CN114535866A - 一种低温即可催化的助焊剂 - Google Patents
一种低温即可催化的助焊剂 Download PDFInfo
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- CN114535866A CN114535866A CN202011352794.XA CN202011352794A CN114535866A CN 114535866 A CN114535866 A CN 114535866A CN 202011352794 A CN202011352794 A CN 202011352794A CN 114535866 A CN114535866 A CN 114535866A
- Authority
- CN
- China
- Prior art keywords
- acid
- soldering flux
- flux
- low temperature
- surfactant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims abstract description 29
- 238000005476 soldering Methods 0.000 title abstract description 19
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims abstract description 22
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000004094 surface-active agent Substances 0.000 claims abstract description 12
- 239000001361 adipic acid Substances 0.000 claims abstract description 11
- 235000011037 adipic acid Nutrition 0.000 claims abstract description 11
- 239000001384 succinic acid Substances 0.000 claims abstract description 10
- 150000007524 organic acids Chemical group 0.000 claims abstract description 9
- 239000013543 active substance Substances 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 6
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical group OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 7
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical group [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 5
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- -1 amide salts Chemical class 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910001502 inorganic halide Inorganic materials 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
本发明提供一种低温即可催化的助焊剂，所述助焊剂为有机酸活性物质助焊剂，有机酸包括丁二酸和己二酸，所述助焊剂还包括酸碱调节剂、表面活性剂，所述丁二酸的物质的量含量大于己二酸，此助焊剂在低温下即可被催化，焊接工程整体的热量消耗小，且危险系数低。
Description
技术领域
本发明主要涉及半导体先进材料领域，尤其涉及一种低温即可催化的助焊剂。
背景技术
倒装焊接工程时，现有的焊接需要在220～250℃条件下，助焊剂才会发挥作用，对球进行融化焊接，工程整体的热量能耗极大，且危险系数极高。急需要一种能够大幅降低催化温度的助焊剂。助焊剂的主要作用有清洗被焊金属和焊料表面的作用(去除氧化物和污物)；熔点要低于所有焊料的熔点(保证先熔化并在表面)；在焊接温度下能形成液状，具有保护金属表面的作用；有较低的表面张力，受热后能迅速均匀地流动(浸润与扩散)；不导电，无腐蚀性，残留物无副作用；熔化时不产生飞溅或飞沫；助焊剂的膜要光亮，致密、干燥快、不吸潮、热稳定性好。
发明内容
针对现有技术的上述缺陷，本发明提供一种低温即可催化的助焊剂，所述助焊剂为有机酸活性物质助焊剂，有机酸包括丁二酸和己二酸，所述助焊剂还包括酸碱调节剂、表面活性剂，所述丁二酸的物质的量含量大于己二酸。
优选的，所述酸碱调节剂为三乙醇胺。
优选的，所述酸碱调节剂为氨水。
优选的，所述表面活性剂为氟碳表面活性剂。
本发明的有益效果：此助焊剂在低温下即可被催化，焊接工程整体的热量消耗小，且危险系数低。
具体实施方式
本部分的描述仅是示范性和解释性，不应对本发明的保护范围有任何的限制作用。
一种低温即可催化的助焊剂，所述助焊剂为有机酸活性物质助焊剂，有机酸包括丁二酸和己二酸，所述助焊剂还包括酸碱调节剂、表面活性剂，所述丁二酸的物质的量含量大于己二酸。
本实施例中优选的，所述酸碱调节剂为三乙醇胺。
本实施例中优选的，所述酸碱调节剂为氨水。
本实施例中优选的，所述表面活性剂为氟碳表面活性剂。
低温助焊剂为有机酸活性物质助焊剂，其主要活性物质为丁二酸和少量的己二酸,而由三乙醇胺为酸碱调节剂，另加氟碳表面活性剂组成。
丁二酸，无色结晶体，熔点185℃，沸点235℃(分解为酸酐)已二酸：沸点:265℃熔点:151-153℃。
