JP7418559B2 - ばね部材を有し半導体構造を劈開するための劈開システム、及びそのような構造を劈開するための方法 - Google Patents

ばね部材を有し半導体構造を劈開するための劈開システム、及びそのような構造を劈開するための方法 Download PDF

Info

Publication number
JP7418559B2
JP7418559B2 JP2022519372A JP2022519372A JP7418559B2 JP 7418559 B2 JP7418559 B2 JP 7418559B2 JP 2022519372 A JP2022519372 A JP 2022519372A JP 2022519372 A JP2022519372 A JP 2022519372A JP 7418559 B2 JP7418559 B2 JP 7418559B2
Authority
JP
Japan
Prior art keywords
cleaving
suction
arm
semiconductor structure
spring member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022519372A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022550363A5 (https=
JP2022550363A (ja
Inventor
スコット カイザー，ジャスティン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalWafers Co Ltd
Original Assignee
GlobalWafers Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GlobalWafers Co Ltd filed Critical GlobalWafers Co Ltd
Publication of JP2022550363A publication Critical patent/JP2022550363A/ja
Priority to JP2023156214A priority Critical patent/JP7699633B2/ja
Publication of JP2022550363A5 publication Critical patent/JP2022550363A5/ja
Application granted granted Critical
Publication of JP7418559B2 publication Critical patent/JP7418559B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Semiconductor Lasers (AREA)
JP2022519372A 2019-09-27 2020-09-17 ばね部材を有し半導体構造を劈開するための劈開システム、及びそのような構造を劈開するための方法 Active JP7418559B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023156214A JP7699633B2 (ja) 2019-09-27 2023-09-21 ばね部材を有し半導体構造を劈開するための劈開システム、及びそのような構造を劈開するための方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962906860P 2019-09-27 2019-09-27
US62/906,860 2019-09-27
PCT/US2020/051180 WO2021061480A1 (en) 2019-09-27 2020-09-17 Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023156214A Division JP7699633B2 (ja) 2019-09-27 2023-09-21 ばね部材を有し半導体構造を劈開するための劈開システム、及びそのような構造を劈開するための方法

Publications (3)

Publication Number Publication Date
JP2022550363A JP2022550363A (ja) 2022-12-01
JP2022550363A5 JP2022550363A5 (https=) 2023-09-26
JP7418559B2 true JP7418559B2 (ja) 2024-01-19

Family

ID=72709863

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022519372A Active JP7418559B2 (ja) 2019-09-27 2020-09-17 ばね部材を有し半導体構造を劈開するための劈開システム、及びそのような構造を劈開するための方法
JP2023156214A Active JP7699633B2 (ja) 2019-09-27 2023-09-21 ばね部材を有し半導体構造を劈開するための劈開システム、及びそのような構造を劈開するための方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023156214A Active JP7699633B2 (ja) 2019-09-27 2023-09-21 ばね部材を有し半導体構造を劈開するための劈開システム、及びそのような構造を劈開するための方法

Country Status (7)

Country Link
US (3) US11538698B2 (https=)
EP (1) EP4035202B1 (https=)
JP (2) JP7418559B2 (https=)
KR (2) KR102937744B1 (https=)
CN (1) CN114556540A (https=)
TW (2) TWI833039B (https=)
WO (1) WO2021061480A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7309191B2 (ja) * 2019-11-06 2023-07-18 中村留精密工業株式会社 ウェハー分割装置
US12019031B2 (en) * 2020-09-16 2024-06-25 Globalwafers Co., Ltd. Cleaved semiconductor wafer imaging system
US20260026320A1 (en) * 2024-07-19 2026-01-22 Globalwafers Co., Ltd. Cleaving systems and methods for cleaving semiconductor structures by combined thermal and mechanical stress induction

