CN114424326A - 用于倒装芯片封装集成电路管芯的可引线键合的转接板 - Google Patents

用于倒装芯片封装集成电路管芯的可引线键合的转接板 Download PDF

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CN114424326A
CN114424326A CN202080066377.0A CN202080066377A CN114424326A CN 114424326 A CN114424326 A CN 114424326A CN 202080066377 A CN202080066377 A CN 202080066377A CN 114424326 A CN114424326 A CN 114424326A
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conductive layer
interposer
electrically
die
insulating layer
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陈志浩
埃德温·洛伊
赵艳阳
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Samtec Inc
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Samtec Inc
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Abstract

本公开描述使用转接板将倒装芯片IC管芯封装转换为可引线键合的部件的多种方法和设置。所述转接板具有绝缘层和附连于所述绝缘层侧面的图案化金属层。所述图案化金属层被使用焊料凸块电连接于所述IC管芯。所述转接板在所述转接板的一个侧面上具有引线键合垫，所述侧面与所述转接板的具有所述IC管芯和所述焊料凸块之间的所述电连接的侧面相对。所述转接板可以是较薄的有机层压板或柔性印刷电路板。

Description

用于倒装芯片封装集成电路管芯的可引线键合的转接板
相关申请的交叉引用
本申请要求于2019年7月25日提交的美国专利申请序列号62/878,466的优先权，其公开内容通过引用并入本文，如同其全部内容在本文中完整阐述一样。
背景技术
有两种基本类型的集成电路(IC)管芯，即被设置为与外基板建立电连接的倒装芯片IC管芯和可引线键合的IC管芯。倒装芯片IC管芯包括管芯基板和制造于管芯基板外表面上的有源电路。为了将倒装芯片IC管芯安装于外基板，倒装芯片IC管芯的外表面面向外基板的表面，使得IC管芯的电接触垫与外基板的电接触垫对准以分别形成接触垫对。使用焊料凸块、铜柱、钉头凸点或一些其他类型的电附连方法制成接触垫对之间的电连接。可引线键合的IC管芯包括管芯基板和有源电路，该有源电路包括由管芯基板的外表面支承的电接触垫。为了将可引线键合的IC管芯安装于外基板，可引线键合的IC管芯的外表面背对外基板的表面。外基板上的电接触垫分布在IC管芯的占用区之外。因此，外基板的电接触垫和IC管芯的电接触垫都被暴露并且可以形成接触垫对。IC管芯的电接触垫和外基板上的电接触垫适用于引线键合或带式键合(本文统称为引线键合)。因此，引线键合可以在由IC管芯的电接触垫和外基板的电接触垫形成的接触垫对之间建立电连接。
一些集成电路管芯可提供引线键合设置和倒装芯片设置，而其他IC管芯仅提供一种设置。通常，可引线键合的IC芯片与倒装芯片安装不兼容，反之亦然。具体而言，倒装芯片IC管芯的接触垫材料虽然被设置为与焊料凸块或铜柱键合，但并不适合引线键合。此外，当传统外基板上的电接触垫具有设置为引线键合到管芯的布局时，电接触垫与倒装芯片IC管芯不兼容。特别地，当倒装芯片管芯封装和可引线键合的外基板的各个表面相互面对时，各个接触垫沿垂直于IC管芯和外基板的对接面的横向方向相互不重叠。这是因为可引线键合的基板的接触垫设置于管芯的占用区之外，以便当管芯安装于基板上时，基板的接触垫被暴露以用于引线键合。此外，将倒装芯片管芯重新设计为可引线键合的管芯既费时又昂贵。因此，希望允许将倒装芯片管芯安装于被设置为接收可引线键合管芯的外基板。
发明内容
本公开描述将倒装芯片IC管芯转换为可引线键合部件的多种方法和设置。在一个示例中，一种将IC管芯转换为可引线键合的电部件的方法包括将IC管芯倒装芯片安装于转接板的至少一个图案化导电层的第一表面的步骤，其中该转接板在该至少一个导电层的与第一表面相对的第二表面处具有引线键合垫。
附图说明
当结合附图阅读时，将更好地理解以下详细说明，在附图中出于说明性的目的示出示例实施例。然而，应当理解，本公开不限于所示的精确设置和手段。在附图中：
图1为倒装芯片IC管芯的一部分的剖视图。
图2为可引线键合的转接板的一部分的剖视图，该部分具有被设置为安装于图1的倒装芯片IC管芯的倒装芯片侧面和被设置用于引线键合的相对的可引线键合侧面；
图3为可引线键合的IC组件的剖视图，该可引线键合的IC组件包括图2所示的、安装于图1所示的倒装芯片IC管芯的可引线键合的转接板。
图4A为另一IC组件的剖视图，该IC组件包括安装于倒装芯片IC管芯的转接板，该倒装芯片IC管芯具有与转接板的导电层中的通孔对准的焊料凸块；
图4B为图4A所示IC组件的剖视图，示出在通孔中回流并与导电层接触的焊料凸块；并且
图5为根据另一示例构造的另一可引线键合的IC组件的剖视图，该可引线键合的IC组件包括安装于图1所示倒装芯片IC管芯的可引线键合的转接板；
图6为图5所示的可引线键合的IC组件的透视图。
图7为包括图6所示IC组件的光收发器的透视图。
图8A示出生产多个IC组件的制造工艺的第一步骤；
图8B示出生产多个IC组件的制造工艺的第二步骤；
图8C示出生产多个IC组件的制造工艺的第三步骤；
图8D示出生产多个IC组件的制造工艺的第四步骤；
图8E示出生产多个IC组件的制造工艺的第五步骤；
图8F示出生产多个IC组件的制造工艺的第六步骤；
图9为包括安装于多个IC管芯的转接板的IC组件的透视图；
图10为根据另一示例构造的另一可引线键合的IC组件的剖视图，该可引线键合的IC组件包括安装于图1所示倒装芯片IC管芯的可引线键合的转接板；
图11A为具有包裹式导电层的转接板的替代实施例的剖视图；以及
图11B为图11A所示的另一示例的转接板的剖视图，但其包括第二电绝缘层。
具体实施方式
本公开针对用于使IC管芯与外基板电连通的方法和设备，其中IC管芯被设置用于倒装芯片安装，并且外基板被设置用于引线键合。因此，被设计为引线键合于各个IC管芯的外基板和电路板布局可以与IC管芯电连通，该IC管芯被设置用于倒装芯片安装而不是用于引线键合安装。
如本文所用，单数形式“一”、“一个”和“该”包括“至少一个”和复数，除非另有说明。此外，在包括所附权利要求的说明书中使用的对复数的引用包括单数“一”、“一个”、“壹个”和“该”，并且还包括“至少一个”，除非另有说明。此外，在包括所附权利要求的说明书中对特定数值的引用至少包括该特定值，除非上下文另有明确规定。
