JP2012054568A - Method of producing joint - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of producing a joint which enhances adhesion of an anisotropic conductive film by preventing oxidation of a connection terminal.SOLUTION: An anisotropic conductive film 4 is arranged on a connection surface where an insulating film 3 covers above and between the connection terminals 2 of a first electronic component 1 flatly, and conductive particles penetrate the insulating film 3 above the connection terminals 2 thus attaining conduction. Consequently, oxidation of the connection terminals 2 can be prevented, adhesion of the anisotropic conductive film is enhanced and the temperature capable of temporary pasting can be lowered. Furthermore, short circuit between adjoining connection terminals can be prevented.

Description

  The present invention relates to a method for manufacturing a joined body in which an electronic component is joined through an anisotropic conductive film in which conductive particles are dispersed.

  Conventionally, substrates such as LCD (Liquid Crystal Display) panels and PD (Plasma Display) panels and wiring materials such as FPC (Flexible Printed Circuits), COF (Chip On Film), and TCP (Tape Carrier Package) are anisotropic. The method of connecting by an electroconductive film (ACF: Anisotropic Conductive Film) is used.

  For example, Patent Document 1 describes that high durability is obtained by covering a part of a wiring material with a resist layer and allowing ACF that flows during pressure bonding to reach the resist layer. Patent Document 2 describes that a resin insulating film is applied to the periphery of the connection terminal to improve the adhesive strength.

JP 2010-199527 A JP 2003-243821 A

  In the techniques described in Patent Documents 1 and 2, since the connection terminal is exposed, for example, the surface of the connection terminal is plated with gold to prevent oxidation of the connection terminal. However, since the adhesion between the gold plating and the ACF is not good, a high temperature is required for temporarily attaching the ACF.

  This invention is proposed in view of the conventional situation, and provides the manufacturing method of the joined body which prevents the oxidation of a connection terminal and improves the adhesiveness of an anisotropic conductive film.

  In order to solve the above-described problems, a method for manufacturing a joined body according to the present invention includes an anisotropic conductive material on a connection surface in which an insulating film is flatly coated on the connection terminals and between the connection terminals of the first electronic component. Temporary pasting step of temporarily pasting the film, placing a connection terminal of the second electronic component on the anisotropic conductive film, causing the first electronic component and the second electronic component to be finally crimped, And a main pressure bonding step of penetrating an insulating film on the connection terminal with conductive particles.

  In addition, the bonded body according to the present invention is electrically connected to the first electronic component in which the insulating film is flatly coated on the connection terminals and between the connection terminals, and the connection terminal of the first electronic component. A second electronic component is provided, and the insulating film on the connection terminal is penetrated by conductive particles.

  According to the present invention, since the insulating film is flatly coated on the connection terminals and between the connection terminals, it is possible to prevent the connection terminals from being oxidized. Moreover, the adhesiveness of an anisotropic conductive film improves and the temperature which can be temporarily stuck can be reduced. Furthermore, since the insulating film on the connection terminal is penetrated by the conductive particles during the main pressure bonding, it is possible to prevent a short circuit from occurring between the adjacent connection terminals.

It is sectional drawing which shows typically the state which temporarily bonded the anisotropic conductive film to the connection surface of the 1st electronic component. It is sectional drawing which shows typically the joined body of the layer structure I produced using PCB by which the resist was coat | covered flatly on the connecting terminal and between connecting terminals. It is sectional drawing which shows typically the joined body of the layer structure II produced using PCB and FPC by which the resist was coat | covered flatly on the connection terminal and between connection terminals. It is sectional drawing which shows typically the joined body of the layer structure III produced using conventional PCB and FPC. It is sectional drawing which shows typically the joined body of the layer structure IV produced using PCB by which the resist was apply | coated between the connection terminals. It is a schematic diagram which shows the process of temporarily sticking an anisotropic conductive film on PCB using a thermal tool. It is a schematic diagram which shows the process of peeling off a peeling sheet using a peeling tool.

