JPWO2013021936A1 - Conductive adhesive tape roll - Google Patents

Abstract

Provided is a conductive adhesive tape wound body that does not cause blocking and that can reduce variations in connection reliability of the obtained circuit connection body. In a conductive adhesive tape winding body comprising: a reel comprising a cylindrical core portion and flanges attached to both sides of the core portion; and a conductive adhesive tape wound around the core portion, The peel strength between the flange and the conductive adhesive constituting the conductive adhesive tape is 1.5 N / 25 mm or less. The flange is a material having a peel strength of 1.5 N / 25 mm or less with respect to the conductive adhesive, preferably a molded article of a hydrocarbon resin.

Description

  The present invention relates to a conductive adhesive tape wound body in which a conductive adhesive tape formed by laminating a film-like conductive adhesive such as a film-like anisotropic conductive adhesive on a base tape is wound around a reel, In detail, when manufacturing a conductive adhesive tape wound body, the adhesive does not easily adhere to the flange of the reel, and for the user, the conductive adhesive tape has good drawability of the conductive adhesive tape from the wound body. It relates to a tape wound body.

  A film-like anisotropic conductive adhesive used for adhesion between circuit boards such as a glass panel of a liquid crystal display (LCD) and a flexible printed circuit board (FPC) is usually a separator, as shown in FIG. A core portion 1 wound as a state (conductive adhesive tape) 10 in which an anisotropic conductive adhesive layer is laminated on a substrate film, and flanges 2 attached to both sides of the core portion 1; It is shipped as a conductive adhesive tape wound body wound around a reel 3 having 2 and is used by being pulled out of the conductive adhesive tape wound body by a user.

  Such a wound body of conductive adhesive tape is usually produced at the production site by coating an adhesive layer on a wide substrate film and then cutting the reel core portion into a thin tape shape. 1 is wound up. The flange 2 of the reel also serves to separate the cut narrow tape from the adjacent narrow tape.

  In the reel, the distance (D) between the flanges is set larger than the width (a) of the conductive adhesive tape, and the conductive adhesive tape 10 is wound around the substantially central portion of the core 1 as shown in FIG. Spaces 4 and 4 are provided on both sides of the taken and wound conductive adhesive tape 10. This space 4 has a clearance that prevents a small amount of adhesive protruding from the base film from adhering to the flange 2 due to a difference in expansion and contraction between the base film and the adhesive layer due to a change in temperature environment or the like, or due to a decrease in the viscosity of the adhesive. It also plays a role.

  However, at the production site, as shown in FIG. 2 (a), the conductive adhesive tape 10 is not necessarily wound around the central portion of the core part 1, but as shown in FIG. 2 (b). In some cases, the flange 4 is shifted to either side of the flange 4 and wound up.

  In the conductive adhesive tape wound body wound up as shown in FIG. 2 (b), the adhesive that forms the adhesive layer is formed when wound on the reel 3 or when the conductive adhesive tape wound body is stored. In some cases, the surface of the flange 2 on the tape winding side (hereinafter referred to as “flange inner side surface”) 2a has adhered. When the adhesive adheres to the flange inner side surface 2a, the production of the user who pulls out the conductive adhesive tape 10 with a constant pulling force from the wound conductive adhesive tape and uses it for the bonding process of the adherend such as the substrate. A phenomenon that the conductive adhesive tape 10 cannot be pulled out (hereinafter referred to as “blocking”) occurs at the site, which causes a decrease in yield at the automatic production site.

  Under such circumstances, as a measure for preventing the occurrence of blocking, various studies have been made on a winding method of a thin conductive adhesive tape, a reel, a conductive adhesive tape, and the like.

  For example, in Japanese Patent Application Laid-Open No. 2011-32318 (Patent Document 1), with respect to the adhesive layer applied on the base film, a part of the adhesive layer located at a portion corresponding to the edge of the base film is cured or It has been proposed to disappear.

  Japanese Unexamined Patent Application Publication No. 2011-58007 (Patent Document 2) proposes providing a protrusion on the edge of the base film. This protrusion is in contact with the flange inner surface, thereby preventing the adhesive layer or the adhesive layer portion from contacting the flange inner surface.

