular in the thickness of a metal thin film membrane | film | coat, For example, they can be 0.01 micrometer or more and 1 micrometer or less. If the thickness of the metal thin film is too thin, the connection becomes unstable when an anisotropic conductive film is used, and if it is too thick, aggregation occurs, which may cause insulation failure. The metal thin film is preferably uniformly coated on the surface of the polymer core material. By coating uniformly, unevenness and chipping of the film can be eliminated and electrical connectivity can be improved.

The release film 13 attached to the back surface of the insulating adhesive film 11 is, for example, polyethylene terephthalate.
At least a contact surface of the release film 13 with the insulating adhesive film 11 is subjected to a silicon release process.
The adhesive tape peeling force of the contact surface of the release film 13 with the back surface of the insulating adhesive film 11 is 100 N / 25 mm or more and 1500 N / 25 mm or less.
Especially, it is preferable that adhesive tape peeling force is 200 N / 25mm or more.
Further, the adhesive tape peeling force is more preferably 1000 N / 25 mm or less.

Here, the measuring method of adhesive tape peeling force is demonstrated.
The release film 13 is cut into 10 cm × 20 cm, and a sample is prepared. A 25 mm wide adhesive tape (Nitto Denko's adhesive tape 31B) is applied to the measurement surface of this sample (the contact surface with the back surface of the insulating adhesive film 11), and one reciprocating load is applied with a pressure roll (2 kg, 45 mm width). multiply.
Next, the sample is cut out to 25 mm × 150 mm, and the adhesive tape side is attached and fixed to an aluminum plate (width 50 mm, length 125 mm).
The 180 ° peeling force is measured at a speed of 300 mm / min with a tensile tester based on JIS B7721. The measurement is performed three times, and the average value is defined as the adhesive tape peeling force.

An example of a method of using the anisotropic conductive film 1 is shown in FIG.
As shown in FIG. 2A, the surface of the LCD panel 5 on which the terminals (electrodes) 51 are provided and the surface of the anisotropic conductive film 1 to which the conductive particles 12 are fixed are arranged opposite to each other.
Thereafter, the surface of the anisotropic conductive film 1 on which the conductive particles 12 are fixed is brought into contact with the surface on which the terminals (electrodes) 51 of the LCD panel 5 are provided to temporarily fix the anisotropic conductive film 1. .
Next, pressure is applied from the anisotropic conductive film 1 side to the LCD panel 5 side, and heating is performed, and the anisotropic conductive film 1 and the LCD panel 5 are temporarily pressure-bonded.
Next, the release film 13 of the anisotropic conductive film 1 is peeled off.

Thereafter, as shown in FIG. 2 (B), the TCP 4 is placed on the back side of the anisotropic conductive film 1 and is temporarily attached by pressurization.
Further, as shown in FIG. 2C, pressure is applied from the TCP 4 side toward the LCD panel 5, and heating is performed to perform final pressure bonding between the TCP 4 and the LCD panel 5.

Next, the manufacturing apparatus 2 for the anisotropic conductive film 1 as described above will be described with reference to FIG.
The manufacturing apparatus 2 includes a transfer unit 21 for transferring the conductive particles 12 from the magnetic medium (base material) 3 on which the conductive particles 12 are fixed to the insulating adhesive film 11, and an insulating property to the transfer unit 21. An insulating adhesive film supply unit 23 for supplying the adhesive film 11, a magnetic medium supply unit 22 for supplying the magnetic medium 3 with the conductive particles 12 fixed to the transfer unit 21, and the anisotropic conductive film 1 are wound. A take-up unit 24 for taking up and a take-up unit 25 for taking up the magnetic medium 3 are provided.

The transfer unit 21 includes a pair of opposed rotating rolls 211.
The insulating adhesive film 11 and the magnetic medium 3 on which the conductive particles 12 are magnetized are supplied between the pair of rotating rolls 211, and the insulating adhesive film 11 and the magnetic medium 3 are sandwiched between the rotating rolls 211.
At this time, the surface of the insulating adhesive film 11 (the surface on which the release film 13 is not attached) is insulated between the rotating rolls 211 so that the surface of the magnetic medium 3 to which the conductive particles 12 are fixed is in contact. The adhesive film 11 is supplied.

