CN103732708A - Conductive adhesive tape winding unit - Google Patents
Conductive adhesive tape winding unit Download PDFInfo
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- CN103732708A CN103732708A CN201280039018.1A CN201280039018A CN103732708A CN 103732708 A CN103732708 A CN 103732708A CN 201280039018 A CN201280039018 A CN 201280039018A CN 103732708 A CN103732708 A CN 103732708A
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- conductive adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2461/00—Presence of condensation polymers of aldehydes or ketones
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
Abstract
Disclosed is a conductive adhesive tape winding unit with which it is possible for blocking to not occur and furthermore for there to be little variability in the connection reliability of circuit connection units that can be obtained therewith. The conductive adhesive tape winding unit is provided with: a reel which comprises a cylindrical winding core and flanges mounted on both sides of this winding core; and conductive adhesive tape wound on this winding core, wherein the peeling strength of the flanges and a conductive adhesive used for the conductive adhesive tape is 1.5 N/25 mm or less. The flanges are moulded items of a material, preferably hydrocarbon resin, having a peeling strength with respect to the conductive adhesive of 1.5 N/25 mm or less.
Description
Technical field
The present invention relates to a kind ofly make conductive paste tape wrapping on spool and the conductive paste tape wrapping body obtaining, described electroconductibility adhesive tape is by being laminated to the membranaceous conductive adhesives such as membranaceous anisotropic conductive tackiness agent on base material band and forming, in more detail, while relating to a kind of manufacture at conductive paste tape wrapping body, tackiness agent is difficult to be attached on the flange of spool, concerning user, the conductive paste tape wrapping body that the pull-out of electroconductibility adhesive tape from coiling body is good.
Background technology
The membranaceous anisotropic conductive tackiness agent using in bonding etc. between the face glass of liquid-crystal display (LCD) and the circuit card as flexible printed circuit board (FPC) conventionally as shown in Figure 1, as the conductive paste tape wrapping body being wound on spool 3, carry out shipment, concerning user, it is pulled out from conductive paste tape wrapping body and use, wherein said spool 3 has as anisotropic conductive binder layer and is laminated to state (electroconductibility adhesive tape) 10 on base material film (it is called as spacer) and the volume core 1 of reeling, and be arranged on the flange 2 of these volume core 1 both sides, 2.
About such conductive paste tape wrapping body, in production scene, on wide base material film, coating forms after binder layer conventionally, is cut into the band shape of fillet while is wound on the volume core 1 of spool.The flange 2 of spool also plays the effect that the fillet adhesive tape of cut-out and adjacent fillet adhesive tape are separated.
In spool, it is larger that flange spacing (D) is set as width (a) than electroconductibility adhesive tape, as shown in Figure 2 (a) shows, at the substantial middle part place of volume core 1, batches electroconductibility adhesive tape 10, thereby the both sides of the electroconductibility adhesive tape 10 after batching are provided with space 4,4.This space 4 has also been played and made the non-cohesive space effect such on flange 2 of trace adhesive of overflowing from base material film, and wherein overflowing of trace adhesive is that the base material film that caused by temperature environment variation etc. and the flexible difference of binder layer or the reduced viscosity of tackiness agent etc. cause.
But in production scene, electroconductibility adhesive tape 10 may not be wound on the middle body of core 1 as shown in Figure 2 (a) shows like that, as shown in Fig. 2 (b), be partial to sometimes any side of flange 4 and batch.
In the conductive paste tape wrapping body batching as shown in Fig. 2 (b), when being wound on spool 3 or when taking care of conductive paste tape wrapping body, the tackiness agent of formation binder layer is attached on face (hereinafter referred to as " flange inner the face ") 2a of the adhesive tape winding side of flange 2 sometimes.The words of adhesive attachment on flange inner face 2a, thereby electroconductibility adhesive tape 10 is pulled out from conductive paste tape wrapping body in user's the production scene of the bonding process that is supplied to the to-be-adhered objects such as substrate at the pullout forces with certain, there is the phenomenon (hereinafter referred to as " interrupting (blocking) ") that electroconductibility adhesive tape 10 can not pull out, become the low reason of productive rate at automatic production scene.
Under these circumstances, as the countermeasure for preventing from interrupting generation, the method for coiling of the electroconductibility adhesive tape to fillet, spool, electroconductibility adhesive tape etc. have carried out various research.