  On the other hand, as a technique for suppressing the occurrence of blocking by devising a reel instead of an adhesive tape, it was attached to both sides of a winding portion corresponding to a winding core in Japanese Patent Application Laid-Open No. 2011-20859 (Patent Document 3). It has been proposed that convex portions be provided continuously or intermittently on a pair of flange portions, that is, on the flange inner surface. Since the convex portion can maintain a separation distance between the adhesive tape and the flange inner surface in the wound body, the adhesive layer can be prevented from adhering to the flange inner surface side in the winding operation. .

JP 2011-32318 A JP 2011-58007 A JP 2011-20859 A

  In the method of Patent Document 1, after applying the adhesive, before winding, a part corresponding to the edge to be cured or disappeared partially needs a process for curing and disappearing. It is troublesome. In particular, since it is necessary to appropriately set the portion to be cured or disappeared according to the width of the final product, it lacks versatility. Moreover, it is difficult to apply the adhesive tape of Patent Document 2 to a production method in which a wide adhesive tape is first manufactured and then cut into narrow widths.

  In this respect, the method of Patent Document 3 can be said to be versatile because it is not necessary to change the configuration of the conductive adhesive tape (base film, adhesive layer). However, it is difficult to prevent adhesion of the adhesive at the convex portion provided on the inner surface of the flange. By reducing the number of protrusions to such an extent that the separation distance between the conductive adhesive tape and the flange in winding can be maintained, it is possible to suppress a large amount of adhesive and blocking due to the large amount of adhesion. However, the present inventors have found that a small amount of adhesive adhering to the convex portion may affect the dispersion of the performance of the circuit connection body using the conductive adhesive tape even if blocking does not occur. It was found.

  The present invention has been made in view of such circumstances, and the object of the present invention is to suppress an increase in the manufacturing cost of the conductive adhesive tape roll and to adhere the adhesive during winding. An object of the present invention is to provide a conductive adhesive tape wound body that can be effectively prevented.

  In the conductive adhesive tape wound body, even if the adhesion amount of the adhesive to the flange is a small amount that does not lead to blocking, from such a conductive adhesive tape wound body, It has been found that there is a relationship with variations in connection reliability of the obtained circuit connection body when it is pulled out and used for the connection process.

  Further examination will show that, when a small amount of adhesive is attached to the inner surface of the flange, the adhesive layer is pulled in the pulling direction as shown in FIG. The adhesive portion 11 extending between the flange inner surface 2a and the drawn adhesive tape 10 will eventually cause a cohesive failure of the adhesive portion 11 or an interface failure between the flange inner surface 2a due to the pulling force. Although the blocking phenomenon does not occur, the conductive adhesive, particularly the anisotropic conductive adhesive, may have an influence on the properties of the obtained bonded body depending on its use. That is, the film-like conductive adhesive needs to be melted by heating and embedded in the recesses caused by the circuit pattern when joining the circuit boards. When the embedding is insufficient, voids are formed in the recesses, resulting in a decrease in the connection reliability of the circuit connection body. Therefore, the film thickness of the film-like conductive adhesive depends on the circuit pattern to be embedded (the number of recesses, It is precisely determined in consideration of the depth of the recess. However, as shown in FIG. 3, when the adhesive attached to the flange is pulled and extended when pulled out, the thickness changes, the amount of adhesive decreases due to cohesive failure, or the adhesive protrudes from the base film Thus, the present inventors have thought that it may be used for the connection process in the user, and as a result, the reliability of the obtained circuit connection body may be affected.

  In particular, in the case of a conductive adhesive, the concentration of conductive particles included in a predetermined area is reduced by the adhesive being pulled and stretched in the pulling direction. The connection reliability may also be affected from the viewpoint of reducing the number of conductive particles trapped between the counter electrodes of the circuit boards to be joined. Furthermore, in the case where linear particles are used as the conductive particles, unnecessary elongation of the adhesive causes disorder of orientation, which may affect connection reliability.

  Therefore, as a conductive adhesive tape wound body that prevents the adhesion of a small amount of adhesive that does not cause blocking, or does not affect the connection reliability of the circuit connection body in the drawing process even if it adheres. The present invention has been reached.