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007526628A (ja) 2004-01-09 2007-09-13 シリコン ジェネシス コーポレーション 制御された分割のための装置および方法
US20130062020A1 (en) 2011-03-15 2013-03-14 Memc Electronic Materials, Inc. Systems and Methods for Cleaving A Bonded Wafer Pair
JP2015076570A (ja) 2013-10-11 2015-04-20 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2018043377A (ja) 2016-09-13 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 剥離装置および剥離方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB763831A (en) * 1953-06-01 1956-12-19 Headley Townsend Backhouse Improvements in sheet separating and forwarding devices
CH635769A5 (fr) * 1980-03-10 1983-04-29 Far Fab Assortiments Reunies Installation pour le sciage de plaques et dispositif de manutention pour une telle installation.
JP2726002B2 (ja) * 1994-06-06 1998-03-11 株式会社アマダ 一枚取り装置
US5676364A (en) 1994-08-19 1997-10-14 Amada Company, Limited Plate material separating apparatus
JPH08229887A (ja) * 1994-12-27 1996-09-10 Seiko Epson Corp 積層シートのカット方法およびその装置
JPH115064A (ja) * 1997-06-16 1999-01-12 Canon Inc 試料の分離装置及びその方法並びに基板の製造方法
JP2000150456A (ja) 1998-11-06 2000-05-30 Canon Inc 試料の分離装置及び分離方法
US6263941B1 (en) 1999-08-10 2001-07-24 Silicon Genesis Corporation Nozzle for cleaving substrates
JP4517315B2 (ja) 1999-10-08 2010-08-04 株式会社ニコン 基板落下防止機構およびこれを備えた基板検査装置
JP2004335930A (ja) * 2003-05-12 2004-11-25 Juki Corp ウェハの劈開方法及び劈開装置
EP1624484B1 (en) 2003-05-13 2012-03-28 Mimasu Semiconductor Industry Co., Ltd. Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
US7427554B2 (en) 2005-08-12 2008-09-23 Silicon Genesis Corporation Manufacturing strained silicon substrates using a backing material
US8993410B2 (en) 2006-09-08 2015-03-31 Silicon Genesis Corporation Substrate cleaving under controlled stress conditions
US11389171B2 (en) * 2006-11-21 2022-07-19 David S. Goldsmith Integrated system for the infixion and retrieval of implants
JP6145415B2 (ja) 2014-02-27 2017-06-14 東京エレクトロン株式会社 剥離方法、プログラム、コンピュータ記憶媒体、剥離装置及び剥離システム
WO2017065155A1 (ja) 2015-10-16 2017-04-20 旭硝子株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP2017168563A (ja) 2016-03-15 2017-09-21 日本電気硝子株式会社 基板の剥離装置
WO2018188731A1 (de) 2017-04-11 2018-10-18 Muehlbauer GmbH & Co. KG Bauteil-empfangseinrichtung mit optischem sensor
KR102565070B1 (ko) 2017-09-04 2023-08-08 린텍 가부시키가이샤 박형화 판상 부재의 제조 방법, 및 제조 장치
CN208898748U (zh) * 2019-03-11 2019-05-24 成都力维展示工程有限公司 一种具有自动掰片功能的玻璃切割机

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007526628A (ja) 2004-01-09 2007-09-13 シリコン ジェネシス コーポレーション 制御された分割のための装置および方法
US20130062020A1 (en) 2011-03-15 2013-03-14 Memc Electronic Materials, Inc. Systems and Methods for Cleaving A Bonded Wafer Pair
JP2015076570A (ja) 2013-10-11 2015-04-20 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2018043377A (ja) 2016-09-13 2018-03-22 株式会社Ｓｃｒｅｅｎホールディングス 剥離装置および剥離方法

Also Published As

Publication number Publication date
TWI902008B (zh) 2025-10-21
KR102710431B1 (ko) 2024-09-25
EP4035202A1 (en) 2022-08-03
EP4035202B1 (en) 2023-08-16
KR20220071229A (ko) 2022-05-31
US12148635B2 (en) 2024-11-19
JP7699633B2 (ja) 2025-06-27
JP2023171825A (ja) 2023-12-05
WO2021061480A1 (en) 2021-04-01
US20230031395A1 (en) 2023-02-02
US20210098272A1 (en) 2021-04-01
CN114556540A (zh) 2022-05-27
KR102937744B1 (ko) 2026-03-12
US11538698B2 (en) 2022-12-27
US20240332042A1 (en) 2024-10-03
KR20230137484A (ko) 2023-10-04
TW202127566A (zh) 2021-07-16
TWI833039B (zh) 2024-02-21
US12334369B2 (en) 2025-06-17
TW202403938A (zh) 2024-01-16
JP2022550363A (ja) 2022-12-01

Similar Documents

Publication Publication Date Title
JP2023171825A (ja) ばね部材を有し半導体構造を劈開するための劈開システム、及びそのような構造を劈開するための方法
US6468879B1 (en) Method and device for separating a plate of material, in particular semiconductor material, into two wafers
KR101265830B1 (ko) 엣지 그립 장치 및 이를 구비하는 로봇
US9159596B2 (en) Clamping apparatus for cleaving a bonded wafer structure
WO2012029402A1 (ja) ピックアップ方法及びピックアップ装置
US20140144965A1 (en) Method to manipulate brittle material sheet compound shape
US12211727B2 (en) Simultaneous bonding approach for high quality wafer stacking
US20120186741A1 (en) Apparatus for wafer-to-wafer bonding
US7264996B2 (en) Method for separating wafers bonded together to form a stacked structure
JP2022550363A5 (https=)
JP2003118859A (ja) 可撓性板状体の取出装置および取出方法
JP2007081352A (ja) 傾斜振動式フィルムシート用エキスパンダ
KR102817534B1 (ko) 이온주입 접합웨이퍼 분리 장치 및 이를 이용한 이온주입 접합웨이퍼 분리 방법
JPS62165946A (ja) 試料支持装置
JP2004128148A (ja) 半導体薄膜の製造方法、薄膜半導体素子の製造方法及び半導体薄膜の剥離装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230915

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230915

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230915

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231219

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240109

R150 Certificate of patent or registration of utility model

Ref document number: 7418559

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150