JP2011202173A - Anisotropic conductive film and process for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an anisotropic conductive film having excellent storage stability, and to provide a process for producing the same.SOLUTION: The anisotropic conductive film includes a film forming resin, a polymerizable acrylic compound, an organic peroxide, and a conductive particle, wherein the organic peroxide is contained in a solid state at ambient temperature. The process for producing the anisotropic conductive film includes an application step wherein a composition containing a film forming resin, a polymerizable acrylic compound, an organic peroxide, and a conductive particle are applied on a stripping base material, and a solidification step wherein the composition on the stripping base material is cooled to convert the organic peroxide into a solid state at ambient temperature.

Description

  The present invention relates to an anisotropic conductive film in which conductive particles are dispersed and a method for producing the same.

  When connecting a liquid crystal panel and a tape carrier package (TCP) substrate or a chip-on-film (COF) substrate, or connecting a printed wiring board (PWB) and a TCP substrate or a COF substrate, it is generally thermosetting. An anisotropic conductive film (ACF) obtained by forming a thermosetting resin composition containing an epoxy resin, a polymerization initiator and conductive particles into a film is widely used. In this case, the pressure bonding temperature is usually about 180 to 250 ° C. and the pressure bonding time is about 5 to 10 seconds.

  In recent years, in order to reduce the thermal stress on the electrode part of PWB and the ITO (Indium Tin Oxide) electrode of the liquid crystal panel, it is required to lower the pressure temperature when thermocompression bonding using an anisotropic conductive film, Furthermore, in order to improve not only thermal stress but also production efficiency, shortening of the crimping time is required. For this reason, as an anisotropic conductive film material, instead of a thermosetting epoxy resin, it is attempted to use a polymerizable acrylic compound that can be cured at a lower temperature and in a shorter time together with a film-forming resin. As a polymerization initiator, use of an organic peroxide that does not generate gas with self-decomposition has been proposed (for example, see Patent Document 1).

JP 2011-32491 A

  However, when an organic peroxide is used as a polymerization initiator, instead of enabling pressure bonding at a low temperature in a short time, the decomposition reaction of the polymerization initiator gradually proceeds even at room temperature or lower, resulting in poor storage stability. .

  This invention is proposed in view of such a conventional situation, and provides the anisotropic conductive film which has the outstanding storage stability, and its manufacturing method.

  In order to solve the above-described problems, an anisotropic conductive film according to the present invention includes a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles, and the organic peroxide. It is characterized in that the object is contained in a solid state at room temperature.

  Moreover, the method for producing an anisotropic conductive film according to the present invention comprises a composition containing a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles on a release substrate. It has the application | coating process to apply | coat and the solidification process which cools the composition on the said peeling base material, and makes the said organic peroxide a solid state at normal temperature.

  Further, the connection method of the mounting body according to the present invention includes a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles, and the organic peroxide is in a solid state at room temperature. Sandwiching the anisotropic conductive film contained in between the electrode of the first electronic component and the electrode of the second electronic component, heating and pressurizing the first electronic component and the second electronic component, The electrode of the first electronic component and the electrode of the second electronic component are electrically connected.

  In addition, the mounting body according to the present invention includes a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles, and the organic peroxide is included in a solid state at room temperature. The anisotropic conductive film is a connection body in which the electrode of the first electronic component and the electrode of the second electronic component are electrically connected.

  According to the present invention, since the organic peroxide in the anisotropic conductive film exists in a solid state at normal temperature, the decomposition reaction of the polymerization initiator is suppressed, and excellent storage stability can be obtained.

Hereinafter, embodiments of the present invention will be described in detail in the following order.
1. 1. Anisotropic conductive film 2. Manufacturing method of anisotropic conductive film 3. Connection method using anisotropic conductive film Example

<1. Anisotropic Conductive Film>
The anisotropic conductive film in the present embodiment contains a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles.

  Specific examples of the film-forming resin include epoxy elastomers, polyester resins, polyurethane resins, phenoxy resins, polyamides, thermoplastic elastomers such as EVA, and the like. Among them, for heat resistance and adhesiveness, polyester resins, polyurethane resins, phenoxy resins, particularly phenoxy resins such as bis A type epoxy resins and phenoxy resins having a fluorene skeleton can be mentioned.