Hereinafter, embodiments of the present invention will be described in detail in the following order with reference to the drawings.
1. 1. Bonded body and manufacturing method thereof Example

<1. Bonded body and manufacturing method thereof>
The manufacturing method of the joined body in the present embodiment is a temporary pasting step in which an anisotropic conductive film is temporarily pasted on a connection surface in which an insulating film is flatly coated on the connection terminals and between the connection terminals of the first electronic component. Then, the connection terminal of the second electronic component is disposed on the anisotropic conductive film, the first electronic component and the second electronic component are finally bonded, and the insulating film on the connection terminal is penetrated by the conductive particles. And a final press bonding step.

  The first electronic component is, for example, a substrate such as an LCD (Liquid Crystal Display) panel or a PD (Plasma Display) panel, and has a connection terminal for connecting to the second electronic component. The second electronic component is, for example, a wiring material such as FPC (Flexible Printed Circuits), COF (Chip On Film), or TCP (Tape Carrier Package), and a connection terminal for connecting to the first electronic component. Is formed.

  FIG. 1 is a cross-sectional view schematically illustrating a state in which an anisotropic conductive film is temporarily attached to a connection surface of a first electronic component. The first electronic component 1 has a connection surface in which an insulating film 3 is flatly coated on the connection terminals 2 and between the connection terminals 2. Thereby, the oxidation of the connection terminal 2 can be prevented. Moreover, the adhesiveness of the anisotropic conductive film 4 improves, and the temperature which can be temporarily stuck can be reduced.

  Moreover, since the insulating film 3 is applied between the connection terminals 2, the filling amount of the anisotropic conductive film 4 can be reduced, and the thickness of the anisotropic conductive film 4 can be reduced. Therefore, when providing the reel body in which the anisotropic conductive film 4 is wound, the length of the anisotropic conductive film 4 can be increased.

  As the insulating film 3, a resist functioning as a protective film is used, and for example, a solder resist applied to the insulating portion of the substrate is optimally used. As a method for applying the resist, it is preferable to use a squeegee or the like in order to apply the resist on the connection terminal in a planar shape. Specifically, a liquid resist is applied onto the connection terminals 2 and between the connection terminals 2 using a squeegee, and semi-curing with heat, curing with UV (ultraviolet), and post-curing with heat are performed. As described above, a step of applying and curing the liquid insulating material on the connection terminals and between the connection terminals of the first electronic component using the squeegee may be provided before the temporary sticking step.

  Since the conductive particles 5 dispersed in the anisotropic conductive film 4 need to have hardness for penetrating the insulating film 3, the core material is, for example, nickel, iron, copper, aluminum, tin, A metal or alloy such as lead, chromium, cobalt, silver, or gold is preferable. The average particle diameter d of the conductive particles 5 is preferably equal to or greater than the thickness h of the insulating film 3 on the connection terminal 2. Thereby, a favorable conduction resistance can be obtained in the joined body. In addition, the average particle diameter in this specification is the median diameter d50 measured by the laser diffraction method.

  Moreover, the anisotropic conductive film 4 contains a thermosetting resin component and a curing agent. Examples of the thermosetting resin component include various epoxy resins, thermosetting resins such as epoxy (meth) acrylate, urethane-modified (meth) acrylate, and the like. These resins may be contained alone or in combination of two or more. What is necessary is just to select a hardening | curing agent according to the kind of thermosetting resin component to be used. For example, when using an acrylate-based resin such as epoxy (meth) acrylate or urethane-modified (meth) acrylate as the thermosetting resin component, for example, peroxide can be used as the curing agent, Can include, for example, lauroyl peroxide. Further, for example, when the thermosetting resin component uses an epoxy resin, an imidazole-based latent curing agent can be exemplified.