For example, in TOHKEMY No. 2011-32318 (patent documentation 1), about the binder layer being coated on base material film, the scheme that the part of the binder layer that makes to be positioned at the position that is equivalent to base material film edge is solidified or disappeared has been proposed.
In addition, in TOHKEMY 2011-58007 communique (patent documentation 2), about base material film, proposed to arrange at film edge the scheme of protuberance.Because this protuberance contacts with flange inner face, prevented that binder layer or the binder layer part from contacting with flange inner face.
On the other hand, thereby as the technology that suppresses to interrupt generation by design spool rather than adhesive tape, in TOHKEMY 2011-20859 communique (patent documentation 3), proposed to be equivalent to the pair of flanges portion of installing on the both sides of the reeling end of rolling up core, the scheme of lug boss has been set continuously or off and at flange internal surface.Due to lug boss, in coiling body, can keep the spacing between adhesive tape and flange inner face, therefore, in the work of batching, can prevent that binder layer is attached in flange inner face side.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2011-32318 communique
Patent documentation 2: TOHKEMY 2011-58007 communique
Patent documentation 3: TOHKEMY 2011-20859 communique
Summary of the invention
The problem that invention will solve
In the method for patent documentation 1, after adhesive coated, batch before, about making its position that is equivalent to edge of solidifying or disappearing, for the operation that partly makes it solidify and to disappear, become newly-increased necessity, this is trouble in production.Particularly, owing to need to suitably setting the part of solidifying or eliminating according to the width of the finished product, therefore also lack versatility.In addition, the adhesive tape of patent documentation 2 is difficult to be applicable to first make wide adhesive tape, is cut into the such production method of fillet afterwards.
In this respect, in the method for patent documentation 3, do not need to change the formation (base material film, binder layer) of electroconductibility adhesive tape, therefore there is versatility.But, being arranged in the lug boss of flange inner face, be difficult to prevent adhering to of tackiness agent.By by the degree of the reduced number of lug boss electroconductibility adhesive tape and spacing of flange to can keep batching time, can suppress tackiness agent adhere in a large number and further inhibition by adhering in a large number the interruption causing.But the inventor finds, can not cause interrupting occurring even if be attached to a small amount of tackiness agent of lug boss, sometimes also can affect the fluctuation of the performance of the circuit connecting body that has used this electroconductibility adhesive tape.
The present invention completes in view of such situation, the object of the present invention is to provide a kind of conductive paste tape wrapping body, and it is when the manufacturing cost that suppresses conductive paste tape wrapping body rises, and in the time of can effectively preventing from batching, tackiness agent adheres to.The means of dealing with problems
The inventor finds, in conductive paste tape wrapping body, adhesion amount about tackiness agent on flange, even if be the degree that can cause on a small quantity and not interrupting, when thereby pull-out from such conductive paste tape wrapping body is supplied to connection operation, adhesion amount also can be relevant with the fluctuation of the connection reliability of the circuit connecting body of gained.
When attempting further research, the in the situation that of being attached with tackiness agent on a small quantity on flange inner face, as shown in Figure 3, binder layer is along the pull-out direction prolongation that is stretched.The adhesive portion 11 extending between flange inner face 2a and the adhesive tape 10 that is drawn out due to pulling force, cause very soon adhesive portion 11 bond damage (cohesive failure) or and flange inner face 2a between interfacial failure, therefore can not cause disruption, but conductive adhesive (particularly anisotropic conductive tackiness agent) may affect the character of gained conjugant sometimes due to this purposes.That is, membranaceous conductive adhesive when the joint between circuit substrate, thereby need heating and melting to embed in the recess being caused by circuit pattern.When embedding is insufficient, in recess, generate space, as a result, become the low reason of connection reliability of circuit connecting body, therefore the thickness of membranaceous conductive adhesive comes up on the basis of having considered the circuit pattern that should embed (recess quantity, recess depths etc.) accurately to determine.But, the inventor recognizes following possibility: as shown in Figure 3, be attached to tackiness agent on the flange words that extended that are stretched when pull-out, thickness changes or because bond damage thereby amount of binder reduce, or become the state overflowing from base material film, while offering the connection operation that user carries out, its result can affect the reliability of gained circuit connecting body.