The insulating adhesive film supply unit 23 includes a supply roll 231 in which the insulating adhesive film 11 is wound around the outer peripheral surface, and supplies the insulating adhesive film 11 between the pair of rotating rolls 211 of the transfer unit 21. .
Although not shown in FIG. 3, a release film 13 is attached to the back surface of the insulating adhesive film 11 wound around the supply roll 231.

The magnetic medium supply unit 22 includes a supply roll 221 in which the magnetic medium 3 is wound around the outer peripheral surface, and a conductive particle dispersion tank 222 for fixing the conductive particles 12 to the magnetic recording region of the magnetic medium 3.
The magnetic medium 3 wound around the supply roll 221 is previously subjected to magnetic recording in a specific area (magnetic recording area).
The magnetic medium 3 used here is not particularly limited as long as the conductive particles 12 can be captured in the magnetically recorded region, and one type of magnetic substance alone, a combination of two or more types of magnetic substances, non-magnetic Any composite of a magnetic substance on a body substrate can be used.

  The conductive particle dispersion tank 222 is a tank filled with a dispersion liquid in which the conductive particles 12 are dispersed, and the magnetic medium 3 is immersed therein. Thereby, the conductive particles 12 are fixed to the magnetic recording area of the magnetic medium 3. In this way, the magnetic medium 3 on which the conductive particles 12 are fixed is supplied to the transfer unit 21.

  A pair of winding auxiliary rolls 26 is disposed on the leading end side in the supply direction of the insulating adhesive film 11 rather than the pair of rotating rolls 211 of the transfer unit 21, and further insulated from the pair of winding auxiliary rolls 26. A winding portion 24 for winding the anisotropic conductive film 1 and a winding portion 25 for winding the magnetic medium 3 are disposed on the leading end side of the conductive adhesive film 11 in the supply direction.

  Here, the manufacturing apparatus 2 is installed in a cooling chamber (not shown), and when the conductive particles 12 are transferred, the surface temperature of the insulating adhesive film 11 is cooled to 5 ° C. or less. The

Next, the manufacturing method of the anisotropic conductive film 1 using such a manufacturing apparatus 2 is demonstrated.
First, the outline | summary of the manufacturing method of the anisotropic conductive film 1 in this embodiment is demonstrated.
The manufacturing method of the anisotropic conductive film 1 in this embodiment includes the step of disposing the conductive particles 12 on the surface of the base material (magnetic medium 3), and the surface of the insulating adhesive film 11 on the surface of the magnetic medium 3. And a step of transferring the conductive particles 12 on the magnetic medium 3 to the insulating adhesive film 11 by bringing them into contact with each other, and a step of transferring the conductive particles 12 on the magnetic medium 3 to the insulating adhesive film 11 Then, the temperature of the surface of the insulating adhesive film 11 shall be 5 degrees C or less.

Next, the manufacturing method of the anisotropic conductive film 1 is demonstrated in detail.
First, the temperature in the cooling chamber is adjusted, and the temperature of the insulating adhesive film 11 supplied from the supply roll 231 is maintained at 5 ° C. or lower.
Next, the insulating adhesive film 11 is supplied from the supply roll 231 between the pair of rotating rolls 211 of the transfer unit 21.
In addition, the magnetic medium 3 on which magnetic recording is performed in a specific area is prepared in advance, and the magnetic medium 3 is supplied from the supply roll 221 to the conductive particle dispersion tank 222. In the conductive particle dispersion tank 222, the magnetic medium 3 is immersed in a dispersion liquid in which the conductive particles 12 are dispersed, and the conductive particles 12 are magnetized on the magnetic recording area of the magnetic medium 3.
Thereafter, the magnetic medium 3 on which the conductive particles 12 are magnetized is supplied between the pair of rotating rolls 211 of the transfer unit 21.