如本文所用，术语“多个”指代多于一个。当表示值的范围时，另一示例包括从一个特定值和/或至另一特定值。类似地，当值被通过使用先行词“实质上”、“大致”、“大约”及其派生词表示为近似值时，可以理解，特定值形成另一示例。所有范围都是包括性的且可组合的。
现在参考图1，在一个示例中，IC管芯20被设置为倒装芯片安装于外基板。IC管芯20包括具有外有源表面26的管芯基板24，其中形成有包括有源电路的电部件。管芯基板24通常由硅制成，尽管管芯基板24可以由任何合适的替代半导体材料制成，例如锗、砷化镓、磷化铟或其他三五族(III-V)或二六族(II-VI)半导体材料。外有源表面26可以包括设置于与IC管芯20的电部件电连通的接触层上的一个或多个金属化层。因此，在一个示例中，外有源表面26可以包括导电接触层30，导电接触层30由外有源表面26支承。在一些示例中，接触层30设置于外有源表面26上。在其他示例中，接触层30设置于至少一个中间层上，该中间层又设置于外有源表面26上。接触层30可以为任何合适的金属，例如铝、铜、镍、钨、钯、金等。接触层30设定可面向外有源表面26的内表面30a和沿横向方向27与内表面30a相对的外表面30b。外有源表面26可背对外基板。
外有源表面26可包括钝化层32，钝化层32沿外表面26延伸并进一步覆盖接触层30的外表面30b的一部分。例如，钝化层32可覆盖外表面30b的外周边。因此，外表面30b可以设定被钝化层32覆盖的覆盖区31a和没有被钝化层32覆盖的非覆盖区31b。在一些示例中，覆盖区31a可以围绕非覆盖区31b。外有源表面26还可以包括凸块下金属化(under bumpmetallization，UBM)层34或与接触层30电连通的其他导电层。在一个示例中，UBM层34可以沿外表面30b的非覆盖区31b延伸并接触外表面30b的非覆盖区31b。此外，UBM层34可以包括沿钝化层32的一部分延伸的重叠区。例如，UBM层34的重叠区可以沿钝化层32的一部分延伸，钝化层32的该部分沿外表面30b的覆盖区31a延伸。因此，钝化层32设定被UBM层34覆盖的覆盖区33a以及与覆盖区33a相邻但没有被UBM层34覆盖的裸露区33b。
IC管芯20还可以包括导电接口件36，导电接口件36与有源电路电接触并且为电信号进入IC管芯20和离开IC管芯20提供路径。例如，可以将导电接口件36安装于UBM层34，并且还可以安装于可以被设置为转接板40(见图2)的外部件的电接触垫，以便将IC管芯20倒装芯片安装于转接板40。导电接口件36可以被设置为焊料块、柱形凸块或铜柱，或任何合适的替代材料和结构。通常，焊料块可以构造为焊料凸块。在一个示例中，焊料凸块可以被设置为具有大致球形形状的焊球，尽管焊料凸块可以根据需要设定任何合适的形状。焊料凸块可以具有在从大约30微米到大约80微米的范围内的直径或其他最大横截面尺寸，例如大约40微米。当然，应当理解，焊料凸块可以根据需要设定任何合适的尺寸和形状。在另一示例中，导电接口件36可以由铜制成并且通常可以构造为柱状。UBM层34因此可以由被设置为与导电接口件36接合的材料制成，例如铝或铜等。
当用于描述尺寸、形状、空间关系、距离、方向和其他类似参数时，术语“实质上”、“大致”、“大约”及其派生词，以及具有类似含义的词语，除了包括比规定参数最多增加10％和最多减少10％的范围，包括最多增加5％和最多减少5％，包括最多增加3％和最多减少3％，包括最多增加1％最多减少1％之外，还包括所述参数本身。
IC管芯20可以包括多个接触层30，并且钝化层32可以以本文描述的方式覆盖接触层30的相应部分。或者，多个钝化层32可以覆盖相应的接触层30的一部分。此外，多个UBM层34可以以上述方式在相应的接触层30上延伸。IC管芯20可以包括多个导电接口件36，该多个导电接口件36以本文所述的方式放置于UBM层34上并最终接合于UBM层34。导电接口件36可以沿IC管芯基板24的外有源表面26设定焊料凸块的栅格阵列(当焊料凸块被设置为焊球时，其可以被称为球栅阵列(或BGA))，该焊料凸块的栅格阵列可以设定IC管芯基板24的安装接口件。导电接口件36可以以微小间距相互间隔开。例如，相邻的导电接口件36可以以小于300微米的间距相互间隔开，但可以理解，可以使用具有任何合适间距或尺寸的导电接口件36。
在一些示例中，可以将至少一个IC管芯20集成于光收发器内。IC管芯20可以设定用于收发器的垂直腔面发射激光器(vertical cavity surface emitting laser,VCSEL)阵列的激光二极管驱动器。或者，IC管芯20可以设定跨阻放大器(transimpedanceamplifier，TIA)，其被设计为接收和调节来自高速光电探测器阵列的电信号。IC管芯20不旨在限于该应用，并且本公开可应用于任何倒装芯片封装的IC管芯，除非另有说明。IC管芯20可以被单切，即IC管芯20已经在先前的处理步骤中与包含多个IC管芯的晶圆分离。
如上所述，IC管芯20可以被设置为通过引线键合件与外部件电连通，外部件可以设置为例如印刷电路板的外基板。除非另有说明，否则包括IC管芯20的IC组件可以被设置用于引线键合。如图2所示，IC组件还可以包括转接板40，由此IC管芯20(参见图1)可以倒装芯片安装于转接板40。从下面的描述中可以理解，转接板40可以双向接入，即可以对转接板40的两个相对的主表面或侧面进行电连接。转接板40的第一侧面42a可以被设置为倒装芯片安装于IC管芯20，转接板40的、沿横向方向27与第一侧面42a相对的第二侧面42b可以被设置为引线键合于例如外基板的外部件。
特别地，继续参考图2，转接板40可以包括导电层44，其设定第一表面或内表面46a和与第一表面46a沿横向方向27相对的第二表面或外表面46b。第一表面46a面向转接板40的第一侧面42a，并且第二表面46b面向第二侧面42b。因此，第一侧面42a被设置为面向倒装芯片IC管芯20(见图3)。转接板40具有从第一表面46a到第二表面46b的厚度。该厚度可以实质上等于或小于大约200微米。导电层44可以为任何合适的材料，例如金属。金属可以根据需要为铜或任何合适的替代材料。此外，金属可以包括在铜或其他金属的一个侧面或两个侧面上的导电涂层。导电层44可以具有从第一表面46a到第二表面46b的厚度，该厚度在大约1微米到大约25微米的范围内。当然，应当理解，导电层44可以根据需要具有任何合适的替代厚度。
导电层44可以被图案化以形成相互电绝缘的多个导电路径。例如，转接板40还可以包括第一电绝缘层48和第二电绝缘层50，使得导电层44位于第一电绝缘层48和第二电绝缘层50之间。特别地，导电层44可以附连于第一电绝缘层48和第二电绝缘层50中的每一者。在一个示例中，第一电绝缘层48和第二电绝缘层50中之一可以与导电层44层压。导电层44可以被图案化并且导电层44的多余材料可以被蚀刻掉。然后可以将第一电绝缘层48和第二电绝缘层50中的另一者施加于导电层44，使得图案化的导电层44设置于第一电绝缘层48和第二电绝缘层50之间。