Particularly, in conductive adhesive, because tackiness agent is elongated extension along pull-out direction, thus regulation area in contained conductive particle density loss.From the viewpoint of the circuit substrate that will connect the conductive particle quantity capturing between electrode reduced, may impact connection reliability.In addition,, in the situation that using straight chain shape particle as conductive particle, the unnecessary extension of tackiness agent can cause the confusion of orientation, from this, puts also and may impact connection reliability.
So the present invention has completed a kind of conductive paste tape wrapping body, it can prevent that can not interrupt such tackiness agent adheres on a small quantity, even or occurred to adhere to, in pull-out operation, also can not exert an influence to the connection reliability of circuit connecting body.
That is, conductive paste tape wrapping body of the present invention has: the spool consisting of cylindric volume core and the flange that is arranged on these volume core both sides; And being wound on the electroconductibility adhesive tape on described volume core, the stripping strength between wherein said flange and the conductive adhesive of the described electroconductibility adhesive tape of formation is below 1.5N/25mm.
In described flange, this flange by the face of described volume core one side, by the stripping strength with respect to described conductive adhesive, be preferably that material below 1.5N/25mm forms.
In addition, described flange is preferably the products formed of the products formed of hydrocarbon resin, particularly polystyrene.
In conductive paste tape wrapping body of the present invention, described conductive adhesive preferably contains at least a kind of above thermosetting resin in the group of selecting free epoxy resin, resol and polymerizability acrylic resin composition, preferably further comprises solidifying agent, thermoplastic resin and conductive particle.Particularly, described conductive adhesive is preferably anisotropic conductive tackiness agent.
In addition, in this manual, " flange " of spool is equivalent in meaning with the object that is called as spool side plate.
The effect of invention
Because the stripping strength between conductive paste tape wrapping body flange medial surface of the present invention and conductive adhesive is below 1.5N/25mm, even if therefore adhered to conductive adhesive on flange inner face, by the pullout forces of adhesive tape, also can easily the conductive adhesive adhering to be peeled off.Therefore, even batching in the mode contacting with flange inner face at electroconductibility adhesive tape, user also can prevent the generation of interrupting here when using, and can further the bad impact on connection reliability causing of pull-out be remained and be minimized.
Brief Description Of Drawings
[Fig. 1] is for showing the skeleton view of conductive paste tape wrapping body structure.
[Fig. 2] is the figure of the problem points for conductive paste tape wrapping body is described.
[Fig. 3] is the figure of the problem points for conductive paste tape wrapping body is described.
Embodiment
Embodiment of the present invention are described below, should be understood that, current disclosed embodiment is all illustrative rather than restrictive aspect all.Scope of the present invention, by the circumscription of claims, is intended to comprise all changes in meaning and the scope being equal to the scope of claims.
Conductive paste tape wrapping body of the present invention is the coiling body that conductive paste tape wrapping obtains on the volume core of spool, and the stripping strength being arranged between the volume spool flange of core both sides and the conductive adhesive of the electroconductibility adhesive tape of coiling is below 1.5N/25mm.Below spool, conductive paste band are described.
[spool]
As shown in Figure 1, the spool using in conductive paste tape wrapping body of the present invention is rolled up core 1 and is arranged on the discoideus flange 2 at these volume core 1 two ends by round shape, 2 form, and by the stripping strength between the electroconductibility adhesive tape 10 of flange inner face 2a and coiling, are that 1.5N/25mm resin following, that be preferably below 1.0N/25mm forms.That is, flange inner face 2a is that 1.5N/25mm material following, that be preferably below 1.0N/25mm forms by the stripping strength with respect to conductive adhesive; Flange 2 itself can be the products formed consisting of above-mentioned materials, can be also at least on flange inner face, to apply the article that make clinging power fall into the coating of above-mentioned scope and to obtain.
Because the stripping strength between flange inner face and conductive adhesive is below 1.5N/25mm, be attached to the pull-out along with adhesive tape of tackiness agent on flange inner face 2a, in interface, there is the flaky tendency of appearance compared with situation about being stretched.Therefore, can prevent that the tackiness agent being stretched from overflowing from the side of adhesive tape or relax.
