JP6442628B2 - Anisotropic conductive film, and manufacturing method and bonded body of bonded body - Google Patents

Description

  The present invention relates to an anisotropic conductive film, a connection method, and a joined body.

  Conventionally, an anisotropic conductive film (ACF) has been used as means for connecting electronic components.

  The anisotropic conductive film is prepared by applying a resin mixture containing conductive particles on a film and drying it. As a method for connecting electronic components, one of the circuits to be connected (or both of the circuits to be connected) is placed on the anisotropic conductive film, and a predetermined temperature and pressure are applied. The electrical connection between them is performed.

In recent years, plastic substrates such as polyethylene terephthalate (PET) and polycycloolefin have been used as substrates for touch panel sensors and the like.
Since such a wiring board is deformed when exposed to high heat, it is necessary to carry out the bonding at a relatively low temperature when pressure bonding using an anisotropic conductive film. As an anisotropic conductive film, a so-called anionic polymerization type anisotropic conductive film mainly composed of an epoxy resin or the like is widely used (see, for example, Patent Document 1), but a so-called anion mainly composed of an epoxy resin or the like. Since the polymerization system requires thermocompression bonding at about 200 ° C., it cannot be used for plastic substrates. Therefore, as the anisotropic conductive film, a radical polymerization system that can be pressure-bonded at a temperature of about 140 ° C. to 180 ° C. is advantageous. However, the radical polymerization system generally has a problem of low adhesion to glass and various plastics.

  In addition, when the plastic substrate and a flexible substrate (FPC) such as polyimide are connected by so-called FOF connection, there is a problem in that the adhesive strength is significantly lowered due to the curing shrinkage of the anisotropic conductive film after the environmental test. .

JP 2011-231146 A

  An object of the present invention is to solve the above-described problems and achieve the following objects. That is, the present invention is an anisotropic conductive film that is excellent in adhesiveness and does not cause a significant decrease in adhesive strength after an environmental test, It is an object to provide a connection method and a bonded body using an anisotropic conductive film.

Means for solving the problems are as follows. That is,
<1> An anisotropic conductive film containing at least a (meth) acrylic monomer,
The (meth) acrylic monomer contains a (meth) acrylic monomer having at least a carboxylic acid,
The anisotropic conductive film is characterized in that 0.01 g to 0.068 mol of (meth) acryl group is contained in 100 g of the anisotropic conductive film.
<2> The anisotropic conductive film according to <1>, wherein the (meth) acrylic monomer having a carboxylic acid is a (meth) acrylic monofunctional monomer having a carboxylic acid.
<3> The anisotropic conductive film according to <2>, wherein the (meth) acrylic monofunctional monomer having a carboxylic acid has a molecular weight of 100 to 500.
<4> The anisotropic conductive film according to <1>, wherein 80% by mass or more of the (meth) acrylic monomer contained in the anisotropic conductive film is a (meth) acrylic monofunctional monomer. It is.
<5> Of the (meth) acrylic monomer contained in the anisotropic conductive film, 80% by mass or more is a (meth) acrylic monofunctional monomer having a carboxylic acid. It is an isotropic conductive film.
<6> The <2>, <3>, and (3), wherein the (meth) acrylic monofunctional monomer having a carboxylic acid is contained in an amount of 3 to 20 parts by mass with respect to 100 parts by mass of the anisotropic conductive film. <5> An anisotropic conductive film according to any one of the above.
<7> The (2), <3>, <3>, wherein the (meth) acrylic monofunctional monomer having the carboxylic acid is contained in an amount of 5 to 10 parts by mass with respect to 100 parts by mass of the anisotropic conductive film. It is an anisotropic conductive film in any one of 5> and <6>.
<8> The anisotropic conductive film according to any one of <1> to <7>, which contains conductive particles.
<9> A connection method for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component,
A first disposing step of disposing the anisotropic conductive film according to any one of claims 1 to 8 on a terminal of the second electronic component;
A second disposing step of disposing the first electronic component on the anisotropic conductive film such that a terminal of the first electronic component is in contact with the anisotropic conductive film;
And a heating and pressing step in which the first electronic component is heated and pressed by a heating and pressing member.
<10> A terminal of at least one of the first electronic component and the second electronic component is formed on a plastic substrate,
The connection method according to <9>, wherein the heating is performed under a temperature condition of 140 ° C. to 180 ° C.
<11> The connection method according to any one of <9> to <10>, wherein the pressing is performed under a pressure condition of 2 MPa or less.
<12> A joined body connected by the connection method according to any one of <9> to <11>.
<13> A touch panel device comprising the joined body according to <12>.

