KR102937744B1 - 반도체 구조를 클리빙하기 위한 스프링 부재를 갖는 클리브 시스템 및 이러한 구조를 클리빙하기 위한 방법 - Google Patents

반도체 구조를 클리빙하기 위한 스프링 부재를 갖는 클리브 시스템 및 이러한 구조를 클리빙하기 위한 방법

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Publication number
KR102937744B1
KR102937744B1 KR1020237031711A KR20237031711A KR102937744B1 KR 102937744 B1 KR102937744 B1 KR 102937744B1 KR 1020237031711 A KR1020237031711 A KR 1020237031711A KR 20237031711 A KR20237031711 A KR 20237031711A KR 102937744 B1 KR102937744 B1 KR 102937744B1
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KR
South Korea
Prior art keywords
cleave
semiconductor structure
suction
cleaving
arm
Prior art date
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Application number
KR1020237031711A
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English (en)
Korean (ko)
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KR20230137484A (ko
Inventor
저스틴 스콧 카이저
Original Assignee
글로벌웨이퍼스 씨오., 엘티디.
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Application filed by 글로벌웨이퍼스 씨오., 엘티디. filed Critical 글로벌웨이퍼스 씨오., 엘티디.
Publication of KR20230137484A publication Critical patent/KR20230137484A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Semiconductor Lasers (AREA)
KR1020237031711A 2019-09-27 2020-09-17 반도체 구조를 클리빙하기 위한 스프링 부재를 갖는 클리브 시스템 및 이러한 구조를 클리빙하기 위한 방법 Active KR102937744B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962906860P 2019-09-27 2019-09-27
US62/906,860 2019-09-27
PCT/US2020/051180 WO2021061480A1 (en) 2019-09-27 2020-09-17 Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures
KR1020227013720A KR102710431B1 (ko) 2019-09-27 2020-09-17 반도체 구조를 클리빙하기 위한 스프링 부재를 갖는 클리브 시스템 및 이러한 구조를 클리빙하기 위한 방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020227013720A Division KR102710431B1 (ko) 2019-09-27 2020-09-17 반도체 구조를 클리빙하기 위한 스프링 부재를 갖는 클리브 시스템 및 이러한 구조를 클리빙하기 위한 방법

Publications (2)

Publication Number Publication Date
KR20230137484A KR20230137484A (ko) 2023-10-04
KR102937744B1 true KR102937744B1 (ko) 2026-03-12

Family

ID=72709863

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020237031711A Active KR102937744B1 (ko) 2019-09-27 2020-09-17 반도체 구조를 클리빙하기 위한 스프링 부재를 갖는 클리브 시스템 및 이러한 구조를 클리빙하기 위한 방법
KR1020227013720A Active KR102710431B1 (ko) 2019-09-27 2020-09-17 반도체 구조를 클리빙하기 위한 스프링 부재를 갖는 클리브 시스템 및 이러한 구조를 클리빙하기 위한 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020227013720A Active KR102710431B1 (ko) 2019-09-27 2020-09-17 반도체 구조를 클리빙하기 위한 스프링 부재를 갖는 클리브 시스템 및 이러한 구조를 클리빙하기 위한 방법

Country Status (7)

Country Link
US (3) US11538698B2 (https=)
EP (1) EP4035202B1 (https=)
JP (2) JP7418559B2 (https=)
KR (2) KR102937744B1 (https=)
CN (1) CN114556540A (https=)
TW (2) TWI833039B (https=)
WO (1) WO2021061480A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7309191B2 (ja) * 2019-11-06 2023-07-18 中村留精密工業株式会社 ウェハー分割装置
US12019031B2 (en) * 2020-09-16 2024-06-25 Globalwafers Co., Ltd. Cleaved semiconductor wafer imaging system
US20260026320A1 (en) * 2024-07-19 2026-01-22 Globalwafers Co., Ltd. Cleaving systems and methods for cleaving semiconductor structures by combined thermal and mechanical stress induction

Citations (4)

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JP2004335930A (ja) 2003-05-12 2004-11-25 Juki Corp ウェハの劈開方法及び劈開装置
US20130062020A1 (en) 2011-03-15 2013-03-14 Memc Electronic Materials, Inc. Systems and Methods for Cleaving A Bonded Wafer Pair
US20150101758A1 (en) 2013-10-11 2015-04-16 Tokyo Electron Limited Peel-off apparatus, peel-off system, peel-off method and computer storage medium
US20180071771A1 (en) 2016-09-13 2018-03-15 SCREEN Holdings Co., Ltd. Detaching apparatus and detaching method