As mentioned above, as the low material of clinging power for conductive adhesive, for example, can enumerate: the fluorine-type resins such as perfluor class fluoro-resin, tetrafluoroethylene-perfluoroalkyl vinyl ether (PFA) resin, tetrafluoraoethylene-hexafluoropropylene copolymer (FEP resin); The hydrocarbon resins such as aromatic resin such as the polyolefin resin such as polyethylene, polypropylene and polystyrene, poly-m-xylene; The chloride polyolefin resin such as polyvinylidene dichloride, polyvinyl chloride; The little polymkeric substance of silicone based resin isopolarity, or have the resin material of water repellency, oil repellent, they are as formed material or as film, form resin and use.There is commercially available product in these resin majorities, as long as be that 1.5N/25mm just can be used below with respect to the stripping strength of conductive adhesive, is not particularly limited.In the middle of these, from viewpoints such as the productivity of flange, formability, loads to environment when discarded, preferably use hydrocarbon resin, more preferably polystyrene.
Therefore,, as spool, preferably, at least flange is the products formed by hydrocarbon resin (preferably polystyrene) moulding.
Forming method to flange is not particularly limited, and can carry out moulding by existing known methods such as injection molding, extrusion moulding, compressed mouldings.
To flange 2, the external diameter of 2 space D (corresponding to the axial length of volume core), volume core 1 is not particularly limited, in the anisotropic conductive adhesive tape at electroconductibility adhesive tape, particularly using in circuit connects, conventionally, wide (a) of anisotropic conductive adhesive tape is 0.5～5mm, and with respect to the wide a of adhesive tape, flange spacing (D) is a+0.2～a+1.5mm left and right, be preferably a+0.2mm～a+1.0mm, more preferably a+0.2mm～a+0.5mm.In the situation that width is this narrow degree, the problem that easily produces adhesive attachment to flange 2 or interrupt.
[electroconductibility adhesive tape]
(1) base material film
The electroconductibility adhesive tape that is applicable to coiling body of the present invention is except membranaceous conductive adhesive being laminated on the base material band that is called spacer and 2 layers of structure that form, can be also on binder layer further lamination be called the base material film of mulch film and 3 layers of structure forming.
As the base material film for spacer, mulch film, can enumerate the plastic films such as polyimide film, polyester film, polyether-ether-ketone film, polyphenylene sulfide film.Preferably demoulding processing is carried out at the surface to these base material films and the back side.But, the in the situation that of 3 layers of structure, as long as spacer and mulch film joined with binder layer to carry out demoulding processing just much of that for the face of a side.
(2) conductive adhesive layer
Kind to conductive adhesive is not particularly limited.Conductive adhesive layer is by the article after binder composition membranization, the thermosetting resin (particularly, epoxy resin, resol, polymerizability acrylic resin (combination of Acrylic Acid Monomer or oligopolymer and polymerization starter)) that described binder composition comprises electrical insulating property, physical strength, chemical-resistant, excellent heat resistance is conventionally as Binder Composition and contain conductive particle.After the binder solution this adhesive resin composition being dissolved in solvent and form is applied on base material film, make solvent seasoning volatilize to solidify, obtain thus conductive adhesive layer.
In binder layer, except above-mentioned thermosetting resin, also can comprise solidifying agent for making gel-type resin generation curing reaction, for guaranteeing the thermoplastic resin of film plasticity, other resin and additive.
As above-mentioned epoxy resin, in 1 molecule, there is the resin of at least 2 epoxy group(ing), can use bisphenol A type epoxy resin, bisphenol f type epoxy resin, Racemic glycidol ether type epoxy, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, phenolic resin varnish type epoxy resin, cresol-novolak type epoxy resin etc.
As above-mentioned resol, can use resol type, phenolic varnish type, cresol-novolak resin, dicyclopentadiene class resol, terpenes resol etc.
As above-mentioned polymerizability acrylic monomer or oligopolymer, can enumerate: (methyl) acrylate such as methyl acrylate, methyl methacrylate, and the acrylic monomer or their oligopolymer or its modifier that contain the functional groups such as carboxyl, hydroxyl, epoxy group(ing), acetoxyl group.As thermal polymerization, can enumerate the organo-peroxides such as ketone peroxide, ketal peroxide, hydroperoxide, dialkyl peroxide, diacyl peroxide, peroxyester, peroxy carbonates and Diisopropyl azodicarboxylate etc.Polymerizability acrylic monomer or oligopolymer can be under the existence of thermal polymerization polymerizing curable.