转接板40可以为较薄的有机层压板或柔性印刷电路。第一电绝缘层48可以从导电层44的第一表面46a延伸，或者设置于第一表面46a上。第二电绝缘层50可以从导电层44的第二表面46b延伸，或者设置于第二表面46b上。第一电绝缘层48设定面向IC管芯20的第一表面或内表面49a，以及与第一表面49a沿横向方向27相对的第二表面或外表面49b。第二表面49b面向导电层44。在一些示例中，第二表面49b可以抵接或附连于导电层44的第一表面46a。第二电绝缘层50设定面向导电层44的第一表面或内表面51a，以及与第一表面51a沿横向方向27相对的第二表面或外表面51b。在一些示例中，第一表面51a可以抵接导电层44的第二表面46b。
第一电绝缘层48可以根据需要为聚酰亚胺(polyimide)或任何合适的替代电绝缘材料。在一个示例中，第二电绝缘层50可以为液态可光成像(liquid photoimageable，LPI)焊接掩模或任何合适的光掩模材料，或者可以根据需要为任何合适的替代电绝缘材料。在一个示例中，在金属层44已经以上述方式图案化之后，第二电绝缘层50可以与金属层44适形。因此，在金属层44的材料已经被蚀刻的位置，第一电绝缘层48可以与第二电绝缘层50相互接触。在一些示例中，第二电绝缘层50可以相对于横向方向27设定转接板40的最外层。因此，在一些示例中，第二表面51b可以相对于横向方向27设定转接板40的最外表面。
第一电绝缘层48沿横向方向27设定从第一表面49a到第二表面49b的厚度。并且第二电绝缘层50可以具有大约0.1微米到大约25微米的厚度范围。在一些示例中，化学钝化层既可以提供绝缘层又可以用作焊接掩模。因此，第一电绝缘层48和第二电绝缘层50中的一者或两者可以至少部分地由化学钝化层设定。在这种情况下，绝缘层的厚度可以非常薄，在大约10纳米到1微米的范围内。
第一电绝缘层48可设定从第二表面49b至第一表面49a沿横向方向27贯穿延伸的至少一个第一孔52或多个第一孔。因此，第一孔52贯穿第一电绝缘层48延伸至导电层44，并且特别延伸至导电垫45，导电垫45可以被设置为导电层处的焊盘，因此导电垫45可以设置于导电层44上或由导电层44设定。从下面的描述中可以理解，导电接触垫45被设置为倒装芯片安装于IC基板24。因此第一孔52可以被称为第一通孔。导电接触垫或电接触垫45可以设置于导电层44的第一表面46a处。换言之，电接触垫可以设置于导电层44的第一表面46a上，或者可以由导电层44的第一表面46a设定。第一孔52可以根据需要具有任何合适的横截面尺寸，使得第一孔52被定尺寸为接收导电接口件36，从而建立转接板40，特别是导电层44，和IC管芯20之间的电连接，如下文更详细的描述。第一孔52可以在垂直于横向方向27定向的平面中设定最大横截面尺寸，其中该最大横截面尺寸可以在大约20微米到大约150微米的范围内，例如从大约30微米到大约100微米，并且在一个示例中可以为大约60微米。当然，应当理解，最大横截面尺寸可以根据需要具有任何尺寸。在一些示例中，第一孔52可以具有圆形横截面，使得最大横截面尺寸为直径。
第二电绝缘层50可设定从第二表面51b至第一表面51a沿横向方向27贯穿延伸的至少一个第二孔或多个第二孔54。第二孔54可整体与第一孔52沿垂直于横向方向27的方向间隔开。在其他示例中，第二孔54可以至少部分地或完全地与第一孔52沿横向方向27对准。因此，第二孔54贯穿第二电绝缘层50延伸至导电层44。特别地，第二孔54可以贯穿第二电绝缘层延伸至导电层44处的导电引线键合垫53。因此第二孔54可以称为第二通孔。因此，可以说导电层44的裸露部分，并且特别是多个导电引线键合垫53，通过第二电绝缘层55的相应的多个第二孔54而裸露。导电引线键合垫53可以设置于导电层44上或由导电层44设定。导电引线键合垫53可以设置于导电层44的第二表面46b处。例如，引线键合垫53可以设置于第二表面46b上或者可以由导电层44的第二表面46b设定。引线键合垫53与相应的电接触垫45电连通。
就此而言，应当理解，导电层44可以设定双接入层，因为导电接口件36和引线键合件56可以安装于导电层44的、相对的侧面。因此，导电层44可以既电连接于导电接口件36又电连接于引线键合件56。第二孔54可以根据需要具有任何合适的横截面尺寸，使得第二孔54被定尺寸为接收引线键合件56，从而建立引线键合件56和转接板40之间的电连接。第二孔54可以在垂直于横向方向27定向的平面中设定最大横截面尺寸，其中该最大横截面尺寸可以在大约20微米到大约150微米的范围内，例如从大约30微米到大约100微米，并且在一个示例中可以为大约60微米。当然，应当理解，第二孔54的最大横截面尺寸可以根据需要具有任何尺寸。在一些示例中，第二孔54可以具有圆形横截面，使得最大横截面尺寸为直径。
因此可以理解，第一孔52和第二孔54可以分别贯穿相应的第一电绝缘层48和第二电绝缘层50延伸，从而暴露出至少一个导电层的相应的第一表面和第二表面。至少一个导电层可以由单个导电层44设定或分别由第一导电层62和第二导电层64设定，如下文更详细的描述。
导电层44适合焊接于或以其他方式接合于其第一侧面或表面46a上的导电接口件36或焊料凸块，并且还适合于其第二侧面或表面46b上的引线键合。因此，导电层44可以通过导电接口件36电连接于IC管芯20。如此，导电层44可以分别在其第一表面46a和第二表面46b上具有不同的涂层或表面处理。当导电接口件36和引线键合件56安装于导电层44时，导电层44使引线键合件56和导电接口件36相互电连通。
因为导电层44可以分别在第一侧面46a和第二侧面46b处与相应的导电部件(接口件36和引线键合件56)接合，所以转接板40可以被称为具有双向接入金属层。因此，转接板可以使接口件36和引线键合件56相互电连通，而无需使用从第一侧面42a到第二侧面42b延伸的、使相对的第一导电表面和第二导电表面相互电连通的导电导孔。因此，当接口件36和引线键合件56安装于相应的第一表面和第二表面时，导孔使接口件和引线键合件相互电连通。尽管相信不使用这样的导孔可以提高转接板的高速性能，但是当然可以认识到，如果需要，转接板40可以替代地包括这样的导孔。转接板40可以被设置为以包括大约28Gbps的、高达大约56Gbps的高数据传输速度将数据从接口件36传输到引线键合件56。
现在参考图3，可引线键合的IC组件58包括IC管芯20和电连接于IC管芯20的转接板40。具体而言，转接板40可以安装于倒装芯片IC管芯20。因此，可引线键合的IC组件58包括倒装芯片IC管芯20，并被设置为引线键合于外部件，例如外基板，以使外部件与IC管芯20电连通。转接板40可以具有以上述方式贯穿第一电绝缘层48延伸的一个或多个第一孔52。每个孔52可以被设置为接收相应的导电接口件36，导电接口件36被设置为接合于相应的IC管芯和转接板40的导电层44。即，第一孔52和导电层44裸露的第一电接触垫45可以与IC管芯20的相应的UBM层34沿横向方向27对准。