  If the amount of the film-forming resin used is too small, a film will not be formed, and if it is too large, the resin exclusion for obtaining electrical connection tends to be low, so resin solids (polymerization acrylic compound and film formation) 80 to 30% by mass, more preferably 70 to 40% by mass.

  Specific examples of the polymerizable acrylic compound include polyethylene glycol diacrylate, phosphate ester acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, isobutyl acrylate, t-butyl acrylate, isooctyl. Acrylate, bisphenoxyethanol full orange acrylate, 2-acryloyloxyethyl succinic acid, lauryl acrylate, stearyl acrylate, isobornyl acrylate, tricyclodecane dimethanol dimethacrylate, cyclohexyl acrylate, tris (2-hydroxyethyl) isocyanurate triacrylate Tetrahydrofurfuryl acrylate, o-phthalic acid diglycidyl ether acrylate, Carboxymethyl bisphenol A dimethacrylate, bisphenol A type epoxy acrylate, urethane acrylate, epoxy acrylate, and can be given the corresponding (meth) acrylate thereto.

  The polymerizable acrylic compound has 5 to 40 parts by weight of a bifunctional acrylate, 10 to 40 parts by weight of a urethane acrylate, and 0.5 to 5 parts by weight of a phosphoric ester acrylate in terms of obtaining high adhesive strength and conduction reliability. It is preferable to use the part together. Here, the bifunctional acrylate is blended to improve the cohesive strength of the cured product and improve the conduction reliability, the urethane acrylate is blended to improve the adhesion to the polyimide, and the phosphate ester acrylate is blended to the metal. Formulated to improve adhesion.

  When the amount of the polymerizable acrylic compound used is too small, the conduction reliability tends to be low, and when it is too large, the adhesive strength tends to be low. Therefore, the resin solid content (the polymerizable acrylic compound and the film forming resin are preferably used. 20) to 70% by mass, and more preferably 30 to 60% by mass.

  Specific examples of the organic peroxide include di (4-methylbenzoyl) peroxide (one minute half-life temperature 128.2 ° C.), di (3-methylbenzoyl) peroxide (one minute half-life temperature 131.1 ° C. ), Dibenzoyl peroxide (one minute half-life temperature 130.0 ° C.), t-hexyl peroxybenzoate (one minute half-life temperature 160.3 ° C.), t-butyl peroxybenzoate (one minute half-life temperature 166.8) ° C), diisobutyryl peroxide (one minute half-life temperature 85.1 ° C), 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate (one-minute half-life temperature 124.3 ° C), dilauroyl Peroxide (1 minute half-life temperature 116.4 ° C), Di (3,5,5-trimethylhexanoyl) peroxide (1 minute Depreciation temperature 112.6 ° C), t-butyl peroxypivalate (half-minute temperature of 1 minute 110.3 ° C), t-hexyl peroxypivalate (half-life temperature of 10 minutes 10 minutes), t-butyl Peroxyneoheptanoate (one minute half-life temperature 104.6 ° C), t-butyl peroxyneodecanoate (one minute half-life temperature 103.5 ° C), t-hexyl peroxyneodecanoate (one Minute half-life temperature 100.9 ° C), di (2-ethylhexyl) peroxydicarbonate (half-life temperature 1 minute 90.6 ° C), di (4-t-butylcyclohexyl) peroxydicarbonate (half-life one minute Temperature 92.1 ° C.), 1,1,3,3-tetramethylbutyl peroxyneodecanoate (one minute half-life temperature 92.1 ° C.), di-sec-butyl pero Sidicarbonate (one minute half-life temperature 85.1 ° C), di-n-propyl peroxydicarbonate (one-minute half-life temperature 85.1 ° C), cumyl peroxyneodecanoate (one-minute half-life temperature 85. 1 ° C). Two or more of these can be used in combination.

  Among such organic peroxides, it is preferable to have a structure that is easier to crystallize, such as a symmetrical structure and a structure having a phenyl group. The organic peroxide can be used as long as it is solid at room temperature, but its melting point is preferably 30 ° C. or higher and 250 ° C. or lower.