  According to the present invention, the conventional problems can be solved, the object can be achieved, and even when a plastic substrate is an object to be bonded and bonded at a low temperature, it has excellent adhesiveness after an environmental test. An anisotropic conductive film that does not cause a significant decrease in adhesive strength, and a connection method and a bonded body using the anisotropic conductive film can be provided.

(Anisotropic conductive film)
The anisotropic conductive film of the present invention contains an adhesive layer-forming component containing at least a (meth) acrylic monomer having carboxylic acid, conductive particles, and, if necessary, other components.
The anisotropic conductive film is an anisotropic conductive film that anisotropically connects the terminals of the first electronic component and the terminals of the second electronic component.
In connection between the terminal of the first electronic component and the terminal of the second electronic component, when the terminal of at least one of the electronic components is formed on a plastic substrate, the connection of the electronic component is different from that of the present invention. It is preferable to use an isotropic conductive film.

For example, in the case of polyimide substrates, a good connection can be obtained by heating and pressure bonding under normal adhesion conditions using a normal epoxy anisotropic conductive film. However, for plastic substrates such as PET, PEN, and polycycloolefin, as described above, ordinary epoxy anisotropic conductive films cannot be pressure-bonded at low temperatures, and radical polymerization anisotropic conductive films are used. There is a problem with adhesion. Therefore, as a result of intensive studies, the present inventors have found that when a (meth) acrylic monomer having a carboxylic acid is used as a radical polymerization material, the carboxylic acid increases the adhesion to a plastic substrate and improves the adhesive strength. I found.
In addition, the present inventors have (meth) acrylic contained in an anisotropic conductive film in forming an anisotropic conductive film that is excellent in adhesiveness and does not show a decrease in adhesive strength after an environmental test. It has been found that the group content needs to be in a specific range.
In addition, content of the (meth) acryl group contained in the anisotropic conductive film will be described later.

<Adhesive layer forming component>
There is no restriction | limiting in particular as said contact bonding layer formation component except containing the (meth) acryl monomer which has carboxylic acid, According to the objective, it can select suitably. For example, a (meth) acrylic monomer including a (meth) acrylic monomer having the carboxylic acid can be contained as the adhesive layer forming component. Moreover, a binder, a hardening | curing agent, a silane coupling agent, an elastomer, etc. can be contained as said adhesive layer formation component.
The (meth) acrylic monomer means to include both an acrylic monomer and a methacrylic monomer.

-(Meth) acrylic monomer-
In the present invention, the (meth) acrylic monomer contains a (meth) acrylic monomer having at least a carboxylic acid.
The (meth) acrylic monomer having a carboxylic acid is more preferably a monofunctional monomer having one polymerizable group in the molecule, that is, a (meth) acrylic monofunctional monomer having a carboxylic acid.
The molecular weight of the (meth) acrylic monofunctional monomer having a carboxylic acid is preferably 100 to 500, and more preferably 200 to 350.
In addition to the (meth) acrylic monofunctional monomer having the carboxylic acid as the (meth) acrylic monomer, (meth) acrylic such as a (meth) acrylic monofunctional monomer or bifunctional (meth) acrylic monomer having no carboxylic acid Mention may be made of polyfunctional monomers.

However, in this invention, it is more preferable that 80 mass% or more is a monofunctional (meth) acryl monomer among the (meth) acryl monomers contained in the anisotropic conductive film, and 80 mass% or more. More preferably, it is a monofunctional (meth) acrylic monomer having a carboxylic acid.
When many polyfunctional (meth) acrylic monomers are contained, even if the amount of (meth) acrylic groups is within the above-mentioned range, the adhesive strength after the environmental test tends to be greatly reduced. . The reason is that if the content of monofunctional (meth) acrylic monomer among (meth) acrylic monomers is large (for example, more than 80% by mass), the polymer has a small proportion of three-dimensional crosslinking, so that stress due to deformation Although relaxation is possible, if the content of polyfunctional (meth) acrylic monomers among the (meth) acrylic monomers is large (for example, more than 80% by mass), the polymer increases the proportion of three-dimensional crosslinking. This is probably because it is difficult to deform and stress relaxation is not possible. As a result, it is presumed that the stress accompanying the curing shrinkage of the anisotropic conductive film cannot be absorbed, and peeling or the like occurs at the adhesive interface, resulting in a decrease in adhesive strength.