When using epoxy resin, resol as heat reactive resin, conventionally preferably use potentiality solidifying agent simultaneously.Potentiality solidifying agent is not particularly limited, can uses one kind or two or more being used in combination in many amine curing agents, acid anhydride type curing agent, boron trifluoride amine complex salt, imidazole curing agent, aromatic diamines solidifying agent, carboxylic-acid solidifying agent etc.
As above-mentioned thermoplastic resin, can use phenoxy resin, acrylic resin, vibrin, polyamide resin, polyimide resin, polyether ketone resin, polyether-ether-ketone resin, polyethersulfone resin, polybenzoxazole resin of being equivalent to high molecular expoxy resin etc.
As conductive particle, as long as thering is the particle of electroconductibility, for example, can use solder grain, nickel particle, gold-plated nickel powder, copper powder, silver powder, nano level metal crystal, metallic surface by metallic particles such as the particles of other coating metal; And the particle obtaining with resin particles such as conductive membrane coating styrene resin, urethane resin, melamine resin, epoxy resin, acrylic resin, resol, styrene butadiene resin such as gold, nickel, silver, copper, scolders, etc.
The in the situation that of anisotropic conductive tackiness agent, from making conductive particle be easy to, along the viewpoint of pre-determined direction (being the thickness direction of adhesive tape the present invention) orientation, preferably use the magnetic particle of tool.Particularly, from making conductive particle be easy to the viewpoint of through-thickness orientation, preferably using long-width ratio is more than 5 conductive particles.Particularly, the shape or the elongated piece that preferably use tiny metallic particles to connect with straight chain shape.Such conductive particle due to the effect in magnetic field, can be orientated by through-thickness when film is shaped.
As above-mentioned additive, can enumerate the mineral fillers such as anhydride silica, aluminium hydroxide, talcum, clay, curing catalyst, silane coupling agent, flow agent, defoamer, tensio-active agent, fire retardant etc.
(3) manufacture of electroconductibility adhesive tape
Further mixed additive as required in mentioned component (thermosetting resin, thermoplastic resin, solidifying agent, conductive particle), add organic solvent, use ball mill, clarifixator, centrifugal mixer, three rollers etc. to mix, make thus adhesive composition, this adhesive composition is coated on base material film, conventionally at 50～100 ℃, heat several minutes to a few hours, make solvent seasoning and solidify, thereby having manufactured electroconductibility adhesive tape.In the case of the electroconductibility bonding film of type with mulch film, after normally mulch film being laminated on the binder layer of dry solidification state, pressurization obtains.Thickness to binder layer is not particularly limited, and is generally 10～60 μ m, is preferably 20～50 μ m.
In addition, the base material film of electroconductibility adhesive tape and the stripping strength of binder layer (bond strength) depend on the kind of tackiness agent composition, base material film, 90 ° of stripping test values measuring take JIS-C-6481 as benchmark are generally 0.1～2N/25mm, are preferably 0.1～1N/25mm.
[conductive paste tape wrapping body]
Conductive paste tape wrapping body obtains on the volume core of above-mentioned conductive paste tape wrapping body having the as above conductive paste tape wrapping of structure.
Conductive paste tape wrapping body of the present invention is manufactured by following mode conventionally: adopt cutting machine, slitter etc. by the bar-shape adhesive tape of pull-out in coiling body leniently (adhesive tape donor rollers) along the longitudinal (direction of adhesive tape pull-out) be conventionally cut into the fillet of wide 0.5～5mm left and right, and gains are wound on volume core.
Batching core is axle, spirally winding.Adhesive tape preferably batches in the mode that is positioned at volume core central authorities, but conductive paste tape wrapping body of the present invention can be wound on central position.In addition, a part for electroconductibility adhesive tape can contact and batch with flange inner face.Based on the material of flange inner face, the stripping strength of conductive adhesive and flange is, below 1.5N/25mm, to be preferably below 1.0N/25mm, even if therefore electroconductibility adhesive tape contacts with flange inner face, tackiness agent is also difficult to adhere to.Even if adhered to, because stripping strength is below 1.5N/25mm, therefore in the operation pulling out from coiling body user, tackiness agent also can easily fall from flange inner emaciated face, can not cause the thickness of the binder layer being caused by the stretching of binder layer to reduce, or the lax such phenomenon of the binder layer of electroconductibility adhesive tape side.Embodiment
By embodiment, describe for implementing best mode of the present invention.Embodiment not delimit the scope of the invention.