  Further, the amount of the organic peroxide used is preferably less than 100 parts by weight of the polymerizable acrylic compound because the reactivity is lost when the amount is too small, and the cohesive force of the anisotropic conductive film tends to decrease when the amount is too large. Is 1-10 parts by mass, more preferably 3-7 parts by mass.

  In the present embodiment, the organic peroxide in the anisotropic conductive film is in a solid state at room temperature. Thereby, the decomposition reaction of the organic peroxide is suppressed, and excellent storage stability can be obtained. Here, normal temperature refers to a range of 20 ° C. ± 15 ° C. (5-35 ° C.) (JIS Z 8703), and a solid state refers to any of a single crystal structure, a polycrystalline structure, and an amorphous structure I say something.

  The particle size of the solid is preferably 0.01 μm or more and 5 μm or less, and more preferably 0.01 μm or more and 3 μm or less, which is smaller than the particle size of the conductive particles. Since the particle size of the organic peroxide solid is 0.01 μm or more and 5 μm or less, a large amount of heat energy is required when changing from solid to liquid, so that the decomposition reaction of the organic peroxide is suppressed and excellent Storage stability can be obtained. Here, the particle size of the solid refers to the maximum particle diameter (long side) measured by an electron microscope or the like, and the shape of the organic peroxide may be a needle shape, a cube shape, or the like.

  The organic peroxide preferably has a one-minute half-life temperature of 80 ° C. or higher and 130 ° C. or lower. Such an organic peroxide having a relatively low half-life temperature of 1 minute undergoes a decomposition reaction gradually even at room temperature or lower, but in this embodiment, since the organic peroxide exists in a solid state, the decomposition reaction Is suppressed, and excellent storage stability can be obtained.

  Furthermore, the organic peroxide having a relatively low half-life temperature of one minute as described above undergoes a rapid curing reaction in a short time, so that the temperature margin at the time of pressure bonding becomes narrow. The presence of the peroxide in a solid state alleviates the rapid curing reaction and can be prevented from curing faster than the electronic connection is made.

  As the conductive particles, conductive particles such as those used in conventional anisotropic conductive films can be used. For example, metal particles such as gold particles, silver particles, nickel particles, benzoguanamine resins, and styrene resins. It is possible to use metal-coated resin particles whose surfaces are coated with a metal such as gold, nickel or zinc. The average particle size of such conductive particles is usually 1 to 10 μm, more preferably 2 to 6 μm.

  If the amount of the conductive particles used is too small, the possibility of poor conduction increases, and if it is too large, the possibility of short-circuiting increases. Therefore, the amount is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the resin solid content. More preferably, it is 0.2-10 mass parts.

  In addition, as other additive composition constituting the anisotropic conductive film in the present embodiment, as necessary, monomers for dilution such as various acrylic monomers, fillers, softeners, colorants, flame retardants, A thixotropic agent, a coupling agent and the like can be contained.

  In the anisotropic conductive film having such a structure, since the organic peroxide is present in a solid state, the decomposition reaction of the organic peroxide is suppressed, and excellent storage stability can be obtained. In addition, the rapid curing reaction of the organic peroxide during thermocompression is alleviated, and the temperature margin during thermocompression can be widened.

<2. Method for producing anisotropic conductive film>
Next, the manufacturing method of the anisotropic conductive film mentioned above is demonstrated. In the manufacturing method of the anisotropic conductive film in the present embodiment, a composition containing a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles is applied onto a release substrate. And a solidifying step of cooling the composition on the release substrate and bringing the organic peroxide into a solid state at room temperature.

  In the coating step, the above-described composition is prepared on a release substrate, and then coated using a bar coater, a coating apparatus, or the like. The release substrate has, for example, a laminated structure in which a release agent such as silicone is applied to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene), etc. Prevents the composition from drying and maintains the shape of the composition. The composition is obtained by dissolving the above-described composition in an organic solvent. As the organic solvent, toluene, ethyl acetate, a mixed solvent thereof, or other various organic solvents can be used.