  That is, the conductive adhesive tape wound body of the present invention includes a reel comprising a cylindrical core part and flanges attached to both sides of the core part; and a conductive adhesive wound around the core part. In the conductive adhesive tape roll provided with the tape, the peel strength between the flange and the conductive adhesive constituting the conductive adhesive tape is 1.5 N / 25 mm or less.

As for the said flange, it is preferable that the surface at the said core part side of this flange is comprised with the material whose peeling strength with respect to the said conductive adhesive is 1.5 N / 25mm or less.
The flange is preferably a molded article of a hydrocarbon resin, particularly a molded article of polystyrene.

  In the conductive adhesive tape roll of the present invention, the conductive adhesive contains at least one thermosetting resin selected from the group consisting of an epoxy resin, a phenol resin, and a polymerizable acrylic resin. It is suitable for the case, and further suitable for the case of containing a curing agent, a thermoplastic resin, and conductive particles. It is particularly suitable when the conductive adhesive is an anisotropic conductive adhesive.

  In the present specification, the “flange” of the reel is synonymous with what is called a reel side plate.

  In the conductive adhesive tape roll of the present invention, the peel strength between the flange inner surface and the conductive adhesive is 1.5 N / 25 mm or less, so even if the conductive adhesive adheres to the flange inner surface. The attached conductive adhesive can be easily peeled off by the pulling force of the adhesive tape. Therefore, even when the conductive adhesive tape is wound so as to come into contact with the inner surface of the flange, when it is used on the user side, the occurrence of blocking is prevented, and connection reliability due to poor pulling is further reduced. The impact can be minimized.

It is a perspective view which shows the structure of a conductive adhesive tape winding body. It is a figure for demonstrating the problem of an electroconductive adhesive tape winding body. It is a figure for demonstrating the problem of an electroconductive adhesive tape winding body.

  Although embodiments of the present invention will be described below, it should be considered that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The conductive adhesive tape wound body of the present invention is obtained by winding a conductive adhesive tape around a reel core, and includes a reel flange attached to both sides of the core, and a conductive adhesive tape to be wound. The peel strength with the conductive adhesive is 1.5 N / 25 mm or less. Hereinafter, the reel and the conductive adhesive tape will be described.

〔reel〕
As shown in FIG. 1, a reel used in the conductive adhesive tape winding body of the present invention includes a cylindrical core 1 and disc-shaped flanges 2 and 2 attached to both ends of the core 1. Thus, the peel strength between the flange inner surface 2a and the wound conductive adhesive tape 10 is made of a resin having a strength of 1.5 N / 25 mm or less, preferably 1.0 N / 25 mm or less. That is, the flange inner surface 2a is made of a material having a peel strength with respect to the conductive adhesive of 1.5 N / 25 mm or less, preferably 1.0 N / 25 mm or less, and the flange 2 itself is a molded product made of the above material. It may be that which has been applied to at least the flange inner surface such that the adhesive strength is in the above range.

  By setting the peel strength between the flange inner surface and the conductive adhesive to 1.5 N / 25 mm or less, the adhesive adhered to the flange inner surface 2a is peeled off at the interface rather than being stretched even when the adhesive tape is pulled out. It tends to be easy. Therefore, it is possible to prevent the stretched adhesive from protruding or dripping from the side surface of the adhesive tape.

  As described above, examples of the material having low adhesive strength to the conductive adhesive include perfluoro fluororesin, tetrafluoroethylene / perfluoroalkyl vinyl ether (PFA) resin, tetrafluoroethylene / hexafluoropropylene, and the like. Fluorine resins such as polymers (FEP resin); Polyolefin resins such as polyethylene and polypropylene; Hydrocarbon resins such as aromatic resins such as polystyrene and polymetaxylylene; Chlorine-containing materials such as polyvinylidene chloride and polyvinyl chloride Polyolefin resins; polymers having a small polarity such as silicone resins, or resin materials having water repellency and oil repellency can be mentioned, and these are used as molding materials or coating film constituting resins. There are many commercially available resins, and any resin can be used without particular limitation as long as the peel strength against the conductive adhesive is 1.5 N / 25 mm or less. Of these, hydrocarbon resins are preferably used from the viewpoints of flange productivity, moldability, environmental impact at the time of disposal, and more preferably polystyrene.

