CN114641854A - 用于基板料盒的装卸装置、基板料盒系统 - Google Patents

用于基板料盒的装卸装置、基板料盒系统 Download PDF

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Publication number
CN114641854A
CN114641854A CN202080076808.1A CN202080076808A CN114641854A CN 114641854 A CN114641854 A CN 114641854A CN 202080076808 A CN202080076808 A CN 202080076808A CN 114641854 A CN114641854 A CN 114641854A
Authority
CN
China
Prior art keywords
substrate
conveyor belt
handling device
magazine
gripper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080076808.1A
Other languages
English (en)
Chinese (zh)
Inventor
托尔斯滕·维格拉恩
于尔根·莱纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asys Automatisierungssysteme GmbH
Original Assignee
Asys Automatisierungssysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asys Automatisierungssysteme GmbH filed Critical Asys Automatisierungssysteme GmbH
Publication of CN114641854A publication Critical patent/CN114641854A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/023—Cartesian coordinate type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202080076808.1A 2019-11-05 2020-11-05 用于基板料盒的装卸装置、基板料盒系统 Pending CN114641854A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019217033.1 2019-11-05
DE102019217033.1A DE102019217033B4 (de) 2019-11-05 2019-11-05 Be- und Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem
PCT/EP2020/081191 WO2021089735A1 (de) 2019-11-05 2020-11-05 Be- und entladeeinrichtung für ein substratmagazin, substratmagazinsystem

Publications (1)

Publication Number Publication Date
CN114641854A true CN114641854A (zh) 2022-06-17

Family

ID=73138846

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080076808.1A Pending CN114641854A (zh) 2019-11-05 2020-11-05 用于基板料盒的装卸装置、基板料盒系统

Country Status (5)

Country Link
EP (1) EP4055626A1 (ko)
KR (1) KR20220098173A (ko)
CN (1) CN114641854A (ko)
DE (1) DE102019217033B4 (ko)
WO (1) WO2021089735A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN217349507U (zh) * 2022-02-21 2022-09-02 上海世禹精密机械有限公司 半导体元件转运设备
CN114904796B (zh) * 2022-07-14 2022-12-27 前海晶方云(深圳)测试设备有限公司 一种测试设备
DE102022129638B3 (de) 2022-11-09 2024-05-02 Asys Automatisierungssysteme Gmbh Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1234924A (en) 1984-01-21 1988-04-05 Hideo Sakamoto Printed circuit board load-unload system with bypass route
JPH0672508A (ja) 1992-08-28 1994-03-15 Kiyoshi Takahashi ウエハ入替え装置
DE59611078D1 (de) 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
KR100555620B1 (ko) 2003-10-28 2006-03-03 주식회사 디엠에스 기판 운반시스템 및 운반방법
US20070018469A1 (en) * 2005-07-25 2007-01-25 Multimetrixs, Llc Contamination-free edge gripping mechanism with withdrawable pads and method for loading/unloading and transferring flat objects
DE102006014136C5 (de) * 2006-03-28 2017-01-12 Rena Gmbh Maschine zum Entstapeln von scheibenförmigen Substraten
TWI354345B (en) * 2006-07-24 2011-12-11 Semes Co Ltd Apparatus and method for transferring substrate
JP4854427B2 (ja) * 2006-08-11 2012-01-18 東京エレクトロン株式会社 基板移載装置，基板処理装置，基板移載用アーム
DE102007061410A1 (de) * 2007-12-11 2009-06-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel
WO2011032567A1 (de) * 2009-09-15 2011-03-24 Rena Gmbh Vorrichtung und verfahren zum berührungslosen aufnehmen und halten sowie zum fördern von flachen gegenständen
DE102016214184A1 (de) * 2016-08-01 2018-02-01 Asys Automatisierungssysteme Gmbh Transportsystem und Bearbeitungssystem für Substrate

Also Published As

Publication number Publication date
DE102019217033A1 (de) 2021-05-06
KR20220098173A (ko) 2022-07-11
WO2021089735A1 (de) 2021-05-14
EP4055626A1 (de) 2022-09-14
DE102019217033B4 (de) 2022-06-30

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