  In the next solidification step, the above-described composition is dried by a heat oven, a heat drying apparatus or the like, and then the organic peroxide is brought into a solid state at room temperature. As a method of bringing the organic peroxide into a solid state at room temperature, cooling the composition, adding a new solvent that reduces the solubility of the organic peroxide, causing a chemical reaction, changing the pH, Although treatment such as slow evaporation can be used, in this embodiment, cooling is preferably performed in order not to cause unnecessary chemical reaction in the anisotropic conductive film. Moreover, the temperature at the time of cooling is set according to the organic peroxide, and the temperature is preferably −50 ° C. or higher and 0 ° C. or lower, more preferably −50 ° C. or higher and −20 ° C. or lower. The cooling time is set according to the crystal grain size of the organic peroxide, and is preferably 6 hours to 24 hours.

  By cooling the composition of the anisotropic conductive film in this manner, the organic peroxide can be crystallized with good dispersibility, and excellent storage stability can be obtained.

<3. Connection Method Using Anisotropic Conductive Film>
Next, a method for mounting an electronic component using the above-described anisotropic conductive film will be described. A method for connecting an electronic component as a specific example includes a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles, and the organic peroxide is included in a solid state at room temperature. An anisotropic conductive film is sandwiched between the electrode of the first electronic component and the electrode of the second electronic component, the first electronic component and the second electronic component are heated and pressurized, and the first electronic component Are electrically connected to the electrode of the second electronic component.

  The anisotropic conductive film in this embodiment can be used in various situations, but the first electrical component is a liquid crystal panel, a printed wiring board (PWB), etc., and the second electrical component is The present invention can be preferably applied to a flexible printed circuit board, a tape carrier package (TCP) board, a chip on film (COF) board, and the like.

  In the connection method in this embodiment, since an anisotropic conductive film in which organic peroxide is present in a solid state is used, a rapid curing reaction can be mitigated, and a temperature margin at the time of pressure bonding is widened. be able to.

  Moreover, since the connection body in this Embodiment uses the anisotropic conductive film with high storage stability in which an organic peroxide exists in a solid state, high connection reliability can be obtained.

<4. Example>
Examples of the present invention will be described below, but the present invention is not limited to these examples.

[Example 1]
[Preparation of anisotropic conductive film]
An anisotropic conductive film was produced as follows. 50 parts by mass of bis A type epoxy type phenoxy resin (YP50, manufactured by Toto Kasei Co., Ltd.), bifunctional acrylic monomer (A-200, manufactured by Shin Nakamura Chemical Co., Ltd.), urethane acrylate (U-2PPA, manufactured by Shin Nakamura Chemical Co., Ltd.), phosphorus Acid ester acrylate (PM-2, manufactured by Nippon Kayaku Co., Ltd.), Ni particles (Type 287, manufactured by Inco) having an average particle diameter of 3 μm, 2 parts by mass of dilauroyl peroxide (Perroyl L, manufactured by NOF Corporation) Toluene was added to to prepare an anisotropic conductive composition.

  These compositions were applied to a release-treated polyester film, and dried by blowing hot air at 70 ° C. for 5 minutes in an oven to produce an anisotropic conductive film.

  And this anisotropic conductive film was put into a -40 degreeC freezer for 6 hours, and the polymerization initiator (dilauroyl peroxide) was crystallized.

[Measurement of crystal diameter]
For the anisotropic conductive film, the particle size of the crystal was measured (3000 times) with a SEM (Scanning Electron Microscope). The long side of the crystal was measured, and the average value measured at any five locations was taken as the crystal diameter.

  When the crystal diameter of the polymerization initiator in the anisotropic conductive film of Example 1 was measured, it was 0.01 μm.

[Fabrication and evaluation of connection reliability evaluation structure]
A connection reliability evaluation structure was produced as follows. The anisotropic conductive film of Example 1 was thermocompression bonded under conditions of 80 ° C., 1 MPa and 2 seconds on a printed wiring board (PWB) having a 200 μm pitch wiring formed of a 35 μm thick copper foil on the surface of a glass epoxy substrate. The peeled PET film was peeled off, and an anisotropic conductive film was temporarily bonded to the PWB surface. To this anisotropic conductive film, a COF substrate (a polyimide film with a thickness of 38 μm, an epoxy adhesive layer with a thickness of 12 μm, and a copper wiring with a thickness of 18 μm with a pitch of 200 μm is formed on the epoxy adhesive layer) The copper wiring portion of the wiring board) was placed and pressure-bonded under the conditions of 130 ° C., 3 MPa, 5 seconds (low temperature connection) or 190 ° C., 3 MPa, 5 seconds (high temperature connection) to obtain a connection structure for evaluation.