  In addition, the second electronic component is preferably covered with an insulating film on the connection terminals and between the connection terminals. Thereby, the filling amount of the anisotropic conductive film 4 can be further reduced, and the thickness of the anisotropic conductive film 4 can be further reduced. In this case, the average particle diameter of the conductive particles 5 is preferably equal to or greater than the thickness of the insulating film on the connection terminals of the first electronic component and the second electronic component. When the average particle diameter of the conductive particles 5 is equal to or greater than the total thickness of the insulating film on the connection terminal, a good conduction resistance can be obtained in the joined body.

  In the bonded body in this embodiment, an insulating film is filled between the connection terminals, and conduction is obtained when the insulating film on the connection terminal penetrates with the conductive particles. Have excellent characteristics.

<2. Example>
Examples of the present invention will be described below. Here, PCB (Printed Circuit Board) is used as a substrate and FPC (Flexible Printed Circuits) is used as a wiring material, and these are connected by an anisotropic conductive film (ACF).

  In Examples 1 to 7 and Reference Example 1, as shown in FIG. 2, a bonded structure having a layer structure I was manufactured using PCB 10 in which a resist 12 was flatly coated on the connection terminals 11 and between the connection terminals 11. . Further, in Examples 8 to 14 and Reference Example 2, as shown in FIG. 3, the PCB 10 on which the resist 12 is flatly coated on the connection terminals 11 and between the connection terminals 11, and on the connection terminals 41 and between the connection terminals 41. A joined body having a layer structure II was manufactured using the FPC 40 on which the resist 42 was flatly coated. In Comparative Example 1, as shown in FIG. 4, a bonded body having a layer structure III was manufactured using a conventional PCB 100 and FPC 110. In Comparative Examples 2 to 5, as shown in FIG. 5, a bonded body having a layer structure IV was manufactured using PCB 120 in which a resist 122 was applied between connection terminals 121. About each joined body, the conduction resistance, the adhesive strength, the insulation resistance, and the temperature which can be temporarily attached were measured and evaluated. The present invention is not limited to these examples.

[Measurement and evaluation of conduction resistance]
With respect to each joined body, a conduction resistance value (initial) was measured when a current of 1 mA was passed by a four-terminal method using a digital multimeter (product number: digital multimeter 7555, manufactured by Yokogawa Electric Corporation). And the thing with a conduction resistance value of less than 2Ω was evaluated as Rank A, the one with energization but 2Ω or more was evaluated as Rank B, and the one with Open was evaluated as Rank C.

[Measurement and evaluation of adhesive strength]
About each joined body, FPC cut to 1 cm width using a tensile tester (Tensilon, manufactured by Orientec Co., Ltd.) was pulled up to 90 degrees (Y-axis direction) at a peeling speed of 50 mm / min, and the adhesive strength was measured. Those having an adhesive strength of 10 N / cm or more were evaluated as Rank A, those having an adhesive strength of 6 N / cm or more and less than 10 N / cm as Rank B, and those having an adhesive strength of 6 N / cm or less as Rank C.

[Measurement and evaluation of insulation resistance]
For each joined body, measurement of insulation resistance value (initial) between adjacent terminals when a current of 1 mA was passed by a four-terminal method using a digital multimeter (part number: digital multimeter 7555, manufactured by Yokogawa Electric Corporation). went. Then, those having an insulation resistance value of 10 ⁹ Ω or more were evaluated as Rank A, those having an insulation resistance value of 10 ⁸ Ω or more and less than 10 ⁹ Ω as Rank B, and those having an insulation resistance value of less than 10 ⁸ Ω as Rank C.

[Measurement and Evaluation of Temporary Pasting Temperature]
An anisotropic conductive film 70 was temporarily pasted on the PCB 60 using the crimping machine 50 shown in FIG. Specifically, the heating tool 52 was set so that the anisotropic conductive film 70 was at a predetermined temperature by thermocouple measurement, and the anisotropic conductive film 70 was temporarily attached onto the PCB 60 fixed on the stage 51. Thereafter, as shown in FIG. 7, the heating tool 52 was raised, and the release sheet 71 was peeled off by the release tool 53. And the minimum temperature which can peel off the peeling sheet 71 from the anisotropic conductive film 70 was made into temporary attachment temperature.

