CN114556540A - 用于切割半导体结构的具有弹簧构件的切割系统及切割此类结构的方法 - Google Patents

用于切割半导体结构的具有弹簧构件的切割系统及切割此类结构的方法 Download PDF

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Publication number
CN114556540A
CN114556540A CN202080072907.2A CN202080072907A CN114556540A CN 114556540 A CN114556540 A CN 114556540A CN 202080072907 A CN202080072907 A CN 202080072907A CN 114556540 A CN114556540 A CN 114556540A
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CN
China
Prior art keywords
cutting
suction
semiconductor structure
spring member
cutting arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080072907.2A
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English (en)
Chinese (zh)
Inventor
J·S·凯泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalWafers Co Ltd
Original Assignee
GlobalWafers Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GlobalWafers Co Ltd filed Critical GlobalWafers Co Ltd
Publication of CN114556540A publication Critical patent/CN114556540A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Semiconductor Lasers (AREA)
CN202080072907.2A 2019-09-27 2020-09-17 用于切割半导体结构的具有弹簧构件的切割系统及切割此类结构的方法 Pending CN114556540A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962906860P 2019-09-27 2019-09-27
US62/906,860 2019-09-27
PCT/US2020/051180 WO2021061480A1 (en) 2019-09-27 2020-09-17 Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures

Publications (1)

Publication Number Publication Date
CN114556540A true CN114556540A (zh) 2022-05-27

Family

ID=72709863

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080072907.2A Pending CN114556540A (zh) 2019-09-27 2020-09-17 用于切割半导体结构的具有弹簧构件的切割系统及切割此类结构的方法

Country Status (7)

Country Link
US (3) US11538698B2 (https=)
EP (1) EP4035202B1 (https=)
JP (2) JP7418559B2 (https=)
KR (2) KR102937744B1 (https=)
CN (1) CN114556540A (https=)
TW (2) TWI833039B (https=)
WO (1) WO2021061480A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7309191B2 (ja) * 2019-11-06 2023-07-18 中村留精密工業株式会社 ウェハー分割装置
US12019031B2 (en) * 2020-09-16 2024-06-25 Globalwafers Co., Ltd. Cleaved semiconductor wafer imaging system
US20260026320A1 (en) * 2024-07-19 2026-01-22 Globalwafers Co., Ltd. Cleaving systems and methods for cleaving semiconductor structures by combined thermal and mechanical stress induction

Citations (7)

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GB763831A (en) * 1953-06-01 1956-12-19 Headley Townsend Backhouse Improvements in sheet separating and forwarding devices
EP0035963A1 (fr) * 1980-03-10 1981-09-16 Les Fabriques d'Assortiments Réunies Installation de sciage de matériaux en plaque
CN1133768A (zh) * 1994-12-27 1996-10-23 精工爱普生株式会社 层积片的切割方法及其装置
JP2004335930A (ja) * 2003-05-12 2004-11-25 Juki Corp ウェハの劈開方法及び劈開装置
CN1910035A (zh) * 2004-01-09 2007-02-07 硅源公司 用于可控分裂的设备和方法
US20150101758A1 (en) * 2013-10-11 2015-04-16 Tokyo Electron Limited Peel-off apparatus, peel-off system, peel-off method and computer storage medium
CN208898748U (zh) * 2019-03-11 2019-05-24 成都力维展示工程有限公司 一种具有自动掰片功能的玻璃切割机

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JP2726002B2 (ja) * 1994-06-06 1998-03-11 株式会社アマダ 一枚取り装置
US5676364A (en) 1994-08-19 1997-10-14 Amada Company, Limited Plate material separating apparatus
JPH115064A (ja) * 1997-06-16 1999-01-12 Canon Inc 試料の分離装置及びその方法並びに基板の製造方法
JP2000150456A (ja) 1998-11-06 2000-05-30 Canon Inc 試料の分離装置及び分離方法
US6263941B1 (en) 1999-08-10 2001-07-24 Silicon Genesis Corporation Nozzle for cleaving substrates
JP4517315B2 (ja) 1999-10-08 2010-08-04 株式会社ニコン 基板落下防止機構およびこれを備えた基板検査装置
EP1624484B1 (en) 2003-05-13 2012-03-28 Mimasu Semiconductor Industry Co., Ltd. Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
US7427554B2 (en) 2005-08-12 2008-09-23 Silicon Genesis Corporation Manufacturing strained silicon substrates using a backing material
US8993410B2 (en) 2006-09-08 2015-03-31 Silicon Genesis Corporation Substrate cleaving under controlled stress conditions
US11389171B2 (en) * 2006-11-21 2022-07-19 David S. Goldsmith Integrated system for the infixion and retrieval of implants
US8845859B2 (en) 2011-03-15 2014-09-30 Sunedison Semiconductor Limited (Uen201334164H) Systems and methods for cleaving a bonded wafer pair
JP6145415B2 (ja) 2014-02-27 2017-06-14 東京エレクトロン株式会社 剥離方法、プログラム、コンピュータ記憶媒体、剥離装置及び剥離システム
WO2017065155A1 (ja) 2015-10-16 2017-04-20 旭硝子株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP2017168563A (ja) 2016-03-15 2017-09-21 日本電気硝子株式会社 基板の剥離装置
JP2018043377A (ja) * 2016-09-13 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 剥離装置および剥離方法
WO2018188731A1 (de) 2017-04-11 2018-10-18 Muehlbauer GmbH & Co. KG Bauteil-empfangseinrichtung mit optischem sensor
KR102565070B1 (ko) 2017-09-04 2023-08-08 린텍 가부시키가이샤 박형화 판상 부재의 제조 방법, 및 제조 장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB763831A (en) * 1953-06-01 1956-12-19 Headley Townsend Backhouse Improvements in sheet separating and forwarding devices
EP0035963A1 (fr) * 1980-03-10 1981-09-16 Les Fabriques d'Assortiments Réunies Installation de sciage de matériaux en plaque
CN1133768A (zh) * 1994-12-27 1996-10-23 精工爱普生株式会社 层积片的切割方法及其装置
JP2004335930A (ja) * 2003-05-12 2004-11-25 Juki Corp ウェハの劈開方法及び劈開装置
CN1910035A (zh) * 2004-01-09 2007-02-07 硅源公司 用于可控分裂的设备和方法
US20150101758A1 (en) * 2013-10-11 2015-04-16 Tokyo Electron Limited Peel-off apparatus, peel-off system, peel-off method and computer storage medium
CN208898748U (zh) * 2019-03-11 2019-05-24 成都力维展示工程有限公司 一种具有自动掰片功能的玻璃切割机

Also Published As

Publication number Publication date
TWI902008B (zh) 2025-10-21
KR102710431B1 (ko) 2024-09-25
EP4035202A1 (en) 2022-08-03
EP4035202B1 (en) 2023-08-16
KR20220071229A (ko) 2022-05-31
US12148635B2 (en) 2024-11-19
JP7699633B2 (ja) 2025-06-27
JP2023171825A (ja) 2023-12-05
WO2021061480A1 (en) 2021-04-01
US20230031395A1 (en) 2023-02-02
US20210098272A1 (en) 2021-04-01
JP7418559B2 (ja) 2024-01-19
KR102937744B1 (ko) 2026-03-12
US11538698B2 (en) 2022-12-27
US20240332042A1 (en) 2024-10-03
KR20230137484A (ko) 2023-10-04
TW202127566A (zh) 2021-07-16
TWI833039B (zh) 2024-02-21
US12334369B2 (en) 2025-06-17
TW202403938A (zh) 2024-01-16
JP2022550363A (ja) 2022-12-01

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