  About the connection structure for evaluation crimped | bonded on each condition, the conduction resistance was measured by the 4-terminal method. The evaluation connection structure having a conduction resistance of 0.2Ω or less was evaluated as “◯”, and the connection resistance higher than 0.2Ω was evaluated as “X”.

  The evaluation of the conduction resistance of the connection structure for evaluation using the anisotropic conductive film of Example 1 was “good” for the high-temperature connection and the low-temperature connection.

[Crimping appearance]
The external appearance of the connection structure for evaluation was observed with a 30-fold stereo microscope, and it was visually confirmed whether there was any floating or bubbles. Regarding the crimped appearance of the connection structure for evaluation, the case where there was no float or bubble was evaluated as ○, and the case where there was a float or bubble was evaluated as x.

  Evaluation of the crimp appearance of the connection structure for evaluation using the anisotropic conductive film of Example 1 was “good”.

[Storage stability]
The anisotropic conductive film was aged at 40 ° C. for 3 days, and DSC (differential scanning calorimetry) measurement was performed. Regarding the storage stability of the connection structure for evaluation, the heat generation amount of 95% or more of the initial value is ◎, the initial value of less than 95% is 80% or more, and the initial value is less than 80% of ×. evaluated.

  Evaluation of the storage stability of the connection structure for evaluation using the anisotropic conductive film of Example 1 was good.

[Example 2]
An anisotropic conductive film of Example 2 was obtained in the same manner as Example 1 except that the polymerization initiator (dilauroyl peroxide) was crystallized in a freezer at −40 ° C. for 24 hours.

  When the crystal diameter of the polymerization initiator in the anisotropic conductive film of Example 2 was measured, it was 0.1 μm.

  Moreover, evaluation of the conduction resistance of the connection structure for evaluation using the anisotropic conductive film of Example 2 was “good” in the high-temperature connection and the low-temperature connection.

  Moreover, evaluation of the crimping | compression-bonding external appearance of the connection structure for evaluation using the anisotropic conductive film of Example 2 was (circle).

  The evaluation of the storage stability of the evaluation connection structure using the anisotropic conductive film of Example 2 was ◎.

[Example 3]
Example 1 except that 10 parts by mass of a bifunctional acrylic monomer and 30 parts by mass of urethane acrylate were blended and placed in a −40 ° C. freezer for 24 hours to crystallize the polymerization initiator (dilauroyl peroxide). Similarly, the anisotropic conductive film of Example 3 was obtained.

  When the crystal diameter of the polymerization initiator in the anisotropic conductive film of Example 3 was measured, it was 1 μm.

  Moreover, the evaluation of the conduction resistance of the connection structure for evaluation using the anisotropic conductive film of Example 3 was “good” in the high-temperature connection and the low-temperature connection.

  Moreover, evaluation of the crimping | compression-bonding external appearance of the connection structure for evaluation using the anisotropic conductive film of Example 3 was (circle).

  The evaluation of the storage stability of the connection structure for evaluation using the anisotropic conductive film of Example 3 was “◎”.

[Example 4]
An anisotropic conductive film of Example 2 was obtained in the same manner as in Example 1 except that the polymerization initiator (dilauroyl peroxide) was crystallized in a freezer at −40 ° C. for 72 hours.

  When the crystal diameter of the polymerization initiator in the anisotropic conductive film of Example 4 was measured, it was 3 μm.

  Moreover, the evaluation of the conduction resistance of the connection structure for evaluation using the anisotropic conductive film of Example 4 was “good” in the high-temperature connection and the low-temperature connection.

  Moreover, evaluation of the crimping | compression-bonding external appearance of the connection structure for evaluation using the anisotropic conductive film of Example 4 was (circle).

  The evaluation of the storage stability of the evaluation connection structure using the anisotropic conductive film of Example 4 was “◎”.