[Example 1]
(Anisotropic conductive film)
8 parts by mass of conductive particles having an average particle diameter of 6 μm made of Au-plated Ni particles, 22 parts by mass of phenoxy resin (YP-50, Toto Kasei Co., Ltd.), dicyclopentadiene dimethacrylate (DCP, Shin-Nakamura Chemical Co., Ltd.) )) 5 parts by mass, urethane acrylate (M-1600, Toagosei Co., Ltd.) 10 parts by mass, acrylic rubber (SG-80H, Nagase ChemteX Corporation) 5 parts by mass, phosphorus-containing methacrylate (PM2, Nippon Kayaku) Ltd.) 1 part by mass, 2 parts by mass of a diacyl peroxide initiator (Perroyl L, NOF Corporation), and 50 parts by mass of toluene were mixed, and the resulting mixture was dried on a release sheet with a dry thickness of 16 μm. The anisotropic conductive film was obtained by apply | coating so that it might become, and drying at 80 degreeC for 5 minute (s).

Moreover, it was 6000 kgf / mm < ² > when the compression hardness at the time of 10% compression displacement of electroconductive particle was measured using the micro compression tester (PCT-200, Shimadzu Corporation Corp.).

(Joint)
As shown in FIG. 2, PCB 10 (FR-4 grade: copper wiring pitch 200 μm, wiring height 35 μm) coated with resist 12 on connection terminal 11 and FPC 30 (polyimide thickness 38 μm, copper wiring pitch 200 μm, wiring height) 8 μm) was anisotropically conductively connected under the heating and pressing conditions of 170 ° C., 4 MPa, and 5 seconds using the anisotropic conductive film, to produce a layered structure I joined body.

(Evaluation)
The temporarily stickable temperature of the joined body of Example 1 was 35 ° C. or higher. The evaluation of conduction resistance was A, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 1 shows these results.

[Example 2]
A joined body having a layer structure I was prepared in the same manner as in Example 1 except that PCB 10 (FR-4 grade: copper wiring pitch 200 μm, wiring height 35 μm) coated with 3 μm of resist 12 on connection terminal 11 was used. . The temporarily stickable temperature of the joined body of Example 2 was 35 ° C. or higher. The evaluation of conduction resistance was A, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 1 shows these results.

[Example 3]
A joined body having a layer structure I was produced in the same manner as in Example 1 except that PCB 10 (FR-4 grade: copper wiring pitch 200 μm, wiring height 35 μm) coated with resist 12 on connection terminal 11 was used. . The temporarily pastable temperature of the joined body of Example 3 was 35 ° C. or higher. The evaluation of conduction resistance was C, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 1 shows these results.

[Example 4]
A bonded structure having a layer structure I was prepared in the same manner as in Example 1 except that an anisotropic conductive film containing conductive particles having an average particle diameter of 3 μm was used. The temporarily pastable temperature of the joined body of Example 4 was 35 ° C. or higher. The evaluation of conduction resistance was A, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 1 shows these results.

[Example 5]
An anisotropic conductive film containing conductive particles having an average particle diameter of 3 μm was used, and PCB 10 (FR-4 grade: copper wiring pitch 200 μm, wiring height 35 μm) in which resist 12 was coated on connection terminals 11 by 3 μm was used. Except for the above, a bonded structure having the layer structure I was produced in the same manner as in Example 1. The temporarily pastable temperature of the joined body of Example 5 was 35 ° C. or higher. The evaluation of conduction resistance was B, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 1 shows these results.

[Example 6]
An anisotropic conductive film containing conductive particles having an average particle diameter of 3 μm was used, and PCB 10 (FR-4 grade: copper wiring pitch 200 μm, wiring height 35 μm) in which resist 12 was coated on connection terminals 11 by 8 μm was used. Except for the above, a bonded structure having the layer structure I was produced in the same manner as in Example 1. The temporarily pastable temperature of the joined body of Example 6 was 35 ° C. or higher. The evaluation of conduction resistance was C, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 1 shows these results.