[measurement for Evaluation method]
The measurement for Evaluation method adopting in following examples is as described below.
(1) stripping strength
Electroconductibility adhesive tape is cut into 25mm × 50mm to make test film, test film is attached on flange, take JIS-C-6481 as benchmark, at 23 ℃, measure and carry out conductive paste girdle tests sheet stripping strength (N/25mm) during 90 ° of stripping tests when flange is peeled off.
(2) pull-out property
Make the spool reversion of the conductive paste tape wrapping body of making, the power take pullout forces as 0.03N/25mm is extracted electroconductibility adhesive tape out from spool.After extraction, visual observation has or not adhesive attachment on flange inner face.
About the extraction of bonding film, using interrupting, also not having on flange inner face, the situation of adhesive attachment is good as pull-out property, is evaluated as "○"; Although be pull-out property possibility " △ " by the average evaluation that does not interrupt, still observes adhesive attachment on flange inner face; By the average evaluation that occurs to interrupt, it is the bad "×" of pull-out property.
[making of electroconductibility adhesive tape]
(1) conductive adhesive compositions
Conductive adhesive solution A
Use solid epoxy resin and liquid-state epoxy resin as thermosetting resin and phenoxy resin as thermoplastic resin, with solid epoxy resin: the % by weight ratio of liquid-state epoxy resin: phenoxy resin=15:50:35 mixes, further mix imidazoles potentiality solidifying agent, after being dissolved in organic solvent, mix 3 minutes with centrifugal mixer mixing machine, make solid content and be 60% homogeneous solution.
Then, it is 0.1 volume % that interpolation conductive particle makes the filling ratio of the conductive particle represented with the per-cent that accounts for solid substance (conductive particle+resin) total amount, stirs and makes it dispersed afterwards with centrifugal mixing machine, makes conductive adhesive solution.The material using is as follows.
Solid epoxy resin: jER1010 and 1004, Mitsubishi chemical Co., Ltd's system
Liquid-state epoxy resin: jER828, Mitsubishi chemical Co., Ltd's system; And EPICLONHP-4032D, Dainippon Ink Chemicals's system
Phenoxy resin: Off ェ ノ ト ー ト YP-50, Toto Kasei KK's system
Imidazoles potentiality solidifying agent: ノ バ キ ュ ア HXA3932HP, the イ ー マ テ リ ア of Asahi Chemical Industry Le ズ Co., Ltd. system
Organic solvent: propylene glycol monomethyl ether
Conductive particle: particle diameter is that 1 μ m is following, particle length is the needle-like Ni particle below 10 μ m
Conductive adhesive solution B
According to the mode same with conductive adhesive solution A, prepare conductive adhesive solution, difference is, the ratio of solid epoxy resin, liquid-state epoxy resin and phenoxy resin is changed into solid epoxy resin: liquid-state epoxy resin: phenoxy resin=15:45:40(% by weight).
Conductive adhesive solution C
According to the mode same with conductive adhesive solution B, prepare conductive adhesive solution, difference is, to further appending with respect to total 100 weight parts of above-mentioned solid epoxy resin, liquid-state epoxy resin and phenoxy resin in electroconductibility binder solution B, it is the elastomerics composition as thermoplastic resin (TPAE-826, Fuji changes into Industrial Co., Ltd's system) of 5 weight parts.
Conductive adhesive solution D
According to the mode same with conductive adhesive solution A, prepare conductive adhesive solution, difference is, to further appending with respect to total 100 weight parts of above-mentioned solid epoxy resin, liquid-state epoxy resin and phenoxy resin in electroconductibility binder solution A, is the above-mentioned elastomerics composition as thermoplastic resin of 5 weight parts.
(2) making of electroconductibility adhesive tape
Use scraper using the conductive adhesive solution A-D of above-mentioned preparation be coated on the polyester film that has carried out demoulding processing as base material film (thickness be 50 μ m) on, making dry thickness is 25 μ m, in the magnetic field that is 100mT in magnetic flux density afterwards, dry solidification 30 minutes at 60 ℃, makes the electroconductibility adhesive tape of conductive particle along field direction orientation, thick 20 μ m thus.
It should be noted that, take JIS K7127 as benchmark, the tensile break strength of membranaceous conductive adhesive that measure, that used above-mentioned conductive adhesive solution A is 5.5N/mm2, and tension fracture elongation rate is 210%.