[Example 5]
An anisotropic conductive film of Example 2 was obtained in the same manner as in Example 1 except that the polymerization initiator (dilauroyl peroxide) was crystallized in a freezer at −40 ° C. for 150 hours.

  When the crystal diameter of the polymerization initiator in the anisotropic conductive film of Example 5 was measured, it was 5 μm.

  Moreover, the evaluation of the conduction resistance of the connection structure for evaluation using the anisotropic conductive film of Example 5 was good for the high-temperature connection and the low-temperature connection.

  Moreover, evaluation of the crimping | compression-bonding external appearance of the connection structure for evaluation using the anisotropic conductive film of Example 5 was (circle).

  The evaluation of the storage stability of the evaluation connection structure using the anisotropic conductive film of Example 5 was “◎”.

[Comparative Example 1]
An anisotropic conductive film of Comparative Example 1 was obtained in the same manner as in Example 1 except that the polymerization initiator was not crystallized without being put in the freezer.

  The polymerization initiator in the anisotropic conductive film of Comparative Example 1 was completely dissolved.

  Moreover, the evaluation of the conduction resistance of the connection structure for evaluation using the anisotropic conductive film of Comparative Example 1 was x for the low temperature connection and ◯ for the high temperature connection.

  Moreover, evaluation of the crimping | compression-bonding external appearance of the connection structure for evaluation using the anisotropic conductive film of the comparative example 1 was (circle).

  The evaluation of the storage stability of the evaluation connection structure using the anisotropic conductive film of Comparative Example 1 was x.

  In Table 1, the anisotropic conductive film of Examples 1-5 and the comparative example 1 and its evaluation are shown.

  As can be seen from Table 1, according to the anisotropic conductive films of Examples 1 to 5 in which dilauroyl peroxide, which is an organic peroxide, is contained in a solid state at room temperature, the decomposition reaction of the organic peroxide is suppressed. And excellent storage stability can be obtained.

  Moreover, as shown in Examples 1-5, the particle size of the organic peroxide solid is 0.01 μm or more and 5 μm or less, and particularly, as shown in Examples 2-5, it is 0.1 μm or more and 5 μm or less. In this case, it was found that excellent storage stability was exhibited.

  Moreover, as shown in Examples 1-5, by including an organic peroxide in a solid state at room temperature, a low temperature connection condition (130 ° C., 3 MPa, 5 seconds) and a high temperature connection condition (190 ° C., 3 MPa, 5 seconds), the conduction resistance was low and the temperature margin was large.

  Moreover, as shown in Examples 1-5, even if the organic peroxide was contained in the anisotropic conductive film in a solid state at room temperature, it was found that no floating or bubbles were generated.

Claims (8)

Contains a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles,
An anisotropic conductive film containing the organic peroxide in a solid state at room temperature.   The anisotropic conductive film according to claim 1, wherein the organic peroxide has a solid particle size of 0.01 μm or more and 5 μm or less.   The anisotropic conductive film according to claim 1 or 2, wherein the organic peroxide has a one-minute half-life temperature of 80 ° C or higher and 130 ° C or lower.   The anisotropic conductive film according to any one of claims 1 to 3, wherein the polymerizable acrylic compound includes a bifunctional acrylate, a urethane acrylate, and a phosphate ester acrylate. On the release substrate, a coating step of applying a composition containing a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles;
A method for producing an anisotropic conductive film, comprising: cooling the composition on the release substrate to bring the organic peroxide into a solid state at room temperature.   The method for producing an anisotropic conductive film according to claim 5, wherein in the solidification step, cooling is performed at a temperature of −50 ° C. or more and −20 ° C. or less. An anisotropic conductive film containing a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles, wherein the organic peroxide is contained in a solid state at room temperature, Sandwiched between the electrode of the electronic component and the electrode of the second electronic component,
A connection method in which the first electronic component and the second electronic component are heated and pressurized to electrically connect the electrode of the first electronic component and the electrode of the second electronic component.   By an anisotropic conductive film containing a film-forming resin, a polymerizable acrylic compound, an organic peroxide, and conductive particles, wherein the organic peroxide is contained in a solid state at room temperature, the first A connection body in which the electrode of the electronic component and the electrode of the second electronic component are electrically connected.