  Moreover, in this invention, it is more preferable when the (meth) acryl monofunctional monomer which has carboxylic acid is contained 3 mass parts-20 mass parts with respect to 100 mass parts of anisotropic conductive films, and 5 mass parts-10 mass parts. More preferably, it is contained in parts by mass.

-Binder-
The binder is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include phenoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, and polyolefin resin. Is mentioned. The said binder may be used individually by 1 type, and may use 2 or more types together. Among these, phenoxy resin is particularly preferable from the viewpoints of film formability, processability, and connection reliability.
The said phenoxy resin is resin synthesize | combined from bisphenol A and epichlorohydrin, Comprising: What was synthesize | combined suitably may be used and a commercial item may be used.
There is no restriction | limiting in particular as content of the said binder in the said anisotropic conductive film, Although it can select suitably according to the objective, For example, it is preferable in it being 10 mass%-60 mass%.

-Curing agent-
The curing agent is not particularly limited as long as it can cure the (meth) acrylic monomer, and can be appropriately selected according to the purpose. For example, an organic peroxide is preferable.
Examples of the organic peroxide include lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauroyl peroxide, dibutyl peroxide, peroxydicarbonate, and benzoyl peroxide. These may be used individually by 1 type and may use 2 or more types together.
There is no restriction | limiting in particular in content in the said anisotropic conductive film of the said hardening | curing agent, According to the objective, it can select suitably, It is preferable that it is 0.5 mass%-15 mass%.

-Silane coupling agent-
The silane coupling agent is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include an epoxy silane coupling agent, an acrylic silane coupling agent, a thiol silane coupling agent, and an amine silane. A coupling agent etc. are mentioned.
There is no restriction | limiting in particular as content of the said silane coupling agent in the said anisotropic conductive film, According to the objective, it can select suitably, For example, it is 0.1 mass%-5.0 mass% preferable.

-Elastomer-
There is no restriction | limiting in particular as said elastomer, According to the objective, it can select suitably, For example, a polyurethane resin (polyurethane-type elastomer), an acrylic rubber, a silicone rubber, a butadiene rubber etc. are mentioned.

<Conductive particles>
There is no restriction | limiting in particular as said electroconductive particle, According to the objective, it can select suitably, For example, a metal particle, a metal covering resin particle, etc. are mentioned.

There is no restriction | limiting in particular as said metal particle, According to the objective, it can select suitably, For example, nickel, cobalt, silver, copper, gold | metal | money, palladium, solder etc. are mentioned. These may be used individually by 1 type and may use 2 or more types together.
Among these, nickel, silver, and copper are preferable. These metal particles may be provided with gold or palladium on the surface for the purpose of preventing surface oxidation. Furthermore, you may use what gave the insulating film with the metal protrusion and organic substance on the surface.

The metal-coated resin particles are not particularly limited as long as the surfaces of the resin particles are coated with metal, and can be appropriately selected according to the purpose. For example, the surface of the resin particles is nickel, silver, solder , Particles coated with at least one of copper, gold, and palladium. Furthermore, you may use what gave the insulating film with the metal protrusion and organic substance on the surface.
There is no restriction | limiting in particular as the coating method of the metal to the said resin particle, According to the objective, it can select suitably, For example, an electroless-plating method, sputtering method, etc. are mentioned.
There is no restriction | limiting in particular as a material of the said resin particle, According to the objective, it can select suitably, For example, a styrene- divinylbenzene copolymer, a benzoguanamine resin, a crosslinked polystyrene resin, an acrylic resin, a styrene-silica composite resin etc. Is mentioned.

  The conductive particles only need to have conductivity during anisotropic conductive connection. For example, even if the surface of the metal particle is an insulating film, the conductive particle may be used as long as the particle is deformed during the anisotropic conductive connection and the metal particle is exposed.

There is no restriction | limiting in particular as an average particle diameter of the said electroconductive particle, Although it can select suitably according to the objective, 1 micrometer-40 micrometers are preferable, 2 micrometers-30 micrometers are more preferable, 3 micrometers-25 micrometers are still more preferable, 3 micrometers ˜15 μm is particularly preferred.
The average particle diameter is an average value of particle diameters measured for 10 conductive particles arbitrarily.
The particle diameter can be measured, for example, by observation with a scanning electron microscope.