为了建立与IC管芯20的电连接，转接板40可以邻近UBM层34定位，并且导电接口件36可以放置于导电层44的电接触垫45和UBM层34之间。然后可以将IC管芯20、转接板40和导电接口件36放置于烘箱中，该烘箱升高导电接口件34的温度，该温度导致导电接口件36与UBM层34和导电层34和转接板40的导电层44接合，从而将转接板40安装于IC管芯20并在IC管芯20和转接板40之间建立永久性电连接和机械连接。特别地，导电层44与UBM层34电连通，并因此与IC管芯基板24通过接触层30电连通。在一个示例中，导电接口件34为焊料凸块，并且烘箱为回流焊炉。
在接合步骤之后，可以将诸如树脂60的电绝缘材料放置于从IC管芯20延伸至转接板40的空隙中，例如沿横向方向27。树脂60可以为环氧树脂或任何合适的替代树脂或其他电绝缘材料。在转接板40已经安装于IC管芯20之后，树脂60可以用作IC管芯20和转接板40之间沿横向方向27的底部填充物。特别地，树脂60可以从钝化层32的裸露区33b至转接板40的第一电绝缘层48延伸。替代地或附加地，树脂60可以从IC管芯基板24的与钝化层32相邻的外有源表面26至转接板40的第一电绝缘层48延伸。树脂60可以进一步沿IC管芯20的侧表面延伸，该侧表面从外有源表面延伸远离转接板40，例如沿横向方向27。应当理解，IC组件58可以设定可引线键合的部件。引线键合件可以安装于转接板40，并且可以进一步安装于诸如外基板的外部件，从而使转接板40以及因此使IC管芯20与外部件电连通。应当理解，转接板40可以包括多个第一孔52，使得转接板40被设置为在延伸至第一孔52中的多个导电接口件36处安装于IC管芯20，如上所述。导电接口件36可以安装于导电层44的通过第一孔52裸露的不同的图案化结构。在一些示例中，导电接口件36可以设定焊料凸块的栅格阵列。转接板40还可以包括多个第二孔54，使得转接板40被设置为安装于与相应的导电接口件36电连通的多个引线键合件56。引线键合件56被设置为安装于导电层44的、通过多个第二孔54裸露的不同的图案化结构。
因此应当理解，本公开提供一种方法，该方法用于将IC管芯基板24的由栅格阵列设定的安装接口件，例如由倒装芯片IC管芯20设定的安装接口件，转换为诸如由可引线键合的IC管芯设定的可引线键合的电部件。除非另有说明，否则该方法可以将焊料凸块的栅格阵列电接口件转换为可引线键合的电接口件。该方法可以包括以本文描述的方式将转接板40安装于IC管芯20的步骤。特别地，倒装芯片IC管芯20上的栅格阵列接口件与转接板40的第一电绝缘层48中的多个第一孔52对准。然后，设置于IC管芯20和转接板40之间的IC管芯、转接板40和导电接口件36可以被加热，从而使导电接口件36回流并设定转接板40和IC管芯20之间的电附连和机械附连。转接板40的第二侧面42b具有第二电绝缘层50中的、将引线键合垫裸露的多个第二孔54。这些裸露的引线键合垫可以设定用于引线键合件56的附连的附连位置。
现在参考图4A至图4B，在另一示例中，第一孔52可以贯穿第一电绝缘层48从第二表面49b至第一表面49a沿横向方向27延伸，如上所述，并且可以进一步贯穿导电层44从第一表面46a至第二表面46b延伸。孔52可进一步贯穿第二电绝缘层50从第一表面51a至第二表面51b延伸。此外，第二电绝缘层50可与第一孔52沿垂直于横向方向27的方向间隔开，从而暴露导电层44的第二表面46b的裸露部分47。因此，可以说导电层的第二表面46b的裸露部分47通过第二电绝缘层中的相应的多个第一孔52暴露。就此而言，孔52的贯穿第一电绝缘层48和导电层44延伸的第一部分52a可以具有第一横截面尺寸。孔52设定贯穿第二电绝缘层50延伸的第二部分52b可以具有大于第一横截面尺寸的第二横截面尺寸。第一横截面尺寸和第二横截面尺寸可以在垂直于横向方向27定向的相应的平面中测量。此外，在一些示例中，第一横截面尺寸和第二横截面尺寸中之一或两者可以由直径设定。孔52的、在第二电绝缘层50处的至少一部分直至整体可以在导电层44处与孔52向外间隔开。
因此，当导电接口件36在回流步骤期间熔化时，导电接口件36的材料可以在导电层44和IC管芯基板24之间形成电连接和机械连接。第一绝缘层48可以设定用于导电接口件36的材料的掩模。因此，在回流步骤期间，导电接口件36可以经孔52的第一部分延伸，并且润湿以及合于导电层44的第二表面46b。虽然IC管芯20可以以上述方式在有源外表面26上包括各种特征，但是出于清楚和方便的目的，这些特征没有在图4A至图4B中示出。
应当认识到，可以根据需要根据任何合适的实施例来构造转接板40。例如，如图2至图4B所示，第二电绝缘层50的第二表面或外表面51b可以设定转接板40的外部外表面。在图5所示的另一示例中，转接板40可以分别包括第一导电层62和第二导电层64。第一导电层62可以通过导电接口件36电连接于IC管芯。第一导电层62可以以如上所述的任何方式由导电层44设定。第二导电层64可以设置于电绝缘层50的第二表面51b上。特别地，第二导电层64可以设定面向第二电绝缘层50的第二表面51b的第一表面或内表面65a，并且可以附连于第二电绝缘层50的第二表面51b和与第一表面65a沿横向方向27相对的第二表面或外表面65b。应该理解，第二表面65b也与第一导电层62的第一表面46a相对。在一些示例中，第一表面65a可以抵接电绝缘层50的第二表面51b。
因此，电绝缘层50可以相对于横向方向27设置于第一导电层62和第二导电层64之间。此外，分别由第一导电层和第二导电层设定的各个占用区可以沿横向方向27相互对准。占用区沿垂直于横向方向27的平面延伸。第二导电层64可以由第二金属或其他合适的导电材料制成。第二导电层64可以为与第一导电层62相同的材料或与第一导电层62不同的材料。在一些示例中，第一层62和第二层64设定第一金属层和第二金属层。
可以根据需要对第一导电层62和第二导电层64中之一或两者进行图案化。因此，第一导电层62可以包括相互电隔离的多个不连续段。类似地，第二导电层64可以包括相互电隔离的多个不连续段。第二孔54贯穿第二电绝缘层50延伸至第一导电层62。因此，引线键合件56可以贯穿第二孔54延伸并且可以电连接于第一导电层62。第二导电层64可以设定电接地件或电屏蔽层，或者可以根据需要将电信号路由至外基板和/或路由来自外基板的电信号。如果用作接地层，则第二导电层64可以为导电金属的单个连续层。导电金属层64可以具有允许电信号从第一导电层62或向第一导电层62传输的孔或空隙。如果用于路由电信号，则可以根据需要对第二导电层64进行图案化。
因此可以理解，导电接口件36可以安装于至少一个导电层的第一表面，并且引线键合件56可以安装于至少一个导电层的第二表面，其中第二表面与第一表面相对。包括第一表面和第二表面的至少一个导电层可以由上文关于图2所述的单个导电层44设定。或者，至少一个导电层可以由分别设定第一表面46a和第二表面65b的第一导电层62和第二导电层64设定。
