KR20220100629A - 세라믹 기판, 복합 기판 및 회로 기판 그리고 세라믹 기판의 제조 방법, 복합 기판의 제조 방법, 회로 기판의 제조 방법 및 복수의 회로 기판의 제조 방법 - Google Patents

세라믹 기판, 복합 기판 및 회로 기판 그리고 세라믹 기판의 제조 방법, 복합 기판의 제조 방법, 회로 기판의 제조 방법 및 복수의 회로 기판의 제조 방법 Download PDF

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KR20220100629A
KR20220100629A KR1020227019594A KR20227019594A KR20220100629A KR 20220100629 A KR20220100629 A KR 20220100629A KR 1020227019594 A KR1020227019594 A KR 1020227019594A KR 20227019594 A KR20227019594 A KR 20227019594A KR 20220100629 A KR20220100629 A KR 20220100629A
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ceramic substrate
metal layer
manufacturing
thickness direction
plate thickness
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Korean (ko)
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유타 츠가와
고지 니시무라
세이지 고바시
요시유키 에시마
아키마사 유아사
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덴카 주식회사
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Ceramic Engineering (AREA)
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  • Materials Engineering (AREA)
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KR1020227019594A 2019-11-15 2020-11-13 세라믹 기판, 복합 기판 및 회로 기판 그리고 세라믹 기판의 제조 방법, 복합 기판의 제조 방법, 회로 기판의 제조 방법 및 복수의 회로 기판의 제조 방법 Ceased KR20220100629A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-206750 2019-11-15
JP2019206750 2019-11-15
PCT/JP2020/042420 WO2021095843A1 (ja) 2019-11-15 2020-11-13 セラミック基板、複合基板及び回路基板並びにセラミック基板の製造方法、複合基板の製造方法、回路基板の製造方法及び複数の回路基板の製造方法

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KR20220100629A true KR20220100629A (ko) 2022-07-15

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KR1020227019594A Ceased KR20220100629A (ko) 2019-11-15 2020-11-13 세라믹 기판, 복합 기판 및 회로 기판 그리고 세라믹 기판의 제조 방법, 복합 기판의 제조 방법, 회로 기판의 제조 방법 및 복수의 회로 기판의 제조 방법

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EP (1) EP4059911B1 (https=)
JP (1) JP7168795B2 (https=)
KR (1) KR20220100629A (https=)
CN (1) CN114667806B (https=)
WO (1) WO2021095843A1 (https=)

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JP7695850B2 (ja) * 2021-09-21 2025-06-19 デンカ株式会社 セラミック複合基板、及びセラミック複合基板の製造方法
CN118119577A (zh) 2021-12-23 2024-05-31 株式会社德山 生片、氮化硅烧结体的制造方法及氮化硅烧结体
CN115124351B (zh) * 2022-07-18 2023-10-20 合肥圣达电子科技实业有限公司 氮化铝多层用高温阻焊浆料及其制备方法
WO2025205771A1 (ja) * 2024-03-28 2025-10-02 京セラ株式会社 窒化珪素基板及び冷却装置

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2018018971A (ja) 2016-07-28 2018-02-01 日立金属株式会社 セラミック基板の製造方法

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US4155960A (en) * 1977-03-02 1979-05-22 Norton Company Porcelain tower packing
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