  Accordingly, it is preferable that at least the flange of the reel is a molded product formed of a hydrocarbon-based resin (preferably polystyrene).

  The method for forming the flange is not particularly limited, and the flange is formed by a conventionally known method such as injection molding, extrusion molding or compression molding.

  Although the distance D between the flanges 2 and 2 (corresponding to the axial length of the core) and the outer diameter of the core 1 are not particularly limited, the conductive adhesive tape, particularly the anisotropic conductive adhesive tape used for circuit connection, Usually, the width (a) of the anisotropic conductive adhesive tape is 0.5 to 5 mm, and the distance (D) between the flanges is about a + 0.2 to a + 1.5 mm, preferably about the width a of the adhesive tape. Is a + 0.2 mm to a + 1.0 mm, more preferably a + 0.2 mm to a + 0.5 mm. This is because in the case of such a narrow width, problems such as adhesion of adhesive to the flange 2 and blocking are likely to occur.

[Conductive adhesive tape]
(1) Substrate film The conductive adhesive tape applied to the wound body of the present invention is a two-layer structure obtained by laminating a film-like conductive adhesive on a substrate tape called a separator, and an adhesive. A three-layer structure in which a base film called a cover film is further laminated on the layer may be used.

  Examples of the base film used for the separator and the cover film include plastic films such as a polyimide film, a polyester film, a polyether ether ketone film, and a polyphenylene sulfide film. These substrate films are preferably subjected to a release treatment on the front and back surfaces. However, in the case of the three-layer structure, it is sufficient that only the surface of the separator and the cover film on the side in contact with the adhesive layer is subjected to release treatment.

(2) Conductive adhesive layer The type of the conductive adhesive is not particularly limited. The binder component is usually a thermosetting resin excellent in electrical insulation, mechanical strength, chemical resistance, and heat resistance, specifically, epoxy resin, phenol resin, polymerizable acrylic resin (acrylic monomer or A combination of an oligomer and a polymerization initiator) and an adhesive composition containing conductive particles is formed into a film. After an adhesive solution obtained by dissolving the adhesive resin composition in a solvent is applied to the substrate film, the solvent is dried and volatilized to solidify, thereby obtaining a conductive adhesive layer.

  In addition to the thermosetting resin, the adhesive layer may contain a curing agent for the curing reaction of the curing resin, a thermoplastic resin for ensuring film formability, other resins, and additives. Good.

  The epoxy resin may be any resin having at least two epoxy groups in one molecule, such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidylamine. Type epoxy resin, novolac type epoxy resin, cresol novolac type epoxy resin, and the like can be used.

  As the phenol resin, a resol type, novolak type, cresol novolac resin, dicyclopentadiene phenol resin, terpene phenol resin, or the like can be used.

  Examples of the polymerizable acrylic monomer or oligomer include (meth) acrylic acid esters such as methyl acrylate and methyl methacrylate, and acrylic monomers having a functional group such as a carboxyl group, a hydroxyl group, an epoxy group, and an acetoxy group. Or these oligomers, or its modified material is mentioned. Examples of thermal polymerization initiators include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxy esters, peroxy carbonates, and other organic peroxides, azobisisobutyronitrile, and the like. It is done. The polymerizable acrylic monomer or oligomer can be polymerized and cured in the presence of a thermal polymerization initiator.

  When an epoxy resin or a phenol resin is used as the thermosetting resin, a latent curing agent is usually preferably used in combination. The latent curing agent is not particularly limited, and includes polyamine curing agents, acid anhydride curing agents, boron trifluoride amine complex salts, imidazole curing agents, aromatic diamine curing agents, carboxylic acid curing agents, and the like. One or a combination of two or more can be used.

  Examples of the thermoplastic resin include phenoxy resin, acrylic resin, polyester resin, polyamide resin, polyimide resin, polyether ketone resin, polyether ether ketone resin, polyether sulfone resin, and polybenzoxazole resin corresponding to high molecular weight epoxy resins. Is used.