[Example 7]
PCB10 (FR-4 grade: copper wiring pitch 200 μm) in which an anisotropic conductive film composed of Au / Ni plated resin particles and containing conductive particles with an average particle diameter of 5 μm is coated with 3 μm of resist 12 on connection terminals 11 Except for using a wiring height of 35 μm, a joined body having a layer structure I was produced in the same manner as in Example 1. The temporarily stickable temperature of the joined body of Example 7 was 35 ° C. or higher. The evaluation of conduction resistance was C, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 1 shows these results. In addition, it was 700 kgf / mm < ² > when the compression hardness at the time of 10% compression displacement of the electroconductive particle which consists of Au / Ni plating resin particle | grains was measured using the micro compression tester (PCT-200, Shimadzu Corporation Corp.). Met.

[Reference Example 1]
A bonded structure having a layer structure I was prepared in the same manner as in Example 1 except that an anisotropic conductive film having a thickness of 35 μm was used. The temporarily stickable temperature of the joined body of Reference Example 1 was 40 ° C. or higher. The evaluation of conduction resistance was C, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 1 shows these results.

[Example 8]
As shown in FIG. 3, PCB 10 (FR-4 grade: copper wiring pitch 200 μm, wiring height 35 μm) coated with 1 μm of resist 12 on connecting terminal 11 and FPC 40 coated with resist 42 of 1 μm on connecting terminal 41 are shown. (A polyimide thickness of 38 μm, a copper wiring pitch of 200 μm, and a wiring height of 8 μm) were heated at 170 ° C., 4 MPa, and 5 seconds using an anisotropic conductive film having a thickness of 8 μm mixed with conductive particles having an average particle diameter of 6 μm. An anisotropic conductive connection was made under pressure conditions to produce a layered structure II joined body.

  The temporarily stickable temperature of the joined body of Example 8 was 35 ° C. or higher. The evaluation of the conduction resistance was A, the evaluation of the adhesive strength was A, and the evaluation of the insulation resistance was A. Table 2 shows these results.

[Example 9]
A joined body having a layer structure II was produced in the same manner as in Example 8 except that FPC 40 (polyimide thickness 38 μm, copper wiring pitch 200 μm, wiring height 8 μm) coated with 3 μm of resist 42 on connection terminal 41 was used. The temporarily stickable temperature of the joined body of Example 9 was 35 ° C. or higher. The evaluation of the conduction resistance was A, the evaluation of the adhesive strength was A, and the evaluation of the insulation resistance was A. Table 2 shows these results.

[Example 10]
A joined body having a layer structure II was produced in the same manner as in Example 8 except that PCB 10 (FR-4 grade: copper wiring pitch 200 μm, wiring height 35 μm) coated with 3 μm of resist 12 on connection terminal 11 was used. . The temporarily pastable temperature of the joined body of Example 10 was 35 ° C. or higher. The evaluation of the conduction resistance was A, the evaluation of the adhesive strength was A, and the evaluation of the insulation resistance was A. Table 2 shows these results.

[Example 11]
PCB 10 (FR-4 grade: copper wiring pitch 200 μm, wiring height 35 μm) coated with resist 12 on connection terminal 11 and FPC 40 (polyimide thickness 38 μm, copper wiring coated with resist 42 3 μm on connection terminal 41) A joined body having a layer structure II was produced in the same manner as in Example 8 except that a pitch of 200 μm and a wiring height of 8 μm were used. The temporarily stickable temperature of the joined body of Example 11 was 35 ° C. or higher. The evaluation of conduction resistance was B, the evaluation of adhesive strength was A, and the evaluation of insulation resistance was A. Table 2 shows these results.