  There is no restriction | limiting in particular as content of the said electroconductive particle, According to the objective, it can select suitably, For example, as content of the said electroconductive particle in the said anisotropic conductive film, 1 mass%-40 It is preferable that it is mass%.

<Characteristics of anisotropic conductive film>
In the anisotropic conductive film, the amount of (meth) acrylic group contained in 100 g of the anisotropic conductive film is 0.01 mol to 0.068 mol. The amount of the (meth) acryl group is more preferably 0.015 mol to 0.055 mol.
When the amount of (meth) acrylic groups is less than 0.01 mol, the adhesive strength of the anisotropic conductive film is reduced, and when the amount of (meth) acrylic groups is greater than 0.068 mol, the anisotropic conductive film is reduced. The adhesive strength of the film decreases.

In order to make the amount of the (meth) acrylic group within the desired range, it can be carried out by adjusting the blending amount of the constituent components of the anisotropic conductive film.
In addition, with respect to the produced anisotropic conductive film, the content of the (meth) acrylic group contained in the anisotropic conductive film is, for example, sorted by liquid chromatography (liquid chromatography), It can obtain | require by analyzing by a Fourier-transform infrared spectroscopy (FT-IR), and quantifying using a calibration curve.

<Peelable substrate>
The anisotropic conductive film may be provided on a peelable substrate.
As the peelable substrate, any film can be used without particular limitation as long as it is a film that can be peeled off from the conductive particle-containing layer during temporary attachment.
Examples thereof include silicone film, fluorine film, PET, PEN, glassine paper and the like which have been subjected to a release treatment with a release agent such as silicone or fluorine. There is no restriction | limiting in particular as average thickness of the said peelable base material, Although it can select suitably according to the objective, 12 micrometers-75 micrometers are preferable.

<First electronic component and second electronic component>
The first electronic component and the second electronic component are not particularly limited as long as they are electronic components having terminals, which are targets for anisotropic conductive connection using the anisotropic conductive film. For example, a glass substrate, a flexible substrate, a rigid substrate, an IC (Integrated Circuit) chip, a TAB (Tape Automated Bonding), a liquid crystal panel, and the like can be given. As said glass substrate, Al wiring formation glass substrate, ITO wiring formation glass substrate, etc. are mentioned, for example. Examples of the IC chip include a liquid crystal screen control IC chip in a flat panel display (FPD).

In the present invention, when the terminal of at least one of the first electronic component and the second electronic component is formed on a plastic substrate, the anisotropy of the present invention is used to connect the electronic component. It is preferable to use a conductive film.
The plastic substrate refers to a thermoplastic flexible substrate having both transparency and electrical characteristics, and specifically includes PET, PEN, polycycloolefin, and the like. Among them, polycycloolefin is preferably used in terms of transparency, low dielectric constant, and low dielectric loss tangent, and PET is preferably used in terms of cost advantage.

  There is no restriction | limiting in particular as average thickness of the said anisotropic conductive film, Although it can select suitably according to the objective, 5 micrometers-100 micrometers are preferable, 10 micrometers-60 micrometers are more preferable, and 15 micrometers-50 micrometers are especially preferable.

(Connection method)
The connection method of the present invention includes at least a first arrangement step, a second arrangement step, and a heating and pressing step, and further includes other steps as necessary.
The connection method is a method in which the terminal of the first electronic component and the terminal of the second electronic component are anisotropically conductively connected.

  There is no restriction | limiting in particular as said 1st electronic component and said 2nd electronic component, According to the objective, it can select suitably, For example, the said illustrated by description of the said anisotropic conductive film of this invention The first electronic component and the second electronic component can be cited respectively.

<First arrangement step>
The first arrangement step is not particularly limited as long as it is a step of arranging the anisotropic conductive film of the present invention on the terminal of the second electronic component, and can be appropriately selected according to the purpose. it can.

<Second arrangement step>
The second placement step is a step of placing the first electronic component on the conductive particle-containing layer so that a terminal of the first electronic component is in contact with the conductive particle-containing layer. There is no particular limitation, and it can be appropriately selected according to the purpose.

<Heat pressing process>
The heating and pressing step is not particularly limited as long as it is a step of heating and pressing the first electronic component with a heating and pressing member, and can be appropriately selected according to the purpose.
Examples of the heating and pressing member include a pressing member having a heating mechanism. Examples of the pressing member having the heating mechanism include a heat tool.