  The conductive particles may be any particles having conductivity, such as solder particles, nickel particles, gold-plated nickel powder, copper powder, silver powder, nano-sized metal crystals, and metal surfaces coated with other metals. Metal particles such as particles; resin particles such as styrene resin, urethane resin, melamine resin, epoxy resin, acrylic resin, phenol resin, and styrene-butadiene resin were coated with a conductive thin film such as gold, nickel, silver, copper, and solder. Particles can be used.

  In the case of an anisotropic conductive adhesive, magnetic particles are preferably used because the conductive particles are easily oriented in a predetermined direction (in the present invention, the thickness direction of the adhesive tape). In particular, conductive particles having an aspect ratio of 5 or more are preferably used from the viewpoint that the conductive particles are easily oriented in the thickness direction. Specifically, a shape in which fine metal particles are connected in a straight chain, or acicular particles are preferably used. Such conductive particles can be oriented in the thickness direction by the action of a magnetic field during film formation.

  Examples of the additives include inorganic fillers such as anhydrous silica, aluminum hydroxide, talc and clay, curing accelerators, silane coupling agents, leveling agents, antifoaming agents, surfactants, flame retardants and the like. .

(3) Manufacture of conductive adhesive tape The above components (thermosetting resin, thermoplastic resin, curing agent, conductive particles), and additives as required are added, an organic solvent is added, and ball mill An adhesive composition prepared by mixing using a homogenizer, centrifugal stirring, three rolls, etc., is coated on a base film and usually heated at 50 to 100 ° C. for several minutes to several hours. The conductive adhesive tape is manufactured by drying and solidifying the solvent. In the case of a conductive adhesive film of a type having a cover film, it is usually obtained by pressurizing after laminating a cover film on a dry / solidified adhesive layer. Although the thickness of an adhesive bond layer is not specifically limited, Usually, 10-60 micrometers, Preferably it is 20-50 micrometers.

  The peel strength (adhesive strength) between the base film and the adhesive layer of the conductive adhesive tape is measured according to JIS-C-6481, although it depends on the adhesive composition and the type of base film. The 90 ° peel test value is usually 0.1 to 2 N / 25 mm, preferably 0.1 to 1 N / 25 mm.

[Conductive adhesive tape roll]
The conductive adhesive tape having the above configuration is wound around the core of the conductive adhesive tape roll.

  The conductive adhesive tape wound body of the present invention is usually a long strip of adhesive tape drawn from a wide wound body (tape supply roller), with a cutter, slitter, etc. in the longitudinal direction (tape drawing direction) Usually, a product cut into a narrow width of about 0.5 to 5 mm is wound around a core to be manufactured.

  The winding is wound in a spiral shape around the winding core. The adhesive tape is preferably wound so as to be positioned at the center of the winding core, but the conductive adhesive tape wound body of the present invention does not necessarily have to be wound at the center position. Furthermore, a part of the conductive adhesive tape may be wound in contact with the inner surface of the flange. Since the conductive adhesive and the flange have a peel strength of 1.5 N / 25 mm or less, preferably 1.0 N / 25 mm or less, based on the material of the flange inner surface, the conductive adhesive tape contacts the flange inner surface. However, it is difficult for the adhesive to adhere. Even if temporarily attached, since the peel strength is 1.5 N / 25 mm or less, it can be easily peeled off from the flange inner surface in the drawing process from the wound body by the user, and by extending the adhesive layer, It is not necessary to reach such a phenomenon that the thickness of the adhesive layer is reduced or the adhesive layer is dripped on the side surface of the conductive adhesive tape.

  The best mode for carrying out the present invention will be described with reference to examples. The examples are not intended to limit the scope of the invention.

[Measurement evaluation method]
The measurement evaluation methods employed in the following examples are as follows.
(1) Peel strength A test piece obtained by cutting a conductive adhesive tape into 25 mm × 50 mm is prepared and affixed to a flange, and the conductive adhesive tape test piece is removed from the flange at 23 ° C. in accordance with JIS-C-6481 The peel strength (N / 25 mm) was measured when a 90 ° peel test was performed.