[Example 12]
A layered structure II assembly was produced in the same manner as in Example 8 except that PCB 10 (FR-4 grade: copper wiring pitch 200 μm, wiring height 18 μm) having a wiring height of the connection terminal 11 of 18 was used. The temporarily pastable temperature of the joined body of Example 12 was 35 ° C. or higher. The evaluation of the conduction resistance was A, the evaluation of the adhesive strength was A, and the evaluation of the insulation resistance was A. Table 2 shows these results.

[Example 13]
A joined body having a layer structure II was produced in the same manner as in Example 8 except that FPC 40 (polyimide thickness: 75 μm, copper wiring pitch: 200 μm, wiring height: 35 μm) having a wiring height of the connection terminal 41 of 35 μm was used. The temporarily stickable temperature of the joined body of Example 13 was 35 ° C. or higher. The evaluation of the conduction resistance was A, the evaluation of the adhesive strength was A, and the evaluation of the insulation resistance was A. Table 2 shows these results.

[Example 14]
A joined body having a layer structure II was produced in the same manner as in Example 8 except that an anisotropic conductive film having a thickness of 16 μm was used. The temporarily pastable temperature of the joined body of Example 14 was 35 ° C. or higher. The evaluation of conduction resistance was C, the evaluation of adhesive strength was A, and the evaluation of insulation resistance was A. Table 2 shows these results.

[Reference Example 2]
A joined body having a layer structure II was produced in the same manner as in Example 8 except that an anisotropic conductive film having a thickness of 35 μm was used. The temporarily stickable temperature of the joined body of Reference Example 2 was 40 ° C. or higher. The evaluation of conduction resistance was C, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 2 shows these results.

[Comparative Example 1]
As shown in FIG. 4, PCB100 (FR-4 grade: copper wiring pitch 200 μm, wiring height 35 μm) and FPC110 (polyimide thickness 38 μm, copper wiring pitch 200 μm, wiring height 8 μm) are electrically conductive with an average particle diameter of 6 μm. Using an anisotropic conductive film having a thickness of 35 μm blended with particles, anisotropic conductive connection was performed under heating and pressurization conditions of 170 ° C., 4 MPa, and 5 seconds, to prepare a layered structure III joined body.

  The temporarily stickable temperature of the joined body of Comparative Example 1 was 60 ° C. or higher. The evaluation of conduction resistance was A, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 3 shows these results.

[Comparative Example 2]
As shown in FIG. 5, PCB 120 (FR-4 grade: copper wiring pitch 200 μm, wiring height 35 μm) coated with a resist 122 between connection terminals 121 and FPC 110 (polyimide thickness 38 μm, copper wiring pitch 200 μm, wiring height 8 μm). ) With an anisotropic conductive film having a thickness of 35 μm mixed with conductive particles having an average particle diameter of 6 μm under a heat and pressure condition of 170 ° C., 4 MPa, 5 seconds, and a layer structure A joined body of IV was prepared.

  The temporarily stickable temperature of the joined body of Comparative Example 2 was 40 ° C. or higher. The evaluation of conduction resistance was C, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 3 shows these results.

[Comparative Example 3]
A bonded structure having a layer structure IV was produced in the same manner as in Comparative Example 2 except that an anisotropic conductive film having a thickness of 16 μm was used. The temporarily pastable temperature of the joined body of Comparative Example 3 was 40 ° C. or higher. The evaluation of conduction resistance was A, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 3 shows these results.

[Comparative Example 4]
The same as Comparative Example 2 except that PCB 120 (FR-4 grade: copper wiring pitch 200 μm, wiring height 18 μm) with a wiring height of the connecting terminal 121 and an anisotropic conductive film with a thickness of 16 μm were used. Thus, a joined body having a layer structure IV was produced. The temporarily pastable temperature of the joined body of Comparative Example 4 was 40 ° C. or higher. The evaluation of conduction resistance was A, the evaluation of adhesive strength was B, and the evaluation of insulation resistance was A. Table 3 shows these results.