The insulating adhesive film 11 and the magnetic medium 3 supplied between the pair of rotating rolls 211 are sandwiched between the rotating rolls 211, and the surface of the insulating adhesive film 11 is the surface of the magnetic medium 3 (the conductive particles 12 are Abut the fixed surface).
Here, the linear pressure between the pair of rotating rolls 211 is about 0.25 N / mm to 2 N / mm.
Next, the insulating adhesive film 11 and the magnetic medium 3 are supplied between the pair of auxiliary winding rolls 26 in a contact state.
Thereafter, when the insulating adhesive film 11 and the magnetic medium 3 are discharged from between the winding auxiliary rolls 26, the insulating adhesive film 11 and the magnetic medium 3 are separated. When the insulating adhesive film 11 and the magnetic medium 3 are separated, the conductive particles 12 are transferred from the magnetic medium 3 to the insulating adhesive film 11. As a result, the conductive particles 12 are transferred from the magnetic medium 3 to the insulating adhesive film 11.
Thereafter, the anisotropic conductive film 1 is taken up by the take-up unit 24, and the magnetic medium 3 is taken up by the take-up unit 25.

Next, the effect of this embodiment will be described.
In this embodiment, the insulating adhesive film 11 having a tack force at 5 ° C. of 0.3 N / 5 mmφ or less is used, and in the step of transferring the conductive particles 12 to the insulating adhesive film 11, an insulating property is obtained. Since the temperature of the adhesive film 11 is set to 5 ° C. or less, the insulating adhesive film 11 can be prevented from excessively sticking to the magnetic medium 3.
Thereby, after transferring the electroconductive particle 12, the insulating adhesive film 11 and the magnetic medium 3 can be smoothly separated, and the production yield of the anisotropic conductive film 1 can be improved.

Moreover, although the release film 13 is affixed on the back surface of the insulating adhesive film 11, as described above, the insulating adhesive film 11 does not adhere to the magnetic medium 3 excessively. After the conductive particles 12 are transferred from the magnetic medium 3 to the insulating adhesive film 11, the insulating adhesive film 11 is released from the release film when the magnetic medium 3 and the insulating adhesive film 11 are separated. 13 can be prevented from coming off.
In addition, since the adhesive tape peeling force at the contact surface of the release film 13 with the back surface of the insulating adhesive film 11 is 100 N / 25 mm or more, the insulating adhesive film 11 is peeled off from the release film 13. Can be surely prevented.
Furthermore, if the adhesive tape peeling force is 200 N / 25 mm or more, it is possible to reliably prevent the insulating adhesive film 11 from being peeled off from the release film 13. The insulating adhesive film 11 is peeled off from the release film 13 not only when the conductive particles 12 are transferred, but also when the insulating adhesive film 11 and the release film 13 are pulled out from the supply roll 231, for example. Can be surely prevented.
In addition, since the adhesive tape peeling force of the contact surface with the back surface of the insulating adhesive film 11 of the release film 13 is 1500 N / 25 mm or less, the anisotropic conductive film 1 and the LCD panel 5 are temporarily pressure-bonded. Then, when the release film 13 is peeled off, it is possible to prevent the release film 13 from being easily peeled off from the insulating adhesive film 11.
In particular, if the adhesive tape peeling force is 1000 N / 25 mm or less, it is possible to more reliably prevent the release film 13 from being easily peeled off from the insulating adhesive film 11.

  In this embodiment, since the insulating adhesive film 11 having a tack force at 5 ° C. of 0.01 N / 5 mmφ or more is used, the conductive particles 12 are securely fixed on the insulating adhesive film 11. be able to.

Furthermore, in this embodiment, since the insulating adhesive film 11 having a tack force at 25 ° C. of 0.1 N / 5 mmφ or more is used, the anisotropic conductive film 1 can be easily temporarily fixed to the LCD 5 or the like. it can.
In addition, when the tack force at 25 ° C. of the insulating adhesive film exceeds 1 N / 5 mmφ, the tack force is too high and the insulating adhesive film 11 may be difficult to handle. Since the tack force at 25 ° C. of the insulating adhesive film 11 in the form is 1 N / 5 mmφ or less, such a problem does not occur.