(2) Pull-out property The reel of the produced conductive adhesive tape roll was reversely rotated, and the conductive adhesive tape was fed out of the reel with a pull-out force of 0.03 N / 25 mm. After feeding, the presence or absence of adhesion of the adhesive on the inner surface of the flange was visually observed.
With regard to the feeding of the adhesive film, when there is no blocking and there is no adhesion of the adhesive on the inner surface of the flange, the drawability is good, and no blocking occurs, but adhesion of the adhesive is recognized on the inner surface of the flange. The case where it was pulled out was evaluated as “Δ”, and the case where blocking occurred was evaluated as “×”.

[Production of conductive adhesive tape]
(1) Conductive adhesive composition Conductive adhesive solution A
A solid epoxy resin and a liquid epoxy resin are used as the thermosetting resin, and a phenoxy resin is used as the thermoplastic resin. The system latent curing agent was mixed and dissolved in an organic solvent, and then mixed for 3 minutes using a centrifugal mixer to prepare a homogeneous solution having a solid content of 60%.
Next, after adding the conductive particles so that the filling rate of the conductive particles represented by the ratio of the solid content (conductive particles + resin) to the total amount becomes 0.1% by volume, using a centrifugal mixer The mixture was uniformly dispersed by stirring to prepare a conductive adhesive solution. The materials used are as follows.
Solid epoxy resin: jER1010 and 1004, manufactured by Mitsubishi Chemical Corporation Liquid epoxy resin: jER828, manufactured by Mitsubishi Chemical Corporation, and EPICLON HP-4032D, manufactured by DIC Corporation Phenoxy resin: Phenotote YP-50, manufactured by Toto Kasei Co., Ltd. Imidazole-based latent curing Agent: NovaCure HXA3932HP, manufactured by Asahi Kasei E-materials Organic solvent: Propylene glycol monomethyl ether acetate Conductive particles: Needle-shaped Ni particle conductive adhesive solution B having a particle size of 1 μm or less and a particle length of 10 μm or less
Except for changing the ratio of solid epoxy resin, liquid epoxy resin, and phenoxy resin to solid epoxy resin: liquid epoxy resin: phenoxy resin = 15: 45: 40 (% by weight), the same as the conductive adhesive solution A, A conductive adhesive solution was prepared.
Conductive adhesive solution C
Further, an elastomer component (TPAE-826, manufactured by Fuji Kasei Kogyo Co., Ltd.) as a thermoplastic resin is added to the conductive adhesive solution B with respect to a total of 100 parts by weight of the solid epoxy resin, liquid epoxy resin, and phenoxy resin. A conductive adhesive solution was prepared in the same manner as the conductive adhesive solution B except that parts by weight were added.
Conductive adhesive solution D
Conductive bonding except that the elastomer component as a thermoplastic resin is further added to the conductive adhesive solution A by 5 parts by weight with respect to a total of 100 parts by weight of the solid epoxy resin, liquid epoxy resin, and phenoxy resin. In the same manner as the agent solution A, a conductive adhesive solution was prepared.

(2) Production of conductive adhesive tape The conductive adhesive solution A-D prepared above was subjected to a release treatment on a polyester film (thickness 50 μm) as a base film, and the doctor had a dry thickness of 25 μm. After coating using a knife, the conductive particles were dried and solidified in a magnetic field with a magnetic flux density of 100 mT at 60 ° C. for 30 minutes to prepare a conductive adhesive tape with a thickness of 20 μm in which conductive particles were oriented in the magnetic field direction.

  In addition, the tensile fracture strength of the film-form conductive adhesive using the said conductive adhesive solution A measured according to JISK7127 was 5.5 N / mm <2>, and the tensile fracture elongation was 210%.

