CN114667806B - 陶瓷基板、复合基板及电路基板以及陶瓷基板的制造方法、复合基板的制造方法、电路基板的制造方法及多个电路基板的制造方法 - Google Patents

陶瓷基板、复合基板及电路基板以及陶瓷基板的制造方法、复合基板的制造方法、电路基板的制造方法及多个电路基板的制造方法 Download PDF

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CN114667806B
CN114667806B CN202080078881.2A CN202080078881A CN114667806B CN 114667806 B CN114667806 B CN 114667806B CN 202080078881 A CN202080078881 A CN 202080078881A CN 114667806 B CN114667806 B CN 114667806B
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ceramic substrate
manufacturing
substrate
metal layer
thickness direction
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CN114667806A (zh
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津川优太
西村浩二
小桥圣治
江嶋善幸
汤浅晃正
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Denka Co Ltd
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Denka Co Ltd
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
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  • Structural Engineering (AREA)
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CN202080078881.2A 2019-11-15 2020-11-13 陶瓷基板、复合基板及电路基板以及陶瓷基板的制造方法、复合基板的制造方法、电路基板的制造方法及多个电路基板的制造方法 Active CN114667806B (zh)

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JP2019-206750 2019-11-15
JP2019206750 2019-11-15
PCT/JP2020/042420 WO2021095843A1 (ja) 2019-11-15 2020-11-13 セラミック基板、複合基板及び回路基板並びにセラミック基板の製造方法、複合基板の製造方法、回路基板の製造方法及び複数の回路基板の製造方法

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CN114667806A CN114667806A (zh) 2022-06-24
CN114667806B true CN114667806B (zh) 2024-04-02

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JP7695850B2 (ja) * 2021-09-21 2025-06-19 デンカ株式会社 セラミック複合基板、及びセラミック複合基板の製造方法
CN118119577A (zh) 2021-12-23 2024-05-31 株式会社德山 生片、氮化硅烧结体的制造方法及氮化硅烧结体
CN115124351B (zh) * 2022-07-18 2023-10-20 合肥圣达电子科技实业有限公司 氮化铝多层用高温阻焊浆料及其制备方法
WO2025205771A1 (ja) * 2024-03-28 2025-10-02 京セラ株式会社 窒化珪素基板及び冷却装置

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JPH02141476A (ja) * 1988-11-21 1990-05-30 Murata Mfg Co Ltd セラミック基板の製造方法
JPH10167804A (ja) * 1996-12-11 1998-06-23 Denki Kagaku Kogyo Kk セラミックス基板及びそれを用いた回路基板とその製造方法
JP2007019123A (ja) * 2005-07-06 2007-01-25 Sumitomo Metal Electronics Devices Inc セラミック回路基板集合体
JP2007198626A (ja) * 2006-01-24 2007-08-09 Tdk Corp 焼成炉
JP2008186897A (ja) * 2007-01-29 2008-08-14 Tdk Corp 多層セラミック基板の製造方法
CN108495831A (zh) * 2016-03-28 2018-09-04 日立金属株式会社 氮化硅烧结基板、氮化硅烧结基板片、回路基板和氮化硅烧结基板的制造方法

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US4155960A (en) * 1977-03-02 1979-05-22 Norton Company Porcelain tower packing
EP1201623B1 (en) * 2000-10-27 2016-08-31 Kabushiki Kaisha Toshiba Silicon nitride ceramic substrate and silicon nitride ceramic circuit board using the substrate
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