[making and the evaluation of conductive paste tape wrapping body]
Conductive paste tape wrapping body No.1-4:
At external diameter, be, on the both sides of 55mm, axial length (flange space D) the volume core that is 1.8mm, the flange (external diameter 125mm) made from material shown in table 1 is installed, as spool No.1-4.The electroconductibility adhesive tape that is cut into wide 1.5mm of being made by above-mentioned conductive adhesive solution A is arranged on automatic coiling apparatus, is wound to each spool No.1-4 that flange material is different upper, make conductive paste tape wrapping body No.1-4.
Detect the pull-out of prepared each conductive paste tape wrapping body No.1-4.
Evaluation result is shown in Table 1 together with the measured value of the stripping strength with respect to flange.
Conductive paste tape wrapping body No.5-8:
According to the method identical with conductive paste tape wrapping body No.1-4, make conductive paste tape wrapping body No.5-8, difference is, uses conductive adhesive solution B to replace conductive adhesive solution A.
Detect the pull-out of prepared each conductive paste tape wrapping body No.5-8.
Evaluation result is shown in Table 2 together with the measured value of the stripping strength with respect to flange.
Conductive paste tape wrapping body No.9-12:
According to the method identical with conductive paste tape wrapping body No.1-4, make conductive paste tape wrapping body No.9-12, difference is, uses conductive adhesive solution C to replace conductive adhesive solution A.
Detect the pull-out of prepared each conductive paste tape wrapping body No.9-12.
Evaluation result is shown in Table 3 together with the measured value of the stripping strength with respect to flange.
Conductive paste tape wrapping body No.13-16:
According to the method identical with conductive paste tape wrapping body No.1-4, make conductive paste tape wrapping body No.13-16, difference is, uses conductive adhesive solution D to replace conductive adhesive solution A.
Detect the pull-out of prepared each conductive paste tape wrapping body No.13-16.
Evaluation result is shown in Table 4 together with the measured value of the stripping strength with respect to flange.
[table 1]
| Coiling body No. | 1 | 2 | 3 | 4 |
| Conductive adhesive solution | A | A | A | A |
| Flange material | PS | AC resin | PC | PET |
| Stripping strength (N/25mm) | 0.5 | 3.0 | 2.1 | 1.7 |
| Pull-out property | ○ | × | × | △ |
[table 2]
| Coiling body No. | 5 | 6 | 7 | 8 |
| Conductive adhesive solution | B | B | B | B |
| Flange material | PS | AC resin | PC | PET |
| Stripping strength (N/25mm) | 0.3 | 1.8 | 0.6 | 1.8 |
| Pull-out property | ○ | × | ○ | × |
[table 3]
| Coiling body No. | 9 | 10 | 11 | 12 |
| Conductive adhesive solution | C | C | C | C |
| Flange material | PS | AC resin | PC | PET |
| Stripping strength (N/25mm) | 0.9 | 2.8 | 1.5 | 4.1 |
| Pull-out property | ○ | × | ○ | × |
[table 4]
| Coiling body No. | 13 | 14 | 15 | 16 |
| Conductive adhesive solution | D | D | D | D |
| Flange material | PS | AC resin | PC | PET |
| Stripping strength (N/25mm) | 1.2 | 2.6 | 2.4 | 3.0 |
| Pull-out property | ○ | × | × | × |
PS: polystyrene
AC resin: acrylic resin
PC: polycarbonate
PET: polyethylene terephthalate
By table 1 to table 4, can be found out, having used in the conductive paste tape wrapping body No.1,5,7,9,11,13 that stripping strength is the spool below 1.5N/25mm, not interrupt.It should be noted that, in the conductive paste tape wrapping body No.1,5,9,13 that has used the spool with polystyrene flange processed, any one does not all interrupt.On the other hand, used stripping strength to exceed that in the conductive paste tape wrapping body No.2,3,6,8,10,12,14,15,16 of spool of 1.5N/25mm, interruption has all occurred for any one.Having used in the conductive paste tape wrapping body No.4 of the PET flange processed that stripping strength is 1.7N/25mm, although do not interrupt, observe adhesive attachment on flange inner face.