[Production and evaluation of conductive adhesive tape roll]
Conductive adhesive tape roll No. 1-4:
Flange (outer diameter 125 mm) made of the material shown in Table 1 is attached to both sides of a core having an outer diameter of 55 mm and an axial length (distance between flanges D) of 1.8 mm. 1-4. Each reel No. with different flange material 1-4, the conductive adhesive tape cut with a width of 1.5 mm produced with the conductive adhesive solution A was set in an automatic winding device, and wound up. 1-4 was produced.
Each of the produced conductive adhesive tape rolls No. With regard to 1-4, the drawability was examined.
The evaluation results are shown in Table 1 together with measured values of peel strength for the flange.
Conductive adhesive tape roll No. 5-8:
Except for using the conductive adhesive solution B instead of the conductive adhesive solution A, the conductive adhesive tape roll No. In the same manner as in 1-4, the conductive adhesive tape roll No. 5-8 was produced.
Each of the produced conductive adhesive tape rolls No. With respect to 5-8, the drawability was examined.
The evaluation results are shown in Table 2 together with measured values of peel strength for the flange.
Conductive adhesive tape roll No. 9-12:
Except for using the conductive adhesive solution C instead of the conductive adhesive solution A, the conductive adhesive tape roll No. In the same manner as in 1-4, the conductive adhesive tape roll No. 9-12 was produced.
Each of the produced conductive adhesive tape rolls No. With respect to 9-12, the drawability was examined.
The evaluation results are shown in Table 3 together with measured values of peel strength for the flange.
Conductive adhesive tape roll No. 13-16:
Except for using the conductive adhesive solution D instead of the conductive adhesive solution A, the conductive adhesive tape roll No. In the same manner as in 1-4, the conductive adhesive tape roll No. 13-16 were produced.
Each of the produced conductive adhesive tape rolls No. With respect to 13-16, the drawability was examined.
The evaluation results are shown in Table 4 together with measured values of peel strength for the flange.

ＰＳ：ポリスチレン
ＡＣ樹脂：アクリル樹脂
ＰＣ：ポリカーボネート
ＰＥＴ：ポリエチレンテレフタレート

PS: Polystyrene AC resin: Acrylic resin PC: Polycarbonate PET: Polyethylene terephthalate

  As can be seen from Table 1 to Table 4, the conductive adhesive tape roll No. using a reel having a peel strength of 1.5 N / 25 mm or less. In 1, 5, 7, 9, 11, and 13, blocking did not occur. In addition, the conductive adhesive tape winding body No. using the reel provided with the flange made from polystyrene. In 1, 5, 9, and 13, no blocking occurred. On the other hand, a conductive adhesive tape winding body No. 1 using a reel exceeding 1.5 N / 25 mm. 2, 3, 6, 8, 10, 12, 14, 15, and 16 were all blocked. Conductive adhesive tape roll No. 1 using a PET flange with a peel strength of 1.7 N / 25 mm. In No. 4, blocking did not occur, but adhesion of adhesive was observed on the inner surface of the flange.

  According to the conductive adhesive tape wound body of the present invention, the conductive adhesive does not easily adhere to the flange inner surface even in the manufacturing process and storage process of the wound body, and even if it adheres, the conductive adhesive tape is drawn out. Since it can be easily peeled off by force, the yield is high and the productivity is excellent both at the production site of the wound body and at the connection site of the circuit board using the conductive adhesive tape wound body.

1 Core part 2 Flange (reel flange)
3 reel 10 conductive adhesive tape

Claims (7)

In a conductive adhesive tape winding body comprising a cylindrical core part and a reel comprising flanges attached to both sides of the core part; and a conductive adhesive tape wound around the core part,
The conductive adhesive tape winding body whose peeling strength of the said flange and the conductive adhesive which comprises the said conductive adhesive tape is 1.5 N / 25mm or less. 2. The conductive adhesive tape winding according to claim 1, wherein the flange has a surface on the core portion side of the flange made of a material having a peel strength of 1.5 N / 25 mm or less with respect to the conductive adhesive. body. The conductive adhesive tape roll according to claim 1, wherein the flange is a molded article of a hydrocarbon resin. The conductive adhesive tape roll according to claim 3, wherein the hydrocarbon resin is polystyrene. The conductive adhesive contains at least one thermosetting resin selected from the group consisting of an epoxy resin, a phenol resin, and a polymerizable acrylic resin, and conductive particles. The conductive adhesive tape winding body of Claim 1. The conductive adhesive tape roll according to claim 5, wherein the conductive adhesive further contains a curing agent and a thermoplastic resin. The conductive adhesive tape wound body according to any one of claims 1 to 6, wherein the conductive adhesive is an anisotropic conductive adhesive.

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