Since the storage elastic modulus of the insulating adhesive film 11 is 5000 Pa or more, when the conductive particles 12 on the magnetic medium 3 are transferred to the insulating adhesive film 11, the conductive particles 12 become the insulating adhesive film. 11 can be prevented from being completely buried inside. When the surface of the conductive particles 12 is exposed from the insulating adhesive film 11, the capture rate of the conductive particles 12 (the conductive particles 12 existing between the terminals 41 and 51 after the terminals 41 and 51 are connected to each other). The number of conductive particles 12 existing between the terminals 41 and 51 before the connection of the terminals 41 and 51 can be improved.
That is, since the conductive particles 12 exposed from the insulating adhesive film 11 can be pressed by the terminals 41 when connecting the terminals 41 and 51 arranged above and below with the anisotropic conductive film 1 interposed therebetween, It is possible to prevent the conductive particles 12 from staying between the upper and lower terminals 41 and 51 and flowing outward.
Furthermore, by setting the storage elastic modulus of the insulating adhesive film 11 to 10000 Pa or more, the insulating adhesive film 11 is not too soft, and the conductive particles 12 are completely embedded in the insulating adhesive film 11. Can be prevented more reliably, and the capture rate can be improved.
Moreover, since the storage elastic modulus of the insulating adhesive film 11 is 100000 Pa or less, the insulating adhesive film 11 does not become too hard, and the conductive particles 12 are embedded by the insulating adhesive film 11. The conductive particles 12 can be reliably fixed to the insulating adhesive film 11.
Furthermore, by setting the storage elastic modulus of the insulating adhesive film 11 to 70000 Pa or less, the conductive particles 12 can be more reliably fixed to the insulating adhesive film 11.
In addition, when the storage elastic modulus of the insulating adhesive film 11 exceeds 100000 Pa, the insulating adhesive film 11 becomes too hard, and there is a possibility that a portion where the conductive particles 12 are not transferred is generated.

  Furthermore, in this embodiment, since the insulating adhesive film 11 and the magnetic medium 3 on which the conductive particles 12 are magnetized are sandwiched by the pair of rotating rolls 211, the conductive particles 12 are removed from the magnetic medium 3. The insulating adhesive film 11 can be reliably transferred.

It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.
For example, in the above embodiment, the anisotropic conductive film is manufactured using the magnetic medium (base material) in which the conductive particles are arranged in the magnetic recording region. However, the base material is limited to the magnetic medium. It is not a thing.

Moreover, the manufacturing apparatus of the anisotropic conductive film 1 is not restricted to the manufacturing apparatus 2 of a structure as shown in FIG. For example, in the above embodiment, the insulating adhesive film 11 and the magnetic medium 3 are supplied between the pair of rotating rolls 211 and the conductive particles 12 on the magnetic medium 3 are transferred. For example, the insulating adhesive film 11 and the magnetic medium 3 may be supplied between a pair of press plates or between endless belts to sandwich the insulating adhesive film 11 and the magnetic medium 3.
Incidentally, the surface pressure at the time of nipping the insulating adhesive film 11 and the magnetic medium 3 ^is preferably 0.01N / mm ² ~0.25N / mm 2 approximately.

  Moreover, in the said embodiment, although the storage adhesive modulus 11 whose storage elastic modulus is 5000 Pa or more and 100000 Pa or less was used, the storage elastic modulus used the insulating adhesive film which is less than 5000 Pa or exceeds 100000 Pa. May be.

  Furthermore, in the said embodiment, although the manufacturing apparatus 2 was arrange | positioned in the cooling chamber (not shown), it is not restricted to this, For example, only the insulating adhesive film supply part 23 is arrange | positioned in a cooling chamber. Then, the temperature of the surface of the insulating adhesive film 11 when the conductive particles 12 on the substrate are transferred to the insulating adhesive film 11 may be 5 ° C. or less.

  Furthermore, as shown in FIG. 4, the insulating adhesive film supply part 23 has the supply roll 231 and the cooling roll 232 arrange | positioned at the insulating adhesive film supply direction front end side of this supply roll 231. The insulating adhesive film 11 may be cooled. The cooling roll 232 is a metallic roll in which a refrigerant is supplied.

