CN114438561A - 部分镀敷用掩模、使用该掩模的绝缘电路基板的制造方法以及部分镀敷方法 - Google Patents

部分镀敷用掩模、使用该掩模的绝缘电路基板的制造方法以及部分镀敷方法 Download PDF

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Publication number
CN114438561A
CN114438561A CN202111253617.0A CN202111253617A CN114438561A CN 114438561 A CN114438561 A CN 114438561A CN 202111253617 A CN202111253617 A CN 202111253617A CN 114438561 A CN114438561 A CN 114438561A
Authority
CN
China
Prior art keywords
plating
sheet member
circuit
mask
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111253617.0A
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English (en)
Chinese (zh)
Inventor
肥后正昭
井手口悟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Metaltech Co Ltd
Original Assignee
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Publication of CN114438561A publication Critical patent/CN114438561A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202111253617.0A 2020-11-04 2021-10-27 部分镀敷用掩模、使用该掩模的绝缘电路基板的制造方法以及部分镀敷方法 Pending CN114438561A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020184591A JP7569202B2 (ja) 2020-11-04 2020-11-04 部分めっき用マスク、そのマスクを用いた絶縁回路基板の製造方法および部分めっき方法
JP2020-184591 2020-11-04

Publications (1)

Publication Number Publication Date
CN114438561A true CN114438561A (zh) 2022-05-06

Family

ID=78413839

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111253617.0A Pending CN114438561A (zh) 2020-11-04 2021-10-27 部分镀敷用掩模、使用该掩模的绝缘电路基板的制造方法以及部分镀敷方法

Country Status (5)

Country Link
US (1) US11761108B2 (https=)
EP (1) EP3995606A1 (https=)
JP (1) JP7569202B2 (https=)
KR (1) KR20220060474A (https=)
CN (1) CN114438561A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025018659A (ja) * 2023-07-27 2025-02-06 トヨタ自動車株式会社 マスキング材およびこれを用いた金属皮膜の成膜装置
JP2025078514A (ja) * 2023-11-08 2025-05-20 トヨタ自動車株式会社 金属皮膜の成膜装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004250762A (ja) * 2003-02-21 2004-09-09 Dowa Mining Co Ltd 金属セラミック複合部材に対するメッキ方法、パターン製造成方法、および湿式処理装置、並びにパワーモジュール用金属セラミックス複合部材
JP2008045218A (ja) * 2007-10-01 2008-02-28 Dowa Holdings Co Ltd 金属セラミック複合部材に対するメッキ方法、パターン製造方法、および湿式処理装置、並びにパワーモジュール用金属セラミックス複合部材
JP2014196540A (ja) * 2013-03-29 2014-10-16 Ｄｏｗａメタルテック株式会社 電気めっき方法およびそれに用いるマスク部材

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243791A (ja) * 1986-04-15 1987-10-24 Matsushita Electric Ind Co Ltd 電解めつき層の選択的形成方法
JP3328812B2 (ja) 2000-10-06 2002-09-30 株式会社山本鍍金試験器 電気めっき試験器の陰極カートリッジおよび陽極カートリッジ
JP4390491B2 (ja) * 2003-07-25 2009-12-24 株式会社フジクラ めっきレジスト用ドライフィルムおよびプリント基板の回路形成方法
US20170253988A1 (en) 2016-03-01 2017-09-07 The Boeing Company Electromodification of Conductive Surfaces

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004250762A (ja) * 2003-02-21 2004-09-09 Dowa Mining Co Ltd 金属セラミック複合部材に対するメッキ方法、パターン製造成方法、および湿式処理装置、並びにパワーモジュール用金属セラミックス複合部材
JP2008045218A (ja) * 2007-10-01 2008-02-28 Dowa Holdings Co Ltd 金属セラミック複合部材に対するメッキ方法、パターン製造方法、および湿式処理装置、並びにパワーモジュール用金属セラミックス複合部材
JP2014196540A (ja) * 2013-03-29 2014-10-16 Ｄｏｗａメタルテック株式会社 電気めっき方法およびそれに用いるマスク部材

Also Published As

Publication number Publication date
KR20220060474A (ko) 2022-05-11
US20220136126A1 (en) 2022-05-05
JP7569202B2 (ja) 2024-10-17
JP2022074500A (ja) 2022-05-18
US11761108B2 (en) 2023-09-19
EP3995606A1 (en) 2022-05-11

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