此外，参考图5至图6，转接板40，以及因此可引线键合的IC组件58，可以包括加强件66，加强件66设置于第二导电层64的第二表面65b上或以其他方式由第二表面65b支承。加强件66设定面向或抵接第二导电层64的第二表面65b的第一加强件表面或加强件内表面67a，以及与第一加强件表面67a相对的第二加强件表面或加强件外表面67b。第一加强件表面67a可以附连于第二导电层64的第二表面65b。因此，第二导电层64可以相对于横向方向27设置于加强件66和第二电绝缘层50之间。加强件66可以由任何合适的材料制成，例如玻璃、陶瓷、有机层压板、诸如聚酰亚胺的聚合物、液晶聚合物(liquid crystal polymer，LCP)等。
加强件66可以设定加强件本体69，加强件本体69从第二导电层64的外周边的至少一部分凹进，使得加强件66不干扰贯穿第二导电层64的外周边延伸的引线键合件56，其中该外周边被设定于垂直于横向方向27定向的平面中。特别地，加强件本体69的外周边的至少一部分、直至整体可以相对于第二导电层64的外周边的至少一部分、直至整体凹进。加强件66还可以包括至少一个或多个突出部71，其从加强件本体66的外周边沿大致垂直于横向方向27的方向伸出。此外，突出部71可以从加强件本体66的外周边的外表面沿大致垂直于该外表面的方向伸出。在沿加强件的周边的不同位置处，一个或多个突出部可以向外延伸。突出部71可以延伸至第二导电层64的外周边。突出部71可以允许转接板40被制造于互连转接板面板中，然后通过切割连接互连转接板面板的、相邻的转接板40的突出部71来单切该互连转接板面板。
在一些示例中，加强件66可以设定从第一加强件表面67a至第二加强件表面67b沿横向方向27延伸的孔。因此，引线键合件可以经加强件66的孔，贯穿上述类型的、第二电绝缘层50的第二孔延伸，并延伸至导电层44。加强件66的孔与第二电绝缘层50的第二孔共同提供将引线键合件安装于电绝缘层44的、在与导电层44的外周边间隔开的位置处的接入口。加强件66可以相对于横向方向27设定转接板40的最外层。因此，第二加强件表面67b可以设定转接板40的最外表面。
加强件66可以具有沿横向方向27的、从第一加强件表面67a到第二加强件表面67b的任何合适的加强件厚度。在一个示例中，加强件厚度可以在大约20微米到大约150微米的范围内，例如大约75微米。应当理解，加强件66可以根据需要具有任何合适的替代厚度。第一导电层62可以沿横向方向27设定从第一表面46a到第二表面46b的第一厚度。类似地，第二导电层64可以沿横向方向27设定从第一表面65a到第二表面65b的第二厚度。第一厚度和第二厚度可以实质上彼此相等。或者，第一厚度和第二厚度可以彼此不同。在一个示例中，第一厚度和第二厚度可以在大约1微米到大约25微米的范围内。第一厚度和第二厚度可以根据需要设定任何合适的替代尺寸。
转接板40的至少一部分可以相对于IC管芯基板24的外周边的至少一部分沿垂直于横向方向27的至少一个方向向外延伸。例如，转接板40可以相对于IC管芯基板24的全部外周边沿垂直于横向方向27的所有方向向外延伸。因此，引线键合垫53可以设置于一位置处，该位置与IC管芯基板24沿与横向方向27垂直的至少一个方向直至所有方向向外间隔开。除非另有说明，否则IC管芯基板26不与引线键合垫53沿横向方向27对准。这可降低在引线键合期间损坏IC管芯基板24的风险。
第一导电层62的电接触垫45可以沿转接板40的外周边的至少一部分直至整体设置。电接触垫45可以沿转接板40的所有侧边延伸或者可以不存在于一条侧边或多条侧边。如图6所示，第一导电层62的电接触垫45可以设置于转接板40的、设定转接板外周边的所有侧边上。同样地，第二导电层64的电接触垫55可以沿转接板40的周边设置于转接板40的一条侧边或多条侧边上。例如，转接板40可以包括第一相对侧边57和在第一相对侧边57之间延伸的第二相对侧边59。第一相对侧边57可以具有比第二相对侧边59长的相应长度。侧边57和侧边59设定转接板40的外周边。
在一个示例中，第一导电层62的电接触垫45可以沿第一相对侧边57中的每一条侧边设置。第二导电层64的电接触垫55可以沿第二相对侧边59中的每一条侧边设置。因此，应当理解，转接板40的、至少部分地设定转接板40的外周边的一条侧边或多条侧边可以仅具有第一导电层62的电接触垫45，而转接板40的、至少部分地设定转接板40的外周边的一条或多条其他侧边可以包括第二导电层64的电接触垫55。在其他示例中，还有一条或多条侧边可以既包括第一导电层62的电接触垫55，又包括第二导电层64的电接触垫55。电接触垫45可以被称为第一电接触垫，并且第二导电层64的电接触垫55可以被称为第二电接触垫。沿转接板40的一条侧边设置的电接触垫可以沿平行于该侧边的长度延伸的直线相互对准。在一些示例中，第一导电层62的电接触垫45和第二导电层64的电接触垫55中的一者或两者可以设置于转接板40远离转接板40的外周边的内部。
现在参考图7，并且如上所述，光收发器75可以包括至少一个可引线键合的IC组件58。光收发器75包括主基板72，主基板72被设置为发射和接收高速电信号(例如，以上述的高数据传输速度传输的电信号)。主基板72可以被设置为印刷电路板(PCB)。这些高速信号可以从主基板72上的一个或多个电接触垫电连接于转接板40的相应的一个或多个电接触垫(例如一个或多个电接触垫45)。在该示例中，主基板72可以设定上述外基板。类似地，高速电信号可以在光电(O/E)元件或电光(E/O)元件上的电接触垫与转接板40的接触垫(例如作为一个或多个电接触垫45)之间使用引线键合件56连通。这些引线键合件56可以设置于转接板40的相对侧边上，如图7所示。应该认识到，在操作期间，转接板40的大多直至所有接触垫56可以具有引线键合连接件56。
在一些示例中，可能希望附连于第一导电层62的电接触垫45的引线键合件56的长度比附连于第二导电层64的电接触垫55的引线键合件56的长度短。因此，附连于第一导电层62的电接触垫45的引线键合件56可以特别适合以本文所述的大于每秒10吉比特(gigabits)的高速发射电信号，例如高达每秒56吉比特。附连于第二层64的电接触垫55的引线键合件56可以更长，并且因此被设置为发送电力和/或控制信号，与高速电信号相比，控制信号的完整性对引线键合件的长度较不敏感。
高速电信号可以在IC管芯基板24中处理。E/O元件的一个示例为垂直腔面发射激光器，其接收输入的高速电信号并输出调制光束。O/E元件的一个示例为光电探测器，其接收入射的调制光束并输出调制电信号。引线键合件56可以进一步在转接板40和主基板72之间建立控制电连接和供电电连接。转接板40接收或发射控制电连接和供电电连接的各个接触垫45可以设置于转接板40的、与转接板40的具有接收或发射高速电信号的接触垫45的侧边的相邻侧边上。O/E元件和E/O元件以及IC管芯基板24可以附连于提升板77，提升板77提供热传递路径以在操作期间从这些元件中去除热量。IC管芯基板24可以被安装为使得IC管芯基板的外有源表面26背对提升板和主基板72。