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GB763831A (en) * 1953-06-01 1956-12-19 Headley Townsend Backhouse Improvements in sheet separating and forwarding devices
CH635769A5 (fr) * 1980-03-10 1983-04-29 Far Fab Assortiments Reunies Installation pour le sciage de plaques et dispositif de manutention pour une telle installation.
JP2726002B2 (ja) * 1994-06-06 1998-03-11 株式会社アマダ 一枚取り装置
US5676364A (en) 1994-08-19 1997-10-14 Amada Company, Limited Plate material separating apparatus
JPH08229887A (ja) * 1994-12-27 1996-09-10 Seiko Epson Corp 積層シートのカット方法およびその装置
JPH115064A (ja) * 1997-06-16 1999-01-12 Canon Inc 試料の分離装置及びその方法並びに基板の製造方法
JP2000150456A (ja) 1998-11-06 2000-05-30 Canon Inc 試料の分離装置及び分離方法
US6263941B1 (en) 1999-08-10 2001-07-24 Silicon Genesis Corporation Nozzle for cleaving substrates
JP4517315B2 (ja) 1999-10-08 2010-08-04 株式会社ニコン 基板落下防止機構およびこれを備えた基板検査装置
EP1624484B1 (en) 2003-05-13 2012-03-28 Mimasu Semiconductor Industry Co., Ltd. Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
US20050150597A1 (en) * 2004-01-09 2005-07-14 Silicon Genesis Corporation Apparatus and method for controlled cleaving
US7427554B2 (en) 2005-08-12 2008-09-23 Silicon Genesis Corporation Manufacturing strained silicon substrates using a backing material
US8993410B2 (en) 2006-09-08 2015-03-31 Silicon Genesis Corporation Substrate cleaving under controlled stress conditions
US11389171B2 (en) * 2006-11-21 2022-07-19 David S. Goldsmith Integrated system for the infixion and retrieval of implants
JP6145415B2 (ja) 2014-02-27 2017-06-14 東京エレクトロン株式会社 剥離方法、プログラム、コンピュータ記憶媒体、剥離装置及び剥離システム
WO2017065155A1 (ja) 2015-10-16 2017-04-20 旭硝子株式会社 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法
JP2017168563A (ja) 2016-03-15 2017-09-21 日本電気硝子株式会社 基板の剥離装置
WO2018188731A1 (de) 2017-04-11 2018-10-18 Muehlbauer GmbH & Co. KG Bauteil-empfangseinrichtung mit optischem sensor
KR102565070B1 (ko) 2017-09-04 2023-08-08 린텍 가부시키가이샤 박형화 판상 부재의 제조 방법, 및 제조 장치
CN208898748U (zh) * 2019-03-11 2019-05-24 成都力维展示工程有限公司 一种具有自动掰片功能的玻璃切割机

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004335930A (ja) 2003-05-12 2004-11-25 Juki Corp ウェハの劈開方法及び劈開装置
US20130062020A1 (en) 2011-03-15 2013-03-14 Memc Electronic Materials, Inc. Systems and Methods for Cleaving A Bonded Wafer Pair
US20150101758A1 (en) 2013-10-11 2015-04-16 Tokyo Electron Limited Peel-off apparatus, peel-off system, peel-off method and computer storage medium
US20180071771A1 (en) 2016-09-13 2018-03-15 SCREEN Holdings Co., Ltd. Detaching apparatus and detaching method

Also Published As

Publication number Publication date
TWI902008B (zh) 2025-10-21
KR102710431B1 (ko) 2024-09-25
EP4035202A1 (en) 2022-08-03
EP4035202B1 (en) 2023-08-16
KR20220071229A (ko) 2022-05-31
US12148635B2 (en) 2024-11-19
JP7699633B2 (ja) 2025-06-27
JP2023171825A (ja) 2023-12-05
WO2021061480A1 (en) 2021-04-01
US20230031395A1 (en) 2023-02-02
US20210098272A1 (en) 2021-04-01
JP7418559B2 (ja) 2024-01-19
CN114556540A (zh) 2022-05-27
US11538698B2 (en) 2022-12-27
US20240332042A1 (en) 2024-10-03
KR20230137484A (ko) 2023-10-04
TW202127566A (zh) 2021-07-16
TWI833039B (zh) 2024-02-21
US12334369B2 (en) 2025-06-17
TW202403938A (zh) 2024-01-16
JP2022550363A (ja) 2022-12-01

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