三乙醇胺：分子式：N(CH2CH2OH)3理化性质：常温下无色、粘稠液体，稍有氨味，易溶于水、乙醇。可腐蚀铜、铝及其合金。液体和蒸汽腐蚀皮肤和眼睛。可与多种酸反应生成酯、酰胺盐。沸点 360.0℃，熔点21.2℃，从理化性质看出，不能多加，同时也有表面活性剂的作用。
因此，虽然加入的是一些复配的有机酸活性剂，但由于加入了三乙醇胺(有些为降低成本而使用氨水)调节PH值，各种物质混合后，其中部分发生反应，只有在一定温度下才具有酸的活性。但是对无机酸和具有酸性特征的无机盐卤化物就不一样了，无机卤化物在常温下也具有一定的活性。
通过上述主要物质性质可以看出，只要焊接温度是可以降低使用的，未参与反应的主要活性物质丁二酸和已二酸能够挥发。而三乙醇胺挥发不完全，整个残留成分偏碱性。
以上所述的本发明实施方式，并不构成对本发明保护范围的限定。任何在本发明的精神和原则之内所作的修改、等同替换和改进等，均应包含在本发明的权利要求保护范围之内。
Claims (4)
1.一种低温即可催化的助焊剂，其特征在于，所述助焊剂为有机酸活性物质助焊剂，有机酸包括丁二酸和己二酸，所述助焊剂还包括酸碱调节剂、表面活性剂，所述丁二酸的物质的量含量大于己二酸。
2.根据权利要求1所述的助焊剂，其特征在于：所述酸碱调节剂为三乙醇胺。
3.根据权利要求2所述的助焊剂，其特征在于：所述酸碱调节剂为氨水。
4.根据权利要求3所述的助焊剂，其特征在于：所述表面活性剂为氟碳表面活性剂。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011352794.XA CN114535866A (zh) | 2020-11-26 | 2020-11-26 | 一种低温即可催化的助焊剂 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011352794.XA CN114535866A (zh) | 2020-11-26 | 2020-11-26 | 一种低温即可催化的助焊剂 |
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|---|---|
| CN114535866A true CN114535866A (zh) | 2022-05-27 |
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| CN202011352794.XA Pending CN114535866A (zh) | 2020-11-26 | 2020-11-26 | 一种低温即可催化的助焊剂 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9219903D0 (en) * | 1990-05-04 | 1992-11-04 | Delco Electronics Corp | Low-residue soldering flux |
| CN1209375A (zh) * | 1997-08-22 | 1999-03-03 | 李圣波 | 低固含量免清洗助焊剂 |
| CN102114582A (zh) * | 2009-12-30 | 2011-07-06 | 郑建国 | 一种基于陶瓷电容钎焊的水溶性助焊剂 |
| CN103785973A (zh) * | 2014-02-20 | 2014-05-14 | 苏州龙腾万里化工科技有限公司 | 一种低温无卤低固含量无铅焊锡用助焊剂 |
| CN104400257A (zh) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | 一种免清洗无铅低银焊膏用助焊剂 |
| CN107378313A (zh) * | 2017-08-01 | 2017-11-24 | 东莞市盟纬电子有限公司 | 一种低固含量无松香无卤助焊剂及其制备方法 |
| CN108817731A (zh) * | 2018-07-04 | 2018-11-16 | 中原工学院 | 一种低温、无卤、低固含量改性松香型助焊剂及制备方法 |
| CN109940311A (zh) * | 2017-12-20 | 2019-06-28 | 海太半导体（无锡）有限公司 | 一种低温催化助焊剂 |
-
2020
- 2020-11-26 CN CN202011352794.XA patent/CN114535866A/zh active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9219903D0 (en) * | 1990-05-04 | 1992-11-04 | Delco Electronics Corp | Low-residue soldering flux |
| CN1209375A (zh) * | 1997-08-22 | 1999-03-03 | 李圣波 | 低固含量免清洗助焊剂 |
| CN102114582A (zh) * | 2009-12-30 | 2011-07-06 | 郑建国 | 一种基于陶瓷电容钎焊的水溶性助焊剂 |
| CN103785973A (zh) * | 2014-02-20 | 2014-05-14 | 苏州龙腾万里化工科技有限公司 | 一种低温无卤低固含量无铅焊锡用助焊剂 |
| CN104400257A (zh) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | 一种免清洗无铅低银焊膏用助焊剂 |
| CN107378313A (zh) * | 2017-08-01 | 2017-11-24 | 东莞市盟纬电子有限公司 | 一种低固含量无松香无卤助焊剂及其制备方法 |
| CN109940311A (zh) * | 2017-12-20 | 2019-06-28 | 海太半导体（无锡）有限公司 | 一种低温催化助焊剂 |
| CN108817731A (zh) * | 2018-07-04 | 2018-11-16 | 中原工学院 | 一种低温、无卤、低固含量改性松香型助焊剂及制备方法 |
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Application publication date: 20220527 |