为了在例如超过10吉比特每秒(Gbps)的高数据传输速度下保持良好的信号完整性，可以希望最小化引线键合件56的长度。在一些示例中，引线键合件56可以小于大约2毫米，例如小于约1毫米。认识到转接板40可以沿横向方向27具有较小厚度，可以允许较短的引线键合件长度。例如，转接板40可以沿横向方向27具有在3微米到500微米的范围内的厚度，例如从大约50微米到大约300微米，包括从大约100微米到大约150微米。在一个特定示例中，转接板的厚度可以为大约100微米。在另一特定示例中，转接板的厚度可以为大约150微米。应该认识到，转接板厚度的这些范围仅作为示例提供，并且转接板40可以根据需要具有任何合适的替代厚度。
现在参考图8A至图8F，本公开提供一种用于例如多个可引线键合的IC组件58的至少一个可引线键合的IC组件58的制造方法。在一个示例中，可以同时并且以低廉成本的方式生产多个可引线键合的IC组件58。如图8A所示，多个转接板40可以形成于单个面板82上并由真空吸盘84保持。面板82可以包含1到大约100个的范围内的所需数量的转接板40，例如大约70个转接板40。如现在将描述的，可以并行制造数量上与面板82的转接板40相等的多个可引线键合的IC管芯组件58。还可设想具有超过100个单个转接板40的面板82。
特别地，真空吸盘84可以具有平直表面86，并且真空可以向面板82施加力，该力保持转接板40并且使转接板40的面板82平直。例如，真空吸盘84可以耦接于转接板40的最外层，例如在最外层的外表面处。如图8B所示，可以在转接板40和相应的多个IC管芯20之间执行使用回流的正常倒装芯片附连工艺，例如焊料回流。可以使用助焊剂来促进焊料润湿。在将转接板40附连于各个IC管芯20之后，可以执行从可引线键合的IC组件58去除助焊剂的清洁步骤。如图8C所示，可以设置为环氧树脂60的底部填充物可以被注入于IC管芯20和转接板40之间的空隙内。底部填充物可以增加可引线键合的IC管芯组件58的机械强度。现在参考图8D，可引线键合的IC管芯组件58的转接板40的面板82可以从真空吸盘84处移除，并且被安装于背衬层88上。因此，可以将背衬层88安装于转接板40的最外层，例如在最外层的外表面处。背衬88可以被设置为玻璃背衬，其在转接板40的面板82所接合的附连表面上具有紫外(UV)光释放粘合剂。如图8E所示，单切步骤可以将转接板40的面板82分切为相互分离的多个单切转接板40。单切转接板40仍由背衬层88支承。参考图8F，背衬层88可暴露于UV光，这可从背衬层88释放单个和单切的可引线键合的IC管芯组件58。因此，随后可容易地从背衬层88移除可引线键合的IC管芯组件58。
现在参考图9，虽然上面已经将示例描述为具有电连接于转接板40的单个IC管芯20以设定可引线键合的IC组件58，但是认识到可引线键合的IC组件58可以包括多个倒装芯片IC管芯20，其电连接于单个转接板40。例如，第一IC管芯20a、第二IC管芯20b和第三IC管芯20c可以安装于单个转接板40。IC管芯20a至IC管芯20c可以如上所述附连于转接板40，但是回流步骤可以将所有三个管芯IC20a至管芯IC20c安装于转接板40并固定于转接板40。应当理解，上述电接口件36和引线键合垫53没有在图9中示出，因为它们隐藏于视线之外。
为了在接收转接板40的基板上保留宝贵的空间，可能希望将转接板40的占用区限制为仅略大于IC管芯20沿垂直于横向方向27的相应平面的占用区。在一些示例中，转接板40的占用区不超过倒装芯片安装于转接板的一个或多个IC管芯20的占用区尺寸的大约两倍。例如，在一些示例中，转接板40的占用区比倒装芯片安装于转接板40的一个或多个IC管芯20的占用区多不到大约50％。在其他示例中，转接板40的占用区比倒装芯片安装于转接板40的一个或多个IC管芯20的占用区多不到20％。占用区可以指元件在垂直于横向方向27的平面内的二维轮廓或主表面的尺寸。
尽管上文已经根据某些示例描述了转接板40，但是应当理解，转接板40可以根据需要、根据任何合适的示例构造。例如，现在参考图10，在另一示例中，认识到第一导电层62和第二导电层64可以根据需要、根据任何合适的替代示例设置为相互电连通。例如，转接板40，以及因此可引线键合的IC组件58，可以包括至少一个或多个导电导孔68，其使第一导电层62和第二导电层64相互电连通。
以第二导电层64代替加强件66或除加强件66之外附加第二导电层64(参见图5)，第二电绝缘层50可以设置于第二导电层64上或以其他方式由第二导电层64支承。第二电绝缘层50可以设置于第二导电层64的第二表面65b上或以其他方式由第二表面65b支承。例如，第二电绝缘层50可以沿第二表面65b延伸，并且可以进一步在第二导电层64的第二表面65b的一部分上方延伸。第二电绝缘层50可以相对于横向方向27设定转接板40的最外层。第二电绝缘层50可以进一步设定第二孔54，第二孔54从第一表面51a至第二表面51b沿横向方向27延伸，从而暴露第二导电层64，并且特别是暴露出第二导电层的第二表面65b。因此，第二电绝缘层50可以暴露至少一个导电层的第二导电表面。因此，可以说第二导电层64的裸露部分通过第二电绝缘层50中相应的多个第二孔54暴露。
转接板40可以包括在第一导电层62和第二导电层64之间延伸的第三电绝缘层70。此外，第三电绝缘层70可以附连于第一导电层62和第二导电层64。第三电绝缘层70可以进一步在第一电绝缘层62和第二电绝缘层50之间延伸，并且可以附连于第一电绝缘层62和第二电绝缘层50。因此，第二导电层64的第一表面65a和第一导电层62的第二表面46b可以面向第三电绝缘层70并附连于第三电绝缘层70。特别地，第三电绝缘层70的第一表面可以面向第一导电层62，并且第三电绝缘层70的第二表面可以面向第二导电层64。因此，第三电绝缘层70可以将第一导电层62与第二导电层64电隔离。导电导孔68可以贯穿第三电绝缘层70从第一导电层延伸至第二导电层64。至少一个导电导孔68中的每一者的至少一部分直至全部可以沿横向方向27定向。导电导孔68可以分别与第一导电层62和第二导电层64中的每一者对接，从而在第一导电层62和第二导电层64之间建立电连接。
第一导电层62和第二导电层64可以被图案化，并且第一导电层62和第二导电层64的多余材料可以被蚀刻掉，其中第三电绝缘层70相对于横向方向27设置于第一导电层62和第二导电层64之间。第三电绝缘材料可以根据需要被设置为聚酰亚胺或任何合适的替代电绝缘材料。第一电绝缘层48和第二电绝缘层50可以分别为液态可光成像(LPI)焊接掩模，在第一导电层62和第二导电层64已经被图案化之后，其分别与第一导电层62和第二导电层64适形。特别地，在第一导电层62和第二导电层64已经被图案化之后，第一电绝缘层48和第二电绝缘层50可以分别施加于第一导电层62和第二导电层64。因此，在第一导电层62的材料已经被蚀刻掉的位置处，第一电绝缘层48和第三电绝缘层70可以相互接触。类似地，在第二导电层64的材料已经被蚀刻掉的位置处，第二电绝缘层50和第三电绝缘层70可以相互接触。