Industrial applicibility
According to conductive paste tape wrapping body of the present invention, in the manufacturing process of coiling body, storage procedure, conductive adhesive is all difficult to be attached on flange inner face, even if adhered to, also can easily come off by the pullout forces of electroconductibility adhesive tape, therefore regardless of being in the production scene of coiling body or using in the connection scene of circuit substrate of conductive paste tape wrapping body, productive rate is all high, and productivity is all excellent.
Nomenclature
1 volume core
2 flanges (spool flange)
3 spools
10 electroconductibility adhesive tapes
Claims (7)
1. a conductive paste tape wrapping body, it comprises the spool consisting of cylindric volume core and the flange that is arranged on these volume core both sides; And be wound on the electroconductibility adhesive tape on described volume core,
Stripping strength between the conductive adhesive of wherein said flange and the described electroconductibility adhesive tape of formation is below 1.5N/25mm.
2. conductive paste tape wrapping body according to claim 1, wherein in described flange, the face by described volume core one side of this flange is that material below 1.5N/25mm forms by the stripping strength with respect to described conductive adhesive.
3. conductive paste tape wrapping body according to claim 1 and 2, the products formed that wherein said flange is hydrocarbon resin.
4. conductive paste tape wrapping body according to claim 3, wherein said hydrocarbon resin is polystyrene.
5. according to the conductive paste tape wrapping body described in any one in claim 1～4, wherein said conductive adhesive contains at least one above thermosetting resin and the conductive particle in the group of selecting free epoxy resin, resol and polymerizability acrylic resin composition.
6. conductive paste tape wrapping body according to claim 5, wherein said conductive adhesive further contains solidifying agent and thermoplastic resin.
7. according to the conductive paste tape wrapping body described in any one in claim 1～6, wherein said conductive adhesive is anisotropic conductive tackiness agent.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-174486 | 2011-08-10 | ||
| JP2011174486 | 2011-08-10 | ||
| PCT/JP2012/069827 WO2013021936A1 (en) | 2011-08-10 | 2012-08-03 | Conductive adhesive tape winding unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103732708A true CN103732708A (en) | 2014-04-16 |
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ID=47668444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280039018.1A Pending CN103732708A (en) | 2011-08-10 | 2012-08-03 | Conductive adhesive tape winding unit |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2013021936A1 (en) |
| CN (1) | CN103732708A (en) |
| WO (1) | WO2013021936A1 (en) |
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| JP7446095B2 (en) * | 2019-12-03 | 2024-03-08 | デクセリアルズ株式会社 | Manufacturing method of film wrapping body and connection body |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101278027A (en) * | 2005-09-30 | 2008-10-01 | 住友电气工业株式会社 | Anisotropic conductive adhesive |
| CN101953026A (en) * | 2008-10-21 | 2011-01-19 | 住友电气工业株式会社 | Opic electroconductive film |
| JP2011126711A (en) * | 2009-11-18 | 2011-06-30 | Hitachi Chem Co Ltd | Reel for anisotropic conductive film, anisotropic conductive film winding and connecting method of circuit member |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61137637U (en) * | 1985-02-13 | 1986-08-27 | ||
| JP3054466B2 (en) * | 1991-05-30 | 2000-06-19 | 信越ポリマー株式会社 | Anisotropic conductive adhesive film and manufacturing method thereof |
| JP3059762U (en) * | 1998-12-10 | 1999-07-13 | アイシート工業株式会社 | Tape reel |
| JP2008239845A (en) * | 2007-03-28 | 2008-10-09 | Sumitomo Chemical Co Ltd | Pressure-sensitive adhesive film |
-
2012
- 2012-08-03 CN CN201280039018.1A patent/CN103732708A/en active Pending
- 2012-08-03 JP JP2013528004A patent/JPWO2013021936A1/en active Pending
- 2012-08-03 WO PCT/JP2012/069827 patent/WO2013021936A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101278027A (en) * | 2005-09-30 | 2008-10-01 | 住友电气工业株式会社 | Anisotropic conductive adhesive |
| CN101953026A (en) * | 2008-10-21 | 2011-01-19 | 住友电气工业株式会社 | Opic electroconductive film |
| JP2011126711A (en) * | 2009-11-18 | 2011-06-30 | Hitachi Chem Co Ltd | Reel for anisotropic conductive film, anisotropic conductive film winding and connecting method of circuit member |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013021936A1 (en) | 2015-03-05 |
| WO2013021936A1 (en) | 2013-02-14 |
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Application publication date: 20140416 |