There is no restriction | limiting in particular as the temperature of the said heating, Although it can select suitably according to the objective, 140 to 180 degreeC is preferable.
By using the anisotropic conductive film of the present invention, good initial connectivity and connection reliability can be obtained even when connection is made at a relatively low temperature of 140 ° C. to 180 ° C.
When the heating temperature is lower than 140 ° C., the thermal activity is low, the adhesiveness is inferior, and the anisotropic conductive film cannot sufficiently flow, and the connectivity is also inferior, resulting in a decrease in initial connectivity and connection reliability. On the other hand, when the heating temperature condition is higher than 180 ° C., the terminal portion of the plastic substrate is deformed, so that the connectivity is inferior.

There is no restriction | limiting in particular as the pressure of the said press, Although it can select suitably according to the objective, 2 Mpa or less is preferable.
There is no restriction | limiting in particular as time of the said press, Although it can select suitably according to the objective, 3 seconds-20 seconds are preferable.

(Joint)
The joined body of the present invention may be a joined body connected by the above connection method, and has at least a first electronic component, a second electronic component, and a conductive particle-containing layer, and further if necessary. And other members.
As a preferred embodiment of the present invention, a touch panel device incorporating the joined body can be mentioned.

<Touch panel device>
The touch panel device of the present invention has the joined body of the present invention.

  An example of the touch panel device includes a touch panel and a flexible substrate, for example. In the touch panel device, for example, one of the first electronic component and the second electronic component is the touch panel, and the other is the flexible substrate. In the touch panel device, for example, the touch panel and the flexible printed board are connected by the anisotropic conductive film. The flexible printed circuit board is connected to, for example, a touch panel control circuit (not shown), and detection of an input position and the like are controlled by the touch panel control circuit.

  Examples of the touch panel include a capacitive touch panel.

  The touch panel device may have a display panel. Examples of the display panel include a liquid crystal display panel, an organic light-emitting diode element, and a surface conduction electron-emitting element. In the touch panel device, the touch panel is disposed on a viewer side surface of the display panel.

  Examples of the present invention will be described below, but the present invention is not limited to these examples.

Example 1
<Preparation of anisotropic conductive film>
47 parts by mass of phenoxy resin (trade name: YP-50, manufactured by Nippon Kayaku Epoxy Co., Ltd.), 3 parts by mass of monofunctional monomer having carboxylic acid (trade name: M-5300, manufactured by Toagosei Co., Ltd.), urethane resin (Trade name: UR-1400, manufactured by Toyobo Co., Ltd.) 25 parts by mass, rubber component (trade name: SG80H, manufactured by Nagase ChemteX Corporation), 15 parts by mass, silane coupling agent (trade name: A-187, Momentive・ Performance Materials Japan 2 parts by mass, Au / Ni plated resin particles (average particle size 10 μm, trade name: Micropearl Au, Sekisui Chemical Co., Ltd.) 5 parts by mass, and organic peroxide (product) Name: Nyper BW, manufactured by NOF Corporation) 3 parts by mass is prepared so that the solid content is 50% by mass, and a mixed solution of ethyl acetate and toluene is prepared. .
The formulation composition of Example 1 is shown in Table 1-1 below.

Content of the acrylic group in 100 g of anisotropic conductive films of Example 1 is 0.01 mol. This is obtained as follows.
The structure of a monofunctional monomer having a carboxylic acid (trade name: M-5300) is as follows (ω-carboxy-polycaprolactone (n≈2) monoacrylate, molecular weight is 300, of which acryl group is 71).
CH ₂ = CHCOO (C ₅ H ₁₀ COO) _n H
Therefore, 0.71 g of an acrylic group, that is, 0.01 mol of an acrylic group is contained in 100 g of the anisotropic conductive film of Example 1 containing 3 parts by mass of M-5300.

  Next, this mixed solution was applied onto a polyethylene terephthalate (PET) film having a thickness of 50 μm, and then dried in an oven at 80 ° C. for 3 minutes. By separating the PET film, an anisotropic conductive film having an average thickness of 25 μm was produced.

<Manufacture of joined body and evaluation of joined body>
FPC (polyimide film thickness 25 μm, copper foil 25 μm, 200 μm pitch (line: space = 1: 1, Au plated product) and PET film (50 μm) on which wiring is formed through the produced anisotropic conductive film Were joined to prepare a joined body.
Here, joining of FPC and PET film was performed on condition of the following.