第一导电层62的图案化部分通过一个或多个导电导孔68与第二导电层64相应的图案部分电连通，并且由第三电绝缘层70与第二导电层64的其他图案化部分电隔离。第一导电层62的图案化部分可以进一步由第一电绝缘层48相互电隔离。相反地，第二导电层64的图案化部分与第一导电层62相应的图案化部分经导孔68电连通，并且与第一导电层62的其他图案化部分由第三电绝缘层70电隔离。第二导电层64的图案化部分还可以由第二电绝缘层50相互电隔离。
转接板40，并且因此可引线键合的IC组件58，可以根据需要包括任意数量的导孔68。导孔可以根据需要沿任何合适的中心距相互间隔开。间距可以沿垂直于横向方向27的任何合适的方向设定。间距可以根据需要在大约200微米至大约500微米的范围内。在一个示例中，间距可以为大约300微米，从而在垂直于横向方向27定向的平面中提供相对较小的可引线键合的IC组件58的占用区。因此可以将引线键合件56安装于第二导电层64，使得引线键合件56与第一导电层62经导孔68电连通。因此，第二导电层64可以设定一个或多个引线键合垫53。
如上所述，转接板40的各个层可以沿垂直于横向方向27定向的各个平面实质上为平直的。然而，在图11A所示的另一示例中，根据另一示例构造的转接板40可以包括电绝缘层90，其设定面向IC管芯20的第一表面或内表面91a，以及与内表面91a沿横向方向27相对的第二表面或外表面91b。转接板40还可包括沿第一表面91a和第二表面91b中的每一者延伸的至少一个导电结构92。例如，至少一个导电结构92可以包括沿第一表面91a的至少一部分延伸的第一导电层94和沿第二表面91b的至少一部分延伸的第二导电层96。因此，电绝缘层90可以沿横向方向27设置于第一导电层94和第二导电层96之间。此外，电绝缘层90可以分别附连于第一导电层94和第二导电层96中的每一者。可以根据需要以上述方式对第一导电层94和第二导电层96进行图案化。
转接板40还可以包括第三导电层98，第三导电层98可以沿电绝缘层90的、从第一表面91a至第二表面91b延伸的外侧表面94延伸。第三导电层98可以从第一导电结构92和第二导电层94延伸。因此，第三导电层98可以垂直于第一导电层94和第二导电层96中的每一者定向。第三导电层98可以如上所述被图案化，以使得第三导电层98的图案化部分使第一导电层94相应的图案化部分与第二导电层94相应的图案化部分电连通。第一导电层94和第二导电层96中之一或两者可以设定通孔从而暴露电绝缘层90的第一表面91a和第二表面91b的相应部分。
第一导电层94可以设定或支承接触垫45，并且第二导电层96可以设定一个或多个引线键合垫53。第一导电层94、第二导电层96和第三导电层98可以由相同的材料设定，例如金属，并且可以彼此成一体。或者，第一导电层94、第二导电层96和第三导电层98中的一者或多者直至全部可以由不同的材料制成。替代地或附加地，第一导电层94、第二导电层96和第三导电层98中的一者或多者直至全部可以设定相互电连通的单独层。应当理解，上述至少一个导电层可以至少部分地由第一导电层94和第二导电层96单独设定或与第三导电层98组合设定。
因此，可以称至少一个导电结构92包裹电绝缘层90。导电接口件36可以以上述方式放置于第一导电层94和倒装芯片IC管芯之间，并回流以将转接板40安装于IC管芯。因此，第一导电层94可以设置于转接板40的第一侧面42a处。引线键合件56可以安装于第二导电层96，从而使引线键合件56与导电接口件36电连通。因此，第二导电层96可以设置于转接板40的第二侧面42b处。因此应该理解，转接板40可以在不制造或以其他方式提供贯穿电绝缘层90延伸的孔的情况下，使引线键合件56与倒装芯片管芯20电连通。换言之，代替以上述方式在导电接口件36和引线键合件56之间(或接触垫45和引线键合垫53之间)的、贯穿电绝缘层延伸的电连接，导电接口件36和引线键合件56之间(或接触焊盘45和引线键合垫53之间)的电连接可以围绕电绝缘层90延伸。在两个示例中，电连接从电绝缘层的第一侧面延伸至电绝缘层的第二侧面。
如上所述，可以根据需要对第一导电层94和第二导电层96中的每一者分别进行图案化。第一导电层94和第二导电层96中的每一者可以分别设定单个接入层。换言之，由导电接口件36和引线键合件56设定的电连接仅分别与第一导电层94和第二导电层96的第一侧面和第二侧面进行。第一导电层94和第二导电层96的第一侧面和第二侧面各自可以背对电绝缘层90并且相互背对。与具有双接入的单个金属层相比，第一导电层94和第二导电层96分别为单接入金属层在某些情况下可能是有利的。例如，与单个金属层层压板相比，两层金属层压板可能更容易采购。对于两金属层层压板，用于层压板的粘合剂或保护膜也可能更易购得。如上所述，转接板40可以包括多个导电结构92，其使各个导电引线键合垫53与相应的电接触垫45电连通，并且因此安装于引线键合垫53的引线键合件56分别与安装于电接触垫45的电接口件36电连通。导电结构可以由电绝缘层90相互电隔离。如图11B所示，转接板40可以包括第二电绝缘层61，第二电绝缘层61附连于第二导电层46的第二侧面上的第二导电层96，第二导电层46的第二侧面与第二导电层96的第一侧面相对，第二导电层96的第一侧面面向电绝缘层90，电绝缘层90可以被称为第一电绝缘层。第二绝缘层61可设定通孔63，通孔63暴露第二导电层96上的引线键合垫53。
应当理解，附图中所示示例的说明和描述仅用于示例性目的，并且不应被解释为限制本公开。本领域技术人员将理解，本公开考虑了各种实施例。例如，加强件可以用作附加部件的安装表面，例如散热器或一些其他电部件。诸如上文和下文的术语与图中描述的各种元件的取向有关，并且不需描述元件在最终产品中的取向。此外，应该理解，上述实施例中描述的概念可以单独使用或与上述任何其他实施例组合使用。还应当理解，以上关于一个图示实施例描述的各种替代实施例可以适用于本文所述的所有实施例，除非另有说明。

Claims (35)

1.将IC管芯转换为可引线键合的电部件的方法，所述方法包括将所述IC管芯倒装芯片安装于转接板的至少一个图案化导电层的第一表面的步骤，其中所述转接板在所述至少一个导电层的、与所述第一表面相对的第二表面处具有引线键合垫。
2.根据权利要求1所述的方法，其中所述至少一个图案化导电层的所述第一表面通过第一孔暴露，所述第一孔贯穿所述转接板的第一侧处的第一电绝缘层，并且所述转接板具有第二电绝缘层中的第二孔，所述第二孔在所述至少一个导电层的所述第二表面处暴露所述引线键合垫。
3.根据权利要求1至2中任一项所述的方法，其中所述倒装芯片安装步骤包括将所述IC管芯上的多个焊料凸块回流到所述至少一个导电层的所述第一表面。
4.根据权利要求1至3中任一项所述的方法，还包括将引线键合件安装于所述至少一个导电层的所述第二表面的步骤。