  Moreover, in the said embodiment, after making the surface temperature of the insulating adhesive film 11 into 5 degrees C or less, the insulating adhesive film 11 and the magnetic medium 3 were contacted, but it is not restricted to this, For example, After the insulating adhesive film 11 and the magnetic medium 3 are brought into contact with each other, the temperature of the insulating adhesive film 11 may be cooled to 5 ° C. or lower.

  Next, examples of the present invention will be described.

(Example)
Insulating adhesive films having the compositions shown in Tables 1 and 2 were produced.
The insulating adhesive film is obtained by producing an insulating adhesive varnish, applying the insulating adhesive varnish on PET (polyethylene terephthalate) subjected to double-sided silicon release treatment as a release film, and drying. .
In addition, the adhesive tape peeling force of the contact surface with the back surface of the insulating adhesive film of a release film was 100 N / 25mm or more and 1500 N / 25mm or less.

なお、表１および表２における単位は、重量部である。

In addition, the unit in Table 1 and Table 2 is a weight part.

Next, when the tack force at 25 ° C. of each insulating adhesive film was measured, it was as shown in Table 3.
Table 3 shows the storage elastic modulus of the insulating adhesive film measured using a dynamic viscoelastic device at 5 ° C., a frequency of 0.1 Hz, and a heating rate of 10 ° C./min.
In addition, the measuring method of tack force and storage elastic modulus is the same as that of the said embodiment.

Next, using each of these insulating adhesive films, an anisotropic conductive film was manufactured by the same method as in the above embodiment using the same manufacturing apparatus as in the above embodiment.
As the conductive particles, particles obtained by metal coating (Ni / Au plating) on the polymer core material were used.

In the examples, the insulating adhesive film was not excessively adhered to the magnetic medium, and after the conductive particles were transferred, the insulating adhesive film and the magnetic medium could be smoothly separated. .
Further, the conductive particles were fixed to the insulating adhesive film, and the conductive particles on the magnetic medium could be reliably transferred to the insulating adhesive film.
Further, after the conductive particles were transferred to the insulating adhesive film, the insulating adhesive film was not peeled off from the release film when the magnetic medium and the insulating adhesive film were separated.

Further, when the anisotropic conductive film produced in this way was used to bond LCD and TCP, the anisotropic conductive film could be easily temporarily fixed to the LCD or the like.

(Comparative example)
Insulating adhesive films having the compositions shown in Tables 4 and 5 were produced. The manufacturing method is the same as in the example.

なお、表４および表５における単位は、重量部である。

The units in Tables 4 and 5 are parts by weight.

  Next, when the tack force at 25 ° C. of each insulating adhesive film was measured, it was as shown in Table 6. Table 6 shows the storage elastic modulus of the insulating adhesive film measured at 5 ° C. using a dynamic viscoelastic device at a frequency of 0.1 Hz and a heating rate of 10 ° C./min.

In the comparative example, in the case of the insulating adhesive film (Production Examples H and J) having a tack force at 5 ° C. exceeding 0.3 N / 5 mmφ, the conductive particles on the magnetic medium are transferred to the insulating adhesive film. In addition, after the conductive particles were transferred onto the magnetic medium, the insulating adhesive film and the magnetic medium could not be separated.
In addition, in the case of an insulating adhesive film (Production Examples H and J) whose tack force at 5 ° C. exceeds 0.3 N / 5 mmφ, after the conductive particles on the magnetic medium are transferred to the insulating adhesive film When the magnetic medium and the insulating adhesive film were separated, the insulating adhesive film was peeled off from the release film.

  In addition, in the case of an insulating adhesive film (Production Examples G and I) having a tack force at 5 ° C. of less than 0.01 N / 5 mmφ, the conductive particles on the magnetic medium are not transferred to the insulating adhesive film, and thus the insulating property The conductive particles did not adhere to the adhesive film.