<< Heating and pressurizing conditions >>
ACF width: 2.0mm
ACF thickness: 25 μm
Temporary sticking conditions: 60 ° C./1 MPa / 2 sec
Crimping condition: 160 ° C / 2MPa / 15sec
Next, the following evaluation was performed on the manufactured joined body.

<< Measurement of adhesive strength >>
First, the PET film side of the joined body was fixed to a glass plate having a thickness of 0.7 mm with a double-sided tape. Thereafter, using a peel tester (TENSILON, manufactured by Orientec Co., Ltd.), the above bonded body was subjected to a 90-degree peel test at a peel rate of 50 mm / min, and the adhesive strength was measured in accordance with JIS K6854-1 (1999). did. The adhesive strength was evaluated by measuring the initial adhesive strength and the adhesive strength after an environmental test (left at 60 ° C. and 95% RH for 200 hours) according to the following criteria.
[Evaluation criteria for initial bond strength]
○: 5 N / cm or more Δ: 3 N / cm or more and less than 5 N / cm x: less than 3 N / cm [Evaluation criteria of adhesive strength after environmental test]
○: 4 N / cm or more Δ: 2 N / cm or more and less than 4 N / cm ×: less than 2 N / cm The results of evaluating the pressure bonding temperature and adhesive strength when obtaining a bonded body are shown in Table 1-1 below.

(Examples 2 to 10)
In Example 1, the composition of the anisotropic conductive film was changed as shown in Table 1-1 and Table 1-2, and the pressure bonding temperature at the time of manufacturing the joined body was shown in Table 1-1 and Table 1-2. An anisotropic conductive film and a joined body were produced in the same manner as in Example 1 except that the procedure was changed as described above.

In addition, the structure of the monofunctional monomer (trade name: HOA-MS (N) manufactured by Kyoeisha Chemical Co., Ltd.) having a carboxylic acid used in Example 5 is as follows (2-acryloyloxyethyl-succinic acid). The molecular weight is 216, of which 71 is an acrylic group.
CH ₂ = CHCOOCH ₂ CH ₂ OCOCH ₂ CH ₂ COOH
Therefore, 3.29 g of acrylic groups, that is, 0.046 mol of acrylic groups are contained in 100 g of the anisotropic conductive film of Example 5 in which 10 parts by mass of HOA-MS (N) is blended. .

The bifunctional monomer (trade name: DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.) used in Example 6 is tricyclodecane dimethanol dimethacrylate (molecular weight is 332, of which acrylic group is 71 × 2 = 142). .
Therefore, by adding 2 parts by mass of DCP, 0.86 g of an acrylic group, that is, 0.006 mol of an acrylic group is contained in 100 g of the anisotropic conductive film.
Therefore, 0.04 mol of acrylic groups are contained in 100 g of the anisotropic conductive film of Example 6 in which 2 parts by mass of DCP and 10 parts by mass of M-5300 are blended.

The structure of the monofunctional monomer having no carboxylic acid used in Example 10 (trade name: M102, manufactured by Toagosei Co., Ltd.) is as follows (phenol EO-modified acrylate, molecular weight: 236, of which the acrylic group is 71).
_{CH 2 = CHCO (OC 2 H} 4) n O-Ph
In the above structural formula, n≈2.
Therefore, by blending 3 parts by mass of M102, 100 g of anisotropic conductive film contains 0.90 g of acrylic groups, that is, 0.013 mol of acrylic groups.
Therefore, 0.023 mol of acrylic groups are contained in 100 g of the anisotropic conductive film of Example 10 in which 3 parts by mass of M-5300 and 3 parts by mass of M102 are blended.

  About the obtained joined body, evaluation similar to Example 1 was performed. The results are shown in Table 1-1 and Table 1-2.

(Comparative Examples 1 to 7)
In Example 1, the composition composition of the anisotropic conductive film was changed as shown in Table 2-1 and Table 2-2, and the pressure bonding temperature at the time of manufacturing the joined body was shown in Table 2-1 and Table 2-2. An anisotropic conductive film and a joined body were produced in the same manner as in Example 1 except that the procedure was changed as described above.
About the obtained joined body, evaluation similar to Example 1 was performed. The results are shown in Table 2-1 and Table 2-2.

