CN114641727A - 感光性组合物的制造方法及制备用预混液、感光性组合物、干膜及抗蚀剂膜的制造方法 - Google Patents

感光性组合物的制造方法及制备用预混液、感光性组合物、干膜及抗蚀剂膜的制造方法 Download PDF

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Publication number
CN114641727A
CN114641727A CN202080076631.5A CN202080076631A CN114641727A CN 114641727 A CN114641727 A CN 114641727A CN 202080076631 A CN202080076631 A CN 202080076631A CN 114641727 A CN114641727 A CN 114641727A
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group
carbon atoms
photosensitive composition
hydrocarbon group
chemically amplified
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CN202080076631.5A
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Chinese (zh)
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小岛大辅
海老泽和明
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Publication of CN114641727A publication Critical patent/CN114641727A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN202080076631.5A 2019-11-12 2020-10-16 感光性组合物的制造方法及制备用预混液、感光性组合物、干膜及抗蚀剂膜的制造方法 Pending CN114641727A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019205087A JP6999627B2 (ja) 2019-11-12 2019-11-12 化学増幅型感光性組成物の製造方法
JP2019-205087 2019-11-12
PCT/JP2020/039019 WO2021095437A1 (ja) 2019-11-12 2020-10-16 化学増幅型感光性組成物の製造方法、化学増幅型感光性組成物調製用プレミックス液、化学増幅型感光性組成物、感光性ドライフィルムの製造方法及びパターン化されたレジスト膜の製造方法

Publications (1)

Publication Number Publication Date
CN114641727A true CN114641727A (zh) 2022-06-17

Family

ID=75898988

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080076631.5A Pending CN114641727A (zh) 2019-11-12 2020-10-16 感光性组合物的制造方法及制备用预混液、感光性组合物、干膜及抗蚀剂膜的制造方法

Country Status (6)

Country Link
US (1) US20230004085A1 (enExample)
JP (2) JP6999627B2 (enExample)
KR (1) KR102807204B1 (enExample)
CN (1) CN114641727A (enExample)
TW (1) TWI865638B (enExample)
WO (1) WO2021095437A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240095523A (ko) * 2021-11-17 2024-06-25 메르크 파텐트 게엠베하 포지티브형 초후막 포토레지스트 조성물
JP7105021B1 (ja) 2022-03-10 2022-07-22 佐伯重工業株式会社 輸送機器
KR20250029198A (ko) * 2022-07-29 2025-03-04 후지필름 가부시키가이샤 감활성광선성 또는 감방사선성 수지 조성물, 감활성광선성 또는 감방사선성막, 패턴 형성 방법 및 전자 디바이스의 제조 방법

Citations (6)

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JP2010159243A (ja) * 2008-07-28 2010-07-22 Sumitomo Chemical Co Ltd 化合物、該化合物の製造法及び該化合物を含むフォトレジスト組成物
JP2011102829A (ja) * 2009-11-10 2011-05-26 Sony Chemical & Information Device Corp キノンジアジド系感光剤溶液及びポジ型レジスト組成物
JP2012185482A (ja) * 2011-02-16 2012-09-27 Sumitomo Chemical Co Ltd レジスト組成物
CN106019830A (zh) * 2015-03-31 2016-10-12 住友化学株式会社 抗蚀剂组合物及抗蚀图案的制造方法
JP2019052142A (ja) * 2017-09-15 2019-04-04 住友化学株式会社 化合物、レジスト組成物及びレジストパターンの製造方法
US20190278178A1 (en) * 2018-03-12 2019-09-12 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive-type photosensitive resin composition, method for manufacturing substrate with template, and method for manufacturing plated article

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JP3921748B2 (ja) 1997-08-08 2007-05-30 住友化学株式会社 フォトレジスト組成物
JP2009176112A (ja) 2008-01-25 2009-08-06 Mazda Motor Corp 乗員の視線検出装置
US8841062B2 (en) 2012-12-04 2014-09-23 Az Electronic Materials (Luxembourg) S.A.R.L. Positive working photosensitive material
CN104460232B (zh) 2013-09-24 2019-11-15 住友化学株式会社 光致抗蚀剂组合物
TWI731961B (zh) 2016-04-19 2021-07-01 德商馬克專利公司 正向感光材料及形成正向凸紋影像之方法
WO2020121968A1 (ja) * 2018-12-12 2020-06-18 Jsr株式会社 メッキ造形物の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010159243A (ja) * 2008-07-28 2010-07-22 Sumitomo Chemical Co Ltd 化合物、該化合物の製造法及び該化合物を含むフォトレジスト組成物
JP2011102829A (ja) * 2009-11-10 2011-05-26 Sony Chemical & Information Device Corp キノンジアジド系感光剤溶液及びポジ型レジスト組成物
CN102597876A (zh) * 2009-11-10 2012-07-18 索尼化学&信息部件株式会社 醌重氮化物类感光剂溶液及正性光致抗蚀剂组合物
JP2012185482A (ja) * 2011-02-16 2012-09-27 Sumitomo Chemical Co Ltd レジスト組成物
CN106019830A (zh) * 2015-03-31 2016-10-12 住友化学株式会社 抗蚀剂组合物及抗蚀图案的制造方法
JP2017009999A (ja) * 2015-03-31 2017-01-12 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP2019052142A (ja) * 2017-09-15 2019-04-04 住友化学株式会社 化合物、レジスト組成物及びレジストパターンの製造方法
US20190278178A1 (en) * 2018-03-12 2019-09-12 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive-type photosensitive resin composition, method for manufacturing substrate with template, and method for manufacturing plated article

Also Published As

Publication number Publication date
TW202124592A (zh) 2021-07-01
WO2021095437A1 (ja) 2021-05-20
KR102807204B1 (ko) 2025-05-13
JP7393408B2 (ja) 2023-12-06
JP6999627B2 (ja) 2022-01-18
KR20220101615A (ko) 2022-07-19
JP2021076784A (ja) 2021-05-20
JP2022037181A (ja) 2022-03-08
US20230004085A1 (en) 2023-01-05
TWI865638B (zh) 2024-12-11

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