Furthermore, an attempt is made to connect the LCD panel and the TCP with an anisotropic conductive film manufactured using an insulating adhesive film (Production Examples G and I) having a tack force of less than 0.1 N / 5 mmφ at 25 ° C. As a result, when the anisotropic conductive film was temporarily fixed to the LCD panel, the anisotropic conductive film was difficult to stick to the LCD panel, and time and effort were required for temporary fixing.
Moreover, the anisotropic conductive film manufactured using the insulating adhesive film (Production Example J) having a tack force at 25 ° C. exceeding 1.0 N / 5 mmφ was very sticky and difficult to handle.

It is sectional drawing which shows the anisotropic conductive film of embodiment of this invention. It is a schematic diagram which shows the process of connecting a terminal with an anisotropic conductive film. It is a schematic diagram which shows the manufacturing apparatus of an anisotropically conductive film. It is a schematic diagram which shows the modification of the manufacturing apparatus of an anisotropically conductive film.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Anisotropic conductive film 2 Manufacturing apparatus 3 Magnetic medium (base material)
5 LCD panel 11 Insulating adhesive film 12 Conductive particle 13 Release film 21 Transfer part 22 Magnetic medium supply part 23 Insulating adhesive film supply part 24 Winding part 25 Winding part 26 Winding auxiliary roll 31B Adhesive tape 41 , 51 Terminal 211 Rotating roll 221 Supply roll 221 Supply roll 222 Conductive particle dispersion tank 231 Supply roll 232 Cooling roll

Claims (7)

In the method for producing an anisotropic conductive film having an insulating adhesive film and conductive particles fixed to the insulating adhesive film,
Arranging the conductive particles on the surface of the substrate;
A step of bringing the surface of the insulating adhesive film into contact with the surface of the base material, and transferring the conductive particles on the base material to the insulating adhesive film;
With
The insulating adhesive film has a tack force at 5 ° C. of 0.01 N / 5 mmφ or more and 0.3 N / 5 mmφ or less, and a tack force at 25 ° C. of 0.1 N / 5 mmφ or more and 1 N / 5 mmφ or less,
In the step of transferring the conductive particles on the base material to the insulating adhesive film, the temperature of the insulating adhesive film is set to 5 ° C. or less. In the manufacturing method of the anisotropically conductive film of Claim 1,
A release film is affixed to the back surface of the insulating adhesive film, and the adhesive tape peeling force of the contact surface of the release film with the back surface of the insulating adhesive film is 100 N / 25 mm or more. The manufacturing method of an anisotropic conductive film characterized by being 1500 N / 25mm or less. In the manufacturing method of the anisotropically conductive film of Claim 1 or 2,
The storage elastic modulus of the insulating adhesive film measured at 5 ° C., sample thickness 100 μm, frequency 0.1 Hz, and heating rate 10 ° C./min measured using a dynamic viscoelasticity measuring device is 5000 Pa or more and 100000 Pa or less. A method for producing an anisotropic conductive adhesive film characterized by the following. In the manufacturing method in any one of Claims 1 thru | or 3,
In the step of transferring the conductive particles on the base material to the insulating adhesive film, the surface of the insulating adhesive film is brought into contact with the base material surface, and the base material and the insulating adhesive are brought into contact with each other. A method for producing an anisotropic conductive film, wherein a conductive film is sandwiched between the conductive particles to transfer the conductive particles to the insulating adhesive film. In the manufacturing method in any one of Claims 1 thru | or 4,
In the step of disposing the conductive particles on a substrate, a magnetic medium is used as the substrate, magnetic recording is performed on a specific area of the magnetic medium, and the conductive particles are formed on the specific area of the magnetic medium. A method for producing an anisotropic conductive film, characterized by comprising: An insulating adhesive film;
Conductive particles fixed to this insulating adhesive film,
The tack force at 5 ° C. of the insulating adhesive film is 0.01 N / 5 mmφ or more and 0.3 N / 5 mmφ or less, and the tack force at 25 ° C. is 0.1 N / 5 mmφ or more and 1 N / 5 mmφ or less. An anisotropic conductive film. In the anisotropic conductive film according to claim 6,
The storage elastic modulus of the insulating adhesive film measured at 5 ° C., using a dynamic viscoelastic device at a frequency of 0.1 Hz, and a heating rate of 10 ° C./min is 5000 Pa or more and 100,000 Pa or less. Conductive film.

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