From Examples 1 to 10, even when the anisotropic conductive film of the present invention is a target for bonding a plastic substrate and bonded at a low temperature, the adhesive film has excellent adhesiveness and greatly reduces the adhesive strength after an environmental test. It was confirmed that it was not generated.
From the results of Examples 6 and 7, a bifunctional monomer may be included as a (meth) acrylic monomer, but 80% by mass or more of the (meth) acrylic monomer is a (meth) acrylic monofunctional monomer. It turns out that it is more preferable.
By comparing the results of Examples 1, 3, and 10, as long as a (meth) acrylic monomer having a carboxylic acid is contained, the acrylic group is defined in the present invention regardless of the amount of carboxylic acid. It was found that the desired effect of the present invention can be obtained if the number of moles is within the range.
From Comparative Examples 1 to 4, it was confirmed that if the (meth) acrylic monomer having carboxylic acid was not contained, the desired effect of the present invention could not be obtained even if the blending amount was changed.
Moreover, even if it contains the (meth) acryl monofunctional monomer which has carboxylic acid from the comparative example 5, if the acrylic group is not contained in the range of the number-of-moles prescribed | regulated by this invention, the effect which this invention desires I can't get.
By comparing the results of Example 3 and Comparative Examples 5 and 6, even if a (meth) acrylic monomer having a carboxylic acid is contained, the acrylic group is not within the range of the number of moles specified in the present invention. It has been found that the desired effect of the present invention cannot be obtained regardless of the amount of carboxylic acid.
From Comparative Example 7, even if the acrylic group is within the range of the number of moles specified in the present invention, it is not desired to have a carboxylic acid and to contain only a bifunctional monomer instead of a monofunctional monomer. It was found that the effect of

  The anisotropic conductive film of the present invention is an anisotropic conductive film that is excellent in adhesiveness even at low-temperature pressure bonding and does not cause a significant decrease in adhesive strength after an environmental test. Can be suitably used as a connection material in the production. In particular, when the anisotropic conductive film of the present invention is used when at least one electronic component is formed on a plastic substrate, it exhibits excellent adhesiveness and adhesive strength even at low-temperature fixing. Demonstrated.

Claims (15)

An anisotropic conductive film containing at least a (meth) acrylic monomer and a binder ,
The (meth) acrylic monomer contains a (meth) acrylic monomer having at least a carboxylic acid,
An anisotropic conductive film comprising 0.01 to 0.068 mol of (meth) acrylic group in 100 g of the anisotropic conductive film.   The anisotropic conductive film according to claim 1, wherein the (meth) acrylic monomer having a carboxylic acid is a (meth) acrylic monofunctional monomer having a carboxylic acid. Furthermore, the anisotropic conductive film of Claim 1 or 2 containing an elastomer. The anisotropic conductive film according to any one of claims 1 to 3, wherein the (meth) acrylic monomer further contains a (meth) acrylic monomer having no carboxylic acid. An anisotropic conductive film for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,
The anisotropic conductive film in any one of Claim 1 to 4 used for heating the said anisotropic conductive film at 140 to 180 degreeC from the said 1st electronic component side. An anisotropic conductive film for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,
The anisotropic conductive film according to claim 1, which is used to press the anisotropic conductive film at 2 MPa or less from the first electronic component side. An anisotropic conductive film for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,
The anisotropic conductive film according to claim 1, wherein at least one of the first electronic component and the second electronic component is a flexible substrate. An anisotropic conductive film for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,
The anisotropic conductive film according to claim 1, wherein at least one of the first electronic component and the second electronic component is a rigid substrate. An anisotropic conductive connection by heating and pressing the first electronic component and the second electronic component from the first electronic component side through the anisotropic conductive film according to any one of claims 1 to 6. A method for producing a joined body. The method for manufacturing a joined body according to claim 9, wherein at least one of the first electronic component and the second electronic component is a flexible substrate. The method for manufacturing a joined body according to claim 9, wherein at least one of the first electronic component and the second electronic component is a rigid substrate. The method for manufacturing a joined body according to claim 9, wherein the pressing is performed under a pressure condition of 2 MPa or less. A joined body in which the first electronic component and the second electronic component are anisotropically conductively connected via a cured product of the anisotropic conductive film according to any one of claims 1 to 6. The joined body according to claim 13, wherein at least one of the first electronic component and the second electronic component is a flexible substrate. The joined body according to claim 13, wherein at least one of the first electronic component and the second electronic component is a rigid substrate.