TWI833039B - 用於切割半導體結構之具有彈簧構件之切割系統及切割該等結構之方法 - Google Patents

用於切割半導體結構之具有彈簧構件之切割系統及切割該等結構之方法 Download PDF

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Publication number
TWI833039B
TWI833039B TW109132794A TW109132794A TWI833039B TW I833039 B TWI833039 B TW I833039B TW 109132794 A TW109132794 A TW 109132794A TW 109132794 A TW109132794 A TW 109132794A TW I833039 B TWI833039 B TW I833039B
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TW
Taiwan
Prior art keywords
cutting
suction
semiconductor structure
cutting arm
arm
Prior art date
Application number
TW109132794A
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English (en)
Chinese (zh)
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TW202127566A (zh
Inventor
賈斯汀 史考特 凱瑟
Original Assignee
環球晶圓股份有限公司
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Publication of TW202127566A publication Critical patent/TW202127566A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Semiconductor Lasers (AREA)
TW109132794A 2019-09-27 2020-09-22 用於切割半導體結構之具有彈簧構件之切割系統及切割該等結構之方法 TWI833039B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962906860P 2019-09-27 2019-09-27
US62/906,860 2019-09-27

Publications (2)

Publication Number Publication Date
TW202127566A TW202127566A (zh) 2021-07-16
TWI833039B true TWI833039B (zh) 2024-02-21

Family

ID=72709863

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109132794A TWI833039B (zh) 2019-09-27 2020-09-22 用於切割半導體結構之具有彈簧構件之切割系統及切割該等結構之方法
TW112134734A TWI902008B (zh) 2019-09-27 2020-09-22 用於切割半導體結構之具有彈簧構件之切割系統及切割該等結構之方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW112134734A TWI902008B (zh) 2019-09-27 2020-09-22 用於切割半導體結構之具有彈簧構件之切割系統及切割該等結構之方法

Country Status (7)

Country Link
US (3) US11538698B2 (https=)
EP (1) EP4035202B1 (https=)
JP (2) JP7418559B2 (https=)
KR (2) KR102937744B1 (https=)
CN (1) CN114556540A (https=)
TW (2) TWI833039B (https=)
WO (1) WO2021061480A1 (https=)

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* Cited by examiner, † Cited by third party
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JP7309191B2 (ja) * 2019-11-06 2023-07-18 中村留精密工業株式会社 ウェハー分割装置
US12019031B2 (en) * 2020-09-16 2024-06-25 Globalwafers Co., Ltd. Cleaved semiconductor wafer imaging system
US20260026320A1 (en) * 2024-07-19 2026-01-22 Globalwafers Co., Ltd. Cleaving systems and methods for cleaving semiconductor structures by combined thermal and mechanical stress induction

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US20150101758A1 (en) * 2013-10-11 2015-04-16 Tokyo Electron Limited Peel-off apparatus, peel-off system, peel-off method and computer storage medium
TW201843418A (zh) * 2017-04-11 2018-12-16 德商紐豹有限責任合資公司 用於組件的接收裝置及自用於組件的接收裝置取下不良組件的方法

Also Published As

Publication number Publication date
TWI902008B (zh) 2025-10-21
KR102710431B1 (ko) 2024-09-25
EP4035202A1 (en) 2022-08-03
EP4035202B1 (en) 2023-08-16
KR20220071229A (ko) 2022-05-31
US12148635B2 (en) 2024-11-19
JP7699633B2 (ja) 2025-06-27
JP2023171825A (ja) 2023-12-05
WO2021061480A1 (en) 2021-04-01
US20230031395A1 (en) 2023-02-02
US20210098272A1 (en) 2021-04-01
JP7418559B2 (ja) 2024-01-19
CN114556540A (zh) 2022-05-27
KR102937744B1 (ko) 2026-03-12
US11538698B2 (en) 2022-12-27
US20240332042A1 (en) 2024-10-03
KR20230137484A (ko) 2023-10-04
TW202127566A (zh) 2021-07-16
US12334369B2 (en) 2025-06-17
TW202403938A (zh) 2024-01-16
JP2022550363A (ja) 2022-12-01

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