[Comparative Example 5]
Except for using FPC110 (polyimide thickness 75 μm, copper wiring pitch 200 μm, wiring height 35 μm) having a wiring height of connection terminal 111 and an anisotropic conductive film having a thickness of 16 μm, the same as Comparative Example 2 A joined body having a layer structure IV was produced. The temporarily pastable temperature of the joined body of Comparative Example 4 was 40 ° C. or higher. The evaluation of conduction resistance was A, the evaluation of adhesive strength was C, and the evaluation of insulation resistance was A. Table 3 shows these results.

  As shown in Examples 1 to 14, by covering the connection terminals and between the connection terminals flatly with an insulating film, the adhesion of the anisotropic conductive film can be improved and the temperature at which temporary bonding can be performed can be lowered. I understand that I can do it. Further, it can be seen from the comparison between the example and the comparative example that the ACF thickness can be reduced by using the joined structure of the layer structures I and II.

  In addition, comparison between Example 2 and Example 7 makes it possible to penetrate the resist on the connection terminal with the conductive particles because the core material of the conductive particles is a metal or alloy harder than the resist. It can be seen that an excellent conduction resistance can be obtained.

  Further, by comparing Examples 1, 2, 4, 5 and Examples 3 and 6, the average particle diameter of the conductive particles is equal to or greater than the thickness of the resist on the connection terminal, so that excellent conduction resistance is obtained. You can see that Further, when the resist 42 is applied on the connection terminal 41 of the FCP 40 as shown in Examples 8 to 14, the average particle diameter of the conductive particles is the resist 12 on the connection terminal 11 of the PCB 10 and the connection terminal 41 of the FCP 40. It can be seen that an excellent conduction resistance can be obtained when the total thickness with the resist 42 is not less than the total thickness.

  Further, as shown in Examples 8 to 14, it can be seen that according to the joined body of the layer structure II, the thickness of the ACF can be made smaller than that of the joined body of the layer structure I.

  DESCRIPTION OF SYMBOLS 1 1st electronic component, 2 connection terminal, 3 insulating film, 4 anisotropic conductive film, 5 conductive particle, 10 PCB, 11 connection terminal, 12 resist, 20 anisotropic conductive film, 21 conductive particle, 30 FPC, 31 connection terminal, 40 FPC, 41 connection terminal, 42 resist, 100 PCB, 101 connection terminal, 110 FPC, 111 connection terminal, 120 PCB, 121 connection terminal, 122 resist

Claims (7)

A temporary pasting step of temporarily pasting an anisotropic conductive film on a connection surface in which an insulating film is flatly coated on the connection terminals and between the connection terminals of the first electronic component;
A connection terminal of a second electronic component is disposed on the anisotropic conductive film, the first electronic component and the second electronic component are finally pressure-bonded, and the insulating film on the connection terminal is formed of conductive particles. A method of manufacturing a joined body, comprising: a main press-bonding step that is caused to pass through. The core material of the conductive particles is a metal or an alloy,
The method for manufacturing a joined body according to claim 1, wherein the insulating film is a resist.   The method for manufacturing a joined body according to claim 1 or 2, wherein an average particle diameter of the conductive particles is equal to or greater than a thickness of the insulating film on the connection terminal.   3. The method for manufacturing a joined body according to claim 1, wherein the second electronic component has an insulating film coated flatly on the connection terminals and between the connection terminals.   The method for manufacturing a joined body according to claim 4, wherein an average particle diameter of the conductive particles is equal to or greater than a thickness of an insulating film on a connection terminal of the first electronic component and the second electronic component.   The joined body according to any one of claims 1 to 5, further comprising a step of applying and curing a liquid insulating material on the connection terminals and between the connection terminals of the first electronic component using a squeegee. Production method. A first electronic component in which an insulating film is flatly coated on the connection terminals and between the connection terminals;
A second electronic component electrically connected to the connection terminal of the first electronic component;
A joined body in which an insulating film on the connection terminal is penetrated by conductive particles.

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