5.根据前述权利要求中任一项所述的方法，其中所述至少一个导电层由单个导电层设定，所述单个导电层设定所述第一表面和所述第二表面中的每一者。
6.根据权利要求1至4中任一项所述的方法，其中所述第一表面由第一导电层设定，并且所述第二表面由第二导电层设定。
7.根据权利要求6所述的方法，其中所述转接板包括设置于所述第一导电层和所述第二导电层之间的第三电绝缘层。
8.根据权利要求7所述的方法，其中所述转接板还包括将所述第一导电层电连接于所述第二导电层的多个导孔。
9.根据权利要求8所述的方法，其中所述导孔贯穿所述第三电绝缘层延伸。
10.根据权利要求9所述的方法，其中所述第一导电层包括图案化部分，所述图案化部分通过所述导孔中的相应一者与所述第二导电层的相应的图案部分电连通，并且所述第一导电层的所述图案化部分与所述第二导电层的其他图案化部分由所述第三电绝缘层电隔离。
11.根据权利要求9至10中任一项所述的方法，其中所述第二导电层包括图案化部分，所述图案化部分通过所述导孔中的相应一者与所述第一导电层的相应的图案部分电连通，并且所述第二导电层的所述图案化部分与所述第一导电层的其他图案化部分由所述第三电绝缘层电隔离。
12.根据权利要求1所述的方法，其中所述至少一个导电层包括沿电绝缘层的第一表面延伸的第一导电层、沿电绝缘层的与所述电绝缘层的所述第一表面相对的第二表面延伸的第二导电层，以及第三导电层，所述第三导电层沿所述电绝缘层的外侧表面从所述第一导电层至所述第二导电层延伸。
13.根据权利要求1所述的方法，其中所述IC管芯为从包含多个IC管芯的晶圆切割的单切IC管芯。
14.根据前述权利要求中任一项所述的方法，还包括将所述转接板引线键合于光收发器的主基板的步骤。
15.可引线键合的IC管芯组件，包括：
IC管芯，所述IC管芯被设置用于倒装芯片安装；
转接板，所述转接板具有第一电绝缘层、第二电绝缘层，以及设置于所述第一电绝缘层和所述第二电绝缘层之间的至少一个图案化导电层；
其中所述IC管芯通过设置于所述第一电绝缘层的孔中的焊料倒装芯片安装于所述至少一个图案化导电层的第一表面，其中所述焊料从所述IC管芯至所述至少一个图案化导电层的所述第一表面延伸，并且
其中所述第二绝缘层具有孔，所述孔在所述至少一个图案化导电层的、与所述第一表面相对的第二表面处暴露引线键合垫。
16.根据权利要求15所述的可引线键合的IC组件，其中所述至少一个图案化导电层包括设定所述第一表面和所述第二表面中的每一者的单个导电层。
17.根据权利要求15所述的可引线键合的IC管芯组件，其中所述单个导电层具有与所述第一电绝缘层中的孔对准的孔，并且所述焊料贯穿所述单个导电层中的所述孔延伸。
18.根据权利要求17所述的可引线键合的IC管芯组件，其中所述单个导电层的所述第二表面被暴露，并且所述焊料延伸至所述第二表面上。
19.根据权利要求15所述的可引线键合的IC管芯组件，其中所述至少一个图案化导电层包括设定所述第一表面的第一导电层和设定所述第二表面的第二导电层。
20.根据权利要求19所述的可引线键合的IC管芯组件，还包括设置于所述第二导电层上的加强件。
21.根据权利要求15至20中任一项所述的可引线键合的IC管芯组件，其中所述第一侧面和所述第二侧面沿横向方向彼此相对，并且所述转接板的占用区小于所述IC管芯的占用区尺寸的两倍，其中所述占用区沿垂直于所述横向方向定向的相应平面延伸。
22.根据权利要求21所述的可引线键合的IC管芯组件，其中所述转接板的占用区比所述IC管芯的占用区大不到50％。
23.根据权利要求21所述的可引线键合的IC管芯组件，其中所述转接板的占用区比所述IC管芯的占用区大不到20％。
24.根据权利要求15至23中任一项所述的可引线键合的IC管芯组件，还包括安装于所述至少一个导电层的多个IC管芯。
25.根据权利要求15所述的可引线键合的IC管芯组件，其中所述转接板在所述焊料和所述引线键合垫之间没有导孔电连接。
26.光收发器，包括：
根据权利要求15至25中任一项所述的可引线键合的IC管芯组件；
外基板；和
引线键合件，所述引线键合件使所述可引线键合的IC管芯组件与所述外基板电连通。
27.根据权利要求26所述的光收发器，其中所述IC管芯具有形成于所述IC管芯的外有源表面上的有源电路，并且所述外有源表面背对所述外基板。
28.将栅格阵列电接口件转换为可引线键合的电接口件的方法，所述方法包括：
将转接板与焊料团的栅格阵列对准，使得焊料凸块的所述栅格阵列的焊料凸块与所述转接板的第一电绝缘层的相应的多个第一孔对准；并且
将焊料凸块的所述栅格阵列的所述焊料凸块焊接于通过所述第一绝缘层中的所述第一孔裸露的导电层，
其中与所述转接板的所述第一侧相对的所述转接板的第二侧在第二绝缘层中具有多个第二孔，所述第二孔将所述金属层中的设置用于引线键合的接触垫暴露。
29.根据权利要求28所述的方法，其中焊料凸块的所述栅格阵列具有相邻焊料凸块之间的、从中心到中心的不超过300微米的间距。
30.可引线键合的IC组件，包括：
IC管芯，所述IC管芯被设置用于倒装芯片安装；
转接板，所述转接板具有图案化的第一导电层、图案化的第二导电层，以及从所述第一导电层至所述第二导电层延伸的电绝缘层，其中所述第一金属层经焊料凸块电连接于所述IC管芯，并且所述第二金属层具有引线键合垫和包裹所述电绝缘层的导电结构，所述导电结构包括所述第一导电层和所述第二导电层。
31.可引线键合的IC组件，包括：
IC管芯，所述IC管芯被设置用于倒装芯片安装；和
转接板，所述转接板具有第一电绝缘层和附连于所述电绝缘层的第一导电层
其中所述第一导电层的第一侧面被使用焊料电连接于所述IC管芯；并且
所述转接板在所述转接板的、与所述转接板的所述第一侧面相对的第二侧面上具有引线键合垫。
32.根据权利要求31所述的组件，其中所述第一电绝缘层设定附连于所述第一导电层的第一侧面和与所述第一侧面相对的第二侧面，所述第二侧面附连于第二导电层，其中包括所述第一导电层和所述第二导电层的导电结构包裹所述电绝缘层。
33.根据权利要求32所述的组件，其中所述电绝缘层为第一电绝缘层，所述组件还包括第二电绝缘层，所述第二电绝缘层附连于所述第二导电层的、与所述第二导电层的第一表面相对的第二表面，所述第一表面面向所述第一电绝缘层，其中所述第二电绝缘层具有暴露所述第二导电层上的引线键合垫的孔。
34.转接板，包括：
导电层，所述导电层设定第一表面和与所述第一表面相对的第二表面；
第一电绝缘层，所述第一电绝缘层设置于所述导电层的所述第一表面上，其中所述第一电绝缘层设定延伸的通孔；
第二电绝缘层，所述第二电绝缘层设置于所述导电层的所述第二表面上；
其中所述转接板设定第一孔，所述第一孔贯穿所述第一电绝缘层延伸至所述导电层的所述第一表面处的电接触垫，所述电接触垫被设置为倒装芯片安装于IC基板，并且所述转接板设定第二孔，所述第二孔贯穿所述第一电绝缘层延伸至所述导电层的所述第二表面处的导电引线键合垫。
35.根据权利要求34所述的转接板，其中所述第一孔还贯穿所述导电层延伸。
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